Temperature acquisition device for semiconductor equipment and semiconductor equipment

Abstract

The utility model provides a temperature acquisition device for semiconductor equipment and the semiconductor equipment. The temperature acquisition device comprises a bias voltage source; the thermosensitive circuit is connected with the bias voltage source and is provided with a first voltage output end, and the thermosensitive circuit is configured to enable a voltage signal of the first voltage output end to change along with the change of the measured temperature; the first input end of the signal conditioning circuit is electrically coupled to the first voltage output end; the input end of the analog-to-digital conversion circuit is electrically connected to the output end of the signal conditioning circuit; the microcontroller is electrically connected to the output end of the analog-to-digital conversion circuit; the microcontroller is provided with a nonlinear temperature compensation module used for conducting nonlinear compensation on signals output by the analog-to-digital conversion circuit.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor equipment technical field especially is related to a temperature acquisition device for semiconductor equipment and semiconductor equipment. BACKGROUND

[0002] Semiconductor equipment usually contains a variety of circuit modules or electronic equipment, and the collection and real-time monitoring of the temperature of these circuit modules or electronic equipment are of great significance to the stability and reliability of the system. Traditional temperature measurement devices usually use thermocouples or platinum resistors, but these devices have certain limitations in temperature measurement accuracy, response speed and cost. Specifically, the thermocouple-based temperature measurement system has the problem of low accuracy. The basic principle of thermocouple temperature measurement is that two different conductors form a closed loop, and when there is a temperature difference between the measurement end and the reference end, an electromotive force-thermal electromotive force will be generated between the contact points of the two different metals. The size of the thermal electromotive force has a deterministic relationship with the temperature difference between the measurement end and the reference end, and the temperature can be measured by measuring the thermal electromotive force. However, the inherent inaccuracy of the thermocouple is caused by the metal characteristics. The platinum resistance-based temperature measurement system has the problem of high cost. The material used to make platinum resistance is platinum, and the purity of platinum is very high. Improving the purity requires a more complex refining process, which further increases the production cost. SUMMARY

[0003] In view of the above problems, the utility model is proposed to provide a temperature acquisition device for semiconductor equipment and semiconductor equipment that overcomes the above problems or at least partially solves the above problems, which can solve the problems of low measurement accuracy and high cost of existing temperature measurement devices, and achieve the effect of improving measurement accuracy and reducing cost.

[0004] Specifically, the utility model provides a temperature acquisition device for semiconductor equipment, which comprises:

[0005] a bias voltage source;

[0006] a thermosensitive circuit connected with the bias voltage source and having a first voltage output end, the thermosensitive circuit being configured to change the voltage signal of the first voltage output end with the change of the measured temperature;

[0007] a signal conditioning circuit, the first input end of the signal conditioning circuit being electrically coupled to the first voltage output end;

[0008] an analog-to-digital conversion circuit, the input end of the analog-to-digital conversion circuit being electrically connected to the output end of the signal conditioning circuit;

[0009] a microcontroller, which is electrically connected to the output end of the analog-digital conversion circuit; the microcontroller has a non-linear temperature compensation module for non-linear compensation of the signal output by the analog-digital conversion circuit.

[0010] Optionally, the thermosensitive circuit is a Wheatstone bridge, one bridge wall of which is provided with a thermistor, the remaining three bridge walls are provided with fixed resistors, and a first end of the thermistor is electrically connected to the bias voltage source, and a second end of the thermistor serves as a first voltage output end.

[0011] Optionally, the three fixed resistors are respectively:

[0012] a first resistor, a first end of which is electrically connected to the bias voltage source, and a second end of which serves as a second voltage output end; a second input end of the signal conditioning circuit is electrically coupled to the second voltage output end;

[0013] a second resistor, a first end of which is electrically coupled to the second voltage output end, and a second end of which is grounded;

[0014] a third resistor, a first end of which is electrically coupled to the first voltage output end, and a second end of which is grounded.

[0015] Optionally, the signal conditioning circuit comprises a differential amplification circuit, a reverse input end of the differential amplification circuit is electrically coupled to the first voltage output end, a forward input end of the differential amplification circuit is electrically coupled to the second voltage output end, and the differential amplification circuit is used to output the difference between the voltage signals generated at the first voltage output end and the first voltage output end.

[0016] Optionally, a first protection resistor is arranged between the reverse input end of the differential amplification circuit and the first voltage output end; a second protection resistor is arranged between the forward input end of the differential amplification circuit and the second voltage output end; the reverse input end of the differential amplification circuit is directly or indirectly electrically coupled to the output end of the differential amplification circuit through a feedback resistor, and the output end of the differential amplification circuit serves as the output end of the signal conditioning circuit.

[0017] Optionally, the temperature acquisition device further comprises:

[0018] a third protection resistor, a first end of which is electrically connected to the output end of the signal conditioning circuit, and a second end of which is electrically connected to the input end of the analog-digital conversion circuit;

[0019] a first filter capacitor circuit, an input end of which is electrically coupled to the second end of the third protection resistor, and an output end of which is grounded.

[0020] Optionally, the temperature acquisition device further comprises:

[0021] a power supply voltage source;

[0022] a fourth resistor, a first end of the fourth resistor being electrically connected with the power supply voltage source;

[0023] a fifth resistor, a first end of the fifth resistor being electrically coupled with a second end of the fourth resistor, and a second end being grounded;

[0024] a sixth resistor, a first end of the sixth resistor being electrically coupled with the second end of the fourth resistor, and a second end being electrically connected with a power supply end of the analog-to-digital conversion circuit.

[0025] Optionally, the temperature acquisition device further comprises:

[0026] a second filter capacitor circuit, a first end of the second filter capacitor circuit being electrically coupled with a second end of the third protective resistor, and a second end being electrically coupled with a second end of the sixth resistor;

[0027] a third filter capacitor circuit, an input end of the third filter capacitor circuit being electrically coupled with the second end of the fourth resistor, and an output end of the third filter capacitor circuit being grounded; and

[0028] a reference voltage end of the signal conditioning circuit being electrically coupled with the second end of the fourth resistor.

[0029] Optionally, the thermistor is a negative temperature coefficient thermistor;

[0030] The temperature acquisition device further comprises:

[0031] an alarm module, electrically connected with the microcontroller, configured to send an alarm signal;

[0032] a communication module, electrically connected with the microcontroller, the communication module being configured to be communicatively connected with a to-be-tested device to send the temperature sensed by the thermistor to the to-be-tested device.

[0033] The utility model further provides a kind of semiconductor equipment, it includes one or more temperature acquisition devices, each described temperature acquisition device is any one of the above temperature acquisition device.

[0034] The temperature acquisition device and the semiconductor equipment have the thermosensitive circuit, the thermosensitive circuit relies on the thermistor to sense temperature, can detect small temperature changes, can measure the temperature of the gap and the cavity which cannot be measured by other thermometers, is easy to process into a complex shape, and has the advantages of high sensitivity, small volume, mass production, good stability, strong overload capacity and the like.

[0035] Further, the temperature acquisition device and the semiconductor equipment have the non-linear temperature compensation module, can solve the non-linear relationship between the resistance of the thermistor and temperature, and improve the precision of temperature measurement.

[0036] The above and other objects, advantages and features of the present application will become more apparent from the following detailed description of some embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0037] Some specific embodiments of the present application will be described in detail below with reference to the accompanying drawings, which are given by way of illustration and are not intended to be limiting of the present application. Identical reference numerals in the figures designate identical or similar parts or portions. It should be understood that the figures are not necessarily drawn to scale. In the figures:

[0038] Figure 1 is a schematic view of a temperature acquisition device according to an embodiment of the present application;

[0039] Figure 2 is a schematic view of a thermosensitive circuit in a temperature acquisition device according to an embodiment of the present application;

[0040] Figure 3 is a schematic view of a temperature acquisition device according to an embodiment of the present application;

[0041] Figure 4 is a schematic view of a microcontroller in a temperature acquisition device according to an embodiment of the present application.

[0042] In the drawings:

[0043] 10. Bias voltage source; 20. Thermistor circuit; 21. Thermistor; 22. First resistor; 23. Second resistor; 24. Third resistor; 30. Signal conditioning circuit; 31. Differential amplifier circuit; 32. First protection resistor; 33. Second protection resistor; 34. Third protection resistor; 35. First filter capacitor circuit; 36. Power supply voltage source; 37. Fourth resistor; 38. Fifth resistor; 39. Sixth resistor; 40. Analog-to-digital converter circuit; 41. Second filter capacitor circuit; 42. Third filter capacitor circuit; 50. Microcontroller; 51. Nonlinear temperature compensation module; 52. Alarm module; 53. Communication module. Detailed Implementation

[0044] The following reference Figures 1 to 4 This invention describes a temperature acquisition device for a semiconductor device and a semiconductor device according to embodiments of the present invention. In this description, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of the present invention, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0045] Unless otherwise expressly specified and limited, the terms "set," "install," "connect," "link," "fix," and "couple" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0046] Furthermore, in the description of this embodiment, "above" or "below" the second feature can include direct contact between the first and second features, or it can include contact between the first and second features through another feature between them. That is, in the description of this embodiment, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," or "below" of the second feature can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0047] In the description of the embodiments, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In the specification, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0048] Figure 1 is the schematic diagram of the temperature acquisition device according to one embodiment of the utility model, as Figure 1 indicated and referring to Figures 2 to 4 , the utility model embodiment provides a temperature acquisition device for semiconductor equipment, it includes bias voltage source 10, thermosensitive circuit 20, signal conditioning circuit 30, analog-digital conversion circuit 40 and microcontroller 50.

[0049] Thermosensitive circuit 20 is connected with bias voltage source 10, and has first voltage output end, thermosensitive circuit 20 is configured to make the voltage signal of its first voltage output end change with the change of measured temperature. Thermosensitive circuit 20 is used to contact the measured temperature part on semiconductor equipment, when the temperature of measured temperature part changes, the voltage signal of the first voltage output end of thermosensitive circuit 20 will also change, so that the temperature signal can be converted into voltage signal, so that the temperature is measured.

[0050] The first input end of signal conditioning circuit 30 is electrically coupled to the first voltage output end. Signal conditioning circuit 30 is an electronic circuit for improving signal quality and enhancing signal processing capability. It is mainly responsible for processing the voltage signal from the thermistor, improving signal quality and enhancing signal processing capability, so as to meet the requirements of subsequent processing or transmission, such as ensuring stable transmission of signals.

[0051] The input end of analog-digital conversion circuit 40 is electrically connected to the output end of signal conditioning circuit 30. Analog-digital conversion circuit 40 (Analog-to-Digital Conversion Circuit, abbreviated as ADC circuit) is a circuit that converts the analog signal processed by the sensor analog interface circuit into digital quantity suitable for computer processing and sends it into the computer data channel. The core of analog-digital conversion circuit 40 is A / D converter, which is integrated on a chip and can complete the conversion of analog input signal to digital signal, providing convenience for the processing of computer or digital system.

[0052] The microcontroller 50 is electrically connected to the output of the analog-to-digital conversion circuit 40. The microcontroller 50 has a non-linear temperature compensation module 51 for non-linear compensation of the signal output by the analog-to-digital conversion circuit 40.

[0053] In the embodiment of the utility model, since having the thermosensitive circuit 20, the thermosensitive circuit 20 senses temperature by thermistor 21, can detect the tiny temperature change, can measure the temperature of the gap, the cavity that other thermometer cannot measure, easy to process into complex shape, with higher sensitivity, small volume, mass production, good stability, strong overload capacity and other advantages.Therefore, the temperature acquisition device of the embodiment of the utility model can solve the problems of low measurement accuracy and high cost of the existing temperature measurement device, and achieve the effect of improving the measurement accuracy and reducing the cost.

[0054] Further, the temperature acquisition device of the embodiment of the utility model also has a non-linear temperature compensation module 51, which can solve the non-linear relationship between the resistance of the thermistor 21 and the temperature, and improve the accuracy of temperature measurement. For example, the non-linear temperature compensation module 51 can perform neural network calculation to compensate the detection signal, and the neural network can improve the accuracy of non-linear compensation through a large number of learning and simulation, and ensure the measurement accuracy. Of course, in some alternative embodiments, other types of non-linear compensation measures can also be used for compensation.

[0055] In some embodiments of the utility model, the thermistor 21 is a negative temperature coefficient thermistor, namely NTC. NTC is the abbreviation of Negative Temperature Coefficient, which means negative temperature coefficient, and refers to a type of thermistor whose resistance value decreases with temperature increase.

[0056] In some embodiments of the utility model, as shown in Figure 2 and Figure 3 The thermosensitive circuit 20 is a Wheatstone bridge, one of the bridge walls is provided with a thermistor 21, the remaining three bridge walls are provided with fixed resistors, and the first end of the thermistor 21 is electrically connected with the bias voltage source 10, and the second end of the thermistor 21 is used as a first voltage output end. The Wheatstone bridge can accurately measure the resistance value of the thermistor 21, that is, the Wheatstone bridge can accurately measure the resistance value change of the thermistor 21, and can even measure very low resistance value, and when the thermistor 21 changes slightly, the output of the bridge will also change accordingly, with high precision and sensitivity.

[0057] Specifically, the three fixed resistances are a first resistance 22, a second resistance 23 and a third resistance 24. The first end of the first resistance 22 is electrically connected with the bias voltage source 10, and the second end is used as a second voltage output end. The second input end of the signal conditioning circuit 30 is electrically coupled to the second voltage output end. The first end of the second resistance 23 is electrically coupled to the second voltage output end, and the second end is grounded. The first end of the third resistance 24 is electrically coupled to the first voltage output end, and the second end is grounded.

[0058] In the embodiments of the utility model, the Wheatstone bridge including the thermistor 21 is adopted, and two voltage output ends are formed, wherein the voltage value of the second voltage output end is basically a fixed value, and the voltage signals of the two voltage output ends are conditioned at the same time, the measurement precision and sensitivity are improved, and the conditioning of the signal conditioning circuit 30 is also beneficial, for example, differential amplification conditioning. The signal conditioning circuit 30 filters and amplifies the unbalanced voltage of the Wheatstone bridge.

[0059] In some embodiments of the utility model, as shown in Figure 3 The signal conditioning circuit 30 includes a differential amplification circuit 31. The reverse input end of the differential amplification circuit 31 is electrically coupled to the first voltage output end as the first input end. The forward input end of the differential amplification circuit 31 is electrically coupled to the second voltage output end as the second input end. The differential amplification circuit 31 is used for outputting the difference between the voltage signals generated on the first voltage output end and the first voltage output end. The differential amplification circuit 31 is a kind of circuit that compares the difference of two input signals and amplifies the difference. When there is a difference in the voltage of the two input ends of the circuit, the output voltage will change. Using the differential amplification circuit 31 for conditioning can improve the signal-to-noise ratio and sensitivity of the signal, and signal amplification can also improve the precision when converting analog signals into digital signals.

[0060] In some embodiments of the utility model, as shown in Figure 3 The reverse input end of the differential amplification circuit 31 and the first voltage output end are provided with a first protection resistance 32. The forward input end of the differential amplification circuit 31 and the second voltage output end are provided with a second protection resistance 33. The reverse input end of the differential amplification circuit 31 is directly or indirectly electrically coupled to the output end of the differential amplification circuit 31 through a feedback resistance, and the output end of the differential amplification circuit 31 is used as the output end of the signal conditioning circuit 30.

[0061] In some embodiments of the utility model, as shown in Figure 3As shown, the temperature acquisition device further comprises a third protective resistor 34 and a first filter capacitor circuit 35. The first end of the third protective resistor 34 is electrically connected with the output end of the signal conditioning circuit 30, and the second end is electrically connected with the input end of the analog-digital conversion circuit 40. The input end of the first filter capacitor circuit 35 is electrically coupled to the second end of the third protective resistor 34, and the output end of the first filter capacitor circuit 35 is grounded. The first filter capacitor circuit can filter the signal to ensure the accuracy of the signal.

[0062] In some embodiments of the utility model, as shown in Figure 3 As shown, the temperature acquisition device further comprises a power supply voltage source 36, a fourth resistor 37, a fifth resistor 38 and a sixth resistor 39. The first end of the fourth resistor 37 is electrically connected with the power supply voltage source 36. The first end of the fifth resistor 38 is electrically coupled to the second end of the fourth resistor 37, and the second end is grounded. The first end of the sixth resistor 39 is electrically coupled to the second end of the fourth resistor 37, and the second end is electrically connected with the power supply end of the analog-digital conversion circuit 40. The power supply voltage source 36 provides voltage to the power supply end of the analog-digital conversion circuit 40 through the fourth resistor 37 and the sixth resistor 39.

[0063] In some embodiments of the utility model, as shown in Figure 3 As shown, the temperature acquisition device further comprises a second filter capacitor circuit 41 and a third filter capacitor circuit 42. The first end of the second filter capacitor circuit 41 is electrically coupled to the second end of the third protective resistor, and the second end is electrically coupled to the second end of the sixth resistor. The second filter capacitor circuit 41 is arranged between the signal input end and the power supply end of the analog-digital conversion circuit 40, which can improve the accuracy and stability of the temperature acquisition device. The input end of the third filter capacitor circuit 42 is electrically coupled to the second end of the fourth resistor, and the output end of the third filter capacitor circuit 42 is grounded.

[0064] In some embodiments of the utility model, the reference voltage end of the signal conditioning circuit 30 is electrically coupled to the second end of the fourth resistor 37. One power supply voltage source 36 can realize the power supply of the reference voltage end of the signal conditioning circuit 30 and the power supply end of the analog-digital conversion circuit 40, so that the circuit structure of the temperature acquisition device is simple and the cost is low.

[0065] In some embodiments of the utility model, as shown in Figure 4 As shown, the microcontroller 50 is electrically connected with an alarm module 52 and a communication module 53. The alarm module 52 is configured to send an alarm signal. The communication module 53 is configured to be communicatively connected with the device to be measured, so as to send the temperature sensed by the thermistor 21 to the device to be measured. That is, when the sensed temperature is higher than the threshold value, an alarm can be sent through the alarm signal. At the same time, the sensed temperature can be sent to the device to be measured, so that the device to be measured works according to the temperature.

[0066] In some embodiments of the utility model, nonlinear temperature compensation module 51 can adopt neural network to carry out nonlinear compensation, improve the precision of temperature measurement. The following steps are required for the setting of nonlinear temperature compensation module 51: collect the resistance value data of thermistor 21 at different temperatures, and normalize the collected data. The neural network architecture includes input layer, hidden layer and output layer, the input layer receives the resistance value of thermistor 21, the output layer predicts the temperature value, and the hidden layer is responsible for learning the nonlinear relationship. Use mean squared error (Mean Squared Error, MSE) function to measure the difference between predicted temperature and actual temperature, update the weights and biases of the network according to the gradient of the function, and perform iterative optimization. The trained neural network is applied to nonlinear temperature compensation module 51, which can significantly improve the nonlinear compensation accuracy of NTC thermistor. The microprocessor receives the temperature compensation data transmitted by nonlinear temperature compensation module 51, and analyzes the data collected by thermistor 21 in real time. When the neural network model predicts that the temperature may exceed the threshold value, alarm module 52 will produce early warning prompt; when the temperature exceeds the set threshold value, alarm module 52 triggers the alarm. The temperature acquisition device of the utility model has good real-time performance, realizes real-time monitoring, early warning and alarm of temperature data, and is convenient for users to take timely measures, thereby improving the reliability of the system.

[0067] The utility model further provides a kind of semiconductor equipment, it includes one or more temperature acquisition devices, each temperature acquisition device is the temperature acquisition device in any of the above embodiments. Semiconductor equipment can have a to-be-measured device, and multiple temperature acquisition devices are used to collect multiple-point temperature of to-be-measured device, to improve measurement accuracy.

[0068] At this point, those skilled in the art should realize that, although the utility model has been shown and described in detail herein, many other variants or modifications consistent with the principles of the utility model can be directly determined or deduced based on the content disclosed by the utility model without departing from the spirit and scope of the utility model. Therefore, the scope of the utility model should be understood and recognized as covering all these other variants or modifications.

Claims

1. A temperature acquisition device for a semiconductor device, characterized by, Comprising: a bias voltage source; a thermosensitive circuit connected with the bias voltage source and having a first voltage output end, the thermosensitive circuit being configured to change the voltage signal of the first voltage output end with the change of the measured temperature; a signal conditioning circuit, a first input end of the signal conditioning circuit being electrically coupled to the first voltage output end; an analog-to-digital conversion circuit, an input end of the analog-to-digital conversion circuit being electrically connected to an output end of the signal conditioning circuit; a microcontroller, the microcontroller being electrically connected to an output end of the analog-to-digital conversion circuit; the microcontroller having a non-linear temperature compensation module for non-linear compensation of the signal output by the analog-to-digital conversion circuit.

2. The temperature acquisition device according to claim 1, wherein the thermosensitive circuit is a Wheatstone bridge, one bridge wall of which is provided with a thermistor, and the remaining three bridge walls are provided with fixed resistors, and a first end of the thermistor is electrically connected with the bias voltage source, and a second end of the thermistor serves as the first voltage output end.

3. The temperature acquisition device according to claim 2, wherein the three fixed resistors are respectively: a first resistor, a first end of the first resistor being electrically connected with the bias voltage source, and a second end of the first resistor serving as a second voltage output end; a second input end of the signal conditioning circuit being electrically coupled to the second voltage output end; a second resistor, a first end of the second resistor being electrically coupled to the second voltage output end, and a second end of the second resistor being grounded; a third resistor, a first end of the third resistor being electrically coupled to the first voltage output end, and a second end of the third resistor being grounded.

4. The temperature acquisition device according to claim 3, wherein the signal conditioning circuit comprises: a differential amplifier circuit, a reverse input end of the differential amplifier circuit being the first input end and being electrically coupled to the first voltage output end; a forward input end of the differential amplifier circuit being the second input end and being electrically coupled to the second voltage output end; the differential amplifier circuit being used to output the difference between the voltage signals generated at the first voltage output end and the first voltage output end.

5. The temperature acquisition device according to claim 4, wherein a first protective resistor is arranged between the reverse input end of the differential amplifier circuit and the first voltage output end; a second protective resistor is arranged between the forward input end of the differential amplifier circuit and the second voltage output end; the reverse input end of the differential amplifier circuit is directly or indirectly electrically coupled to the output end of the differential amplifier circuit through a feedback resistor; the output end of the differential amplifier circuit serves as the output end of the signal conditioning circuit. Further comprising: a third protective resistor, a first end of the third protective resistor being electrically connected with the output end of the signal conditioning circuit, and a second end of the third protective resistor being electrically connected with the input end of the analog-to-digital conversion circuit; a first filter capacitor circuit, an input end of the first filter capacitor circuit being electrically coupled to the second end of the third protective resistor, and an output end of the first filter capacitor circuit being grounded. Further comprising:

6. The temperature acquisition device of claim 2, wherein, a power supply voltage source; a fourth resistor, a first end of the fourth resistor being electrically connected with the power supply voltage source. ​ 7. The temperature acquisition device of claim 6, wherein, ​ ​ ​ A fifth resistor, a first end of the fifth resistor is electrically coupled with a second end of the fourth resistor, and a second end of the fifth resistor is grounded; A sixth resistor, a first end of the sixth resistor is electrically coupled with the second end of the fourth resistor, and a second end of the sixth resistor is electrically connected with a power supply end of the analog-to-digital conversion circuit.

8. The temperature acquisition device of claim 7, wherein, Further comprising: A second filter capacitor circuit, a first end of the second filter capacitor circuit is electrically coupled with a second end of the third protective resistor, and a second end of the second filter capacitor circuit is electrically coupled with a second end of the sixth resistor; A third filter capacitor circuit, an input end of the third filter capacitor circuit is electrically coupled with the second end of the fourth resistor, and an output end of the third filter capacitor circuit is grounded; and A reference voltage end of the signal conditioning circuit is electrically coupled with the second end of the fourth resistor. 9.The temperature acquisition device according to claim 2, wherein The thermistor is a negative temperature coefficient thermistor; The temperature acquisition device further comprises: An alarm module electrically connected with the microcontroller and configured to send an alarm signal; A communication module electrically connected with the microcontroller, the communication module being configured to be communicatively connected with a device to be measured to send the temperature sensed by the thermistor to the device to be measured.

10. A semiconductor device, characterized by comprising: Comprise: One or more temperature acquisition devices, each of the temperature acquisition devices being the temperature acquisition device according to any one of claims 1 to 9.

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