Solder sealing cover plate with exhaust structure

Abstract

The utility model relates to the technical field of electronic packaging, and discloses a solder fusion sealing cover plate with an exhaust structure, the cover plate is welded with a ceramic shell through a solder ring, a plurality of groups of exhaust grooves are formed in the welding surface of the cover plate along the circumferential direction of the central axis of the cover plate, each group of exhaust grooves are located at the corners of the cover plate, and each group of exhaust grooves comprises a plurality of exhaust grooves; the exhaust grooves are distributed in a radial mode in the direction from the position close to the center line to the position away from the center line and penetrate through the sealing area of the cover plate. The method has the effect of reducing the possibility that bubbles exist in the welding seam.

Description

Technical Field

[0001] This application relates to the field of electronic packaging technology, and in particular to a solder seal cover with a venting structure. Background Technology

[0002] In the manufacturing process of high-reliability electronic components, hermetic encapsulation is a crucial step in ensuring device performance. Gold-tin solder sealing, as a primary sealing process, directly impacts the sealing reliability and mechanical strength of the device. During this process, after the solder-sealed cover plate is sealed, bubbles of various shapes and sizes often appear in the weld seam. The distribution and size of these bubbles are not fixed, but they are most concentrated in the four apex regions of the weld seam.

[0003] The formation of bubbles is mainly attributed to two factors: firstly, insufficient flatness of the sealing area of ​​the ceramic shell; and secondly, gas released from the coating of the sealing area of ​​the cover plate and the shell. During the fusion sealing process, uneven surfaces may lead to the formation of encapsulated bubbles, and if the released gas is not discharged in time before the solder solidifies, bubbles will also form.

[0004] The presence of these air bubbles not only reduces the reliability of the seal, but also weakens the strength and mechanical reliability of the cover plate weld. Utility Model Content

[0005] To reduce the possibility of air bubbles in the weld, this application provides a solder sealing cover plate with an venting structure.

[0006] The solder sealing cover plate with venting structure provided in this application adopts the following technical solution:

[0007] A solder sealing cover with a venting structure is provided. The cover is welded to a ceramic shell by a solder ring. Several sets of venting grooves are provided on the welding surface of the cover along the central axis of the cover. Each set of venting grooves is located at a corner of the cover and each set of venting grooves includes several venting grooves. The several venting grooves are radially distributed from near the center line to away from the center line. The venting grooves penetrate the sealing area of ​​the cover.

[0008] Optionally, the inner wall of the exhaust channel is provided with a corrosion-resistant coating.

[0009] Optionally, the depth of the venting groove is 25% to 100% of the solder ring thickness, and the width of the venting groove is 1 to 2 times the depth of the venting groove.

[0010] Optionally, the distance between two adjacent exhaust slots is 5 to 20 times the width of the exhaust slot.

[0011] Optionally, the corrosion-resistant coating is a Ni-Au or Ni-Au-Ni-Au coating.

[0012] In summary, this application includes at least one of the following beneficial technical effects:

[0013] 1. During the welding process of the cover plate and ceramic shell, radially distributed venting channels efficiently guide and expel gases generated during the melting of the solder ring, preventing gas accumulation at the weld and thus reducing porosity and bubble formation. The reasonable size and layout of the venting channels increase the venting coverage area of ​​the sealing zone, ensuring smooth gas flow and discharge. Simultaneously, the corrosion-resistant Ni-Au or Ni-Au-Ni-Au plating on the inner wall of the venting channels not only protects the channels from corrosive environments and extends the service life of the cover plate, but also provides a smooth surface, further reducing gas flow resistance, improving venting efficiency, and ensuring weld quality. Attached Figure Description

[0014] Figure 1 This is a schematic diagram illustrating the relative positions of the cover plate and the ceramic shell in an embodiment of this application.

[0015] Figure 2 This is a schematic diagram illustrating the relative positions of the cover plate and the solder ring in an embodiment of this application.

[0016] Figure 3 This is a schematic diagram illustrating the relative positions of the cover plate and the exhaust channel in an embodiment of this application.

[0017] Explanation of reference numerals in the attached figures:

[0018] 1. Cover plate; 11. Sealing area; 12. Venting groove; 13. Plating; 2. Solder ring; 3. Ceramic shell. Detailed Implementation

[0019] The following is in conjunction with the appendix Figures 1-3 This application will be described in further detail.

[0020] This application discloses a solder sealing cover plate with an venting structure.

[0021] A solder sealing cover plate with an exhaust structure has several exhaust grooves 12 on the welding surface of the cover plate 1. When welding the cover plate 1 and the ceramic shell 3 with a solder ring 2, the solder ring 2 is placed between the cover plate 1 and the ceramic shell 3. Then, the cover plate 1, the ceramic shell 3 and the solder ring 2 are placed in a high-temperature environment to melt the solder ring 2, thereby sealing the welded cover plate 1 and the ceramic shell 3.

[0022] When the solder ring 2 is welding the cover plate 1 and the ceramic shell 3, the generated gas is introduced into the venting groove 12 and discharged under the guidance of the venting groove 12, thereby reducing the possibility of gas accumulation at the weld. At the same time, when the solder ring 2 melts, the molten solder gradually flows into the venting groove 12 to facilitate the solder sealing of the venting groove 12.

[0023] To ensure the accuracy of the relative position of the solder ring 2 and the cover plate 1 during welding, the solder ring 2 is pre-fixed on the cover plate 1 before the ceramic shell 3 is welded to the cover plate 1. In this embodiment, the solder ring 2 is pre-spot-welded to the welding surface of the cover plate 1.

[0024] The exhaust groove 12 is provided in several groups, and the several groups of exhaust grooves 12 are distributed circumferentially along the central axis of the cover plate 1. Each group of exhaust grooves 12 is mainly concentrated at the four corners of the cover plate 1. Each group of exhaust grooves 12 includes several exhaust grooves 12, and the several exhaust grooves 12 are distributed radially from the direction close to the center line to the direction away from the center line. The exhaust grooves 12 penetrate the sealing area 11 of the cover plate 1.

[0025] During welding, the radially distributed exhaust grooves 12 are evenly distributed in the sealing area 11. Multiple exhaust grooves 12 guide the gas to be discharged to the edge of the cover plate 1, reducing the possibility of gas accumulation in local areas and improving the path and speed of gas discharge.

[0026] The depth of the venting groove 12 is 25% to 100% of the thickness of the solder ring 2, the width of the venting groove 12 is 1 to 2 times its depth, and the spacing between two adjacent venting grooves 12 is 5 to 20 times their width. This is to maximize the coverage area of ​​the venting groove 12 over the sealing area 11 while ensuring the structural strength of the cover plate 1, thereby facilitating gas flow within the venting groove 12 and improving gas discharge efficiency.

[0027] The inner wall of the exhaust channel 12 is provided with a corrosion-resistant coating 13, which is a Ni-Au or Ni-Au-Ni-Au coating 13. By providing a corrosion-resistant coating 13 on the inner wall of the exhaust channel 12, the impact of the corrosive environment on the exhaust channel 12 is reduced, further extending the service life of the cover plate 1. At the same time, the corrosion-resistant coating 13 further improves the structural stability of the exhaust channel 12. To further extend the service life of the cover plate 1, a corrosion-resistant coating 13 is also provided on the outer peripheral surface of the cover plate 1.

[0028] The Ni-Au or Ni-Au-Ni-Au coating 13 typically provides a smooth surface, thereby reducing the resistance to gas movement within the exhaust channel 12 and improving the efficiency of gas movement within the exhaust channel 12. Simultaneously, the smooth coating 13 also facilitates cleaning of the exhaust channel 12, further enhancing the exhaust efficiency of the exhaust channel 12.

[0029] The implementation principle of a solder sealing cover plate with an venting structure in this application embodiment is as follows: During the welding process between the cover plate 1 and the ceramic shell 3, the radially distributed venting grooves 12 efficiently guide and discharge the gas generated during the melting of the solder ring 2, preventing gas accumulation at the weld and thus reducing the generation of porosity and bubbles. The reasonable size and layout of the venting grooves 12 increase the venting coverage area of ​​the sealing zone 11, ensuring smooth gas flow and discharge. At the same time, the corrosion-resistant Ni-Au or Ni-Au-Ni-Au plating layer 13 on the inner wall of the venting grooves 12 not only protects the venting grooves 12 from the corrosive environment and extends the service life of the cover plate 1, but also provides a smooth surface, further reducing gas flow resistance, improving venting efficiency, and ensuring welding quality. Before welding, the solder ring 2 is fixed to the cover plate 1 by spot welding to ensure precise alignment of the solder ring 2 and the cover plate 1 during welding, so that the cover plate 1 and the ceramic shell 3 form a firm and sealed connection after welding.

[0030] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A solder sealing cover plate with a venting structure, wherein the cover plate is welded to a ceramic shell via a solder ring, characterized in that: The welding surface of the cover plate is provided with a number of sets of exhaust grooves along the central axis of the cover plate. Each set of exhaust grooves is located at a corner of the cover plate, and each set of exhaust grooves includes several exhaust grooves. The exhaust grooves are radially distributed from near the center line to away from the center line, and the exhaust grooves penetrate the sealing area of ​​the cover plate.

2. The solder sealing cover plate with venting structure according to claim 1, characterized in that: The inner wall of the exhaust channel is provided with a corrosion-resistant coating.

3. The solder sealing cover plate with venting structure according to claim 1, characterized in that: The depth of the venting groove is 25% to 100% of the thickness of the solder ring, and the width of the venting groove is 1 to 2 times the depth of the venting groove.

4. A solder sealing cover plate with an venting structure according to claim 1, characterized in that: The distance between two adjacent exhaust slots is 5 to 20 times the width of the exhaust slot.

5. A solder sealing cover plate with an venting structure according to claim 2, characterized in that: The corrosion-resistant coating is a Ni-Au or Ni-Au-Ni-Au coating.

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