High-frequency power supply capable of dissipating heat
By combining a variable air duct design with an electric heating film, the heat dissipation problem of high-frequency power supplies in cold regions is solved, achieving stable operation of the heat pipe radiator and protection of IGBT devices.
Patent Information
- Application Number
- CN202423185281.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-12-02
- Estimated Expiration
- 2034-12-23
AI Technical Summary
When high-frequency power supplies are used in cold regions, the temperature in the rear area of the heat pipe radiator may be too low, causing the condensate to freeze, which affects the heat dissipation performance and may damage the power device IGBT.
The heat pipe radiator adopts a variable airflow design. The airflow path is controlled by adjusting the position of the baffle through an electric push rod, which prevents cold air from blowing directly to the rear of the heat pipe radiator. An electric heating film is installed at the end to heat the radiator when the temperature is too low, ensuring that the condensate does not freeze.
Effective heat dissipation prevents condensate from freezing, ensures stable performance of the heat pipe radiator, and protects IGBT devices from damage.
Smart Images

Figure CN223626202U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power distribution box technology, specifically a heat-dissipating high-frequency power supply. Background Technology
[0002] High-frequency power supplies, currently the mainstream high-voltage dust collector power supplies, are generally located at the top of the dust collector. Their main circuit uses IGBT inverters. IGBTs are the main power devices and generate a lot of heat; therefore, they are typically cooled using heat pipe radiators with good heat dissipation performance combined with air cooling.
[0003] Chinese utility model patent with authorization announcement number CN211406723U, published on September 1, 2020, discloses a high-frequency power supply heat dissipation device. It can provide a low temperature source for air-cooled and water-cooled heat dissipation devices by setting a semiconductor cooling chip. It achieves strong heat dissipation of high-frequency power supply by using electric-driven forced cooling. The heat dissipation effect is good. However, when the high-frequency power supply is used in some cold regions, there is a possibility that the temperature in the rear area of the heat pipe heat sink is too low, causing the vapor in the heat pipe heat sink to freeze directly in the rear cooling section. This prevents the condensate from flowing back to the evaporation section, affecting the performance of the heat pipe heat sink and causing damage to the power device IGBT due to untimely heat dissipation. Utility Model Content
[0004] To address the aforementioned technical problems, this utility model provides a heat-dissipating high-frequency power supply with a heat pipe radiator featuring a variable airflow design. This design ensures effective heat dissipation of the heat pipe radiator while preventing condensate from freezing in the rear cooling section.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] A heat-dissipating high-frequency power supply includes a heat dissipation device, a power device, and a housing. A partition plate is fixed inside the housing, and the partition plate has rectangular holes. The heat dissipation device is fixed to the partition plate around the rectangular holes. The power device passes through the rectangular holes and is fixed to the heat dissipation device. The heat dissipation device includes an electric push rod, a baffle, a cooling fan, and a heat pipe radiator. The heat pipe radiator is fixed to the partition plate and the power device. A cooling fan is installed on the top of the heat pipe radiator and connected to a top cover. The electric push rod adjusts the position of the baffle to control the airflow of the cooling fan.
[0007] Furthermore, the electric push rod includes a first electric push rod and a second electric push rod, and the baffle includes a first baffle and a second baffle. The first baffle is horizontally disposed at the bottom of the heat pipe radiator, and the bottom of the first baffle is fixed to the top of the first electric push rod. The side wall of the first electric push rod is fixed to the side wall of the housing. The second baffle is vertically disposed between the cooling fan and the heat pipe radiator. The top of the second baffle is rotatably connected to the side wall of the housing, and one end of the second electric push rod abuts against the second baffle.
[0008] Furthermore, an electric heating film is fixed to the end of the heat pipe radiator.
[0009] Furthermore, a temperature probe is fixed at the end of the heat pipe radiator.
[0010] Furthermore, the heat pipe radiator is made of copper.
[0011] Compared with the prior art, the beneficial effects of this utility model are:
[0012] 1. The heat pipe radiator of this utility model adopts a variable air duct design, which can not only ensure the effective heat dissipation of the heat pipe radiator, but also avoid the condensate from freezing in the rear cooling section.
[0013] 2. This utility model can use a first electric push rod to adjust the position of the first baffle and a second electric push rod to adjust the position of the second baffle, thereby changing the path through which the air can pass, so that the cold air blown out by the cooling fan only blows to the front middle heat sink and base plate of the heat pipe radiator, avoiding the cold air blowing directly to the heat sink at the rear of the heat pipe radiator.
[0014] 3. This utility model adds an electric heating film to the end of the heat pipe radiator. When the temperature is too low, the electric heating film is turned on simultaneously to increase the temperature of the rear part of the heat pipe radiator, further ensuring that the temperature of the condensate in the rear cooling section will not be too low. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the structure of this utility model;
[0016] Figure 2 This is a schematic diagram of the structure of the push rod of this utility model when it is extended;
[0017] Figure 3 This is a side sectional view of the present invention.
[0018] The attached diagram is labeled as follows:
[0019] 1. First electric push rod; 2. Second electric push rod; 3. First baffle; 4. Second baffle; 5. Cooling fan; 6. Heat pipe radiator; 7. Power device; 8. Electric heating film heating element; 9. Temperature probe; 10. Cabinet; 11. Top cover; 12. Divider plate. Detailed Implementation
[0020] Please see Figure 1-3The heat-dissipating high-frequency power supply of this embodiment includes a heat dissipation device, a power device 7, and a housing 10. A partition plate 12 is fixed inside the housing 10. The partition plate 12 has a rectangular hole. The heat dissipation device is fixed to the partition plate 12 around the rectangular hole. The power device 7 is fixed to the heat dissipation device through the rectangular hole. The heat dissipation device includes an electric push rod, a baffle, a cooling fan 5, and a heat pipe radiator 6. The heat pipe radiator 6 is fixed to the partition plate 12 and the power device 7. A cooling fan 5 is provided on the top of the heat pipe radiator 6 and is connected to the top cover 11. The electric push rod adjusts the position of the baffle to control the size of the airflow of the cooling fan 5.
[0021] This utility model heat pipe radiator adopts a variable air duct design, which can not only ensure the effective heat dissipation of the heat pipe radiator, but also avoid the condensate from freezing in the rear cooling section; the power device 7 is mainly IGBT; the cooling fan 5 is fixed on the top of the control cabinet, and uses a sampling air intake method to draw air from the surrounding environment through the air inlets around the top cover 11 and blow air downwards to dissipate heat from the heat pipe radiator 6.
[0022] Furthermore, the electric push rod includes a first electric push rod 1 and a second electric push rod 2, and the baffle includes a first baffle 3 and a second baffle 4. The first baffle 3 is horizontally disposed at the bottom of the heat pipe radiator 6, and the bottom of the first baffle 3 is fixed to the top of the first electric push rod 1. The side wall of the first electric push rod 1 is fixed to the side wall of the housing 10. The second baffle 4 is vertically disposed between the cooling fan 5 and the heat pipe radiator 6. The top of the second baffle 4 is rotatably connected to the side wall of the housing 10, and one end of the second electric push rod 2 abuts against the second baffle 4.
[0023] This invention can use the first electric push rod 1 to adjust the position of the first baffle 3 and the second electric push rod 2 to adjust the position of the second baffle 4, thereby changing the path through which the air can pass, so that the cold air blown out by the cooling fan 5 only blows to the front middle heat sink and substrate of the heat pipe radiator 6, avoiding the cold air blowing directly to the heat sink at the rear of the heat pipe radiator 6.
[0024] Furthermore, an electric heating film heating element 8 is fixed to the end of the heat pipe radiator 6.
[0025] An electric heating film 8 is installed at the end of the heat pipe radiator 6. When the temperature is too low, the electric heating film 8 is turned on simultaneously to increase the temperature of the rear part of the heat pipe radiator 6, and further ensure that the temperature of the condensate in the rear cooling section is not too low.
[0026] Furthermore, a temperature probe 9 is fixed to the end of the heat pipe radiator 6.
[0027] Furthermore, the heat pipe radiator 6 is made of copper.
[0028] The working principle of this utility model is as follows:
[0029] The temperature is measured to determine if the temperature is too low. When this temperature is too low, the first electric push rod 1 and the second electric push rod 2 push out, causing the second baffle 4 to tilt at a certain angle, and the first baffle 3 to move a certain distance towards the front of the heat pipe radiator 6. The adjustment of the airflow channel ensures that the cold air blown by the cooling fan 5 only reaches the front middle section of the heat sink and base plate of the heat pipe radiator 6, preventing cold air from directly blowing onto the rear heat sink. This ensures the performance of the heat pipe radiator 6 and also prevents the condensate from freezing in the rear cooling section due to excessively low temperatures. Simultaneously, an electric heating film fin 8 is installed at the end of the heat pipe fin 6. When the temperature is too low, the electric heating film fin 8 is activated simultaneously to raise the temperature of the rear of the heat pipe radiator 6, further ensuring that the condensate temperature in the rear cooling section does not become too low.
[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A heat-dissipating high-frequency power supply, comprising a heat dissipation device, a power device (7), and a housing (10), wherein a partition plate (12) is fixed inside the housing (10), the partition plate (12) has a rectangular hole, the heat dissipation device is fixed to the partition plate (12) around the rectangular hole, and the power device (7) passes through the rectangular hole and is fixed to the heat dissipation device, characterized in that, The heat dissipation device includes an electric push rod, a baffle, a heat dissipation fan (5) and a heat pipe radiator (6). The heat pipe radiator (6) is fixed to the partition plate (12) and the power device (7). A heat dissipation fan (5) is installed on the top of the heat pipe radiator (6). The heat dissipation fan (5) is connected to the top cover (11). The electric push rod adjusts the position of the baffle to control the size of the airflow path of the heat dissipation fan (5).
2. The heat-dissipating high-frequency power supply according to claim 1, characterized in that, The electric push rod includes a first electric push rod (1) and a second electric push rod (2). The baffle includes a first baffle (3) and a second baffle (4). The first baffle (3) is horizontally arranged at the bottom of the heat pipe radiator (6). The bottom of the first baffle (3) is fixed to the top of the first electric push rod (1). The side wall of the first electric push rod (1) is fixed to the side wall of the box (10). The second baffle (4) is longitudinally arranged between the cooling fan (5) and the heat pipe radiator (6). The top of the second baffle (4) is rotatably connected to the side wall of the box (10). One end of the second electric push rod (2) abuts against the second baffle (4).
3. The heat-dissipating high-frequency power supply according to claim 1, characterized in that, The heat pipe radiator (6) has an electric heating film heating element (8) fixed at its end.
4. The heat-dissipating high-frequency power supply according to claim 1, characterized in that, A temperature probe (9) is fixed at the end of the heat pipe radiator (6).
5. A heat-dissipating high-frequency power supply according to claim 1, characterized in that, The heat pipe radiator (6) is made of copper.
Citation Information
Patent Citations
High-frequency power supply heat dissipation device
CN211406723U