Efficient heat dissipation base
By designing an efficient heat dissipation base, and utilizing Kovar alloy and copper materials combined with high-expansion low-temperature solder and ceramic gold-plated materials, the problems of insufficient heat dissipation and high-temperature cracking of the chip base were solved, achieving stable connection and good thermal conductivity, and improving the heat dissipation effect of the chip.
Patent Information
- Application Number
- CN202422781594.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-11-14
AI Technical Summary
The existing chip base has insufficient heat dissipation, which cannot meet the heat dissipation requirements of high-performance chips, and it is prone to cracking in high-temperature environments.
It adopts a high-efficiency heat dissipation base design, including base body, heat sink, wires, insulators and chip fixing plate, using Kovar alloy and copper materials, combined with high expansion low temperature solder and ceramic gold-plated materials to ensure stable connection and good thermal conductivity.
It improves heat dissipation, ensuring a stable connection between the chip mounting plate and the base body in high-temperature environments without cracking, and enhances the chip's heat dissipation performance.
Smart Images
Figure CN223624980U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a high-efficiency heat dissipation base and belongs to the field of optoelectronic technology. Background Technology
[0002] As chip performance continues to improve, energy consumption also increases, placing increasingly higher demands on the heat dissipation of the mounting base. To adapt to different device requirements, the style and size of the mounting base also need to be adjusted, all of which will affect the heat dissipation effect of the base. Summary of the Invention
[0003] This utility model provides the following technical solution:
[0004] A high-efficiency heat dissipation base includes a base body, a heat sink, wires, insulators, and a chip fixing plate. The base body has a heat dissipation hole at its top center. The heat sink has a protrusion that passes through the heat dissipation hole. The base body is sleeved on the heat sink. A chip fixing plate is fixed above the heat dissipation hole. The base body is sleeved on the heat sink. The protrusion passes through the heat dissipation hole and connects to the bottom of the chip fixing plate. The base body also has wire connection holes distributed on both sides of the chip fixing plate. An insulator is placed in each wire connection hole. The wire passes through the insulator from the bottom of the base body and is bonded to the base body. The top surfaces of the base body and the chip fixing plate are gold-plated.
[0005] Preferably, the base body is made of Kovar alloy.
[0006] Preferably, the chip mounting plate is soldered to the base body using a high-expansion, low-temperature solder.
[0007] Preferably, the heat sink and the boss are made of copper.
[0008] Preferably, the chip mounting plate is made of ceramic gold-plated material.
[0009] The beneficial effects of this utility model are:
[0010] Adding a heat sink improves heat dissipation. Using high-expansion, low-temperature solder ensures a stable connection between the chip mounting plate and the base body, which have different expansion rates at high temperatures, without cracking. The chip mounting plate is made of ceramic gold-plated material, which not only fixes the chip but also has good thermal conductivity. Connecting the heat sink enhances the chip's heat dissipation. Attached Figure Description
[0011] Figure 1 This is a cross-sectional view of the present invention.
[0012] Figure 2 Top view of this utility model
[0013] Figure 3 Right view of this utility model
[0014] Figure 4 Top view of the base body
[0015] In the diagram: 1 is the base body; 2 is the heat sink; 3 is the chip fixing plate; 4 is the insulator; 5 is the wire; 11 is the wire connection hole; 12 is the heat dissipation hole; 21 is the boss. Detailed Implementation
[0016] Example 1
[0017] A high-efficiency heat dissipation base includes a base body 1, a heat sink 2, wires 5, insulators 4, and a chip fixing plate 3. The base body 1 has a heat dissipation hole 12 at its top center. The heat sink 2 has a protrusion 21 that can pass through the heat dissipation hole 12. The base body 1 is sleeved on the heat sink 2. The chip fixing plate 3 is fixed above the heat dissipation hole 12. The base body 1 is sleeved on the heat sink 2. The protrusion 21 passes through the heat dissipation hole 12 and connects to the bottom of the chip fixing plate 3. The base body 1 also has wire connection holes 11, which are distributed on both sides of the chip fixing plate 3. An insulator 4 is disposed in the wire connection hole 11. The wires 5 pass through the insulator 4 from the bottom of the base body 1 and are bonded to the base body 1. The top surfaces of the base body 1 and the chip fixing plate 3 are gold-plated.
[0018] The base body 1 is made of Kovar alloy.
[0019] The chip mounting plate 3 is welded to the base body 1 using a high-expansion, low-temperature solder.
[0020] The heat sink 2 and the boss are made of copper.
[0021] The chip mounting plate 3 is made of ceramic material.
[0022] Adding a heat sink 2 improves heat dissipation. Using a high-expansion, low-temperature solder allows the chip fixing plate 3 and the base body 1, which have different high-temperature expansion rates, to be stably connected in a high-temperature environment without cracking. The chip fixing plate 3 is made of ceramic gold-plated material, which not only fixes the chip but also has good thermal conductivity. Connecting the heat sink 2 can enhance the chip's heat dissipation effect.
Claims
1. A high-efficiency heat dissipation base, characterized in that, The device includes a base body (1), a heat sink (2), a wire (5), an insulator (4), and a chip fixing plate (3). The base body (1) has a heat dissipation hole (12) at the top center. The heat sink (2) has a boss (21) that can pass through the heat dissipation hole (12). The base body (1) is sleeved on the heat sink (2). The chip fixing plate (3) is fixed above the heat dissipation hole (12). The base body (1) is sleeved on the heat sink (2). The boss (21) passes through the heat dissipation hole (12) and connects to the bottom of the chip fixing plate (3). The base body (1) also has wire connection holes (11) distributed on both sides of the chip fixing plate (3). An insulator (4) is provided in the wire connection hole (11). The wire (5) passes through the insulator (4) from the bottom of the base body (1) and is bonded to the base body (1). The top surfaces of the base body (1) and the chip fixing plate (3) are gold plated. The base body (1) is made of Kovar alloy; The chip mounting plate (3) is welded to the base body (1) by high expansion low temperature solder; The heat sink (2) and the boss are made of copper; The chip fixing plate (3) is made of ceramic material.