Composite aluminum-based heat dissipation structure

Abstract

The utility model relates to the technical field of heat dissipation structures, and discloses a composite aluminum-based heat dissipation structure which comprises a high-thermal-conductivity aluminum alloy, a vacuum cavity is formed in the high-thermal-conductivity aluminum alloy, and the vacuum cavity is filled with a phase change working medium. According to the composite aluminum-based heat dissipation structure, the high-heat-conductivity aluminum alloy is used as a base material, an efficient heat conduction path can be created, heat is rapidly dispersed to a larger surface area from a heat source, the heat conduction efficiency is further improved through the use of the copper plating layer and the graphene film, and when heat is conducted in the high-heat-conductivity aluminum alloy, the heat conduction efficiency is improved. Due to the fact that the heat transfer efficiency of steam is extremely high in the vacuum environment, heat can be rapidly transferred to other areas of the cavity and then rapidly diffused to the cold end, namely the top, of the cavity, and when the heat reaches the top end of the vacuum cavity and makes contact with the top end of the vacuum cavity, the working medium releases heat and is condensed into a liquid state. And the condensed liquid working medium is sucked to flow back to the heat source position through the metal fiber net.

Description

Technical Field

[0001] This application relates to the field of heat dissipation structure technology, specifically a composite aluminum-based heat dissipation structure. Background Technology

[0002] With the rapid development of electronic devices, the computational efficiency requirements of the electronic components inside these devices are becoming increasingly higher, which makes the temperature of the electronic components prone to rise, thus causing heat dissipation problems.

[0003] An existing patent (publication number: CN216253725U) discloses a heat dissipation structure, which includes: a heat-absorbing component in contact with a heat source; a heat-conducting component disposed on the heat-absorbing component; and a heat dissipation assembly disposed on the heat-absorbing component and in contact with the heat-conducting component. The heat dissipation assembly includes a first heat dissipation component and a second heat dissipation component spaced apart from the first heat dissipation component, with the second heat dissipation component located in the middle of the first heat dissipation component. The heat dissipation structure provided in this application is simple in structure and is particularly suitable for circular heat distribution situations, enabling effective heat dissipation to the center of the heat source and avoiding inadequate local heat dissipation.

[0004] The aforementioned comparative documents mainly use heat sink fins for heat dissipation. However, due to the gap between the heat sink fins and electronic components, efficient heat dissipation cannot be achieved. To address this issue, a composite aluminum-based heat dissipation structure is proposed. Utility Model Content

[0005] To address the shortcomings of existing technologies, this application provides a composite aluminum-based heat dissipation structure that combines composite aluminum-based materials, efficient phase change heat dissipation principles, and vacuum cavity technology to achieve efficient heat dissipation in ultra-thin electronic devices.

[0006] To achieve the above objectives, this application provides the following technical solution: a composite aluminum-based heat dissipation structure, comprising a high thermal conductivity aluminum alloy, wherein a vacuum cavity is formed inside the high thermal conductivity aluminum alloy, the vacuum cavity is filled with a phase change working fluid, a metal fiber mesh is installed inside the vacuum cavity, a copper plating layer is provided on the upper surface of the high thermal conductivity aluminum alloy, a graphene film is coated on the upper surface of the copper plating layer, a flexible heat dissipation plate is fixedly connected to the upper surface of the graphene film, and uniformly distributed flexible heat dissipation fins are fixedly connected to the upper surface of the flexible heat dissipation plate.

[0007] The above scheme utilizes a high thermal conductivity aluminum alloy to provide a basic heat conduction path, rapidly dispersing heat from the heat source to a larger surface area. The copper plating layer and graphene film further enhance thermal conductivity. As heat is conducted through the high thermal conductivity aluminum alloy, the phase change working fluid inside the vacuum chamber evaporates. Because vapor has extremely high heat transfer efficiency in a vacuum environment, heat can be rapidly transferred to other areas of the chamber. Therefore, the vapor quickly diffuses towards the cold end of the chamber, i.e., the top of the vacuum chamber. Upon contact with the top, it releases heat and condenses into a liquid state. After condensation, the liquid working fluid flows back to the heat source location through a metal fiber mesh. Through capillary action, the phase change working fluid is attracted and driven to flow back to the heat source area along the chamber. No external mechanical pump or pressure system is needed; relying on the natural flow of the liquid in the microchannels ensures the continuity and stability of the phase change cycle. Finally, flexible heat sinks and flexible heat dissipation fins achieve efficient heat dissipation, meeting the requirements of lightweight design and high-efficiency heat dissipation.

[0008] Furthermore, the thickness of the vacuum cavity is controlled at 1-2 mm, and the metal fiber mesh is located on the upper side inside the vacuum cavity.

[0009] The above solution limits the size of the vacuum chamber, making it easy to meet the heat dissipation needs of thin and light devices.

[0010] Furthermore, the phase change working medium is ethanol, acetone, or a low-boiling-point liquid metal.

[0011] The above scheme limits the material of the phase change working fluid, enabling it to have a low boiling point. Therefore, it can absorb and carry heat at a lower temperature, thereby achieving heat transfer.

[0012] Furthermore, temperature sensors are installed on both sides of the upper surface of the flexible heat sink.

[0013] The above scheme enables real-time monitoring of the heat source temperature using a temperature sensor.

[0014] Furthermore, thermally conductive pads are fixedly connected to both sides of the outer surface of the high thermal conductivity aluminum alloy.

[0015] The above solution utilizes thermal pads to provide cushioning and effectively transfer heat, thereby improving heat dissipation efficiency.

[0016] Furthermore, a U-shaped frame is welded to each of the two heat-conducting pads on the side that is far apart from each other.

[0017] The above solution allows the device to be easily fitted inside the main unit of the equipment by setting a U-shaped frame, facilitating subsequent installation and positioning.

[0018] Furthermore, each of the U-shaped frames has multiple positioning holes on both sides of its bottom end.

[0019] The above solution allows the device to be positioned and installed in a suitable location within the main unit of the equipment by creating positioning holes, and enables the bottom surface of the high thermal conductivity aluminum alloy to be in close contact with the heat source.

[0020] Furthermore, each of the U-shaped frames has multiple miniature fan interfaces on both sides of its top end.

[0021] The above solution allows users to easily install small external fans as needed by opening a micro fan interface, providing additional airflow and further improving heat dissipation.

[0022] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0023] This composite aluminum-based heat dissipation structure uses a high thermal conductivity aluminum alloy as the base material to create an efficient heat conduction path, rapidly dispersing heat from the heat source to a larger surface area. The use of a copper plating layer and graphene film further enhances the thermal conductivity. As heat is conducted through the high thermal conductivity aluminum alloy, it causes the phase-change working fluid to evaporate within the vacuum chamber. Due to the extremely high heat transfer efficiency of the vapor in the vacuum environment, heat can be rapidly transferred to other areas of the chamber, and then quickly diffuse towards the cold end, i.e., the top. When the heat reaches and contacts the top of the vacuum chamber, the working fluid releases heat and condenses into a liquid state. The condensed liquid... The working fluid is drawn back to the heat source through the metal fiber mesh. Thanks to the capillary action of the liquid working fluid in the microchannel, the phase change working fluid is driven to flow back to the heat source area along the cavity. This process does not require an external mechanical pump or pressure system, and relies entirely on the natural flow of the liquid in the microchannel, thus ensuring the continuity and stability of the phase change cycle. Finally, through the flexible heat sink and flexible heat sink fins, high-efficiency heat dissipation performance can be further provided to meet the needs of lightweight equipment and high-efficiency heat dissipation. The entire heat dissipation system ingeniously combines natural conduction, phase change transfer and high-efficiency heat radiation to achieve efficient, stable and flexible heat dissipation effect. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of this application;

[0025] Figure 2 For the structure of this application Figure 1 Enlarged schematic diagram of the structure at point A in the middle;

[0026] Figure 3 This is a first sectional view of the structure of this application;

[0027] Figure 4 This is a second sectional view of the structure of this application.

[0028] In the picture:

[0029] 1. High thermal conductivity aluminum alloy; 2. Vacuum chamber; 3. Phase change working fluid; 4. Metal fiber mesh; 5. Copper plating layer; 6. Graphene film; 7. Flexible heat sink; 8. Flexible heat sink fins; 9. Temperature sensor; 10. Thermal pad; 11. U-shaped frame; 12. Positioning hole; 13. Miniature fan interface. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] Please see Figure 1 , Figure 3 and Figure 4 This embodiment of a composite aluminum-based heat dissipation structure includes a high thermal conductivity aluminum alloy 1, with a vacuum cavity 2 inside the high thermal conductivity aluminum alloy 1. The high thermal conductivity aluminum alloy 1 is preferably AA6061 aluminum alloy, processed into a lightweight structure so that the high thermal conductivity aluminum alloy 1 can provide a basic heat conduction path, quickly dispersing heat from the heat source to a larger surface area. The thickness of the vacuum cavity 2 is controlled at 1-2 mm, limiting the size of the vacuum cavity 2, which can easily meet the heat dissipation needs of thin and light devices. The vacuum cavity 2 is filled with a phase change working fluid 3, which is ethanol, acetone, or a low-boiling-point liquid metal. The material of the phase change working fluid 3 is limited so that it has a low boiling point, thus absorbing and carrying heat at a lower temperature, thereby realizing heat transfer. The heat generated by the heat source causes the phase change working fluid to absorb and carry heat at a lower temperature. The phase change working fluid 3 evaporates, and the vapor rapidly diffuses towards the cold end of the cavity, which is the top of the vacuum cavity 2. The vacuum environment inside the vacuum cavity 2 reduces thermal resistance, and the vapor diffusion can quickly and evenly distribute heat within the cavity. A metal fiber mesh 4 is installed inside the vacuum cavity 2. The metal fiber mesh 4 is made of flexible metal fibers woven into a mesh structure, providing a high-density capillary channel. The metal fiber mesh 4 is located on the upper side inside the vacuum cavity 2. The vapor condenses into liquid at the top of the vacuum cavity 2, and then the metal fiber mesh 4 can form a capillary effect. Under the capillary effect, the phase change working fluid 3 is driven back to the heat source position. No external mechanical pump or pressure system is required. It only relies on the natural flow of liquid in the microchannel, ensuring the continuity and stability of the phase change cycle. The efficient evaporation and condensation cycle significantly improves heat dissipation efficiency.

[0032] It should be noted that capillary action is important. The metal fiber mesh 4 provides a path for the reflux of the condensed phase change working fluid 3 through its tiny pores or fibrous network structure. Capillary action automatically attracts and pushes the condensed liquid back to the heat source area, ensuring the circulation of the phase change working fluid 3. Furthermore, the low-pressure characteristics of the vacuum environment are key to phase change heat dissipation technology. Low pressure can lower the boiling point of the phase change working fluid 3, allowing it to evaporate at low temperatures, thereby improving heat transfer efficiency. At the same time, the vacuum environment avoids heat loss and accelerates the flow of vapor, improving heat dissipation efficiency.

[0033] Please see Figure 1 and Figure 2 The upper surface of the high thermal conductivity aluminum alloy 1 is provided with a copper plating layer 5, and the upper surface of the copper plating layer 5 is coated with a graphene film 6. The copper plating layer 5 and the graphene film 6 work together to effectively improve the thermal conductivity of the high thermal conductivity aluminum alloy 1. A flexible heat sink 7 is fixedly connected to the upper surface of the graphene film 6. The thickness of the flexible heat sink 7 can be less than 1 mm to meet the requirements of thin and light devices. The upper surface of the flexible heat sink 7 is fixedly connected with uniformly distributed flexible heat sink fins 8. The flexible heat sink fins 8 are wavy to enhance the heat dissipation surface area, optimize air flow, and improve the natural convection heat dissipation effect. Temperature sensors 9 are installed on both sides of the upper surface of the flexible heat sink 7. The temperature of the heat source can be monitored in real time through the set temperature sensors 9.

[0034] Please see Figure 2 , Figure 3 and Figure 4 Both sides of the outer surface of the high thermal conductivity aluminum alloy 1 are fixedly connected with thermally conductive pads 10. The thermally conductive pads 10 have a certain buffering effect and can effectively transfer heat, thereby improving heat dissipation efficiency. U-shaped frames 11 are welded to the sides of the two thermally conductive pads 10 that are far apart from each other. The U-shaped frames 11 can be used to easily fit the device inside the main unit of the equipment, which is convenient for subsequent installation and positioning. Multiple positioning holes 12 are opened on both sides of the bottom end of each U-shaped frame 11. The device can be positioned and installed in a suitable position in the main unit of the equipment by opening the positioning holes 12, and the bottom surface of the high thermal conductivity aluminum alloy 1 can be in close contact with the heat source, thereby improving the heat dissipation effect. Multiple miniature fan interfaces 13 are opened on both sides of the top end of each U-shaped frame 11. The miniature fan interfaces 13 can be used by users to install small fans as needed to provide additional airflow and further improve the heat dissipation capacity.

[0035] In this embodiment, a composite aluminum-based heat dissipation structure provides a basic heat conduction path through a high thermal conductivity aluminum alloy 1, rapidly dispersing heat from the heat source to a larger surface area. The copper plating layer 5 and graphene film 6 further enhance thermal conductivity. As heat is conducted within the high thermal conductivity aluminum alloy 1, the phase change working fluid 3 inside the vacuum chamber 2 evaporates. Because vapor has extremely high heat transfer efficiency in a vacuum environment, heat can be rapidly transferred to other areas of the chamber. Therefore, the vapor quickly diffuses towards the cold end of the chamber, i.e., the top of the vacuum chamber 2. Upon contact with the top, it releases heat and condenses into a liquid state. After condensation, the liquid working fluid is returned through the metal fiber mesh 4. Upon reaching the heat source, the phase change working fluid 3 is attracted and driven to flow back to the heat source area along the cavity through capillary action. Without the need for external mechanical pumps or pressure systems, it relies on the natural flow of the liquid in the microchannels to ensure the continuity and stability of the phase change cycle. Finally, efficient heat dissipation is achieved through the flexible heat sink 7 and flexible heat dissipation fins 8, meeting the requirements of lightweight and efficient heat dissipation. This device utilizes the high thermal conductivity of the high thermal conductivity aluminum alloy 1, the ultra-thin high thermal conductivity of the graphene film 6, the circulation of the phase change working fluid 3 in the vacuum cavity 2, and the capillary reflux mechanism of the metal fiber mesh 4, combined with the heat dissipation effect of the flexible heat dissipation fins 8, to achieve efficient and stable heat dissipation performance.

[0036] The working principle of the above embodiment is as follows: The device is installed inside a thin and light device via a U-shaped frame 11 and positioning holes 12. Then, the bottom surface of the high thermal conductivity aluminum alloy 1 is brought into contact with the heat source. The generated heat is first conducted through the high thermal conductivity aluminum alloy 1 to the copper plating layer 5 and graphene film 6 on the surface. The copper plating layer 5 and graphene film 6 rapidly conduct the heat to the vacuum cavity 2 inside the high thermal conductivity aluminum alloy 1. The heat is then conducted to the phase change working medium 3 in the vacuum cavity 2. The phase change working medium 3 evaporates into vapor in the heat source area, absorbing a large amount of heat, and then flows along the vacuum cavity 2 towards... At the top of the vacuum chamber 2, vapor condenses into liquid. The condensed liquid is guided back to the heat source through the capillary structure of the metal fiber mesh 4, forming a circulation within the vacuum chamber 2. The heat from the condensation is received by the flexible heat dissipation plate 7 and the flexible heat dissipation fins 8. The flexible heat dissipation fins 8 dissipate the heat from the system by increasing the surface area and through natural convection or accelerated airflow from a fan. The condensed liquid of the phase change working fluid 3 returns to the heat source through capillary action. The entire process is continuously circulated, continuously removing heat and ensuring that the equipment maintains a stable operating temperature.

[0037] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0038] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A composite aluminum-based heat dissipation structure, comprising a high thermal conductivity aluminum alloy (1), characterized in that: The high thermal conductivity aluminum alloy (1) has a vacuum cavity (2) inside, the vacuum cavity (2) is filled with a phase change working medium (3), a metal fiber mesh (4) is installed inside the vacuum cavity (2), the upper surface of the high thermal conductivity aluminum alloy (1) is provided with a copper plating layer (5), the upper surface of the copper plating layer (5) is coated with a graphene film (6), the upper surface of the graphene film (6) is fixedly connected with a flexible heat sink (7), and the upper surface of the flexible heat sink (7) is fixedly connected with uniformly distributed flexible heat sink fins (8).

2. The composite aluminum-based heat dissipation structure according to claim 1, characterized in that: The thickness of the vacuum chamber (2) is controlled at 1-2 mm, and the metal fiber mesh (4) is located on the upper side inside the vacuum chamber (2).

3. The composite aluminum-based heat dissipation structure according to claim 1, characterized in that: The phase change working medium (3) is ethanol, acetone or low-boiling-point liquid metal.

4. The composite aluminum-based heat dissipation structure according to claim 1, characterized in that: Temperature sensors (9) are installed on both sides of the upper surface of the flexible heat sink (7).

5. The composite aluminum-based heat dissipation structure according to claim 1, characterized in that: Thermal pads (10) are fixedly connected to both sides of the outer surface of the high thermal conductivity aluminum alloy (1).

6. The composite aluminum-based heat dissipation structure according to claim 5, characterized in that: U-shaped brackets (11) are welded to the two heat-conducting pads (10) on opposite sides.

7. The composite aluminum-based heat dissipation structure according to claim 6, characterized in that: Each of the U-shaped frames (11) has multiple positioning holes (12) on both sides of its bottom end.

8. The composite aluminum-based heat dissipation structure according to claim 6, characterized in that: Each of the U-shaped frames (11) has multiple miniature fan interfaces (13) on both sides of its top end.

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