Split type rectifier bridge structure

Abstract

According to the technical scheme, the split type rectifier bridge structure is characterized in that the split type rectifier bridge structure comprises a shell, a mounting groove is formed in the top face of the shell, a copper sheet bridge frame is arranged in the mounting groove, the top face of the copper sheet bridge frame is connected with two diode chips, and the top face of the copper sheet bridge frame is connected with an extraction electrode; the heat dissipation assembly is arranged in the shell and used for dissipating heat of the rectifier bridge, the first insulating layer is a ceramic substrate, heat generated by the diode chip is absorbed through the first insulating layer, then the heat is transmitted to the outside through the aluminum plate for heat dissipation, and the purpose of heat dissipation is achieved; heat-conducting silica gel can be filled between the first insulating layer and the aluminum plate through the filling holes, thermal resistance between components is reduced, the heat dissipation effect is improved, heat on the back of the rectifier bridge is absorbed through the second insulating layer, heat absorbed by the second insulating layer is diffused in cooperation with a heat dissipation copper sheet, and the overall heat dissipation efficiency and capacity of the rectifier bridge are further improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor rectification technology, specifically to a split-type rectifier bridge structure. Background Technology

[0002] A rectifier bridge is a rectifier diode encapsulated in a housing. There are full-bridge and half-bridge types. A full-bridge rectifier encapsulates all four diodes of a bridge rectifier circuit together, while a half-bridge rectifies half of the four diodes together. Two half-bridges can form a bridge rectifier circuit, and a single half-bridge can also form a full-wave rectifier circuit with a transformer and a center tap. When selecting a rectifier bridge, the rectifier circuit and operating voltage must be considered. As a power component, the rectifier bridge is widely used in various power supply devices.

[0003] For example, Chinese patent CN216252555U proposes a split rectifier bridge structure. In this component, the insulating layer and central pillar are integrally die-cast from epoxy resin. Epoxy resin has good heat resistance, alkali resistance, and electrical insulation. The integral molding of the insulating layer and central pillar creates a seamless electrical insulation layer between the semi-finished rectifier bridge and the aluminum plate, ensuring reliable insulation. Because it is a seamless electrical insulation layer, the insulation gap between the semi-finished rectifier bridge and the aluminum plate can be smaller than with gapped insulation layers, achieving safe insulation performance with a thinner insulation layer. A thinner insulation layer also facilitates heat conduction to the aluminum plate, further increasing the rectifier bridge's heat dissipation capacity. The semi-finished rectifier bridge includes diode chips, copper bridge plates, and lead-out electrodes. The diode chips and lead-out electrodes are fixedly connected to the copper bridge plates. However, in this design, single-sided heat dissipation is insufficient, and overheating is still likely. Therefore, we propose a split rectifier bridge structure. Utility Model Content

[0004] In view of the problems mentioned in the background art, the purpose of this utility model is to provide a split rectifier bridge structure to solve the problems mentioned in the background art.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0006] The split-type rectifier bridge structure includes: a housing, the top surface of which has a mounting groove, a copper plate bridge is arranged inside the mounting groove, two diode chips are connected to the top surface of the copper plate bridge, and lead electrodes are connected to the top surface of the copper plate bridge; and a heat dissipation assembly, which is arranged inside the housing and is used to dissipate heat from the rectifier bridge.

[0007] By adopting the above technical solution and setting up a heat dissipation component, the rectifier bridge can be cooled during use, thus preventing overheating and reducing its service life.

[0008] Preferably, the heat dissipation assembly includes: a limiting post connected to the top surface of the copper sheet bridge, a support block connected to the outer wall of the limiting post, and a first insulating layer connected to the top surface of the support block; and an aluminum plate connected to one end of the limiting post, with a filling hole formed on the top surface of the aluminum plate.

[0009] By adopting the above technical solution, by setting a first insulating layer, which is a ceramic substrate, the heat generated by the diode chip is absorbed by the first insulating layer, and then the heat is transferred to the outside through the aluminum plate for heat dissipation, thereby achieving the purpose of heat dissipation. Thermally conductive silicone can also be filled between the first insulating layer and the aluminum plate through the filling hole to reduce the thermal resistance between components and improve the heat dissipation effect.

[0010] Preferably, the heat dissipation assembly further includes a heat-conducting hole, which is formed on the top surface of the limiting post.

[0011] By adopting the above technical solution, by setting heat conduction holes, and by making the limiting column a high-heat material, the flowing gas can carry away the heat absorbed by the limiting column through the heat conduction holes, thereby improving practicality.

[0012] Preferably, a second insulating layer is connected to the bottom surface of the copper sheet bridge, and a heat dissipation copper sheet is connected to the bottom surface of the second insulating layer.

[0013] By adopting the above technical solution and setting a second insulation layer, the heat from the back of the rectifier bridge is absorbed by the second insulation layer during use. In addition, the heat dissipation copper fins diffuse the heat absorbed by the second insulation layer, thereby further improving the overall heat dissipation efficiency and capacity of the rectifier bridge.

[0014] Preferably, a plurality of air guide grooves are provided on one side of the outer casing.

[0015] By adopting the above technical solution and setting up air guide channels, the airflow can come into closer contact with the heat sink copper fins, thereby improving heat dissipation efficiency.

[0016] Preferably, the inner bottom surface of the housing is connected to a plurality of buffer pads, the top surface of the buffer pads is provided with a fixing groove, the top surface of the copper sheet bridge is provided with a plurality of fixing holes, the positions of the fixing holes correspond to the positions of the fixing grooves, and fixing bolts are movably fitted inside the fixing holes.

[0017] By adopting the above technical solution and setting up buffer pads, the copper sheet bridge can be effectively supported, vibration energy can be absorbed, electronic equipment in the rectifier bridge can be protected, and practicality can be improved.

[0018] In summary, the present invention has the following main advantages:

[0019] By setting a first insulating layer, which is a ceramic substrate, the heat generated by the diode chip is absorbed by the first insulating layer, and then the heat is transferred to the outside through the aluminum plate for heat dissipation, thus achieving the purpose of heat dissipation. Thermally conductive silicone can also be filled between the first insulating layer and the aluminum plate through the filling hole to reduce the thermal resistance between components and improve the heat dissipation effect. By setting a second insulating layer, the heat on the back of the rectifier bridge is absorbed by the second insulating layer during use, and the heat dissipation copper plate further diffuses the heat absorbed by the second insulating layer, thereby further improving the overall heat dissipation efficiency and capability of the rectifier bridge.

[0020] By setting up air guide channels, the airflow can make better contact with the heat sink copper fins, improving heat dissipation efficiency. By setting up buffer pads, the copper fin bridge can be effectively supported, and the buffer pads can absorb vibration energy, protecting the electronic equipment in the rectifier bridge and improving practicality. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0022] Figure 2 This is a schematic diagram of the outer shell structure of this utility model;

[0023] Figure 3 This is a cross-sectional schematic diagram of the copper sheet cable tray of this utility model;

[0024] Figure 4 This is a cross-sectional schematic diagram of the buffer pad of this utility model;

[0025] Reference numerals: 1. Outer shell; 2. Mounting slot; 3. Copper bridge; 4. Diode chip; 5. Lead electrode; 6. Limiting post; 7. Support block; 8. First insulating layer; 9. Aluminum plate; 10. Filling hole; 11. Heat conduction hole; 12. Second insulating layer; 13. Heat dissipation copper sheet; 14. Air guide groove; 15. Buffer pad; 16. Fixing groove; 17. Fixing hole. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] refer to Figures 1-4The split-type rectifier bridge structure includes a housing 1. A mounting groove 2 is formed on the top surface of the housing 1. A copper plate bridge 3 is installed inside the mounting groove 2. Two diode chips 4 are connected to the top surface of the copper plate bridge 3, and lead electrodes 5 are also connected to the top surface of the copper plate bridge 3. A heat dissipation component is located inside the housing 1 to dissipate heat from the rectifier bridge. By setting up the heat dissipation component, the rectifier bridge is cooled during use, preventing overheating and reducing its lifespan. The heat dissipation component includes a limiting post 6 connected to the top surface of the copper plate bridge 3. A support block 7 is connected to the outer wall of the limiting post 6, and a first insulating layer 8 is connected to the top surface of the support block 7. One end of the limiting post 6 is connected to... An aluminum plate 9 is attached, and a filling hole 10 is opened on the top surface of the aluminum plate 9. By setting a first insulating layer 8, which is a ceramic substrate, the heat generated by the diode chip 4 is absorbed by the first insulating layer 8, and then the heat is transferred to the outside through the aluminum plate 9 for heat dissipation, thus achieving the purpose of heat dissipation. Thermally conductive silicone can also be filled between the first insulating layer 8 and the aluminum plate 9 through the filling hole 10 to reduce the thermal resistance between components and improve the heat dissipation effect. The heat dissipation component also includes a thermally conductive hole 11, which is opened on the top surface of the limiting post 6. By setting the thermally conductive hole 11, the limiting post 6 is also made of a high-heat material. The thermally conductive hole 11 allows the flowing gas to carry away the heat absorbed by the limiting post 6, improving practicality.

[0028] Reference Figures 1-4 The bottom surface of the copper plate bridge 3 is connected to a second insulating layer 12, and the bottom surface of the second insulating layer 12 is connected to a heat dissipation copper fin 13. By setting the second insulating layer 12, heat is absorbed from the back of the rectifier bridge during use. The heat dissipation copper fin 13 further diffuses the heat absorbed by the second insulating layer 12, thereby improving the overall heat dissipation efficiency and capacity of the rectifier bridge. Multiple air guide slots 14 are provided on one side of the outer casing 1. By setting the air guide slots 14, the airflow can come into closer contact with the heat dissipation copper fin 13, thereby improving the heat dissipation efficiency. Multiple buffer pads 15 are connected to the bottom surface of the inner surface of the outer casing 1. The top surface of the buffer pads 15 is provided with a fixing groove 16. Multiple fixing holes 17 are provided on the top surface of the copper plate bridge 3. The positions of the fixing holes 17 correspond to the positions of the fixing grooves 16. Fixing bolts are movably fitted inside the fixing holes 17. By setting the buffer pads 15, the copper plate bridge 3 can be effectively supported. The buffer pads 15 can absorb vibration energy, protect the electronic equipment in the rectifier bridge, and improve practicality.

[0029] Working principle: Please refer to Figures 1-4As shown, by setting a first insulating layer 8, which is a ceramic substrate, the heat generated by the diode chip 4 is absorbed by the first insulating layer 8, and then the heat is transferred to the outside through the aluminum plate 9 for heat dissipation, thus achieving the purpose of heat dissipation. Thermally conductive silicone can also be filled between the first insulating layer 8 and the aluminum plate 9 through the filling hole 10 to reduce the thermal resistance between components and improve the heat dissipation effect. By setting a second insulating layer 12, the heat on the back of the rectifier bridge is absorbed during use, and the heat absorbed by the second insulating layer 12 is diffused in conjunction with the heat sink copper plate 13, further improving the overall heat dissipation efficiency and capacity of the rectifier bridge. By setting an air guide groove 14, the airflow can come into closer contact with the heat sink copper plate 13, improving the heat dissipation efficiency. By setting a buffer pad 15, the buffer pad 15 can provide effective support for the copper plate bridge 3, and the buffer pad 15 can absorb vibration energy, protect the electronic equipment in the rectifier bridge, and improve practicality.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A split-type rectifier bridge structure, characterized in that, include: The outer casing (1) has a mounting groove (2) on its top surface. A copper plate bridge (3) is provided inside the mounting groove (2). Two diode chips (4) are connected to the top surface of the copper plate bridge (3). Lead-out electrodes (5) are connected to the top surface of the copper plate bridge (3). A heat dissipation component is disposed inside the housing (1) and is used to dissipate heat from the rectifier bridge.

2. The split-type rectifier bridge structure according to claim 1, characterized in that, The heat dissipation component includes: A limiting post (6) is connected to the top surface of the copper sheet bridge (3). A support block (7) is connected to the outer wall of the limiting post (6). A first insulating layer (8) is connected to the top surface of the support block (7). An aluminum plate (9) is connected to one end of the limiting post (6), and a filling hole (10) is provided on the top surface of the aluminum plate (9).

3. The split-type rectifier bridge structure according to claim 2, characterized in that, The heat dissipation component also includes: Heat conduction hole (11) is formed on the top surface of the limiting post (6).

4. The split-type rectifier bridge structure according to claim 1, characterized in that, The bottom surface of the copper sheet bridge (3) is connected to a second insulating layer (12), and the bottom surface of the second insulating layer (12) is connected to a heat dissipation copper sheet (13).

5. The split-type rectifier bridge structure according to claim 1, characterized in that, Multiple air guide grooves (14) are provided on one side of the outer shell (1).

6. The split-type rectifier bridge structure according to claim 1, characterized in that, The inner bottom surface of the outer shell (1) is connected to a plurality of buffer pads (15), the top surface of the buffer pads (15) is provided with a fixing groove (16), the top surface of the copper sheet bridge (3) is provided with a plurality of fixing holes (17), the position of the fixing holes (17) corresponds to the position of the fixing grooves (16), and the fixing bolts are movably fitted inside the fixing holes (17).

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