Gas compression radiator and camera

Abstract

The utility model relates to a gas compression radiator and a camera, and relates to the technical field of cameras, the gas compression radiator comprises a heat dissipation shell, first heat dissipation fins, a gas inlet connector and a gas outlet connector, and a first heat dissipation cavity is formed in the heat dissipation shell; the first heat dissipation fins are arranged in the first heat dissipation cavity; the air inlet connector is arranged on one side of the heat dissipation shell, and the air inlet connector is configured to introduce compressed air flowing through the first heat dissipation fins into the first heat dissipation cavity; the air outlet connector is arranged on the other side of the heat dissipation shell and is configured to exhaust air passing through the first heat dissipation fins. Compared with the prior art, the compressed air is used for heat dissipation, a conventional fan structure is omitted, the structure is compact, the occupied space is reduced, miniaturization of the camera is facilitated, meanwhile, the design of the air inlet connector and the air outlet connector can be suitable for a vacuum space, and the problem of water-cooling medium leakage caused by water-cooling design is solved.

Description

Technical Field

[0001] This application relates to the field of camera technology, and more specifically, to a gas compression radiator and a camera. Background Technology

[0002] Image sensors and some high-power components in their hardware circuitry are the main heat sources in cameras. Generally, heat is transferred to the outside through a heat sink. For cooled cameras, a thermoelectric cooler is used to cool the sensor and then the heat is transferred out through a heat sink.

[0003] Common methods for active heat exchange with radiators include: 1. Air cooling, which uses a fan to dissipate heat; 2. Water cooling, which uses circulating water to remove heat; and 3. A cooling structure that combines fan cooling and circulating water cooling.

[0004] However, fan-cooled systems require a large space, and the vibration of the fan itself can affect image quality. Furthermore, fan-cooled structures are not suitable for vacuum environments. Water cooling may pose a risk of leakage in the piping, contaminating the camera or other equipment using it. Water pipe joints may also experience electrochemical corrosion, clogging the pipes and causing cooling failure. Utility Model Content

[0005] The purpose of this application is to provide a gas compression radiator and camera that utilize compressed gas for heat dissipation, have a compact structure, reduce space occupation, facilitate camera miniaturization, are suitable for vacuum spaces, and avoid the problem of water cooling medium leakage.

[0006] To achieve the above objectives, the embodiments of this utility model employ the following solutions:

[0007] In one aspect, this utility model provides a gas compression radiator, comprising:

[0008] A heat dissipation housing, wherein a first heat dissipation cavity is provided inside the heat dissipation housing;

[0009] The first heat dissipation fin is disposed inside the first heat dissipation cavity;

[0010] An air inlet connector is disposed on one side of the heat dissipation housing and communicates with the first heat dissipation cavity, and the air inlet connector is configured to introduce compressed gas flowing through the first heat dissipation fins into the first heat dissipation cavity.

[0011] An exhaust connector is provided on the other side of the heat dissipation housing and communicates with the first heat dissipation cavity. The exhaust connector is configured to discharge gas passing through the first heat dissipation fins.

[0012] In an optional embodiment, the gas compression radiator further includes a second heat dissipation fin, and the heat dissipation housing is further provided with a second heat dissipation cavity separated from the first heat dissipation cavity. The second heat dissipation fin is disposed in the second heat dissipation cavity. The air inlet connector is connected to the second heat dissipation cavity and is configured to introduce compressed gas flowing through the second heat dissipation fin into the second heat dissipation cavity. The air outlet connector is connected to the second heat dissipation cavity and is configured to discharge the gas that has passed through the second heat dissipation fin.

[0013] In an optional embodiment, the heat dissipation housing includes a first heat dissipation housing and a second heat dissipation housing, the first heat dissipation housing and the second heat dissipation housing are overlapped and detachably connected, a first heat dissipation cavity is formed in the first heat dissipation housing, a second heat dissipation cavity is formed in the second heat dissipation housing, the air inlet is connected to one side of both the first heat dissipation housing and the second heat dissipation housing, and the air outlet is connected to the other side of both the first heat dissipation housing and the second heat dissipation housing.

[0014] In an optional embodiment, the first heat dissipation shell includes a first cover and a first base plate. The first cover is disposed on the first base plate and forms the first heat dissipation cavity. The first heat dissipation fins are disposed on the first base plate. The second heat dissipation shell includes a second cover and a second base plate. The second cover is disposed on the second base plate and forms the second heat dissipation cavity. The second heat dissipation fins are disposed on the second base plate. The side of the first base plate away from the first cover is connected to the side of the second cover away from the second base plate.

[0015] In an optional embodiment, the surface of the first base plate is provided with a first channel, and a first annular seal is provided in the first channel. The first cap abuts against the first annular seal to seal the first cap and the first base plate. The surface of the second base plate is provided with a second channel, and a second annular seal is provided in the second channel. The second cap abuts against the second annular seal to seal the second cap and the second base plate. And / or, the side wall of the first cap near the vent connector is provided with a first flared channel, one end of which connects to the first heat dissipation cavity and the other end of which connects to the vent connector. The side wall of the second cap near the vent connector is provided with a second flared channel, one end of which connects to the second heat dissipation cavity and the other end of which connects to the vent connector. And / or, the side of the first base plate near the second base plate is further provided with a first groove, configured to partially accommodate a heat pipe connected to a first heat source. The side of the second base plate away from the first base plate is further provided with a second groove, configured to accommodate a second heat source.

[0016] In an optional embodiment, the first cover is provided with a first inlet channel and a first confluence cavity on the side wall near the air inlet connector. One end of the first inlet channel is connected to the air inlet connector and the other end is connected to the first confluence cavity. A first slit nozzle is formed between the side wall of the first cover near the air inlet connector and the first base plate. One side of the first slit nozzle is connected to the first heat dissipation cavity and the other side is connected to the first confluence cavity.

[0017] The second cover has a second inlet channel and a second confluence cavity on its side wall near the air inlet connector. One end of the second inlet channel is connected to the air inlet connector and the other end is connected to the second confluence cavity. A second slit nozzle is formed between the side wall of the second cover near the air inlet connector and the second base plate. One side of the second slit nozzle is connected to the second heat dissipation cavity and the other side is connected to the second confluence cavity.

[0018] In an optional embodiment, the slit width of both the first slit nozzle and the second slit nozzle is less than 1 mm.

[0019] In an optional embodiment, the first cover has a first flared channel on the side wall near the air outlet connector, one end of the first flared channel is connected to the first heat dissipation cavity, and the other end is connected to the air outlet connector; the second cover has a second flared channel on the side wall near the air outlet connector, one end of the second flared channel is connected to the second heat dissipation cavity, and the other end is connected to the air outlet connector.

[0020] In an optional embodiment, a first groove is provided on the side of the first base plate near the second base plate, the first groove being configured to partially accommodate a heat pipe connected to a first heat source; a second groove is also provided on the side of the second base plate away from the first base plate, the second groove being configured to accommodate a second heat source.

[0021] Secondly, this utility model provides a camera, including a camera housing, a control module, a sensing module, and the aforementioned gas compression radiator. The radiator housing, the control module, and the sensing module are all disposed within the camera housing, and the first radiator fins are configured to exchange heat with the control module and / or the sensing module.

[0022] In an optional embodiment, the sensing module includes a sensor and a thermoelectric cooler configured to exchange heat with the sensor, wherein the first heat dissipation fins are configured to exchange heat with the thermoelectric cooler.

[0023] The heat dissipation housing is further provided with a second heat dissipation cavity separated from the first heat dissipation cavity. The two ends of the second heat dissipation cavity are respectively connected to the air inlet and the air outlet. The second heat dissipation cavity is also provided with a second heat dissipation fin. The control module includes a motherboard, and the second heat dissipation fin is configured to achieve heat exchange with the motherboard.

[0024] In an optional embodiment, the sensing module further includes a sealing plate, the cold end of the thermoelectric cooler is configured to exchange heat with the sensor, and the hot end of the thermoelectric cooler is connected to one side of the sealing plate.

[0025] The camera housing is also provided with a heat pipe. One end of the heat pipe is connected to the other side of the sealing plate and is configured to exchange heat with the thermoelectric cooler. The other end of the heat pipe extends toward the first heat dissipation fin, which is configured to exchange heat with the heat pipe.

[0026] Through the above technical solution, this utility model provides a first heat dissipation fin within the first heat dissipation cavity of the heat dissipation housing. An air inlet and an air outlet are respectively provided on both sides of the heat dissipation housing. The air inlet is configured to introduce compressed gas into the first heat dissipation cavity, allowing the compressed gas to flow through the first heat dissipation fins. The air outlet is configured to discharge the gas after heat exchange through the first heat dissipation fins, thereby achieving heat dissipation. Compared to existing technologies, this utility model utilizes compressed gas for heat dissipation, eliminating the need for a conventional fan structure. This results in a compact structure, reduced space occupation, and facilitates camera miniaturization. Furthermore, the design of the air inlet and outlet allows for application in vacuum spaces and avoids the leakage problem of water cooling media caused by water-cooling designs.

[0027] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 An exploded view of the gas compression radiator provided in the embodiment of this application;

[0030] Figure 2 This is a schematic cross-sectional view of a gas compression radiator provided in an embodiment of this application.

[0031] Figure 3An exploded view of the gas compression radiator provided in the embodiment of this application from a second perspective.

[0032] Figure 4 for Figure 3 A schematic diagram of the structure of the first cap;

[0033] Figure 5 This is a schematic diagram of the overall structure of the camera provided in an embodiment of this application;

[0034] Figure 6 An exploded view of the camera provided in an embodiment of this application;

[0035] Figure 7 for Figure 5 A schematic diagram of the cross-sectional structure at point AA.

[0036] icon:

[0037] 100 - Gas compression radiator; 110 - Heat sink housing; 111 - First heat sink housing; 112 - Second heat sink housing; 113 - First cover; 1131 - First inlet channel; 1132 - First manifold cavity; 1133 - First slit nozzle; 1134 - First flared channel; 114 - First base plate; 1141 - First groove; 115 - Second cover; 1151 - Second inlet channel; 1152 - Second manifold cavity; 1153 - Second slit nozzle; 1154 - Second flared channel; 116 - Second base plate; 1161 - Second groove; 117-First channel; 118-Second channel; 120-First heat dissipation fin; 130-Inlet connector; 140-Outlet connector; 141-Sealing channel; 150-Second heat dissipation fin; 200-Camera; 210-Camera housing; 211-Upper shell; 213-Middle shell; 214-Lower shell; 220-Control module; 221-Main board; 222-Power components; 230-Sensing module; 231-Sensing circuit board; 232-Sensor; 233-Thermoelectric cooler; 234-Sealing plate; 235-Heat pipe. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0039] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0040] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] To address the shortcomings of current fan-based heat dissipation structures, such as large size and the impact of fan vibration on image quality, as well as the risks of water channel blockage and leakage associated with water cooling, this utility model provides a gas compression heat sink. It utilizes compressed gas for heat dissipation, eliminating the need for a conventional fan structure. This results in a compact structure, reduced space occupation, and facilitates camera miniaturization. Furthermore, the design of the air inlet and outlet connectors allows for application in vacuum spaces and avoids the leakage problems associated with water cooling designs.

[0042] See Figure 1 and Figure 2 The gas compression radiator 100 provided in this embodiment of the present invention includes a heat dissipation shell 110, a first heat dissipation fin 120, an air inlet connector 130, and an air outlet connector 140. A first heat dissipation cavity is provided inside the heat dissipation shell 110. The first heat dissipation fin 120 is disposed in the first heat dissipation cavity. The air inlet connector 130 is disposed on one side of the heat dissipation shell 110 and communicates with the first heat dissipation cavity. The air inlet connector 130 is configured to introduce compressed gas flowing through the first heat dissipation fin 120 into the first heat dissipation cavity. The air outlet connector 140 is disposed on the other side of the heat dissipation shell 110 and communicates with the first heat dissipation cavity. The air outlet connector 140 is configured to discharge the gas that has passed through the first heat dissipation fin 120.

[0043] It should be noted that the gas compression radiator 100 provided in this embodiment is suitable for industrial cameras 200, and can effectively dissipate heat from the internal heat source of the camera 200. The air inlet 130 is connected to an external air source, such as an air compressor or a throttled supply after storage in an air tank. Alternatively, it can be any other air supply method capable of providing constant pressure or constant flow gas. Specifically, the gas compression radiator 100 can be integrated into the camera housing 210 to dissipate heat from the camera 200. For most production plants or research facilities, clean compressed air is a readily available resource and conveniently used as a heat dissipation medium. Furthermore, after entering through the air inlet 130, the compressed air quickly flows through the first heat dissipation fins 120. This forced convection heat transfer using compressed air makes the heat dissipation structure more compact, eliminating the need for a conventional cooling fan structure, reducing space requirements, and facilitating the miniaturization of the camera 200. Meanwhile, the design of the air inlet connector 130 and the air outlet connector 140 allows the gas compression radiator 100 to be installed relatively sealed inside the camera 200. Only the air inlet connector 130 and the air outlet connector 140 are reserved, which can be used in vacuum spaces. At the same time, the gas leakage has less impact on the camera 200 itself or other equipment compared to water cooling leakage, avoiding the problem of water cooling medium leakage caused by water cooling design.

[0044] In addition, it should be noted that the position of the air outlet 140 may include, but is not limited to, the side opposite to or adjacent to the air inlet 130. The position of the air inlet 130 and the air outlet 140 should be such that they can connect to the first heat dissipation chamber and allow for gas flow.

[0045] Furthermore, the gas compression radiator 100 also includes a second heat dissipation fin 150, and a second heat dissipation cavity separated from the first heat dissipation cavity is also provided in the heat dissipation housing 110. The second heat dissipation fin 150 is disposed in the second heat dissipation cavity. The air inlet connector 130 is connected to the second heat dissipation cavity and is configured to introduce compressed gas flowing through the second heat dissipation fin 150 into the second heat dissipation cavity. The air outlet connector 140 is connected to the second heat dissipation cavity and is configured to discharge the gas passing through the second heat dissipation fin 150.

[0046] It is worth noting that the air inlet connector 130 and the air outlet connector 140 are preferably located on opposite sides of the heat dissipation housing 110, but this is not a limitation. In other preferred embodiments, the air inlet connector 130 and the air outlet connector 140 may also be located on adjacent sides, which is not further limited here. The air inlet connector 130 has two air inlet channels, which can respectively connect to the first heat dissipation cavity and the second heat dissipation cavity, thereby simultaneously providing compressed air to the first heat dissipation fin 120 and the second heat dissipation fin 150 to achieve forced convection heat transfer. The air outlet connector 140 can adopt a flared structure, simultaneously connecting to the first heat dissipation cavity and the second heat dissipation cavity, allowing the heat-exchanged gas to be discharged promptly and quickly. Of course, in other preferred embodiments, the air outlet connector 140 may also adopt the same structure as the air inlet connector 130, thereby reducing manufacturing costs.

[0047] It should be noted that in this embodiment, the first heat dissipation fin 120 and the second heat dissipation fin 150 can dissipate heat from different heat sources inside the camera 200, or they can dissipate heat from the same heat source. The specific configuration can be determined according to the structure of the camera 200.

[0048] See Figure 2 and Figure 3 In some embodiments, the heat dissipation housing 110 includes a first heat dissipation housing 111 and a second heat dissipation housing 112. The first heat dissipation housing 111 and the second heat dissipation housing 112 are overlapped and detachably connected. A first heat dissipation cavity is formed in the first heat dissipation housing 111, and a second heat dissipation cavity is formed in the second heat dissipation housing 112. An air inlet connector 130 is connected to one side of both the first heat dissipation housing 111 and the second heat dissipation housing 112, and an air outlet connector 140 is connected to the other side of both the first heat dissipation housing 111 and the second heat dissipation housing 112. Specifically, the first heat dissipation housing 111 and the second heat dissipation housing 112 are stacked vertically and are assembled together to form an integral structure by fixing screws. By adopting the overlapping design of the first heat dissipation housing 111 and the second heat dissipation housing 112, the first heat dissipation cavity and the second heat dissipation cavity can be separated from each other, and air leakage can be better avoided. Of course, in other preferred embodiments of this utility model, the first heat dissipation housing 111 and the second heat dissipation housing 112 can also be overlapped horizontally or vertically.

[0049] In some embodiments, the air inlet connector 130 and the air outlet connector 140 can be tightly fitted onto the assembled first heat sink 111 and second heat sink 112 by fixing screws. Furthermore, the mating surfaces of the air inlet connector 130 and the air outlet connector 140 are provided with sealing grooves 141, and an annular sealing structure is formed in the sealing grooves 141, for example, by filling with O-ring seals to achieve a sealing effect on the mating surfaces.

[0050] In some embodiments, the first heat sink 111 includes a first cover 113 and a first base plate 114. The first cover 113 covers the first base plate 114 and forms a first heat sink cavity. A first heat sink fin 120 is disposed on the first base plate 114. The second heat sink 112 includes a second cover 115 and a second base plate 116. The second cover 115 covers the second base plate 116 and forms a second heat sink cavity. A second heat sink fin 150 is disposed on the second base plate 116. The side of the first base plate 114 away from the first cover 113 is connected to the side of the second cover 115 away from the second base plate 116. Specifically, the first cover 113 and the first base plate 114 are fixedly assembled as a whole by fixing screws, and the second cover 115 and the second base plate 116 are also fixedly assembled as a whole by fixing screws.

[0051] In other preferred embodiments of this utility model, the second cover 115 and the first base plate 114 can also be designed as a single unit, thereby further reducing the thickness of the heat sink and improving the structural compactness.

[0052] Furthermore, the surface of the first base plate 114 is provided with a first channel 117, and a first annular seal (not labeled in the figure) is disposed in the first channel 117. The first cap 113 abuts against the first annular seal to achieve a sealed connection between the first cap 113 and the first base plate 114. The surface of the second base plate 116 is provided with a second channel 118, and a second annular seal (not labeled in the figure) is disposed in the second channel 118. The second cap 115 abuts against the second annular seal to achieve a sealed connection between the second cap 115 and the second base plate 116. The first and second annular seals can be O-rings, or they can be formed by filling with indium wire or other materials capable of achieving a seal.

[0053] It should be noted that the first heat dissipation fin 120 is integrally mounted on the first base plate 114 and has multiple first fin channels, each of which is arranged along the line connecting the inlet connector 130 and the outlet connector 140. The first channel 117 surrounds the first heat dissipation fin 120, and using the first annular seal, the first cover 113 and the first base plate 114 form a relatively sealed first heat dissipation cavity, ensuring that compressed gas flows through the multiple first fin channels to the outlet connector 140. Similarly, the second heat dissipation fin 150 is integrally mounted on the second base plate 116 and has multiple second fin channels, each of which is arranged along the line connecting the inlet connector 130 and the outlet connector 140. The second channel 118 is arranged around the second heat dissipation fin 150. The second annular seal allows the second cover 115 and the second base plate 116 to form a relatively sealed second heat dissipation cavity, ensuring that the compressed gas flows to the outlet connector 140 through multiple second fin channels.

[0054] See Figure 2 and Figure 4 In some embodiments, the first cover 113 has a first inlet channel 1131 and a first confluence cavity 1132 on its side wall near the air inlet connector. One end of the first inlet channel 1131 is connected to the air inlet connector, and the other end is connected to the first confluence cavity 1132. A first slit nozzle 1133 is formed between the side wall of the first cover 113 near the air inlet connector and the first base plate 114. One side of the first slit nozzle 1133 is connected to the first heat dissipation cavity, and the other side is connected to the first confluence cavity 1132. Specifically, the first inlet channel 1131 is circular and corresponds to the air inlet channel on the air inlet connector 130. The first confluence cavity 1132 is an air cavity structure. During actual heat dissipation, the gas is diverted through the air inlet connector 130 and enters the first inlet channel 1131 through the air inlet channel. After filling the first confluence cavity 1132, the gas is blown out through the first slit nozzle 1133.

[0055] In some embodiments, the second cover 115 is provided with a second inlet channel 1151 and a second confluence cavity 1152 on the side wall near the air inlet connector. One end of the second inlet channel 1151 is connected to the air inlet connector, and the other end is connected to the second confluence cavity 1152. A second slit nozzle 1153 is formed between the side wall of the second cover 115 near the air inlet connector and the second base plate 116. One side of the second slit nozzle 1153 is connected to the second heat dissipation cavity, and the other side is connected to the second confluence cavity 1152. Specifically, the second inlet channel 1151 is circular and is connected to the air inlet channel on the air inlet connector 130. The second confluence cavity 1152 is an air cavity structure. During actual heat dissipation, the gas is diverted through the air inlet connector 130 and enters the second inlet channel 1151 through the air inlet channel. After filling the second confluence cavity 1152, the gas is blown out through the second slit nozzle 1153.

[0056] Furthermore, the slit widths of both the first slit nozzle 1133 and the second slit nozzle 1153 are less than 1 mm. Both the first slit nozzle 1133 and the second slit nozzle 1153 are slit-shaped; the slit width here refers to the width of the first slit nozzle 1133 and the second slit nozzle 1153 along the height direction, and the slit width is much smaller than the horizontal extension width of the first slit nozzle 1133 and the second slit nozzle 1153. The first slit nozzle 1133 is formed by the fit between the first cover 113 and the first base plate 114, and the width of the entire first slit nozzle 1133 is equivalent to the corresponding width of the first heat dissipation fin 120. Similarly, the second slit nozzle 1153 is formed by the fit between the second cover 115 and the second base plate 116, and the width of the entire second slit nozzle 1153 is equivalent to the corresponding width of the second heat dissipation fin 150. Of course, the corresponding widths of the first heat dissipation fin 120 and the second heat dissipation fin 150 here refer to the horizontal width perpendicular to the airflow direction. By combining the confluence cavity and the slit nozzle, the originally concentrated gas jet can be transformed into a wider airflow surface, which is beneficial for blowing more fin surfaces to achieve convective heat transfer.

[0057] In some embodiments, the first cover 113 has a first flared channel 1134 on its side wall near the air outlet 140, one end of the first flared channel 1134 connecting to the first heat dissipation cavity and the other end connecting to the air outlet 140; the second cover 115 has a second flared channel 1154 on its side wall near the air outlet 140, one end of the second flared channel 1154 connecting to the second heat dissipation cavity and the other end connecting to the air outlet 140. Specifically, both the first flared channel 1134 and the second flared channel 1154 can be widened in the horizontal and / or vertical directions, thereby helping to reduce wind resistance and allowing hot air to flow out as quickly as possible.

[0058] See Figure 2 and Figure 3In some embodiments, a first groove 1141 is provided on the side of the first base plate 114 near the second base plate 116. The first groove 1141 is configured to partially accommodate a heat pipe 235 connected to a first heat source. A second groove 1161 is provided on the side of the second base plate 116 away from the first base plate 114. The second groove 1161 is configured to accommodate a second heat source. Specifically, the first groove 1141 corresponds to the top surface of the second sealing plate, thereby forming a space to accommodate the heat pipe 235. The heat pipe 235 can be accommodated in the first groove 1141 and attached to the first base plate 114, thereby exchanging heat with the first heat exchange fins. Furthermore, the other end of the heat pipe 235 can be bent and extended to the lower space of the camera 200, thereby directly reaching the first heat source. The second groove 1161 can directly accommodate the second heat source. Through this arrangement, the first heat dissipation fins 120 and the second heat dissipation fins 150 can respectively dissipate heat from the first heat source and the second heat source of the camera 200, improving heat dissipation efficiency.

[0059] See Figures 5 to 7 This utility model embodiment also provides a camera 200, including a camera housing 210, a control module 220, a sensing module 230, and the aforementioned gas compression radiator 100. The gas compression radiator 100 includes a heat dissipation housing 110, a first heat dissipation fin 120, a second heat dissipation fin 150, an air inlet 130, and an air outlet 140. The heat dissipation housing 110 has a first heat dissipation cavity and a second heat dissipation cavity that are separated from each other. The first heat dissipation fin 120 is disposed in the first heat dissipation cavity, and the second heat dissipation fin 150 is disposed in the second heat dissipation cavity. Inside the heat dissipation cavity, an air inlet 130 is located on one side of the heat dissipation housing 110 and communicates with both the first and second heat dissipation cavities. The air inlet 130 is configured to introduce compressed gas into the first and second heat dissipation cavities and allow the compressed gas to flow through the first and second heat dissipation fins 120 and 150. An air outlet 140 is located on the other side of the heat dissipation housing 110 and communicates with both the first and second heat dissipation cavities. The air outlet 140 is configured to discharge the gas that has passed through the first and second heat dissipation fins 120 and 150. The heat dissipation housing 110, the control module 220, and the sensing module 230 are all located inside the camera housing 210. The first heat dissipation fin 120 is configured to exchange heat with the sensing module 230, and the second heat dissipation fin 150 is configured to exchange heat with the control module 220.

[0060] In some embodiments, the sensing module 230 includes a sensor 232 and a thermoelectric cooler 233 configured to exchange heat with the sensor 232, and a first heat sink fin 120 configured to exchange heat with the thermoelectric cooler 233. A second heat sink cavity, separated from the first heat sink cavity, is also provided within the heat sink housing 110. The two ends of the second heat sink cavity are respectively connected to an air inlet connector 130 and an air outlet connector 140, and a second heat sink fin 150 is also provided within the second heat sink cavity. The control module 220 includes a main board 221, on which power components 222 are provided, and the second heat sink fin is configured to exchange heat with the main board 221.

[0061] In some embodiments, the sensing module 230 further includes a sealing plate 234 and a sensing circuit board 231, a sensor 232 is disposed on the sensing circuit board 231, the cold end of the thermoelectric cooler 233 is configured to exchange heat with the sensor 232, and the hot end of the thermoelectric cooler 233 is connected to one side of the sealing plate 234.

[0062] Furthermore, a heat pipe 235 is also provided inside the camera housing 210. One end of the heat pipe 235 is connected to the other side of the sealing plate 234, and the other end of the heat pipe 235 extends toward the first heat dissipation fin 120. Specifically, the heat pipe 235 is welded to the sealing plate 234 and configured to exchange heat with the thermoelectric cooler 233. The first heat dissipation fin 120 is configured to exchange heat with the heat pipe 235. The thermoelectric cooler 233 can be a semiconductor cooling chip, which is mainly used to actively cool the sensor 232. The heat dissipation of the hot end is conducted through the sealing plate 234 and the welded heat pipe 235. The heat pipe 235 bends upward and extends into the first groove 1141 of the first base plate 114, where it exchanges heat with the upper first heat dissipation fin 120. The power component 222 is disposed in the second groove 1161 of the second base plate 116, so that it can directly exchange heat with the second heat dissipation fin 150.

[0063] It should be noted that the first heat sink 120 can be located above the second heat sink 150. The first heat sink 120 mainly dissipates the heat generated by the thermoelectric cooler 233 through the heat pipe 235, while the second heat sink 150 mainly dissipates heat for the power components 222 on the motherboard 221.

[0064] Furthermore, the camera housing 210 includes an upper shell 211, a middle shell 213, and a lower shell 214. The upper shell 211 is connected to the upper end of the middle shell 213 and is used to house the gas compression radiator 100. Meanwhile, the lower shell 214 is connected to the lower part of the middle shell 213 and can house the sensing module 230. The sealing plate 234, the lower shell 214, and the sensing circuit board 231 together form a relatively sealed chamber to house the sensor 232 and the thermoelectric cooler 233, thereby providing a cooling environment for the sensor 232.

[0065] Through the above technical solution, this utility model provides a first heat dissipation fin 120 inside the first heat dissipation cavity of the heat dissipation housing 110. An air inlet 130 and an air outlet 140 are respectively provided on both sides of the heat dissipation housing 110. The air inlet 130 is configured to introduce compressed gas into the first heat dissipation cavity, allowing the compressed gas to flow through the first heat dissipation fin 120. The air outlet 140 is configured to discharge the gas after heat exchange through the first heat dissipation fin 120, thereby achieving heat dissipation. Compared with the prior art, this utility model utilizes compressed gas for heat dissipation, eliminating the need for a conventional fan structure. This results in a compact structure, reduced space occupation, and facilitates the miniaturization of the camera 200. Furthermore, the design of the air inlet 130 and air outlet 140 allows for application in vacuum spaces and avoids the problem of water cooling medium leakage caused by water-cooling designs.

[0066] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0067] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A gas compression radiator, characterized in that, include: A heat dissipation housing (110) is provided with a first heat dissipation cavity inside the heat dissipation housing (110); The first heat dissipation fin (120) is disposed in the first heat dissipation cavity; An air inlet connector (130) is disposed on one side of the heat dissipation housing (110) and communicates with the first heat dissipation cavity. The air inlet connector (130) is configured to introduce compressed gas flowing through the first heat dissipation fins (120) into the first heat dissipation cavity. An exhaust connector (140) is disposed on the other side of the heat sink housing (110) and communicates with the first heat sink cavity. The exhaust connector (140) is configured to discharge gas passing through the first heat sink fins (120).

2. The gas compression radiator according to claim 1, characterized in that, The gas compression radiator further includes a second heat dissipation fin (150), and the heat dissipation housing (110) is also provided with a second heat dissipation cavity separated from the first heat dissipation cavity. The second heat dissipation fin (150) is disposed in the second heat dissipation cavity. The air inlet connector (130) is connected to the second heat dissipation cavity and is configured to introduce compressed gas flowing through the second heat dissipation fin (150) into the second heat dissipation cavity. The air outlet connector (140) is connected to the second heat dissipation cavity and is configured to discharge the gas passing through the second heat dissipation fin (150).

3. The gas compression radiator according to claim 2, characterized in that, The heat dissipation housing (110) includes a first heat dissipation housing (111) and a second heat dissipation housing (112). The first heat dissipation housing (111) and the second heat dissipation housing (112) are overlapped and detachably connected. A first heat dissipation cavity is formed in the first heat dissipation housing (111), and a second heat dissipation cavity is formed in the second heat dissipation housing (112). The air inlet connector (130) is connected to one side of both the first heat dissipation housing (111) and the second heat dissipation housing (112), and the air outlet connector (140) is connected to the other side of both the first heat dissipation housing (111) and the second heat dissipation housing (112).

4. The gas compression radiator according to claim 3, characterized in that, The first heat sink (111) includes a first cover (113) and a first base plate (114). The first cover (113) covers the first base plate (114) and forms the first heat sink cavity. The first heat sink fins (120) are disposed on the first base plate (114). The second heat sink (112) includes a second cover (115) and a second base plate (116). The second cover (115) covers the second base plate (116) and forms the second heat sink cavity. The second heat sink fins (150) are disposed on the second base plate (116). The side of the first base plate (114) away from the first cover (113) is connected to the side of the second cover (115) away from the second base plate (116).

5. The gas compression radiator according to claim 4, characterized in that, The surface of the first base plate (114) is provided with a first channel (117), and a first annular seal is provided in the first channel (117). The first cover (113) abuts against the first annular seal to seal the first cover (113) and the first base plate (114); the surface of the second base plate (116) is provided with a second channel (118), and a second annular seal is provided in the second channel (118). The second cover (115) abuts against the second annular seal to seal the second cover (115) and the second base plate (116); and / or, The first cover (113) has a first flared channel (1134) on its side wall near the vent connector (140), one end of which is connected to the first heat dissipation cavity and the other end to the vent connector (140); the second cover (115) has a second flared channel (1154) on its side wall near the vent connector (140), one end of which is connected to the second heat dissipation cavity and the other end to the vent connector (140); and / or, The first base plate (114) is provided with a first groove (1141) on the side near the second base plate (116), and the first groove (1141) is configured to partially accommodate a heat pipe (235) connected to a first heat source; the second base plate (116) is provided with a second groove (1161) on the side away from the first base plate (114), and the second groove (1161) is configured to accommodate a second heat source.

6. The gas compression radiator according to claim 4, characterized in that, The first cover (113) is provided with a first inlet channel (1131) and a first confluence cavity (1132) on the side wall near the air inlet connector. One end of the first inlet channel (1131) is connected to the air inlet connector, and the other end is connected to the first confluence cavity (1132). A first slit nozzle (1133) is formed between the side wall of the first cover (113) near the air inlet connector and the first base plate (114). One side of the first slit nozzle (1133) is connected to the first heat dissipation cavity, and the other side is connected to the first confluence cavity (1132). The second cover (115) is provided with a second inlet channel (1151) and a second manifold (1152) on the side wall near the air inlet connector. One end of the second inlet channel (1151) is connected to the air inlet connector, and the other end is connected to the second manifold (1152). A second slit nozzle (1153) is formed between the side wall of the second cover (115) near the air inlet connector and the second base plate (116). One side of the second slit nozzle (1153) is connected to the second heat dissipation cavity, and the other side is connected to the second manifold (1152).

7. The gas compression radiator according to claim 6, characterized in that, The slit widths of the first slit nozzle (1133) and the second slit nozzle (1153) are both less than 1 mm.

8. A camera, characterized in that, The device includes a camera housing (210), a control module (220), a sensing module (230), and a gas compression radiator as described in any one of claims 1-7, wherein the heat dissipation housing (110), the control module (220), and the sensing module (230) are all disposed within the camera housing (210), and the first heat dissipation fins (120) are configured to exchange heat with the control module (220) and / or the sensing module (230).

9. The camera according to claim 8, characterized in that, The sensing module (230) includes a sensor (232) and a thermoelectric cooler (233) configured to exchange heat with the sensor (232), wherein the first heat dissipation fins (120) are configured to exchange heat with the thermoelectric cooler (233). The heat dissipation housing (110) is further provided with a second heat dissipation cavity separated from the first heat dissipation cavity. The two ends of the second heat dissipation cavity are respectively connected to the air inlet connector (130) and the air outlet connector (140). The second heat dissipation cavity is also provided with a second heat dissipation fin (150). The control module (220) includes a motherboard (221). The second heat dissipation fin is configured to achieve heat exchange with the motherboard (221).

10. The camera according to claim 9, characterized in that, The sensing module (230) also includes a sealing plate (234), the cold end of the thermoelectric cooler (233) is configured to exchange heat with the sensor (232), and the hot end of the thermoelectric cooler (233) is connected to one side of the sealing plate (234). A heat pipe is also provided inside the camera housing (210). One end of the heat pipe (235) is connected to the other side of the sealing plate (234) and is configured to exchange heat with the thermoelectric cooler (233). The other end of the heat pipe (235) extends toward the first heat dissipation fin (120), which is configured to exchange heat with the heat pipe (235).

Images