Novel crystal oscillator packaging structure

Abstract

The utility model relates to a novel crystal oscillator packaging structure, which comprises a packaging shell, a wafer and a sealing cover, and is characterized in that the inner bottom surface of the packaging shell is provided with a plurality of rows of lower heat dissipation through holes, the outer bottom surface of the packaging shell is provided with a plurality of horizontal straight-through grooves, and the horizontal straight-through grooves extend from the left side surface of the packaging shell to the right side surface of the packaging shell; the top face of the horizontal straight-through groove is communicated with the lower heat dissipation through holes, Z-direction heat conduction silica gel columns are injected into the lower heat dissipation through holes, X-direction heat conduction silica gel strips connected with the Z-direction heat conduction silica gel columns are arranged in the horizontal straight-through groove, and metal supporting ribs which are through in length with the X-direction heat conduction silica gel strips are arranged in the X-direction heat conduction silica gel strips. A plurality of rows of upper heat dissipation through holes are formed between the bottom face of the horizontal heat dissipation cavity and the bottom face of the sealing cover, the front end face and the rear end face of the sealing cover are communicated with the horizontal heat dissipation cavity, and an insulating heat conduction film is fixed to the bottom face of the sealing cover. The crystal oscillator packaging structure solves the problem that an existing crystal oscillator packaging structure is poor in heat dissipation performance, the heat dissipation performance is good, the sealing performance is guaranteed, and the crystal oscillator packaging structure is suitable for being used in various occasions.

Description

Technical Field

[0001] This utility model relates to the field of crystal oscillator structure technology, specifically to a novel crystal oscillator packaging structure. Background Technology

[0002] A crystal oscillator, or simply crystal, is made using a quartz crystal wafer that exhibits piezoelectricity. After prolonged use, crystal oscillators accumulate a significant amount of heat, necessitating the design of appropriate heat dissipation structures.

[0003] For example, CN 218829875 U discloses a heat dissipation packaging structure for a crystal oscillator, which includes a crystal oscillator body. A heat sink is disposed inside the crystal oscillator body, and several ventilation holes are provided through the sidewalls of the crystal oscillator body. A protective mesh and a protective cover are coaxially fitted around the outside of the crystal oscillator body from the inside out. Several mesh holes are provided through the sidewalls of the protective mesh, and the horizontal projection of the ventilation holes is located within the protective mesh. The protective cover includes a fixed cover fixedly fitted onto the outer wall of the crystal oscillator body and a movable cover that can move freely vertically on the outer wall of the fixed cover. The top of the fixed cover is higher than the top of the protective cover. A cleaning brush is horizontally arranged around the inner wall of the movable cover. The cleaning brush includes a cleaning seat and bristles surrounding the inner wall of the cleaning seat, with the bristles abutting against the outer wall of the protective mesh. A slot adapted to the cleaning seat is opened at the bottom of the inner wall of the movable cover, and the cleaning seat is detachably inserted into the slot. This structure can clean the protective mesh, prevent dust from adhering to the surface of the protective mesh, and thus ensure heat dissipation efficiency. However, the following problems exist during use: 1. During normal operation, the protective mesh isolates the interior from the outside, resulting in poor sealing; 2. Its cleaning components occupy a large space, making it unsuitable for use in crystal oscillator installation environments, and some dust may enter the crystal body during the brush cleaning process. In summary, although this structure has good heat dissipation, it also introduces many new problems. Utility Model Content

[0004] The purpose of this invention is to provide a novel crystal oscillator packaging structure that is structurally sound and reliable in use, solving the problem of poor heat dissipation in existing crystal oscillator packaging structures. It not only has good heat dissipation but also ensures sealing, making it suitable for use in various applications.

[0005] The technical solution of this utility model is:

[0006] A novel crystal oscillator packaging structure includes a packaging shell, a wafer located within the packaging shell, and a cap disposed at the upper end of the packaging shell. The key technical features are: the inner bottom surface of the packaging shell has multiple rows of lower heat dissipation through-holes; the outer bottom surface of the packaging shell has multiple horizontal through-grooves extending from the left side to the right side of the packaging shell; the number of horizontal through-grooves is equal to and corresponds one-to-one with the number of rows of lower heat dissipation through-holes; the top surface of each horizontal through-grooves communicates with each corresponding row of lower heat dissipation through-hole; Z-directing thermally conductive silicone pillars are injected into the lower heat dissipation through-holes; X-directing thermally conductive silicone strips connected to the Z-directing thermally conductive silicone pillars are disposed in the horizontal through-grooves; the X-directing thermally conductive silicone strips have internally embedded metal support ribs extending the same length as the pillars; the cap has a horizontal heat dissipation cavity; multiple rows of upper heat dissipation through-holes are provided between the bottom surface of the horizontal heat dissipation cavity and the bottom surface of the cap; the front and rear end faces of the cap communicate with the horizontal heat dissipation cavity; and an insulating thermally conductive film is fixed to the bottom surface of the cap.

[0007] In the aforementioned novel crystal oscillator packaging structure, the metal support rib is composed of a cylindrical rib and two horizontal fins symmetrically arranged on the outer side of the cylindrical rib.

[0008] In the aforementioned novel crystal oscillator packaging structure, the horizontal through groove has a semi-circular cross-section, and the X-shaped thermally conductive silicone strip has a semi-circular cross-section that matches the horizontal through groove.

[0009] In the novel crystal oscillator packaging structure described above, conductive adhesive is provided between the sidewall of the wafer and the inner side of the packaging shell, and the outer sidewall of the packaging shell is provided with a groove and an electrode electrically connected to the conductive adhesive is provided in the groove.

[0010] The beneficial effects of this utility model are:

[0011] 1. The heat generated by the chip is transferred to the outside through the Z-shaped thermal conductive silicone pillars and X-shaped thermal conductive silicone strips at its bottom, and also through the insulating thermal conductive film, upper heat dissipation through-holes and horizontal heat dissipation cavity at its top, solving the problem of poor heat dissipation in existing crystal oscillator packaging structures. At the same time, the Z-shaped thermal conductive silicone pillars and insulating thermal conductive film ensure sealing.

[0012] 2. The X-guided heat-conducting silicone strip conducts heat outward through its left and right ends, and connects to the installation site through its bottom surface, which facilitates the transfer of heat to the radiator at the installation site. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model;

[0014] Figure 2 yes Figure 1 Mid-section view.

[0015] In the diagram: 1. Cover, 2. Horizontal heat dissipation cavity, 3. Upper heat dissipation through hole, 4. Insulating thermal conductive film, 5. Wafer, 6. Z-direction thermally conductive silicone pillar, 7. Conductive adhesive, 8. Encapsulation shell, 9. Electrode, 10. Groove, 11. X-direction thermally conductive silicone strip, 12. Metal support rib. Detailed Implementation

[0016] The present invention will be described in detail with reference to the accompanying drawings.

[0017] like Figure 1 , Figure 2 As shown, the novel crystal oscillator packaging structure includes a packaging shell 8, a wafer 5 located in the packaging shell 8, and a cover 1 disposed at the upper end of the packaging shell 8.

[0018] The inner bottom surface of the encapsulation shell 8 is provided with multiple rows of lower heat dissipation holes, and the outer bottom surface of the encapsulation shell 8 is provided with multiple horizontal straight grooves, which extend from the left side of the encapsulation shell 8 to the right side of the encapsulation shell 8.

[0019] The number of horizontal straight-through grooves is equal to and corresponds one-to-one with the number of rows of lower heat dissipation through holes. The top surface of each horizontal straight-through groove communicates with each lower heat dissipation through hole in the corresponding row. Z-shaped heat-conducting silicone pillars 6 are injected into each lower heat dissipation through hole. An X-shaped heat-conducting silicone strip 11, connected to the Z-shaped heat-conducting silicone pillars 6, is provided in each horizontal straight-through groove. A metal support rib 12, extending the same length as the X-shaped heat-conducting silicone strip 11, is built into each X-shaped heat-conducting silicone strip 11. In this embodiment, the metal support rib 12 consists of a cylindrical rib and two horizontal fins symmetrically arranged on the outside of the cylindrical rib. The cross-section of the horizontal straight-through groove is semi-circular, and the cross-section of the X-shaped heat-conducting silicone strip 11 is a semi-circular shape matching the horizontal straight-through groove.

[0020] The cover 1 has a horizontal heat dissipation cavity 2. Multiple rows of upper heat dissipation through holes 3 are provided between the bottom surface of the horizontal heat dissipation cavity 2 and the bottom surface of the cover 1. The front and rear end faces of the cover 1 are connected to the horizontal heat dissipation cavity 2. An insulating thermally conductive film 4 is also fixed to the bottom surface of the cover 1.

[0021] In this embodiment, conductive adhesive 7 is provided between the sidewall of the wafer 5 and the inner side of the package shell 8, and the outer sidewall of the package shell 8 is provided with a groove 10 and an electrode 9 electrically connected to the conductive adhesive 7 is provided in the groove 10.

[0022] Working principle:

[0023] When in use, the heat generated by the chip 5 is transferred to the outside through the multiple rows of Z-guided thermal silicone pillars 6 and multiple X-guided thermal silicone strips 11 at its bottom, and also through the insulating thermal conductive film 4, various upper heat dissipation holes 3 and horizontal heat dissipation cavity 2 at its top, resulting in good heat dissipation.

[0024] The embodiments of this utility model have been described in detail above, but the content described is only a preferred embodiment of this utility model and should not be considered as limiting the scope of implementation of this utility model. All equivalent changes and improvements made within the scope of this utility model should still fall within the scope of this patent.

Claims

1. A novel crystal oscillator packaging structure, comprising a packaging shell, a wafer located within the packaging shell, and a cap disposed at the upper end of the packaging shell, characterized in that: The inner bottom surface of the encapsulation shell has multiple rows of lower heat dissipation through holes, and the outer bottom surface of the encapsulation shell has multiple horizontal straight through grooves. The horizontal straight through grooves extend from the left side to the right side of the encapsulation shell. The number of horizontal straight through grooves is equal to the number of rows of lower heat dissipation through holes and corresponds one-to-one. The top surface of the horizontal straight through grooves communicates with each lower heat dissipation through hole in the corresponding row. Z-guided thermal silicone pillars are injected into the lower heat dissipation through holes. X-guided thermal silicone strips connected to the Z-guided thermal silicone pillars are provided in the horizontal straight through grooves. Metal support ribs of the same length as the X-guided thermal silicone strips are built into the X-guided thermal silicone strips. The cover has a horizontal heat dissipation cavity. Multiple rows of upper heat dissipation through holes are provided between the bottom surface of the horizontal heat dissipation cavity and the bottom surface of the cover. The front and rear end faces of the cover communicate with the horizontal heat dissipation cavity. An insulating thermally conductive film is also fixed to the bottom surface of the cover.

2. The novel crystal oscillator packaging structure according to claim 1, characterized in that: The metal support rib consists of a cylindrical rib and two horizontal fins symmetrically arranged on the outside of the cylindrical rib.

3. The novel crystal oscillator packaging structure according to claim 1, characterized in that: The horizontal straight channel has a semi-circular cross-section, and the X-guided heat-conducting silicone strip has a semi-circular cross-section that matches the horizontal straight channel.

4. The novel crystal oscillator packaging structure according to claim 1, characterized in that: Conductive adhesive is provided between the sidewall of the wafer and the inner side of the package shell, and the outer sidewall of the package shell is provided with a groove and an electrode electrically connected to the conductive adhesive is provided in the groove.

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