Optical module

Abstract

The optical module provided by the utility model comprises a lens assembly which is used for changing the transmission direction of an optical signal; a through hole is formed in the circuit board, and a first copper-clad layer is formed on the side edge of the through hole; the through hole and the first copper-clad layer are located below the lens assembly; a supporting part is formed in the through hole; the supporting part comprises a heat resistance layer, and the heat conductivity coefficient of the heat resistance layer is lower than that of the circuit board; the first heat conduction layer is located above the heat resistance layer, and the heat conductivity coefficient of the first heat conduction layer is larger than that of the heat resistance layer; a gap is formed between the edge of the first heat conduction layer and the edge of the first copper-clad layer; the laser is arranged on the first heat conduction layer; the driving chip is arranged on the first copper-clad layer; the driving chip is electrically connected with the circuit board and the laser; the heating device is arranged on the first heat conduction layer and located on the side edge, away from the driving chip, of the laser; the heating device is electrically connected with the circuit board and used for heating the laser at low temperature. And the laser can be conveniently heated in a low-temperature environment.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. BACKGROUND

[0002] With the development of new business and application mode such as cloud computing, mobile Internet, video, etc., the development and progress of optical communication technology becomes increasingly important. In optical communication technology, the optical module is a tool for converting optical signals and electrical signals, and is one of the key devices in optical communication equipment. With the development of optical communication technology, the transmission rate of the optical module is continuously improved.

[0003] The optical module is provided with a laser and other optical chips. The laser is used to generate an optical signal. In use, it is found that for single-wave 100G high-speed lasers, when the optical module is in a low-temperature environment, such as 0℃, the laser is affected by the low-temperature environment, and the performance of the laser is often degraded, such as optical power drop, spectral shift, and laser bandwidth reduction, etc., which further causes the optical module to fail to work normally. CONTENT OF THE UTILITY MODEL

[0004] Some embodiments provide an optical module, which facilitates heating the laser in a low-temperature environment, maintains the working temperature of the laser, and reduces the adverse effects of the low-temperature environment on the performance of the laser.

[0005] Some embodiments provide an optical module, comprising:

[0006] A lens assembly for changing the transmission direction of an optical signal;

[0007] A circuit board formed with a through hole, a side of the through hole being formed with a first copper layer; the through hole and the first copper layer are located below the lens assembly; a support portion is arranged in the through hole; the support portion comprises:

[0008] A heat resistance layer, the thermal conductivity coefficient of the heat resistance layer being less than the thermal conductivity coefficient of the circuit board;

[0009] A first heat conduction layer located above the heat resistance layer, the thermal conductivity coefficient of the first heat conduction layer being greater than the thermal conductivity coefficient of the heat resistance layer; an edge of the first heat conduction layer and an edge of the first copper layer form a gap;

[0010] A laser arranged on the first heat conduction layer;

[0011] A driving chip arranged on the first copper layer; the driving chip is electrically connected to the circuit board and electrically connected to the laser;

[0012] A heating device arranged on the first heat conduction layer and located on a side of the laser away from the driving chip; the heating device is electrically connected to the circuit board and is used for heating the laser in a low-temperature environment.

[0013] One of the above technical solutions has the following advantages or beneficial effects: a through hole and a first copper clad layer are arranged on the circuit board below the lens assembly. A support part is arranged in the through hole, and the support part includes a heat resistance layer and a first heat conduction layer. The first heat conduction layer is located above the heat resistance layer, and the edges of the first heat conduction layer and the edges of the first copper clad layer form a gap. The heat resistance layer is filled with a material with low thermal conductivity in the through hole, and the top of the heat resistance layer forms the first heat conduction layer. The laser and the heating device are arranged on the first heat conduction layer, and the driving chip is arranged on the first copper clad layer. The edges of the first heat conduction layer and the edges of the first copper clad layer form a gap, which facilitates the isolation of the heat cross talk between the first heat conduction layer and the first copper clad layer. When the optical module is in a low-temperature environment, the heating device is controlled to work, and the heating device generates heat. The heat generated by the heating device is radiated to the surroundings of the heating device. Since the first heat conduction layer has a relatively high thermal conductivity, most of the heat will be transmitted to the first heat conduction layer. The heat transmitted to the first heat conduction layer will be transmitted to the laser. Since the heat resistance layer is below the first heat conduction layer, the heat resistance layer will block the conduction of the heat on the first heat conduction layer to the lower part of the first heat conduction layer, facilitating the more efficient transmission of the heat on the first heat conduction layer to the laser. When the optical module is in a non-low-temperature environment, the heating device is not powered on, and the heating device will not generate heat. When the optical module is in a high-temperature environment, the heat resistance layer can block the heat generated by the devices arranged on the circuit board such as the driving chip, reduce the conduction of the heat generated by the driving chip to the first heat conduction layer, and further reduce the transmission of the heat generated by the driving chip to the laser, so as to reduce the influence of the heat generated by the driving chip on the laser, thereby ensuring the performance of the laser in a high-temperature environment.

[0014] Some embodiments provide an optical module, wherein the support part further includes a second heat conduction layer, and the second heat conduction layer is located below the heat resistance layer; and the second heat conduction layer is connected to the heat dissipation protrusion of the shell.

[0015] Another of the above technical solutions has the following advantages or beneficial effects: the bottom of the support part forms a second heat conduction layer, and the second heat conduction layer can be used to connect the heat dissipation protrusion of the shell. In this way, the heat on the circuit board can be transmitted through the heat dissipation protrusion on the shell, thereby facilitating heat dissipation for the devices on the circuit board.

[0016] Some embodiments provide an optical module, wherein the back surface of the circuit board forms a second copper clad layer, the second copper clad layer is connected to the second heat conduction layer; a via hole is arranged on the second copper clad layer, the via hole connects the first copper clad layer and the second copper clad layer; and the second copper clad layer is connected to the heat dissipation protrusion.

[0017] Another technical solution in the above technical solution has the following advantages or beneficial effects: the back of the circuit board is provided with a second copper clad layer, the second copper clad layer is connected with the first heat conduction layer, a via hole is arranged on the second copper clad layer, and the second copper clad layer is connected with the first copper clad layer through the via hole. The heat generated by the driving chip is radiated and transmitted to the first copper clad layer, and then transmitted to the second copper clad layer through the hole. The second copper clad layer can be used to connect the heat dissipation protrusion of the shell, so as to conveniently transmit the heat of the second copper clad layer to the shell of the optical module, thereby facilitating heat dissipation for the driving chip and other devices on the circuit board.

[0018] Some embodiments provide an optical module, wherein the heating device comprises a substrate, a heating layer, a first pad and a second pad are arranged on the substrate, one end of the heating layer is connected with the first pad, the other end of the heating layer is connected with the second pad, and the heating layer extends from one end of the laser to the other end of the laser; the substrate is arranged on the first heat conduction layer by surface mounting, and the first pad and the second pad are electrically connected with the circuit board.

[0019] Another technical solution in the above technical solution has the following advantages or beneficial effects: the heating device comprises a substrate, a heating layer and a first pad and a second pad connected with the heating layer are arranged on the top of the substrate. The substrate facilitates the arrangement of the heating device on the first heat conduction layer, and the first pad and the second pad facilitate the connection of the heating device with the circuit board. The heating layer extends from one end of the laser to the other end of the laser, thereby facilitating the radiation of the heat generated by the heating layer to the laser, so as to ensure the heating efficiency of the heating device.

[0020] Some embodiments provide an optical module, wherein the bottom of the first heat conduction layer is lower than the top surface of the circuit board, and the top of the first heat conduction layer is higher than the top surface of the circuit board.

[0021] Another technical solution in the above technical solution has the following advantages or beneficial effects: the bottom of the first heat conduction layer is lower than the top surface of the circuit board, and the top of the first heat conduction layer is higher than the top surface of the circuit board, so that the bottom of the first heat conduction layer is embedded in the through hole and the top of the first heat conduction layer protrudes from the through hole, thereby facilitating the arrangement of the laser and the heating device on the first heat conduction layer.

[0022] Some embodiments provide an optical module, wherein the heat resistance layer is an epoxy resin layer, and the through hole is filled with epoxy resin to form the epoxy resin layer.

[0023] Another technical solution in the above technical solution has the following advantages or beneficial effects: the thermal conductivity coefficient of the epoxy resin is lower than that of the circuit board, and the through hole is filled with epoxy resin to form the heat resistance layer, thereby facilitating the formation of the heat resistance layer in the through hole.

[0024] Some embodiments provide an optical module, further comprising a temperature sensor, the temperature sensor is located below the lens assembly and close to the laser, the temperature sensor is located outside the first heat-conducting layer and the first copper-clad layer.

[0025] Another technical solution in the above technical solution has the following advantages or beneficial effects: the temperature sensor is located below the lens assembly and close to the laser, which facilitates more accurate acquisition of the temperature around the laser. The temperature sensor is not located on the first heat-conducting layer and the first copper-clad layer, which facilitates reducing the influence of the heat generated by the heating device and the heat generated by the driving chip on the accuracy of the temperature sensor in measuring the temperature around the laser.

[0026] Some embodiments provide an optical module, comprising: a circuit board formed with a through hole; a first copper-clad layer is formed on the top surface of the circuit board, the first copper-clad layer is located on the side of the through hole; a support part is arranged in the through hole; the support part comprises:

[0027] a heat-resistant layer, the thermal conductivity of the heat-resistant layer is less than the thermal conductivity of the circuit board;

[0028] a first heat-conducting layer located above the heat-resistant layer, the thermal conductivity of the first heat-conducting layer is greater than the thermal conductivity of the heat-resistant layer; the edge of the first heat-conducting layer and the edge of the first copper-clad layer form a gap;

[0029] a laser arranged on the first heat-conducting layer;

[0030] a driving chip arranged on the first copper-clad layer; the driving chip is electrically connected to the circuit board and electrically connected to the laser;

[0031] a heating device arranged on the first heat-conducting layer and located on the side of the laser away from the driving chip; the heating device is electrically connected to the circuit board and is used for heating the laser at low temperature.

[0032] Another technical solution in the above technical solution has the following advantages or beneficial effects: a through hole is formed on the circuit board, a first copper layer is formed on the top of the circuit board, and the first copper layer is located on the side of the through hole. A support part is arranged in the through hole, the support part includes a heat resistance layer and a first heat conduction layer, the first heat conduction layer is located above the heat resistance layer, and the edges of the first heat conduction layer and the first copper layer are spaced apart. The through hole is filled with a material with low thermal conductivity to form a heat resistance layer, and the top of the heat resistance layer is formed with a first heat conduction layer. The laser and the heating device are arranged on the first heat conduction layer, and the driving chip is arranged on the first copper layer. The edges of the first heat conduction layer and the first copper layer are spaced apart, which facilitates the isolation of the heat cross talk between the first heat conduction layer and the first copper layer. When the optical module is in a low-temperature environment, the heating device is controlled to work, and the heating device generates heat. The heat generated by the heating device is radiated to the surrounding of the heating device. Since the first heat conduction layer has a relatively high thermal conductivity, most of the heat will be transmitted to the first heat conduction layer. The heat transmitted to the first heat conduction layer will be transmitted to the laser. Since the heat resistance layer is below the first heat conduction layer, the heat resistance layer will block the conduction of the heat on the first heat conduction layer to the first heat conduction layer below, facilitating the more efficient transmission of the heat on the first heat conduction layer to the laser. When the optical module is in a non-low-temperature environment, the heating device is not powered on, and the heating device will not generate heat. When the optical module is in a high-temperature environment, the heat resistance layer can block the heat generated by the devices arranged on the circuit board such as the driving chip, reduce the conduction of the heat generated by the driving chip to the first heat conduction layer, and further reduce the transmission of the heat generated by the driving chip to the laser, so as to reduce the influence of the heat generated by the driving chip on the laser, thereby facilitating to ensure the performance of the laser in a high-temperature environment.

[0033] Some embodiments provide an optical module, wherein the support part further comprises a second heat conduction layer located below the heat resistance layer.

[0034] The back surface of the circuit board is formed with a second copper layer, the second copper layer is connected to the second heat conduction layer, a via hole is arranged on the second copper layer, the via hole connects the second copper layer and the first copper layer, and the second heat conduction layer and the second copper layer are connected to the heat dissipation protrusions on the shell of the optical module.

[0035] Another technical solution in the above technical solution has the following advantages or beneficial effects: the bottom of the support part is formed with a second heat conduction layer, the back surface of the circuit board is provided with a second copper layer, the second copper layer is connected to the first heat conduction layer, a via hole is arranged on the second copper layer, and the second copper layer is connected to the first copper layer through the via hole. The heat generated by the driving chip is radiated to the first copper layer, and then transmitted to the second copper layer through the via hole. The second copper layer can be used to connect the heat dissipation protrusions of the shell, so as to facilitate the transmission of the heat of the second copper layer to the shell of the optical module, thereby facilitating the heat dissipation of the devices such as the driving chip on the circuit board.

[0036] Some embodiments, provide a light module, the heating device includes a substrate, the substrate is provided with a heating layer, a first pad and a second pad, one end of the heating layer is connected to the first pad, the other end of the heating layer is connected to the second pad, and the heating layer extends from one end of the laser to the other end of the laser; the substrate is attached to the first thermally conductive layer, and the first pad and the second pad are electrically connected to the circuit board.

[0037] Another technical solution in the above technical solution has the following advantages or beneficial effects: the heating device includes a substrate, the heating layer and the first pad and the second pad connected to the heating layer are arranged on the top of the substrate. The substrate facilitates the arrangement of the heating device on the first thermally conductive layer, and the first pad and the second pad facilitate the connection of the heating device to the circuit board. The heating layer extends from one end of the laser to the other end of the laser, which facilitates the radiation of the heat generated by the heating layer to the laser, so as to ensure the heating efficiency of the heating device. BRIEF DESCRIPTION OF DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only some of the drawings of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limited to the actual size, actual process, actual timing of signals, etc. of the products involved in the embodiments of the present disclosure.

[0039] Figure 1 A partial architecture diagram of an optical communication system according to some embodiments;

[0040] Figure 2 A partial structure diagram of a host computer according to some embodiments;

[0041] Figure 3 A structure diagram of a light module according to some embodiments;

[0042] Figure 4 An exploded view of a light module according to some embodiments;

[0043] Figure 5A An exploded view of a lens assembly and a circuit board according to some embodiments;

[0044] Figure 5B A Figure 5A A partial enlarged view of A in FIG. 8;

[0045] Figure 6A A partial schematic view of a light module according to some embodiments Figure 1 ;

[0046] Figure 6B A partial schematic diagram of an optical module according to some embodiments. Figure 2 ;

[0047] Figure 6C A partial schematic diagram of an optical module according to some embodiments. Figure 3 ;

[0048] Figure 7 This is a partial schematic diagram of the bottom surface of a circuit board according to some embodiments;

[0049] Figure 8 This is a structural diagram of a heating device according to some embodiments;

[0050] Figure 9A A usage state of a support portion according to some embodiments Figure 1 ;

[0051] Figure 9B A usage state of a support portion according to some embodiments Figure 2 ;

[0052] Figure 10A This is a performance test diagram of a circuit board without a support and heating element according to some embodiments;

[0053] Figure 10B This is a performance test diagram showing a support and heating element mounted on a circuit board according to some embodiments. Detailed Implementation

[0054] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0055] Unless otherwise required by the context, the term "comprises" in the specification and claims is to be construed as open, inclusive, meaning "including but not limited to"; the terms "first", "second" are not to be construed as indicating or implying relative importance or indicating a quantity of upper limit; the term "multiple" means two or more; the term "connected" should be broadly understood, for example, "connected" can be fixed connection, or detachable connection, or integral, can be directly connected, or indirectly connected through intermediate media; the use of the terms "adapted to" or "configured to" means open and inclusive language, which does not exclude devices adapted to or configured to perform additional tasks or steps; the terms "parallel", "vertical", "same", "consistent", "flush" and the like are not limited to absolute mathematical theoretical relationship, but also include acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0056] In optical communication technology, in order to establish information transmission between information processing devices, information is loaded onto light, and the transmission of information is carried out by using the propagation speed of light. Such information-loaded light is optical signal. The optical signal can reduce the loss of optical power when transmitted in optical information transmission equipment, and realize long-distance transmission of optical signal. At the same time, the cost of optical information transmission equipment such as optical fiber is lower than that of electrical information transmission equipment such as copper wire. Therefore, optical communication technology can realize high-speed, long-distance and low-cost information transmission.

[0057] Information processing devices usually include optical network terminal (ONU), gateway, router, switch, mobile phone, computer, server, tablet computer, television and the like, and optical information transmission equipment usually includes optical fiber and optical waveguide and the like. The signal that can be recognized and processed by the information processing device is electrical signal, while the optical communication technology uses optical signal for transmission, which requires optical module to convert optical signal and electrical signal.

[0058] The optical module can realize the mutual conversion between the optical signal and the electrical signal between the information processing device and the optical information transmission equipment. In some embodiments, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network terminal; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; a second electrical signal from the optical network terminal is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber.

[0059] Since information can be transmitted between multiple information processing devices through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, without all the information processing devices being directly connected to the optical module. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module is referred to as the optical port, and the electrical signal input end or the electrical signal output end of the optical module is referred to as the electrical port.

[0060] Figure 1 FIG. 1 is a schematic diagram of a part of an optical communication system according to some embodiments. As shown in FIG. 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 of an optical module, an optical module 200, an optical fiber 101, and a network cable 103, wherein the optical fiber 101 belongs to an optical information transmission device, and the network cable 103 belongs to an electrical information transmission device. Figure 1

[0061] In some embodiments, one end of the optical fiber 101 extends towards the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0062] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0063] The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0064] The host computer 100 includes a housing accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102, so that the host computer 100 and the optical module 200 establish a one-way or two-way electrical signal connection.

[0065] ​The host computer 100 further comprises an external electrical interface which can access a telecommunication network. In some embodiments, the external electrical interface comprises a Universal Serial Bus (USB) or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 to enable the host computer 100 to establish a unidirectional or bidirectional electrical signal connection with the network cable 103.

[0066] One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100 to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0067] In some embodiments, the first optical signal from the remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal according to the first electrical signal, and the fourth electrical signal is transmitted to the local information processing device 2000.

[0068] In some embodiments, the optical module is a tool for converting optical signals and electrical signals, and in the conversion process of the optical signals and the electrical signals, the information does not change, and the encoding or decoding mode of the information changes.

[0069] In addition to the optical network terminal, the host computer 100 further comprises an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), or a data center server, etc.

[0070] Figure 2 A partial structure diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. As Figure 2As shown in some embodiments, the host computer 100 further comprises a PCB circuit board 105 arranged in the accommodating cavity, and a cage 106 arranged on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0071] In some embodiments, the cage 106 is provided with a heat sink 107, which can dissipate heat for the optical module; in some embodiments, the heat sink 107 has a fin structure or other protruding structure to increase the heat dissipation area.

[0072] In some embodiments, the cage 106 is internally provided with an electrical connector configured to access the electrical port of the optical module 200.

[0073] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107.

[0074] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 establish electrical signal connection.

[0075] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish optical signal connection.

[0076] Figure 3 A structural diagram of an optical module according to some embodiments, Figure 4 An exploded view of an optical module according to some embodiments. As Figure 3 and Figure 4 As shown in some embodiments, the optical module 200 comprises a shell comprising an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202 to form two openings 203 and 204, one of which is an electrical port and the other of which is an optical port. In some embodiments, the shell forms one opening which is both an electrical port and an optical port.

[0077] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal material, which is beneficial to realize electromagnetic shielding and heat dissipation.

[0078] The assembly method of the upper shell 201 and the lower shell 202 facilitates the installation of the circuit board 300, the lens assembly 400 and the like into the shell, and the shell can encapsulate and protect the above-mentioned devices.

[0079] The direction of the line connecting the two openings 203 and 204 can be consistent with the length direction of the optical module 200, or can be inconsistent with the length direction of the optical module 200. For example, the opening 203 is located at the left end of the optical module 200, and the opening 204 is also located at the right end of the optical module 200. Alternatively, the opening 203 is located at the end of the optical module 200, and the opening 204 is located at the side of the optical module 200. Figure 3 Figure 3 Alternatively, the opening 203 is located at the end of the optical module 200, and the opening 204 is located at the side of the optical module 200.

[0080] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicularly to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the shell.

[0081] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicularly to the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011, and the two upper side plates and the two lower side plates 2022 are combined to realize that the upper shell 201 covers the lower shell 202.

[0082] As shown in Figure 3 and Figure 4 In some embodiments, the optical module includes a circuit board 300 arranged in the shell, and the circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize power supply, electrical signal transmission, and grounding functions. The electronic components can include capacitors, resistors, transistors, and metal oxide semiconductor field effect transistors (MOSFETs). The chips can include microcontroller units (MCUs), laser drive chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0083] ​In some embodiments, the circuit board comprises a rigid circuit board, which can also serve as a carrier due to its relatively hard material, such as the rigid circuit board can stably carry the electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0084] In some embodiments, the circuit board further comprises a flexible circuit board, which can be used independently; or can be used in cooperation with the rigid circuit board.

[0085] In some embodiments, the circuit board further comprises a gold finger formed on the end surface thereof, which is composed of a plurality of pins independent of each other.

[0086] In some embodiments, the gold finger is arranged on the surface of one side of the circuit board 300 (for example, the upper surface shown in the figure); in some embodiments, the gold finger is arranged on the surfaces of both upper and lower sides of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. Figure 4

[0087] In some embodiments, the gold finger of the circuit board extends from the electrical port and is inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold finger is in conduction with the electrical connector in the cage 106. The gold finger is configured to establish electrical connection with the host computer, and can realize functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc.

[0088] In some embodiments, the optical module 200 further comprises an unlocking component 600 located outside the shell thereof. The unlocking component 600 is configured to realize the fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0089] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower shell 202, and comprises a clamping component matched with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the clamping component of the unlocking component 600; when the unlocking component 600 is pulled, the clamping component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the clamping component and the host computer, to release the fixation between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0090] ​In some embodiments, the lens assembly 400 is connected to the circuit board 300 and covers the devices such as the light emitting chip and / or the light receiving chip. The lens assembly 400 has a transmission surface and a reflection surface. The transmission direction of the transmitted light signal and / or the received light signal is adjusted by the combination of the transmission surface and the reflection surface, so that the light signal generated by the light emitting chip can be output from the optical module, and the light signal input into the optical module can be transmitted to the light receiving chip. The light emitting chip can be a laser, and the light receiving chip can be a photodetector.

[0091] In some embodiments, the lens assembly 400 is connected to the optical fiber ribbon 410. The light signal generated by the light emitting chip is transmitted to the optical fiber ribbon 410 through the lens assembly 400, or the light signal input through the optical fiber ribbon 410 is transmitted to the lens assembly 400 and then transmitted to the light receiving chip through the lens assembly 400.

[0092] In some embodiments, the optical module 200 can include one lens assembly 400. Of course, in some embodiments, the number of lens assemblies 400 in the optical module 200 is not limited to one, and two lens assemblies 400 can be included, and the light emitting chip and / or the light receiving chip are arranged below each lens assembly 400.

[0093] Figure 5A An exploded view of a lens assembly and a circuit board according to some embodiments, Figure 5B An exploded view of a lens assembly and a circuit board according to some embodiments, Figure 5A An enlarged view of part A in FIG. 4. As shown in Figure 5A An enlarged view of part A in FIG. 4. As shown in Figure 5B In some embodiments, the lens assembly 400 is connected to the circuit board 300 and covers the devices such as the light emitting chip and / or the light receiving chip. The lens assembly 400 has a transmission surface and a reflection surface. The transmission direction of the transmitted light signal and / or the received light signal is adjusted by the combination of the transmission surface and the reflection surface, so that the light signal generated by the light emitting chip can be output from the optical module, and the light signal input into the optical module can be transmitted to the light receiving chip. The light emitting chip can be a laser, and the light receiving chip can be a photodetector.

[0094] In some embodiments, the laser 310 is arranged on the side of the driving chip 320, and the laser 310 is located below the lens assembly 400. The laser 310 is used to generate a light signal. The laser 310 is close to the driving chip 320, so as to reduce the distance between the driving signal output by the driving chip 320 and the laser 310. The laser 310 can be wire-bonded to the driving chip 320. Exemplarily, the laser 310 can be a laser array, which can generate multiple light signals.

[0095] The laser 310 can be a VCSEL (Vertical Cavity Surface Emitting Laser) laser. The VCSEL laser is developed on the basis of a gallium arsenide semiconductor material, has the advantages of small size, circular output spot, small threshold current, easy to be integrated into a large area array, and is widely used in the field of optical communication. In the process of continuous use, it is found that the performance of the VCSEL laser is generally cracked seriously in a low-temperature environment, which will seriously affect the normal use of the optical module.

[0096] In some optical modules, the laser can be placed on the semiconductor cooler through the COC substrate, the semiconductor cooler is placed on the surface of the circuit board 300, the negative electrode of the laser is directly welded with the pad on the surface of the COC substrate, the positive electrode of the laser is connected with the COC substrate through wire bonding, and the semiconductor cooler conducts heat to the laser. The laser 310 needs to be arranged below the lens assembly 400, and needs to be wire-bonded with the driving chip 320, which is not convenient for the laser 310 to be heated by the semiconductor cooler.

[0097] In some embodiments, the laser 310 is provided with a heating device 330 on the side of the laser 310. When the optical module is in a low-temperature environment, the heating device 330 is powered on to generate heat. The heat generated by the heating device 330 can heat the laser 310, reducing the adverse effects of the low-temperature environment on the laser 310. The heating device 330 can be a heating resistor or the like.

[0098] In some embodiments, the laser 310 and the heating device 330 are arranged on the circuit board 300. Since the circuit board 300 is composed of multiple layers of boards, the adjacent boards are bonded by resin, and the heat conduction and heat dissipation performance of the circuit board 300 is not good, therefore when the laser 310 is bonded on the circuit board 300, the heat generated by the heating device 330 is conducted to the laser 310 only through the circuit board 300, which will cause low heat transfer efficiency, resulting in increased energy consumption of the heating device 330.

[0099] In some embodiments, in order to improve the efficiency of the heat generated by the heating device 330 to the laser 310, a copper clad layer and a via hole are arranged on the circuit board 300, the heating device 330 is arranged on the copper clad layer, and the copper clad layer surrounds the side of the laser 310. However, in use, it is found that the temperature of the laser 310 is prone to be too high in a high-temperature environment.

[0100] In some embodiments, a support portion 301 is formed on the circuit board 300, which supports and connects the heating device 330 and the laser 310. Heat generated by the heating device 330 is transferred to the support portion 301, which then transfers this heat to the laser 310. The support portion 301 also reduces heat transfer to other parts of the circuit board 300, minimizing heat loss from the heating device 330 and improving its heating efficiency. This helps maintain the operating temperature of the laser 310 and reduces the adverse effects of low-temperature environments on the laser 310's performance. The support portion 301 can be formed by filling the circuit board 300 with a material with low thermal conductivity. The material with low thermal conductivity can be epoxy resin, polyethylene resin, etc., whose thermal conductivity is lower than that of the circuit board 300. Therefore, in high-temperature environments, the support portion 301 can prevent heat generated by other devices on the circuit board 300 from being conducted to the laser 310, thereby reducing the excessively high temperature of the laser 310 in high-temperature environments.

[0101] In some embodiments, a photodetector 340 may be disposed below the lens assembly 400, and the photodetector 340 is used to receive optical signals. The photodetector 340 is located on the side of the laser 310 and is not located on the support portion 301. The photodetector 340 may be a photodetector array, capable of receiving multiple optical signals.

[0102] In some embodiments, a TIA 350 may be disposed below the lens assembly 400, and the TIA 350 is located on the side of the photodetector 340. Exemplarily, the TIA 350 may be located on the side of the driver chip 320.

[0103] Figure 6A A partial schematic diagram of an optical module according to some embodiments. Figure 1 .like Figure 6A As shown, a through-hole 302 is formed on the circuit board 300. The through-hole 302 is located on the side of the driver chip 320 and is spaced from the edge of the driver chip 320. A support portion 301 is formed by filling the through-hole 302 with a material with low thermal conductivity. Exemplarily, a material with low thermal conductivity and a material with high thermal conductivity can be stacked and filled in the through-hole 302. For example, a heat-resistant layer is formed by filling the through-hole 302 with a material with low thermal conductivity, and a heat-conducting layer is formed by filling the heat-resistant layer with a material with high thermal conductivity. The heat-conducting layer connects the laser 310 and the heating device 330. A metal layer or the like can be provided above the heat-resistant layer, and the thermal conductivity of the metal layer or the like is greater than that of the heat-resistant layer.

[0104] In some embodiments, the first copper layer 303 is arranged on the circuit board 300, the first copper layer 303 is located at the edge of the through hole 302, and a gap is formed between the through hole 302 and the first copper layer 303, and the driving chip 320 is attached to the first copper layer 303. When the optical module 200 is in a low-temperature environment, in order to ensure the working temperature of the laser 310, the heating device 330 works, and the gap can reduce the heat generated by the heating device 330 to be transmitted to the first copper layer 303; when the optical module 200 is in a high-temperature environment, the heating device 330 does not work, and the gap can reduce the heat generated by the driving chip 320 to be transmitted to the support part 301, thereby reducing the influence of the heat generated by the driving chip 320 on the laser 310.

[0105] Figure 6B A partial view of an optical module according to some embodiments Figure 2 , Figure 6C A partial view of an optical module according to some embodiments Figure 3 , Figure 6B and Figure 6C A support part structure is shown. As shown in Figure 6B and Figure 6C , in some embodiments, the support part 301 includes a heat-blocking layer 3011 located in the through hole 302. The heat-blocking layer 3011 can be formed of a material with low thermal conductivity; the thermal conductivity of the heat-blocking layer 3011 is lower than that of the main material of the circuit board 300. Exemplarily, the through hole 302 is filled with epoxy to form the heat-blocking layer 3011. The heat-blocking layer 3011 can block the heat generated by the heating device 330, reduce the transmission of the heat generated by the heating device 330 to the outside of the laser 310, and facilitate to improve the heating efficiency of the heating device 330; the heat-blocking layer 3011 can also block the heat generated by other devices on the circuit board 300 from being transmitted to the laser 310, thereby facilitating to reduce the influence of the heat generated by other devices on the circuit board 300 on the laser 310 in a high-temperature environment, and further facilitating to control the working temperature of the laser 310 within a relatively stable range.

[0106] In some embodiments, the support part 301 can include a first heat-conducting layer 3012 located on the top of the heat-blocking layer 3011. The first heat-conducting layer 3012 can be formed of a metal covering the top of the heat-blocking layer 3011, such as copper, gold, or other metals, of course, the first heat-conducting layer 3012 is not limited to being formed of a covering metal. The first heat-conducting layer 3012 is not connected to the first copper layer 303. The laser 310 and the heating device 330 are arranged on the first heat-conducting layer 3012, and the heat generated by the heating device 330 is transmitted to the laser 310 through the first heat-conducting layer to heat the laser 310. The first heat-conducting layer 3012 uses copper or gold, etc., to accelerate the transmission efficiency of heat.

[0107] In some embodiments, the top of the first thermally conductive layer 3012 is higher than the top surface of the circuit board 300, and the bottom of the first thermally conductive layer 3012 is lower than the top surface of the circuit board 300.

[0108] In some embodiments, the support portion 301 may include a second thermally conductive layer 3013, which is located at the bottom of the heat-insulating layer 3011. The second thermally conductive layer 3013 may be formed by covering the bottom of the heat-insulating layer 3011 with a metal, such as copper or gold.

[0109] In some embodiments, the top of the second thermal conductive layer 3013 is higher than the bottom surface of the circuit board 300, and the bottom of the second thermal conductive layer 3013 is lower than the bottom surface of the circuit board 300.

[0110] In some embodiments, a temperature sensor is disposed below the lens assembly 400, located on the circuit board 300 outside the first thermally conductive layer 3012 and the first copper-clad layer 303. The temperature sensor is used to collect the operating temperature of the laser within the optical module, facilitating the control of the heating device 330 to turn on or off. The temperature sensor transmits the collected laser operating temperature to the MCU, which compares the laser operating temperature with a preset temperature. If the laser operating temperature is lower than the preset temperature, it indicates that the optical module is in a low-temperature environment, and the MCU controls the heating device 330 to supply power for heating, thereby heating the laser 310 and increasing its operating temperature. If the laser operating temperature is not lower than the preset temperature, it indicates that the optical module is in a normal operating environment, and the heating device 330 does not operate.

[0111] In some embodiments, the temperature sensor may also be located within the MCU. The temperature sensor collects the operating temperature of the laser 310 in the optical module and stores the collected operating temperature of the laser in the register of the MCU. The MCU reads the operating temperature of the laser 310 and controls the start and stop of the heating device 330 according to the operating temperature of the laser 310.

[0112] Figure 7 This is a partial schematic diagram of the bottom surface of a circuit board according to some embodiments. Figure 7 As shown, in some embodiments, a second copper-clad layer 304 is formed on the bottom surface of the circuit board 300. The second copper-clad layer 304 is located at the edge of the second thermally conductive layer 3013 and is connected to the second thermally conductive layer 3013. The second copper-clad layer 304 and the second thermally conductive layer 3013 can be connected to heat dissipation protrusions on the housing to ensure the heat dissipation effect of the heat dissipation protrusions. Exemplarily, the top of the second thermally conductive layer 3013 is flush with the top of the second copper-clad layer 304.

[0113] In some embodiments, a second copper-clad layer 304 is disposed opposite to a first copper-clad layer 303, and the second copper-clad layer 304 is disposed in the projection area of ​​the first copper-clad layer 303 in the bottom direction of the circuit board 300. A via 305 is disposed between the second copper-clad layer 304 and the first copper-clad layer 303, connecting the first copper-clad layer 303 and the second copper-clad layer 304. Heat generated by the driver chip 320 is radiated to the first copper-clad layer 303, conducted through the via 305 to the second copper-clad layer 304, and then conducted through the via 305 to the heat dissipation protrusions on the housing. Exemplarily, a plurality of vias 305 are disposed between the second copper-clad layer 304 and the first copper-clad layer 303.

[0114] Figure 8 This is a structural diagram of a heating device according to some embodiments. Figure 8 As shown, in some embodiments, the heating device 330 includes a substrate 331, a heating layer 332, a first pad 333, and a second pad 334. The heating layer 332, the first pad 333, and the second pad 334 are disposed on the substrate 331. One end of the heating layer 332 is connected to the first pad 333, and the other end of the heating layer 332 is connected to the second pad 334. The substrate 331 may be a ceramic substrate, but is not limited to a ceramic substrate; the heating layer 332 may optionally be a resistance wire. The first pad 333 and the second pad 334 are used to electrically connect to the circuit board 300 to energize the heating layer 332.

[0115] In some embodiments, the heating layer 332 extends from one end of the laser 310 to the other end of the laser 310, that is, the length of the heating layer 332 is greater than or equal to the length of the laser 310, so that the heat generated by the heating layer 332 can be transferred to the laser 310 more evenly.

[0116] In some embodiments, the first pad 333 and the second pad 334 are disposed on the top surface of the substrate 331 to facilitate the electrical connection between the heating device 330 and the circuit board 300.

[0117] Figure 9A A usage state of a support portion according to some embodiments Figure 1 , Figure 9B A usage state of a support portion according to some embodiments Figure 2 In this context, solid arrows represent heat generated by heating devices, while dashed arrows represent heat generated by driver chips, etc. For example... Figure 9A and Figure 9B As shown, in some embodiments, the laser 310 and the heating device 330 are disposed on the first thermally conductive layer 3012. The laser 310 is located between the heating device 330 and the driving chip 320, so that the heating device 330 can be close to the laser 310 and far away from the driving chip 320, thereby reducing the adverse effects of heat radiation from the heating device 330 to the driving chip 320.

[0118] When the optical module is in a low-temperature environment, the heating device 330 is powered on and generates heat. This heat radiates outwards from the heating device 330. Due to the high thermal conductivity of the first thermally conductive layer 3012, most of the heat is radiated to it. This radiated heat is then transferred to the laser 310. Since a heat-blocking layer 3011 lies beneath the first thermally conductive layer 3012, it prevents heat from being conducted downwards from the first thermally conductive layer 3012, facilitating more efficient heat transfer to the laser 310. When the optical module is in a non-low-temperature environment, the heating device 330 is not powered on and does not generate heat.

[0119] When the optical module is in a high-temperature environment, the heat-blocking layer 3011 can block the heat generated by the driver chip 320 and other devices on the circuit board 300, reduce the heat generated by the driver chip 320 and other devices from being conducted to the first heat-conducting layer 3012, and thus reduce the heat generated by the driver chip 320 and other devices from being transferred to the laser 310, so as to reduce the impact of the heat generated by the driver chip 320 and other devices on the laser 310.

[0120] Figure 10A This is a performance test diagram of a circuit board without a support and heating element, according to some embodiments. Figure 10B This is a performance test diagram showing a support and heating element mounted on a circuit board according to some embodiments; where BER is the Bit Error Rate (BER) and TEMP is the temperature. Figure 10A and Figure 10B As shown, without a support and heating element on the circuit board 300, the performance of the laser 310 is relatively poor when the ambient temperature of the optical module is below 20°C. However, after the support 302 and heating element 330 are installed on the circuit board 300, the performance of the laser 310 is significantly improved. (Comparison) Figure 10A and Figure 10B It can be seen that the support part 302 and the heating device 330 are provided on the circuit board 300, which can significantly improve the performance of the laser 310 in low temperature environment, and the performance of the laser 310 does not change significantly in high temperature environment.

[0121] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module characterized by comprising: The application relates to a lens assembly and a circuit board. The lens assembly is used for changing the transmission direction of an optical signal. The circuit board is provided with a through hole, and a first copper layer is formed on the side of the through hole. The through hole and the first copper layer are located below the lens assembly. The through hole is provided with a support part. The support part comprises: A heat resistance layer, the thermal conductivity of the heat resistance layer is less than the thermal conductivity of the circuit board. A first heat conduction layer is located above the heat resistance layer, the thermal conductivity of the first heat conduction layer is greater than the thermal conductivity of the heat resistance layer, and the edge of the first heat conduction layer is spaced from the edge of the first copper layer. A laser is arranged on the first heat conduction layer.

2. The optical module according to claim 1, characterized by A driving chip is arranged on the first copper layer, and the driving chip is electrically connected with the circuit board and the laser.

3. The optical module according to claim 2, characterized by A heating device is arranged on the first heat conduction layer and located on the side of the laser away from the driving chip, and the heating device is electrically connected with the circuit board and used for heating the laser at low temperature. The support part further comprises a second heat conduction layer, and the second heat conduction layer is located below the heat resistance layer.

4. The optical module according to claim 1, characterized by The second heat conduction layer is connected with a heat dissipation protrusion of a housing.

5. The optical module of claim 1, wherein, A second copper layer is formed on the back of the circuit board, the second copper layer is connected with the second heat conduction layer, a via hole is arranged on the second copper layer, and the via hole is connected with the first copper layer and the second copper layer.

6. The optical module of claim 1, wherein, The second copper layer is connected with the heat dissipation protrusion.

7. The optical module of claim 1, wherein, The heating device comprises a substrate, a heating layer, a first pad and a second pad are arranged on the substrate, one end of the heating layer is connected with the first pad, the other end of the heating layer is connected with the second pad, and the heating layer extends from one end of the laser to the other end of the laser; the substrate is attached and arranged on the first heat conduction layer, and the first pad and the second pad are electrically connected with the circuit board.

8. An optical module characterized by comprising: The bottom of the first heat conduction layer is lower than the top surface of the circuit board, and the top of the first heat conduction layer is higher than the top surface of the circuit board. The heat resistance layer is an epoxy resin layer, and the through hole is filled with epoxy resin to form an epoxy resin layer. A temperature sensor is further arranged below the lens assembly and close to the laser, and the temperature sensor is located outside the first heat conduction layer and the first copper layer. The application relates to a lens assembly and a circuit board. The circuit board is provided with a through hole. A first copper layer is formed on the top surface of the circuit board and located on the side of the through hole. The through hole is provided with a support part. The support part comprises: A heat resistance layer, the thermal conductivity of the heat resistance layer is less than the thermal conductivity of the circuit board. A first heat conduction layer is located above the heat resistance layer, the thermal conductivity of the first heat conduction layer is greater than the thermal conductivity of the heat resistance layer, and the edge of the first heat conduction layer is spaced from the edge of the first copper layer. A laser is arranged on the first heat conduction layer. A driving chip is arranged on the first copper layer, and the driving chip is electrically connected with the circuit board and the laser. A heating device is arranged on the first heat-conducting layer and located at the side of the laser away from the driving chip; the heating device is electrically connected to the circuit board and used for heating the laser at low temperature.

9. The optical module according to claim 8, characterized by The support part further comprises a second heat-conducting layer located below the heat-resisting layer. The back surface of the circuit board is formed with a second copper-clad layer connected to the second heat-conducting layer. A via hole is arranged on the second copper-clad layer and connected to the second copper-clad layer and the first copper-clad layer. The second heat-conducting layer and the second copper-clad layer are connected to heat dissipation protrusions on the optical module shell.

10. The optical module of claim 8, wherein, The heating device comprises a substrate provided with a heating layer, a first pad and a second pad, one end of the heating layer is connected to the first pad, the other end of the heating layer is connected to the second pad, and the heating layer extends from one end of the laser to the other end of the laser; the substrate is arranged on the first heat-conducting layer, and the first pad and the second pad are electrically connected to the circuit board.

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