Heat dissipation structure of intelligent controller for weaving machine

Abstract

The utility model discloses a heat dissipation structure of an intelligent controller for a weaving machine, which relates to the field of controllers, and is characterized in that the heat dissipation structure comprises a case and a mainboard, the mainboard is fixedly connected to the inner side wall of the case, a heat dissipation piece is fixedly connected to the outer wall of the case, a heat dissipation plate is arranged between the heat dissipation piece and the case, and the heat dissipation plate is fixedly connected to the case. A plurality of first through holes are formed in the heat dissipation plate, heat dissipation pipes are fixedly connected to the inner walls of the through holes, second through holes are formed in the outer wall of the case, one ends of the heat dissipation pipes extend into the second through holes and abut against the heat dissipation plate, and the other ends of the heat dissipation pipes abut against the heat dissipation pieces. According to the heat dissipation structure of the intelligent controller for the weaving machine, the heat dissipation effect of the controller is improved through the arrangement of the structure, and the stability and the service life of the controller are guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of controller technology, and more specifically, to a heat dissipation structure for an intelligent controller for a loom. Background Technology

[0002] A PLC (Programmable Logic Controller) is essentially a computer specifically designed for industrial control. Its hardware structure is basically the same as that of a microcomputer, consisting of a power supply, a central processing unit (CPU), a memory, input units, and output units. The input / output units, CPU, and memory are all integrated on the motherboard, and the motherboard is protected by a casing. In the textile machinery field, PLCs are widely used to automate the operation of textile machinery, monitor and control the production process, and perform fault detection and protection. By controlling the start, stop, speed adjustment, and working mode of the loom, the PLC can automate the operation of the loom. By connecting sensors on the loom, the working status of the loom, such as weaving tension and weaving speed, can be monitored in real time, and the working status of the loom can be automatically adjusted according to the set control strategy.

[0003] In the patent document for a dustproof and high-efficiency heat dissipation CNC polishing machine controller (application number CN202420112229.3), a cooling fan is installed inside the main body of the chassis, and the chassis has air intake and exhaust slots. Heat sinks are installed on opposite sides of the chassis. The motherboard is cooled by the heat sinks, cooling fan, and exhaust slots. However, the location and area of ​​the exhaust slots and air intake slots are limited. The heat sinks and cooling fans on both sides of the motherboard achieve internal heat dissipation in a passive manner. However, the end face of the motherboard that contacts the chassis does not directly participate in the heat dissipation of the heat sinks and cooling fans, so the heat dissipation effect is generally poor. The part of the controller that generates the most heat is the chip on the motherboard. If the chip temperature is too high, heat will be conducted to the motherboard. The operating temperature of the motherboard is generally 30-70°C. Higher temperatures will affect the stability and lifespan of the motherboard. The existing heat dissipation method has limited heat dissipation effect on the motherboard.

[0004] Therefore, a new solution is needed to address this problem. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a heat dissipation structure for an intelligent controller for a loom.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a heat dissipation structure for an intelligent controller for a loom includes a heat dissipation component disposed on the outer wall of the machine casing, a heat dissipation plate between the machine casing and the heat dissipation component, and a main board fixedly connected to the inner wall of the machine casing. The heat dissipation plate has several through holes I, and a heat dissipation pipe is fixedly connected to the inner wall of the through hole I. The outer wall of the machine casing has through holes II, one end of the heat dissipation pipe extends into the through hole II and abuts against the heat dissipation plate, and the other end of the heat dissipation pipe abuts against the heat dissipation component.

[0007] The present invention is further configured such that: a plurality of the through holes one are arranged in a matrix array on the heat sink, and a plurality of the through holes two are arranged in a matrix array on the end face of the motherboard and the chassis that are fixedly connected, and the distance between adjacent through holes one is equal to the distance between adjacent through holes two.

[0008] The present invention is further configured such that the thickness of the heat pipe is greater than or equal to the sum of the thickness of the chassis side wall and the thickness of the heat sink.

[0009] The present invention is further configured such that a plurality of heat dissipation strips are fixedly connected to the end face of the heat dissipation component away from the chassis.

[0010] The present invention is further configured such that a Z-shaped bend is provided at the center of the heat dissipation strip.

[0011] The present invention is further configured such that: the heat sink has a plurality of mounting holes, the mounting holes simultaneously penetrating the heat sink plate, the side wall of the chassis and the motherboard, and the mounting holes on the heat sink are threaded holes.

[0012] The present invention is further configured such that: a plurality of heat dissipation vents are provided on the side of the chassis away from the motherboard, and a plurality of heat sinks are provided on the bottom surface of the chassis.

[0013] In summary, this utility model has the following beneficial effects: one end of the heat dissipation pipe extends into the second through hole and abuts against the heat dissipation plate, and the other end of the heat dissipation pipe abuts against the heat dissipation component. The heat dissipation pipe connecting the first and second through holes abuts against the motherboard and the heat dissipation component at both ends, respectively. This structure forms several heat passages between the motherboard and the heat dissipation component, increasing the heat transfer channels and improving the heat dissipation efficiency of the motherboard. Furthermore, several heat dissipation grooves are formed by several heat dissipation strips, allowing the air to generate more turbulence when flowing through the heat dissipation strips, thereby further improving the heat dissipation efficiency. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the present invention. Figure 1 ;

[0015] Figure 2 This is a schematic diagram of the structure of the present invention. Figure 2 ;

[0016] Figure 3 For the explosion of this utility model Figure 1 ;

[0017] Figure 4 For the explosion of this utility model Figure 2 ;

[0018] Figure 5 for Figure 4 Enlarged diagram of section A in the middle;

[0019] Figure 6 This is a cross-sectional view of the present invention.

[0020] In the diagram: 1. Chassis; 101. Vent; 102. Heatsink; 103. Through hole 2; 2. Heatsink component; 201. Heatsink strip; 204. Mounting hole; 3. Heatsink plate; 301. Through hole 1; 302. Heat pipe; 4. Motherboard. Detailed Implementation

[0021] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0022] A heat dissipation structure for an intelligent controller used in a loom, such as Figure 1 - Figure 6 As shown, the system includes a chassis 1 and a motherboard 4. The motherboard 4 is fixedly connected to the inner wall of the chassis 1. A heat sink 2 is fixedly connected to the outer wall of the chassis 1. A heat sink 3 is provided between the heat sink 2 and the chassis 1. The heat sink 3 has several through holes 301. A heat pipe 302 is fixedly connected to the inner wall of the through holes. A second through hole 103 is provided on the outer wall of the chassis 1. One end of the heat pipe 302 extends into the second through hole 103 and abuts against the heat sink 3. The other end of the heat pipe 302 abuts against the heat sink 2. The heat pipe 302 connecting the first through hole 301 and the second through hole 103 abuts against the motherboard 4 and the heat sink 2 at both ends, respectively. This structure forms several heat through holes between the motherboard 4 and the heat sink 2, increasing the heat transfer channels and improving the heat dissipation efficiency of the motherboard 4.

[0023] like Figure 3 - Figure 6As shown, a heat sink 3 is installed between the chassis 1 and the heat sink 2. The heat sink 3 is mainly designed to increase the heat dissipation area. The heat sink 3 is made of a material with good thermal conductivity, such as aluminum alloy or copper alloy. Multiple through holes 301 are formed on the heat sink 3 in a matrix array to maximize the heat dissipation area. A heat pipe 302 is fixedly connected to the inner wall of each through hole 301. These heat pipes 302 not only enhance the heat dissipation effect but also connect the heat sink 3 and the chassis 1. Multiple through holes 103 are also formed on the outer wall of the chassis 1 at positions corresponding to the heat sink 3. These through holes 103 are also arranged in a matrix array, and the distance between adjacent through holes 301 is equal to the distance between adjacent through holes 103. This design ensures the smooth installation of the heat pipe 302 and the uniformity of heat dissipation. One end of the heat pipe 302 extends into the through hole 103 and abuts against the heat sink 3, while the other end abuts against the heat sink 2, forming a heat dissipation channel. The thickness of the heat pipe 302 is designed to be greater than or equal to the sum of the thickness of the side wall of the chassis 1 and the thickness of the heat sink 2. That is, when the heat sink 2 and the side wall of the chassis 1 are in contact, the heat pipe 302 penetrates through the heat sink 2 and the chassis 1, ensuring that both ends of the heat pipe 302 can stably abut against the motherboard 4 and the heat sink 2, ensuring a good heat dissipation effect on the motherboard 4. At the same time, this design ensures that the heat pipe 302 can fit tightly when connecting the chassis 1 and the heat sink 2 without gaps, thereby improving heat dissipation efficiency. Preferably, the heat pipe 302 can be made of copper with a good thermal conductivity.

[0024] like Figure 3 - Figure 6 As shown, multiple heat dissipation strips 201 are fixedly connected to the end face of the heat sink 2 away from the chassis 1. These heat dissipation strips 201 further increase the heat dissipation area. The heat dissipation strips 201 are formed by milling the heat sink 2, so several heat dissipation strips 201 are integrally formed with the heat sink 2, ensuring the integrity and stability of the structure. Adjacent heat dissipation strips 201 form several heat dissipation grooves on the heat sink 2. These grooves help air flow and improve the heat dissipation effect. Some heat dissipation strips 201 have Z-shaped bends at the center. This design not only increases the strength of the heat dissipation strips 201, but also allows the air to generate more turbulence when flowing through the heat dissipation strips 201, improving the heat dissipation effect of the heat sink 2.

[0025] like Figure 1 - Figure 6As shown, the heat sink 2 has multiple mounting holes 204. These mounting holes 204 pass through the heat sink 3, the side wall of the chassis 1, and the motherboard 4. The mounting holes 204 on the heat sink 2 are threaded holes. After the bolt passes through the motherboard 4, the chassis 1, and the heat sink 3, it is threaded into the mounting holes 204 on the heat sink 2, thus achieving a fixed connection between the heat sink 2, the heat sink 3, and the chassis 1. The motherboard 4 has an additional fixing method with the chassis 1, which can be a bolt connection. Here, the mounting holes 204 on the motherboard 4 are mainly used to position the motherboard 4 and ensure that the heat pipe 302 is in stable contact with the motherboard 4. Multiple heat dissipation vents 101 are provided on the side of the chassis 1 away from the motherboard 4. These heat dissipation vents 101 help to dissipate heat from inside the chassis 1. Multiple heat sinks 102 are also provided on the bottom surface of the chassis 1. These heat sinks 102 further improve the heat dissipation efficiency of the chassis 1 by increasing the heat dissipation area.

[0026] Working principle: The motherboard 4 is fixedly installed on the inner wall of the chassis 1 using a fixed connection method (such as screws, clips, etc.), ensuring that the motherboard 4 is stable and will not loosen due to vibration. Several through holes 103 are opened on the outer wall of the chassis 1. Heat pipes 302 are fixedly connected to the inner wall of the through hole 301 on the heat sink 3, and some of the heat pipes 302 extend out of the through hole 301. Since the opening position, shape and size of the through hole 301 and the through hole 103 are the same, after the heat pipes 302 extending out of the through hole 301 extend out of the through hole 103, the heat sink 3 is snapped onto the chassis 1. At this time, the heat pipes 302 extend out or The heat pipe 302 is positioned at the opening of the second through hole 103, abutting against the motherboard 4. Preferably, the length of the heat pipe 302 is determined by the distance between the heat sink 3 and the motherboard 4. The bolt passes through the mounting holes 204 on the motherboard 4, the chassis 1, and the heat sink 3, and is threadedly connected to the mounting holes 204 on the heat sink 2, thus fixing the heat sink 2 and the heat sink 3 to the chassis 1. The first through hole 301, the second through hole 103, and the heat pipe 302 form several heat-through holes between the heat sink 2 and the motherboard 4, increasing heat transfer. The temperature on the motherboard 4 is transferred to the heat sink 2 through the heat pipe 302, improving the heat dissipation efficiency of the motherboard 4.

[0027] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A heat dissipation structure for an intelligent controller used in a loom, characterized in that: The device includes a heat sink (2) installed on the outer wall of the chassis (1) and a heat sink plate (3) between the chassis (1) and the heat sink (2), and a motherboard (4) fixedly connected to the inner wall of the chassis (1). The heat sink plate (3) has several through holes (301). A heat sink pipe (302) is fixedly connected to the inner wall of the through hole (301). The outer wall of the chassis (1) has a through hole (103). One end of the heat sink pipe (302) extends into the through hole (103) and abuts against the heat sink plate (3). The other end of the heat sink pipe (302) abuts against the heat sink (2).

2. The heat dissipation structure of an intelligent controller for a loom according to claim 1, characterized in that: A plurality of through holes (301) are arranged in a matrix array on the heat sink (3), and a plurality of through holes (103) are arranged in a matrix array on the end face of the motherboard (4) and the chassis (1) which are fixedly connected. The distance between adjacent through holes (301) is equal to the distance between adjacent through holes (103).

3. The heat dissipation structure of an intelligent controller for a loom according to claim 1, characterized in that: The thickness of the heat pipe (302) is greater than or equal to the sum of the thickness of the side wall of the chassis (1) and the thickness of the heat sink (2).

4. The heat dissipation structure of an intelligent controller for a loom according to claim 1, characterized in that: Several heat dissipation strips (201) are fixedly connected to the end face of the heat dissipation component (2) away from the chassis (1).

5. The heat dissipation structure of an intelligent controller for a loom according to claim 4, characterized in that: The heat dissipation strip (201) has a Z-shaped bend at its center.

6. The heat dissipation structure of an intelligent controller for a loom according to claim 1, characterized in that: The heat sink (2) has several mounting holes (204) that penetrate the heat sink (3), the side wall of the chassis (1) and the motherboard (4). The mounting holes (204) on the heat sink (2) are threaded holes.

7. The heat dissipation structure of an intelligent controller for a loom according to claim 1, characterized in that: The chassis (1) has several heat dissipation vents (101) on the side away from the motherboard (4), and several heat sinks (102) are provided on the bottom surface of the chassis (1).

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