Adsorption assembly and wafer carrier plate fixing jig

Abstract

The utility model discloses an adsorption assembly and a wafer carrier plate fixing jig, for two carrier plates with different sizes, the edges of the two carrier plates without wafers can be respectively abutted against the edge of a first groove or the edge of a second groove, and negative pressure is provided for a first negative pressure channel, so that the two carrier plates can be fixed on the first negative pressure channel. By providing negative pressure for the first negative pressure channel, the first adsorption hole can adsorb the carrier plate to the edge of the first groove, by providing negative pressure for the second negative pressure channel, the second adsorption hole can adsorb the carrier plate to the edge of the second groove, and the carrier plate is firmly fixed. The first adsorption hole and the second adsorption hole can fix the carrier plate, and the arrangement of the first groove and the second groove enables the adsorption assembly to be compatible with carrier plates of different sizes.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer bonding field, concretely relates to a kind of adsorption subassembly and wafer carrier plate fixing jig. BACKGROUND

[0002] In the production process of MicroLed wafer bonding, wafer carrier plate is fixed by jig. In the prior art, in order to prevent damage to the wafer, only the edge of the wafer is not set on the carrier plate to contact with the jig, the carrier plate is not firmly fixed, and it is easy to fall during transportation. Moreover, the existing jig cannot be compatible with two different sizes of carrier plates. If two different sizes of carrier plates are to be processed, the jig type needs to be manually changed, which reduces the processing efficiency of Micro Led bonding process. SUMMARY

[0003] In order to overcome the shortcomings of the prior art, the utility model provides an adsorption subassembly and a wafer carrier plate fixing jig, which can solve the problem of unstable fixing of wafer carrier plate and the problem that the existing jig cannot be compatible with two different sizes of wafer carrier plates.

[0004] The technical scheme adopted by the utility model to solve its technical problems is as follows: on the one hand, an adsorption subassembly is provided, which comprises a support plate and an adsorption plate, the adsorption plate is installed on the support plate, a plurality of grooves are provided on the adsorption plate, each groove is arranged in a stepped manner, an adsorption hole is provided on the edge of each groove, a plurality of negative pressure channels are provided in the interior of the adsorption plate, each negative pressure channel is arranged in a staggered manner, and each negative pressure channel is in communication with each adsorption hole.

[0005] As a further improvement of the above technical scheme, the grooves are provided with two, which are a first groove and a second groove, the second groove is arranged inside the first groove, the adsorption holes are provided with two groups, which are a first adsorption hole and a second adsorption hole, the negative pressure channels are provided with two, which are a first negative pressure channel and a second negative pressure channel, the first adsorption hole is located at the edge of the first groove, the second adsorption hole is located at the edge of the second groove, the first negative pressure channel is in communication with the first adsorption hole, and the second negative pressure channel is in communication with the second adsorption hole.

[0006] As a further improvement of the above technical scheme, the first negative pressure channel and the second negative pressure channel are both in a grid shape, and the first negative pressure hole and the second negative pressure hole are respectively formed on the side surface of the adsorption plate, and the first negative pressure hole and the second negative pressure hole are arranged in a staggered manner.

[0007] As a further improvement of the above technical scheme, the second negative pressure channel is located below the second groove, the first negative pressure channel is located below the second negative pressure channel, and the first negative pressure hole is located below the second negative pressure hole.

[0008] As a further improvement of the above technical solution, four connecting holes are further arranged on the adsorption plate, and the four connecting holes are arranged in a square shape outside the first groove.

[0009] As a further improvement of the above technical solution, the wafer carrier plate further comprises a main body and an abutting portion, the abutting portion is arranged around the edge of the main body, the main body is bonded with a wafer, and the abutting portion is abutted with the edge of the first groove provided with the first adsorption hole or the edge of the second groove provided with the second adsorption hole.

[0010] As a further improvement of the above technical solution, the edge of the abutting portion is provided with a notch.

[0011] In addition, the wafer carrier plate fixing jig further comprises a base and two adsorption assemblies, and the two adsorption assemblies are arranged side by side on the base.

[0012] As a further improvement of the above technical solution, the wafer carrier plate further comprises two electromagnetic valves, and the two electromagnetic valves are respectively connected with the two adsorption plates, and the electromagnetic valves are used for controlling the switching of the negative pressure airflow in the negative pressure channels.

[0013] As a further improvement of the above technical solution, the wafer carrier plate further comprises two vacuum generators, and the two vacuum generators are respectively connected with the two adsorption plates, and the two vacuum generators are respectively used for providing negative pressure to the two adsorption plates.

[0014] The wafer carrier plate fixing jig has the advantages that: for different sizes of carrier plates, the edges of the carrier plates without wafers can be respectively abutted with the edges of the grooves, negative pressure is provided to the negative pressure channels, the adsorption holes can adsorb the carrier plates to the edges of the grooves, and the carrier plates are fixed firmly; since the negative pressure channels are arranged in a staggered manner, the negative pressure channels are not connected, one group of adsorption holes can be controlled to have negative pressure, so that the adsorption force of other adsorption holes does not damage the wafers on the carrier plate when the carrier plate of large size is fixed. The adsorption holes can fix the carrier plate, and the stepped grooves make the adsorption assembly compatible with carrier plates of different sizes. BRIEF DESCRIPTION OF DRAWINGS

[0015] The utility model is further described below in combination with the drawings and examples.

[0016] Figure 1 is the structure schematic diagram of wafer carrier plate fixing jig provided by preferred embodiment of the utility model;

[0017] Figure 2 is the structure schematic diagram of wafer carrier plate fixing jig from another angle provided by preferred embodiment of the utility model;

[0018] Figure 3 is a structure diagram of the adsorption plate of the adsorption assembly provided by the preferred embodiment of the utility model;

[0019] Figure 4 is a sectional view of the adsorption plate of the adsorption assembly provided by the preferred embodiment of the utility model;

[0020] Figure 5 is a sectional view of another position of the adsorption plate of the adsorption assembly provided by the preferred embodiment of the utility model.

[0021] Reference signs: 1, adsorption assembly, 2, wafer carrier plate, 3, base, 4, electromagnetic valve, 5, vacuum generator;

[0022] Support plate, 12, adsorption plate, 21, main body, 22, abutting portion;

[0023] 121, first groove, 122, first adsorption hole, 123, second groove, 124, second adsorption hole, 125, first negative pressure channel, 126, second negative pressure channel, 127, first negative pressure hole, 128, second negative pressure hole, 129, connecting hole, 221, notch. DETAILED DESCRIPTION

[0024] The concept, specific structure and generated technical effects of the utility model will be described clearly and completely in combination with the embodiments and drawings, so as to fully understand the purpose, features and effects of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments, based on the embodiments of the utility model, other embodiments obtained by the skilled in the art without creative labor are within the protection scope of the utility model. In addition, all the coupling / connection relations involved in the patent are not single component direct connection, but can form a better coupling structure by adding or reducing coupling auxiliary components according to the specific implementation situation, such as fixed connection / fixed installation, which can be selected according to the needs, such as screw connection, bolt connection, pin connection, key connection, bonding, mortise and tenon connection, welding, riveting and the like, such as detachable connection, which can be selected according to the needs, such as screw connection, bolt connection, threaded connection, buckle connection, mortise and tenon connection, magic tape connection and the like. The various technical features in the utility model creation can be combined interactively on the premise of not mutually contradictory and conflicting.

[0025] Please see Figures 1-5The utility model discloses an optimal embodiment provides a kind of adsorption assembly 1, including support plate 11 and adsorption plate 12, adsorption plate 12 is installed on support plate 11, groove is provided with two, respectively first groove 121 and second groove 123, second groove 123 is arranged inside first groove 121, adsorption hole is provided with two groups, respectively first adsorption hole 122 and second adsorption hole 124, negative pressure passage is provided with two, respectively first negative pressure passage 125 and second negative pressure passage 126, first adsorption hole 122 is located the edge of first groove 121, second adsorption hole 124 is located the edge of second groove 123, first negative pressure passage 125 is communicated with first adsorption hole 122, second negative pressure passage 126 is communicated with second adsorption hole 124.For two different sizes of carrier plate, the edge of the two carrier plates not provided with wafer can be respectively abutted with the edge of first groove 121 or the edge of second groove 123, by providing negative pressure to first negative pressure passage 125, so that first adsorption hole 122 can adsorb carrier plate on the edge of first groove 121, by providing negative pressure to second negative pressure passage 126, so that second adsorption hole 124 can adsorb carrier plate on the edge of second groove 123, carrier plate is fixed firm;Because the first negative pressure passage 125 and the second negative pressure passage 126 are mispositioned, the first negative pressure passage 125 and the second negative pressure passage 126 are not communicated, so that when first adsorption hole 122 generates negative pressure, second adsorption hole 124 can not generate negative pressure, so as to prevent the adsorption force of second adsorption hole 124 from damaging wafer on carrier plate when fixing large-size carrier plate.First adsorption hole 122 and second adsorption hole 124 can fix carrier plate, and the setting of first groove 121 and second groove 123 makes that the adsorption assembly 1 can be compatible with different sizes of carrier plate.

[0026] In other embodiments, the adsorption plate is provided with a plurality of grooves, each of the grooves is arranged in a stepped manner, the edge of each of the grooves is provided with an adsorption hole, the inside of the adsorption plate is provided with a plurality of negative pressure passages, each of the negative pressure passages is mispositioned, and each of the negative pressure passages is communicated with each of the adsorption holes.For different sizes of carrier plate, the edge of the carrier plate not provided with wafer can be respectively abutted with the edge of the groove, by providing negative pressure to the negative pressure passage, so that the adsorption hole can adsorb the carrier plate on the edge of the groove, and the carrier plate is fixed firm;Because each negative pressure passage is mispositioned, each negative pressure passage is not communicated, and one group of adsorption holes can be controlled to have negative pressure, so as to prevent the adsorption force of other adsorption holes from damaging wafer on carrier plate when fixing large-size carrier plate.The adsorption hole can fix the carrier plate, and the setting of the stepped groove makes that the adsorption assembly can be compatible with different sizes of carrier plate.

[0027] The first negative pressure channel 125 and the second negative pressure channel 126 are both grid-shaped, and the first negative pressure channel 125 and the second negative pressure channel 126 form a first negative pressure hole 127 and a second negative pressure hole 128 on the side of the adsorption plate 12, respectively, and the first negative pressure hole 127 and the second negative pressure hole 128 are arranged in a staggered manner. The first negative pressure hole 127 and the second negative pressure hole 128 are used to transport a negative pressure gas source to the first negative pressure channel 125 and the second negative pressure channel 126, so that the first adsorption hole 122 and the second adsorption hole 124 have adsorption force.

[0028] The second negative pressure channel 126 is located below the second groove 123, the first negative pressure channel 125 is located below the second negative pressure channel 126, and the first negative pressure hole 127 is located below the second negative pressure hole 128. The second groove 123, the first negative pressure channel 125, and the second negative pressure channel 126 do not affect each other, and the thickness of the adsorption plate 12 is fully utilized, and the structure is compact.

[0029] The first adsorption hole 122 and the second adsorption hole 124 are both provided with a plurality of first adsorption holes 122, and a plurality of second adsorption holes 124 are arranged around the edge of the second groove 123. The edges of the four sides of the carrier plate can be adsorbed, preventing the carrier plate from being warped, and further improving the firmness of the carrier plate.

[0030] The adsorption plate 12 is also provided with four connecting holes 129, and the four connecting holes 129 are located outside the first groove 121 and arranged in a square shape. By arranging the connecting piece to pass through the connecting hole 129, the four corners of the adsorption plate 12 can be fixed on the support plate 11.

[0031] Please refer to Figure 2 The adsorption assembly 1 further includes a wafer carrier plate 2, and the wafer carrier plate 2 includes a main body 21 and an abutting portion 22. The abutting portion 22 is arranged around the edge of the main body 21, the main body 21 is bonded with a wafer, the abutting portion 22 is in abutment with the edge of the second groove 123 provided with the second adsorption hole 124, the second adsorption hole 124 adsorbs the abutting portion 22 on the adsorption plate 12, and the main body 21 faces the bottom of the second groove 123, so as to avoid damaging the wafer on the main body 21.

[0032] In other embodiments, the abutting portion is in abutment with the edge of the first groove provided with the first adsorption hole, and the first adsorption hole adsorbs the main body on the adsorption plate, so as to fix the carrier plate firmly.

[0033] Please refer to Figure 2 The edge of the abutting portion 22 is provided with a notch 221, and after production is completed, the carrier plate can be easily taken out from the adsorption plate 12 through the notch 221.

[0034] The wafer carrier plate fixing jig can fix two carrier plates simultaneously, and the carrier plates are fixed firmly, and the wafer carrier plate fixing jig can also be compatible with two carrier plates of different sizes.

[0035] The wafer carrier plate fixing jig also comprises two electromagnetic valves 4, and the two electromagnetic valves 4 are connected with the two adsorption plates 12 respectively.

[0036] In other embodiments, the negative pressure channels are provided with a plurality of negative pressure channels, and the wafer carrier plate fixing jig comprises two electromagnetic valves, and the two electromagnetic valves are connected with the two adsorption plates respectively.

[0037] The jig also comprises two vacuum generators 5, and the two vacuum generators 5 are connected with the two adsorption plates 12 respectively.

[0038] The above is a specific description of the preferred embodiment of the utility model, but the utility model is not limited to the described embodiments, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the utility model, and these equivalent modifications or replacements are all included in the range defined by the claims of the present application.

Claims

1. A sorption assembly, characterized by: The adsorption plate is internally provided with a plurality of negative pressure channels, and each negative pressure channel is arranged in a staggered manner.

2. The adsorption assembly of claim 1, wherein: The adsorption plate is internally provided with a plurality of negative pressure channels, and each negative pressure channel is arranged in a staggered manner.

3. The adsorption assembly of claim 2, wherein: The first negative pressure channel and the second negative pressure channel are both in a grid shape, and the first negative pressure channel and the second negative pressure channel respectively form a first negative pressure hole and a second negative pressure hole on the side surface of the adsorption plate.

4. The adsorption assembly of claim 3, wherein: The second negative pressure channel is located below the second recess, and the first negative pressure channel is located below the second negative pressure channel.

5. The adsorption assembly of claim 2, wherein: The adsorption plate is further provided with four connecting holes, and the four connecting holes are all located outside the first recess and arranged in a square shape.

6. The adsorption assembly of claim 2, wherein: The wafer carrier plate further comprises a main body and an abutting portion, the abutting portion is arranged around the edge of the main body, the main body is bonded with a wafer, and the abutting portion abuts against the edge of the first recess provided with the first adsorption hole or the edge of the second recess provided with the second adsorption hole.

7. The adsorption assembly of claim 6, wherein: The edge of the abutting portion is provided with a notch.

8. A wafer carrier fixing jig, characterized by: The adsorption assembly comprises a base and two adsorption assemblies according to any one of claims 1-7, and the two adsorption assemblies are arranged side by side on the base.

9. The wafer carrier fixation jig of claim 8, wherein: The adsorption assembly further comprises two electromagnetic valves, and the two electromagnetic valves are respectively connected with the two adsorption plates, and the electromagnetic valves are used for controlling the switching of negative pressure airflow in each negative pressure channel.

10. The wafer boat fixing jig according to claim 8, wherein: The adsorption assembly further comprises two vacuum generators, and the two vacuum generators are respectively connected with the two adsorption plates, and the two vacuum generators are respectively used for providing negative pressure to the two adsorption plates.

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