Ball mounting jig

Abstract

The utility model discloses a ball mounting jig which comprises a base, a cover plate and a ball mounting net, the base comprises a base table and a positioning plate, and the positioning plate is arranged on the surface of the base table and used for placing a substrate to be subjected to ball mounting; the cover plate comprises a connecting frame, the connecting frame is provided with a first through hole, and the first through hole is used for exposing the substrate when the base and the cover plate are covered; the ball planting net is arranged on the connecting frame and covers the first through hole. The ball mounting jig provided by the utility model has the characteristics of simple structure, short delivery time and low cost.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more particularly to a bulb jig. Background Technology

[0002] With the rapid development of integrated circuit technology, the application of integrated circuit chips is becoming increasingly widespread, and the requirements for chip packaging technology are also becoming higher and higher. As a key step in the chip packaging process, ball placement plays a vital role in the electrical connection between the chip and external devices.

[0003] Currently, the main method of ball placement is automatic ball placement using a ball placement machine. The ball placement machine can place solder balls onto the printed circuit board. However, the structure of the automatic ball placement machine is complex, resulting in long lead times and high costs for customized automatic ball placement machines. When processing small batches or chips with special requirements, the lack of cost and flexibility has become a significant limiting factor for automatic ball placement machines.

[0004] Therefore, there is an urgent need to develop a ball-planting device with a shorter delivery time and lower cost. Utility Model Content

[0005] In view of this, this application provides a ball-planting fixture that can solve the above-mentioned technical problems.

[0006] A bulb planting fixture, comprising:

[0007] The base includes a base platform and a positioning plate, the positioning plate being disposed on the surface of the base platform and used to place the substrate to be planted with balls;

[0008] A cover plate, the cover plate including a connecting frame having a first through hole for exposing the substrate when the base and the cover plate are closed; and

[0009] A ball-planting net is disposed on the connecting frame and covers the first through hole.

[0010] In some embodiments, the cover plate includes a sealing frame disposed on the side of the connecting frame facing the base and for fitting around the positioning plate.

[0011] In some embodiments, the substrate includes solder pads, and the ball-planting mesh has mesh openings corresponding to the positions of the solder pads.

[0012] In some embodiments, the surface of the positioning plate includes a first positioning element for fixing the substrate to the positioning plate.

[0013] In some embodiments, the base includes a second positioning element, and the cover plate includes a fixing hole that extends through the connecting frame and the sealing frame. The second positioning element is used to pass through the fixing hole to fix the base and the cover plate.

[0014] In some embodiments, the connecting frame is provided with a collection hole that extends through the connecting frame and communicates with the first through hole.

[0015] In some embodiments, the base is provided with a first slot, and the first slot is fitted with a buckle for engaging the cover plate.

[0016] In some embodiments, the ball-planting net is sandwiched between the connecting frame and the sealing frame.

[0017] In some embodiments, the base and the cover are connected by a pivot.

[0018] In some embodiments, the base is provided with a second slot that extends through the base and the positioning plate, and the second slot is used to expose a portion of the substrate.

[0019] The ball-planting fixture provided in this application includes a base, a cover plate, and a ball-planting mesh. The base includes a positioning plate, and the cover plate includes a connecting frame with a first through hole. When the cover plate is closed with the base, the first through hole exposes the substrate to be ball-planted. The positioning plate helps to align the substrate with the ball-planting mesh, which facilitates the precise placement of solder balls onto the substrate's solder pads during ball planting. The ball-planting fixture provided in this application has a simple structure, short manufacturing lead time, and low cost, allowing for ball planting to be completed in a shorter time and at a lower cost. Attached Figure Description

[0020] Figure 1 This is a schematic diagram showing the disassembly of the ball-planting fixture provided in one embodiment of this application.

[0021] Figure 2 This is an assembly diagram of the ball-planting fixture provided in one embodiment of this application.

[0022] Explanation of main component symbols

[0023] 1. Base; 11. Platform; 111. First surface; 112. Second surface; 113. First side; 114. Second side; 12. Positioning plate; 2. Cover plate; 21. Connecting frame; 211. First through hole; 22. Sealing frame; 221. Second through hole; 3. Planting net; 31. Mesh; 41. First positioning component; 42. Second positioning component; 5. Fixing hole; 6. Collection hole; 71. First slot; 72. Buckle; 73. Second slot; 100. Planting fixture.

[0024] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0025] The embodiments of this application are described in detail below. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. The reagents and materials described in the following embodiments are all commercially available.

[0026] To better understand the above-mentioned objectives, features, and advantages of the embodiments of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the features in the embodiments of this application can be combined with each other.

[0027] The following description sets forth numerous specific details to provide a thorough understanding of the embodiments of this utility model. The described embodiments are only a portion, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of the embodiments of this utility model.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments of this invention pertain. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention.

[0029] The present application will be specifically described below through specific embodiments.

[0030] Please see Figure 1 and Figure 2 This application provides a ball-mounting fixture 100, including a base 1, a cover plate 2, and a ball-mounting mesh 3. The base 1 includes a platform 11 and a positioning plate 12. The positioning plate 12 is disposed on the surface of the platform 11 and is used to place the substrate to be ball-mounted. The cover plate 2 includes a connecting frame 21, which has a first through hole 211. The first through hole 211 exposes the substrate when the base 1 and the cover plate 2 are closed. The ball-mounting mesh 3 is disposed on the connecting frame 21 and covers the first through hole 211. The ball-mounting mesh 3 is disposed on the connecting frame 21 and covers the first through hole 211, so that there is no gap between the ball-mounting mesh 3 and the connecting frame 21, preventing a large number of solder balls from falling through the gap between the ball-mounting mesh 3 and the connecting frame 21 without landing on the solder pads during ball-mounting.

[0031] In some embodiments, the substrate includes solder pads, and the ball-mounting mesh 3 has mesh openings 31 corresponding to the positions of the solder pads. When the base 1 is closed with the cover plate 2, the solder pads are exposed from the mesh openings 31 of the ball-mounting mesh 3.

[0032] In some embodiments, the substrate includes multiple solder pads, and the ball-mounting mesh 3 has multiple mesh openings 31, each opening 31 exposing one solder pad, such that the size of each opening 31 allows one solder ball to pass through. This allows the solder balls to be aligned one-to-one with the solder pads, ensuring that one solder pad is bonded to only one solder ball, reducing the occurrence of multiple balls and decreasing the probability of manual rework.

[0033] In some embodiments, the cover plate 2 further includes a sealing frame 22, which is disposed on the side of the connecting frame 21 facing the base 1 and is used to fit around the positioning plate 12. The sealing frame 22 serves to seal the cover plate 2 and the positioning plate 12, preventing solder balls from falling into areas outside the positioning plate 12.

[0034] In some embodiments, the ball-planting mesh 3 is sandwiched between the connecting frame 21 and the sealing frame 22, and covers the first through hole 211. In other embodiments, the four inner walls of the connecting frame 21 surround the first through hole 211, and the ball-planting mesh 3 is connected to the four inner walls of the connecting frame 21, covering the first through hole 211. These methods ensure that there are no gaps between the ball-planting mesh 3 and the connecting frame 21, preventing a large number of solder balls from falling through the gaps between the ball-planting mesh 3 and the connecting frame 21 without landing on the solder pads during ball planting.

[0035] In some implementations, the arrangement of the mesh openings 31 on the ball-planting mesh 3 is consistent with the arrangement of the solder pads on the substrate, so that each solder pad has a corresponding mesh opening 31.

[0036] In some implementations, the solder balls can be tin balls or other solderable metal balls.

[0037] In some embodiments, the surface of the positioning plate 12 includes a first positioning element 41 for fixing the substrate to the positioning plate 12. The first positioning element 41 helps to fix the substrate, prevents displacement between the substrate and the positioning plate 12, and reduces the occurrence of misalignment between the mesh 31 of the ball-planting mesh 3 and the solder pads on the substrate.

[0038] In some embodiments, the sealing frame 22 has a second through hole 221 for accommodating the substrate when the base 1 and the cover plate 2 are closed. The substrate is accommodated within the second through hole 221 so that the solder balls can fall accurately onto the solder pads without slipping on the solder pads.

[0039] In some embodiments, the base 11 includes a second positioning element 42, and the cover plate 2 includes a fixing hole 5, which penetrates the connecting frame 21 and the sealing frame 22. The second positioning element 42 is used to pass through the fixing hole 5 to fix the base 1 and the cover plate 2. The second positioning element 42 facilitates the precise closing of the base 1 and the cover plate 2, thereby further ensuring that the mesh 31 of the ball-planting net 3 can be precisely aligned with the welding pad.

[0040] In some embodiments, the connecting frame 21 is provided with a collection hole 6, which penetrates the connecting frame 21 and communicates with the first through hole 211. There can be one or more collection holes 6, which can be located at a corner of the connecting frame 21. The collection hole 6 is used to collect solder balls that do not fall into the mesh 31, so that these solder balls can be recycled and reused.

[0041] In some embodiments, the base 11 includes a first surface 111 and a second surface 112 disposed opposite to each other, and a first side surface 113 connecting the first surface 111 and the second surface 112. The base 11 has first slots 71 exposed on opposite sides of the positioning plate 12, the first slots 71 penetrating the first surface 111, the second surface 112, and the first side surface 113. The first slots 71 are fitted with latches 72 for engaging the base 1 and the cover plate 2.

[0042] In some embodiments, the base 1 and the cover plate 2 can also be connected by a pivot, allowing the cover plate 2 to move axially relative to the base 1. When the substrate is placed, the cover plate 2 rotates around the pivot away from the base 1, opening the cover plate 2 so that the substrate can be placed on the positioning plate 12; after the substrate is placed, the cover plate 2 rotates around the pivot toward the base 1, closing the cover plate 2 with the base 1.

[0043] In some embodiments, the base 11 further includes a second side surface 114, which is connected to the first surface 111 and the second surface 112. The second side surface 114 of the base 11 is provided with a second slot 73, which passes through the first surface 111, the second surface 112 and the second side surface 114 and extends into the positioning plate 12. The second slot 73 is used to expose a portion of the substrate.

[0044] When using the ball-planting fixture 100 provided in this application, the substrate to be ball-planted is placed on the positioning plate 12, and then the cover plate 2 and the base 1 are closed. At this time, the mesh 31 of the ball-planting mesh 3 is aligned with the solder pads on the substrate. Solder balls are sprinkled onto the surface of the ball-planting mesh 3, and the ball-planting fixture 100 is manually shaken to allow the solder balls to fall from the mesh 31 of the ball-planting mesh 3 onto the solder pads, thus completing the ball-planting purpose. When the ball-planting is finished, the cover plate 2 and the base 1 are separated, the substrate is removed, and it is checked whether each solder pad is distributed with solder balls. If missing balls, multiple balls, solder ball bridging, etc. are found, they can be manually handled on a small scale. Finally, the qualified substrate is placed in the equipment for reflow soldering, thus completing the ball-planting and reflow soldering steps of the substrate.

[0045] In summary, the ball-planting fixture 100 provided in this application includes a base 1, a cover plate 2, and a ball-planting mesh 3. The base 1 includes a positioning plate 12, and the cover plate 2 includes a connecting frame 21, which has a first through hole 211. When the base 1 and the cover plate 2 are closed, the first through hole 211 exposes the substrate to be ball-planted. The positioning plate 12 helps to achieve precise alignment between the substrate and the ball-planting mesh 3, which is beneficial for the solder balls to accurately land on the solder pads of the substrate during ball planting. The ball-planting fixture 100 provided in this application has a simple structure, short manufacturing lead time, and low cost, and can complete ball planting in a shorter time and at a lower cost.

[0046] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A bulb-planting fixture, characterized in that, include: The base includes a base platform and a positioning plate, the positioning plate being disposed on the surface of the base platform and used to place the substrate to be planted with balls; A cover plate, the cover plate including a connecting frame having a first through hole, the first through hole being used to expose the substrate when the base is closed with the cover plate; as well as A ball-planting net is disposed on the connecting frame and covers the first through hole.

2. The ball-planting fixture as described in claim 1, characterized in that, The cover plate includes a sealing frame, which is located on the side of the connecting frame facing the base and is used to fit around the positioning plate.

3. The ball-planting fixture as described in claim 1, characterized in that, The substrate includes solder pads, and the ball-planting mesh has mesh openings corresponding to the positions of the solder pads.

4. The ball-planting fixture as described in claim 1, characterized in that, The surface of the positioning plate includes a first positioning element, which is used to fix the substrate to the positioning plate.

5. The ball-planting fixture as described in claim 2, characterized in that, The base includes a second positioning element, and the cover plate includes a fixing hole that passes through the connecting frame and the sealing frame. The second positioning element is used to pass through the fixing hole to fix the base and the cover plate.

6. The ball-planting fixture as described in claim 1, characterized in that, The connecting frame is provided with a collection hole, which passes through the connecting frame and communicates with the first through hole.

7. The ball-planting fixture as described in claim 1, characterized in that, The base is provided with a first slot, and a buckle is installed in the first slot. The buckle is used to engage the cover plate.

8. The ball-planting fixture as described in claim 2, characterized in that, The ball-planting net is sandwiched between the connecting frame and the sealing frame.

9. The ball-planting fixture as described in claim 1, characterized in that, The base and the cover are connected by a pivot.

10. The ball-planting fixture as described in claim 1, characterized in that, The base is provided with a second slot, which extends through the base and the positioning plate, and is used to expose a portion of the substrate.

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