Testing device applied to high-frequency high-speed chip coaxial needle
By using a low dielectric constant isolation film and metal plate structure in the coaxial socket chip test socket, the problems of cumbersome potting process and low strength of traditional plastic test sockets are solved, achieving high isolation impedance matching and improved stability.
Patent Information
- Application Number
- CN202423091861.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-12-16
AI Technical Summary
The existing coaxial socket chip test socket has a complicated potting process, low yield, poor quality consistency, and high cost. In addition, traditional plastic test sockets have low strength, are easy to wear, and have a short lifespan.
A high-isolation impedance matching structure is constructed by replacing the traditional injection-molded plastic test socket with an isolation membrane having a dielectric constant of less than 3.0 and a thickness of 0.05 mm, combined with a metal plate and an insulating connecting ring.
It improves the yield and quality consistency of the testing equipment, avoids electrical interference from the probe, reduces manufacturing difficulty and cost, and extends service life.
Smart Images
Figure CN223637570U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of a test device, in particular to a test device applied to a coaxial needle of a high-frequency high-speed chip. BACKGROUND
[0002] In the field of coaxial socket chip test sockets, please refer to Figure 5 The industry generally uses a glue injection process to solve the problem of configuring and constructing high-isolation impedance matching among Power, Ground and signal probes. However, the glue injection process is complicated and needs to solve the problems of vacuumizing, debubbling and solidifying under high and low temperature environments, controlling the volume of the glue and solving the glue flow in the tiny microchannels of the metal frame. The process is difficult, and the yield of the finished product is very low. The consistency of the parameters of different batches of products is poor, and the quality control is not ideal. Therefore, the coaxial socket chip test socket has poor quality consistency and high cost. CONTENT OF THE UTILITY MODEL
[0003] The utility model mainly aims at the above problems, and provides a test device applied to a coaxial needle of a high-frequency high-speed chip, which aims to solve the technical problems in the background art.
[0004] To achieve the above purpose, the utility model provides a test device applied to a coaxial needle of a high-frequency high-speed chip, which comprises:
[0005] A probe positioning plate is provided with a plurality of probe accommodation holes; the probe positioning plate comprises an upper positioning plate and a lower positioning plate;
[0006] A plurality of probes are arranged in the plurality of probe accommodation holes, and the two ends of the probes protrude out of the probe accommodation holes;
[0007] An insulating connecting ring is sleeved on the outer wall of the probe, and the insulating connecting ring blocks the contact between the probe and the probe positioning plate; and the insulating connecting ring blocks the disengagement of the probe from the probe accommodation hole;
[0008] An isolation film has a thickness greater than or equal to 0.05 mm and a dielectric constant less than 3.0; the isolation film is provided with a clearance hole corresponding to the probe; and the isolation film is connected to the lower end surface of the lower positioning plate.
[0009] Further, the number of isolation films is two, and the other isolation film is arranged between the upper positioning plate and the lower positioning plate.
[0010] Further, the material of the isolation film is polyimide.
[0011] Further, the probe positioning plate is a metal plate; and the insulating connecting ring is made of epoxy resin, silica gel or polyester vinyl.
[0012] Further, the probe positioning plate is a metal plate; and the insulating connecting ring is made of epoxy resin, silica gel or polyester vinyl.
[0013] Further, the probe positioning plate is a metal plate; and the insulating connecting ring is made of epoxy resin, silica gel or polyester vinyl.
[0014] Further, the probe positioning plate is a metal plate; and the insulating connecting ring is made of epoxy resin, silica gel or polyester vinyl.
[0015] Further, the probe positioning plate is a metal plate; and the insulating connecting ring is made of epoxy resin, silica gel or polyester vinyl.
[0016] Further, the probe positioning plate is a metal plate; and the insulating connecting ring is made of epoxy resin, silica gel or polyester vinyl.
[0017] Further, the probe positioning plate is a metal plate; and the insulating connecting ring is made of epoxy resin, silica gel or polyester vinyl.
[0018] Compared with the prior art, the test device for the high-frequency high-speed chip coaxial needle can replace the traditional injection plastic test seat with the isolation film 4 with a dielectric constant lower than 3.0 and a minimum thickness of 0.05 mm, avoids the problems of difficult processing and manufacturing process of the probe mounting plate and poor yield, avoids the shortcomings of low strength, easy wear and short service life of conventional polycarbonate plastic, and can quickly complete the connection by only laying the isolation film on the lower end face of the lower positioning plate. The isolation film effectively isolates the probe ends of the probe mounting hole of the lower positioning plate, avoids mutual electrical interference between the probes due to too close distance, and configures high-isolation impedance matching. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 The application is a test device structure schematic view for a high-frequency high-speed chip coaxial needle.
[0020] Figure 2 Figure 1 is a structural schematic diagram of the opening of the pressing upper cover relative to the support top plate of the test device for the coaxial needle of the high-frequency high-speed chip according to the present application.
[0021] Figure 3 Figure 2 is a partial assembly structural exploded schematic diagram of the test device for the coaxial needle of the high-frequency high-speed chip according to the present application.
[0022] Figure 4 Figure 3 is a partial sectional view of the test device for the coaxial needle of the high-frequency high-speed chip according to the present application.
[0023] Figure 5 Figure 4 is a sectional view of a test seat produced by the glue injection process in the prior art.
[0024] The reference numerals shown in the figure are as follows: 1, probe positioning plate; 110, upper positioning plate; 111, positioning counterbore; 120, lower positioning plate; 2, probe; 3, insulating connecting ring; 4, isolation film; 5, chip placement plate; 510, pick-and-place slot; 6, support bottom plate; 7, support top plate; 710, buckling groove; 8, screw; 9, pressing upper cover; 910, elastic buckling member; 920, chip pressing block; 10, torsion spring; 11, pad plate; 12, threaded column. DETAILED DESCRIPTION
[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application. It can be understood that the drawings are only provided for reference and illustration, and are not used to limit the present application. The connection relationship shown in the drawings is only for clear description, and does not limit the connection mode.
[0026] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component, or a middle component can exist at the same time. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. It should also be noted that, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected, or it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. The terms used in the description of the present application are only for the purpose of describing the specific embodiments, and are not intended to limit the present application.
[0027] It should also be noted that in the description of the present application, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.
[0028] Please refer to Figure 1 Figure 4 The embodiment provides a test device applied to a coaxial needle of a high-frequency high-speed chip, which comprises:
[0029] A probe positioning plate 1 is provided with a plurality of probe accommodation holes; the probe positioning plate 1 comprises an upper positioning plate 110 and a lower positioning plate 120.
[0030] A plurality of probes 2 are respectively arranged in the plurality of probe accommodation holes, and the two ends of the probe 2 extend out of the probe accommodation hole.
[0031] An insulating connecting ring 3 is sleeved with the outer wall of the probe 2, and blocks the contact between the probe 2 and the probe positioning plate 1, and the insulating connecting ring 3 blocks the probe 2 from separating from the probe accommodation hole.
[0032] An isolation film 4 has a thickness greater than or equal to 0.05mm and a dielectric constant less than 3.0; the isolation film 4 is provided with a position avoiding hole corresponding to the probe 2; the isolation film 4 is connected with the lower end surface of the lower positioning plate 120.
[0033] By replacing the traditional injection molded plastic test socket shown in Figure 5 with an isolation film 4 with a dielectric constant below 3.0 and a thickness of at least 0.05 mm, the manufacturing process of the probe 2 mounting plate is avoided, and the problem of poor yield is avoided. Avoiding the use of conventional plastics such as polycarbonate, which has the disadvantages of low strength, easy wear, and short service life.
[0034] The isolation film 4 is only laid on the lower end surface of the lower positioning plate 120, and the connection can be quickly completed. The isolation film 4 effectively isolates the probe 2 from the probe 2 extending from the probe 2, avoiding mutual electrical interference between the probes 2 due to too close distance. The configuration builds high isolation impedance matching.
[0035] Please refer to Figure 3 and Figure 4 , the number of isolation films 4 is two, and the other isolation film 4 is arranged between the upper positioning plate 110 and the lower positioning plate 120.
[0036] Since the number of probes 2 is multiple and is arranged in multiple probe arrangement holes, the probe positioning plate 1 is designed in the form of an upper positioning plate 110 and a lower positioning plate 120, and the insulating connecting ring 3 is sleeved on the outer wall of the probe 2, which prevents the probe 2 from contacting the probe positioning plate 1, and the insulating connecting ring 3 prevents the probe 2 from separating from the probe arrangement hole, which is a dual-purpose.
[0037] The inventor has found that not only the multiple probes 2 at the lower end surface of the lower positioning plate 120 do not have isolation measures and can cause mutual electrical interference, but also the multiple probes 2 at the parting surface of the upper positioning plate 110 and the lower positioning plate 120 can also cause interference. By setting the isolation film 4 to this position, such adverse interference can be avoided, and the accuracy and stability of chip testing can be improved.
[0038] In some embodiments, the isolation film 4 is made of polyimide.
[0039] According to theoretical calculation, simulation and actual measurement, a polyimide material with a dielectric constant below 3.0 in a temperature range of -60 degrees to +175 degrees and a frequency of 40 GHz bandwidth is found. By matching the corresponding impedance matching probe structure according to the conventional pitch of the chip, such as P1.0, P0.9, P0.8, P0.65, P0.4, P0.35, single-ended and differential impedance, the impedance matching coaxial socket device for chip testing is designed and manufactured.
[0040] The polyimide material can also be referred to as Pi, and the isolation film 4 can also be referred to as Pi film or Pi sheet.
[0041] Adopt this isolation film 4, also can avoid the whole thickness of probe positioning plate 1 is thick from structure.
[0042] In some embodiments, the probe positioning plate 1 is a metal plate;
[0043] The insulating connecting ring 3 material is any one of epoxy resin, silica gel, polyester vinyl. These materials are low dielectric constant plastic materials. It can better block the probe 2 and the probe positioning plate 1, and avoid the electrical interference of the probe positioning plate 1 to the probe 2.
[0044] In some embodiments, the probe positioning plate 1 is a steel plate. This material has high strength and long service life, and can be repeatedly used to cope with large quantities of chip testing. Combined with the above-mentioned auxiliary impedance matching isolation film 4 and insulating connecting ring 3, it can stably provide positioning support for the probe 2.
[0045] The probe 2 corresponds to a plurality of probe placement holes. Its rule can be arranged in PGSGP or PGSSGP along the vertical or horizontal direction. According to the definition of the probe 2, the outer diameter of the probe 2 also has differences, for example, the definition of S probe 2, the outer diameter is slightly larger than the other two, and the wall thickness of the insulating connecting ring 3 corresponding to the S probe 2 is slightly thinner.
[0046] Please refer to Figure 4 , the probe placement hole is a stepped hole with smaller hole diameter at both ends and larger hole diameter in the middle; the outer diameter of the insulating connecting ring 3 is larger than the hole diameter at both ends of the probe placement hole.
[0047] This structure can prevent the probe 2 from falling off the probe placement hole.
[0048] Please refer to Figure 2 and Figure 3 , including a chip placement plate 5 connected with the upper end face of the upper positioning plate 110; the chip placement plate 5 is provided with a surrounding side wall corresponding to the side edge of the chip; the surrounding side wall is provided with a taking and placing groove 510; the upper positioning plate 110 is provided with a positioning counterbore 111 corresponding to the chip placement plate 5.
[0049] The taking and placing groove 510 can provide a gap between the chip and the surrounding side wall, which is convenient for manual operation to take and place the chip on the chip placement area of the chip placement plate 5.
[0050] By setting the positioning counterbore 111, the chip placement plate 5 can be placed in the upper positioning plate 110, and the upper end faces of the two are flush, which does not affect the thickness of the upper positioning plate 110, and at the same time plays a positioning role for the chip placement plate 5, which is convenient for assembly.
[0051] Please refer to Figure 2 and Figure 3The support bottom plate 6 and the support top plate 7 are connected and fixed by screwing 8.
[0052] In some embodiments, a spacer plate 11 can be arranged between the probe positioning plate 1 and the support bottom plate 6, and the thickness of the spacer plate 11 can be adjusted according to the material cost.
[0053] Please refer to Figure 1 Figure 3 The support top plate 7 is rotatably connected with the pressing upper cover 9. One end of the support top plate 7 is rotatably connected with the pressing upper cover 9 away from the support top plate 7. The support top plate 7 is provided with a buckling groove 710, and the pressing upper cover 9 is provided with an elastic buckling piece 910 corresponding to the buckling groove 710. The elastic buckling piece 910 is rotatable relative to the pressing upper cover 9, and the support top plate 7 and the pressing upper cover 9 are switched between being locked and being unlocked.
[0054] After the chip is placed in the chip enclosing area of the chip mounting plate 5, the upper end surface of the chip is pressed by the pressing upper cover 9, so that the electrical connection end or the end of the chip is connected with the upper end of the probe 2 extending from the upper positioning plate 110, and the test is ensured.
[0055] Please refer to Figure 2 The rotatable connection between the support top plate 7 and the pressing upper cover 9 is provided with a torsion spring 10 for keeping the relative rotation of the two.
[0056] Please refer to Figure 1 and Figure 2 The pressing upper cover 9 is provided with a chip pressing block 920 corresponding to the arrangement area of the probe 2. When the support top plate 7 and the pressing upper cover 9 are closed, the chip pressing block 920 is adjustable relative to the pressing upper cover 9 towards the direction of approaching or moving away from the chip.
[0057] In some embodiments, a threaded hole is arranged in the pressing upper cover 9, a threaded column 12 is arranged in the threaded hole, the chip pressing block 920 is slidably connected with the pressing upper cover 9 through a slide rod (not shown), and the pressing force on the chip can be adjusted by rotating the threaded column 12 to drive the chip pressing block 920 to move relative to the pressing upper cover 9.
[0058] In the specification and claims of the present application, the words "comprise / contain" and the words "have / including" and their variants are used to specify the presence of the stated features, values, steps or components, but do not exclude the presence or addition of one or more other features, values, steps, components or combinations thereof.
[0059] For the sake of clarity, some features of the present application are described in different embodiments, however, these features can also be described in a single embodiment. Conversely, some features of the present application are described in a single embodiment for the sake of brevity, however, these features can also be described in different embodiments, alone or in any suitable combination.
[0060] The above merely describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A testing device applied to a coaxial needle of a high-frequency high-speed chip, characterized in that, include: A probe positioning plate, wherein the probe positioning plate is provided with multiple probe mounting holes; The probe positioning plate includes an upper positioning plate and a lower positioning plate; The probes are multiple in number and are respectively placed in multiple probe placement holes, with both ends of the probes extending out of the probe placement holes; An insulating connecting ring is sleeved on the outer wall of the probe to prevent the probe from contacting the probe positioning plate, and the insulating connecting ring also prevents the probe from disengaging from the probe mounting hole. The isolation membrane has a thickness greater than or equal to 0.05 mm and a dielectric constant less than 3.0; the isolation membrane is provided with a clearance hole corresponding to the probe; the isolation membrane is connected to the lower end face of the lower positioning plate.
2. The testing device for high-frequency high-speed coaxial needle chips according to claim 1, characterized in that, The number of isolation membranes is two, with the other isolation membrane disposed between the upper positioning plate and the lower positioning plate.
3. The testing device for high-frequency high-speed coaxial needle chips according to claim 1, characterized in that, The separator is made of polyimide.
4. The testing device for high-frequency high-speed coaxial needle chips according to claim 1, characterized in that, The probe positioning plate is a metal plate; the insulating connecting ring is made of epoxy resin, silicone, or polyester.
5. The testing device for high-frequency high-speed coaxial needle chips according to claim 1, characterized in that, The probe mounting hole is a stepped hole with the diameters at both ends smaller than the diameter in the middle; the outer diameter of the insulating connecting ring is larger than the diameters at both ends of the probe mounting hole.
6. The testing device for high-frequency high-speed coaxial needle chips according to claim 1, characterized in that, It includes a chip mounting plate connected to the upper end face of the upper positioning plate; the chip mounting plate has an enclosing sidewall corresponding to the side of the chip; the enclosing sidewall has a pick-and-place groove; the upper positioning plate has a positioning countersunk hole corresponding to the chip mounting plate.
7. The testing device for high-frequency high-speed coaxial needle chips according to claim 1, characterized in that, It includes a support base plate and a support top plate respectively located on the upper and lower ends of the probe positioning plate; the support top plate, probe positioning plate and support base plate are connected and fixed by screws.
8. The testing device for high-frequency high-speed coaxial needle chips according to claim 7, characterized in that, It includes a pressing cover rotatably connected to the supporting top plate; at the end away from the supporting top plate and rotatably connected to the pressing cover, the supporting top plate is provided with a fastening groove, and the pressing cover is provided with an elastic fastening member corresponding to the fastening groove; the elastic fastening member rotates relative to the pressing cover to switch the supporting top plate and the pressing cover to be locked or unlocked.
9. The testing device for high-frequency high-speed coaxial needle chips according to claim 8, characterized in that, The supporting top plate and the pressing top cover are provided with a torsion spring at the rotatable connection point to keep them rotating relative to each other.
10. The testing device for high-frequency high-speed coaxial needle chips according to claim 8, characterized in that, The pressing cover is provided with a chip pressing block corresponding to the probe arrangement area. When the support top plate is closed with the pressing cover, the chip pressing block can be adjusted relative to the pressing cover to move closer to or further away from the chip.