Laser cooling device and processing equipment

Abstract

The utility model relates to a laser cooling device and processing equipment. The laser cooling device comprises a heat insulation unit; the cooling mechanism comprises a cooling container; a first heating assembly in the laser is isolated in the cooling container by the heat insulation unit, a second heating assembly in the laser is isolated outside the cooling container by the heat insulation unit, a medium inflow port is formed in one side of the cooling mechanism, and a medium outflow port is formed in the other opposite side of the cooling mechanism. The cooling medium can flow into the cooling mechanism through the medium inflow port and soak the cooling container, and then flows out of the cooling mechanism through the medium outflow port. According to the laser cooling device, the problem that a flow channel is easy to block and difficult to clean due to a narrow built-in heat dissipation flow channel in water cooling plate type water cooling heat dissipation is effectively solved, the efficiency of the laser cooling heat dissipation process is guaranteed while the laser cooling effect is improved, and therefore the heat dissipation requirement for the laser in the laser machining process is met, and the laser machining efficiency is improved. And therefore, higher requirements in the laser processing process are met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of laser, in particular to a laser cooling device and processing equipment. BACKGROUND

[0002] With the continuous progress of laser technology and the continuous diversification of laser product application scenarios, the requirements for laser processing are becoming higher and higher. In the laser processing process, a part of the energy in the laser device is converted into heat, so the heat generated by the laser also increases accordingly. The heat generated by the laser seriously affects the performance of the laser, so the cooling measures for the laser are very important.

[0003] The common laser cooling method is water-cooled heat dissipation through a water-cooled plate, but due to the narrow built-in heat dissipation flow channel, the flow channel is easy to block and difficult to clean, which cannot meet the heat dissipation requirements of the laser in the laser processing process. CONTENT OF THE INVENTION

[0004] Therefore, it is necessary to provide a laser cooling device and processing equipment to solve the above technical problems.

[0005] A laser cooling device, the laser includes a first heat generating component and a second heat generating component, the first heat generating component generates more heat per unit time than the second heat generating component, and the laser cooling device includes:

[0006] a heat insulation unit;

[0007] a cooling mechanism including a cooling container;

[0008] The first heat generating component is isolated from the inside of the cooling container by the heat insulation unit, and the second heat generating component is isolated from the outside of the cooling container by the heat insulation unit. One side of the cooling mechanism is provided with a medium inlet, and the opposite side of the cooling mechanism is provided with a medium outlet. Cooling medium can flow into the cooling mechanism through the medium inlet and soak the cooling container, and then flow out of the cooling mechanism through the medium outlet.

[0009] In one embodiment, the cooling mechanism further includes a heat dissipation component, and the heat dissipation component is arranged on the exposed side of the cooling container.

[0010] In one embodiment, the number of cooling containers is multiple, and multiple cooling containers are arranged in the inside of the cooling mechanism.

[0011] In one of the embodiments, the medium inflow port is arranged close to the top of the cooling mechanism along the height direction of the cooling mechanism, and the medium outflow port is arranged close to the bottom of the cooling mechanism along the height direction of the cooling mechanism.

[0012] In one of the embodiments, the immersion height of the cooling medium along the height direction of the cooling container is less than the height value of the cooling container.

[0013] In one of the embodiments, the heat insulation unit comprises a heat insulation piece, a first end surface of the heat insulation piece is connected to the first heat generating component, and an opposite second end surface of the heat insulation piece is connected to the second heat generating component.

[0014] In one of the embodiments, the heat insulation unit further comprises a holding piece, the holding piece is arranged on opposite sides of the heat insulation piece.

[0015] In one of the embodiments, the heat insulation piece is provided with a receiving groove, a first end of the receiving groove is connected to the first end surface of the heat insulation piece, and an opposite second end of the receiving groove is connected to the second end surface of the heat insulation piece.

[0016] In one of the embodiments, the first heat generating component comprises a fiber amplifier and a pump source, and the second heat generating component comprises a driving circuit and a main control circuit.

[0017] A processing device comprises:

[0018] The laser cooling device as described above.

[0019] The technical effects of the embodiments provided in the present application are as follows:

[0020] In the laser cooling device, during the laser processing, the cooling medium flows into the cooling mechanism through the medium inflow port arranged on one side of the cooling mechanism, and immerses the cooling container and the first heat generating component in the laser which is isolated by the heat insulation unit inside the cooling container, directly cools the first heat generating component in the laser, and indirectly cools the second heat generating component in the laser which is isolated by the heat insulation unit outside the cooling container. The cooled cooling medium flows out of the cooling mechanism through the medium outflow port arranged on the opposite side of the cooling mechanism, that is, the continuously flowing cooling medium effectively cools the laser, effectively improves the problem that the flow channel is easy to block and not easy to clean due to the narrow built-in heat dissipation flow channel of the water-cooled plate type water-cooled heat dissipation, improves the cooling effect of the laser, ensures the efficiency of the laser cooling and heat dissipation process, and meets the heat dissipation demand of the laser in the laser processing process, and further meets the higher requirement of the laser processing process. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0022] Fig. 1 Structure diagram of a laser cooling device in an embodiment.

[0023] Fig. 2 Structure diagram of a laser cooling device in an embodiment. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the present application more clear, the following will further describe the present application in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0025] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0026] It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0027] In addition, the terms "first", "second" are only used for description purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0028] Figs. 1-2 Structure diagram of a laser cooling device in an embodiment.

[0029] In the present embodiment, as shown in Figs. 1-2As shown, the laser cooling device is used for cooling the laser in the laser processing process, and the laser includes a first heat generating component and a second heat generating component, the first heat generating component generates more heat per unit time than the second heat generating component; the laser cooling device includes a heat insulation unit 10 and a cooling mechanism 20.

[0030] The first heat generating component can be a component that generates more heat per unit time inside the laser in the laser processing process. The second heat generating component can be a component that generates less heat per unit time inside the laser in the laser processing process. Alternatively, the first heat generating component includes a fiber amplifier and a pump source, and the second heat generating component includes a driving circuit and a master control circuit.

[0031] The cooling mechanism 20 includes a cooling container 210 and a heat dissipation component 220, and the heat dissipation component 220 is arranged on the exposed side of the cooling container 210. The first heat generating component is isolated from the inside of the cooling container 210 by the heat insulation unit 10, and the second heat generating component is isolated from the outside of the cooling container 210 by the heat insulation unit 10. The cooling mechanism 20 is provided with a medium flow inlet on one side and a medium flow outlet on the opposite side. The cooling medium can flow into the cooling mechanism 20 through the medium flow inlet and soak the cooling container 210, and then flow out of the cooling mechanism 20 through the medium flow outlet.

[0032] The heat insulation unit 10 can be a functional unit connected to the cooling mechanism 20 and arranged between the first heat generating component and the second heat generating component, which can isolate the first heat generating component and the second heat generating component at different positions of the cooling mechanism 20. The cooling mechanism 20 can be a functional structure connected to the heat insulation unit 10 and the cooling medium source, which can isolate the first heat generating component in cooperation with the insulation unit and cool the first heat generating component by the flowing cooling medium. The cooling container 210 can be a functional unit connected to the heat insulation unit 10, which can provide a containing space for the first heat generating component in cooperation with the heat insulation unit 10 and soak in the flowing cooling medium in the cooling mechanism 20. The heat dissipation component 220 can be a functional component arranged on the outer surface of the cooling container 210, which can directly contact the flowing cooling medium in the cooling mechanism 20 to cool the first heat generating component contained in the cooling container 210. Alternatively, the heat dissipation component 220 can be a sheet or block heat dissipation structure, such as a heat dissipation fin. The cooling medium can be a liquid with a relatively low temperature.

[0033] In the laser processing process, the cooling medium flows into the cooling mechanism 20 through the medium inlet arranged on one side of the cooling mechanism 20, and soaks the cooling container 210 and the first heat generating component in the laser which is isolated from the inside of the cooling container 210 by the heat insulation unit 10, directly cools the first heat generating component in the laser, and indirectly cools the second heat generating component in the laser which is isolated from the outside of the cooling container 210 by the heat insulation unit 10, and then the cooled cooling medium flows out of the cooling mechanism 20 through the medium outlet arranged on the other side of the cooling mechanism 20; and cooperates with the heat dissipation component 220 arranged on the outer surface of the cooling container 210, which can increase the contact area of the cooling container 210 and the cooling medium flowing in the cooling mechanism 20, accelerate the heat generated by the first heat generating component in the cooling container 210 to the cooling medium, and effectively improve the cooling efficiency of the first heat generating component.

[0034] The number of cooling containers 210 is multiple, and the multiple cooling containers 210 are arranged in the cooling mechanism 20, which can increase the contact area of the cooling container 210 and the cooling medium flowing in the cooling mechanism 20, accelerate the heat generated by the first heat generating component in the cooling container 210 to the cooling medium, and further improve the cooling efficiency of the first heat generating component.

[0035] The medium inlet is arranged near the top of the cooling mechanism 20 along the height direction of the cooling mechanism 20, and the medium outlet is arranged near the bottom of the cooling mechanism 20 along the height direction of the cooling mechanism 20, and the height difference between the medium inlet and the medium outlet along the height direction of the cooling mechanism 20 can realize the potential energy difference between the cooling medium inlet and the cooling medium outlet, thereby accelerating the contact speed of the cooling container 210 and the cooling medium flowing in the cooling mechanism 20, and also ensuring that the cooled cooling medium flows out quickly through the cooling medium outlet, thereby accelerating the heat generated by the first heat generating component in the cooling container 210 to the cooling medium, and further improving the cooling efficiency of the first heat generating component.

[0036] The immersion height of the cooling medium along the height direction of the cooling container 210 is less than the height value of the cooling container 210, which can realize the full contact of the cooling container 210 and the cooling medium, improve the problem of the cooling medium immersed into the cooling container 210 through the top of the cooling container 210, and further improve the cooling effect of the first heat generating component in the laser while ensuring the working stability and reliability of the first heat generating component in the laser.

[0037] The heat insulation unit 10 comprises a heat insulation piece 110 and a holding piece 120. The first end surface of the heat insulation piece 110 is connected to the first heat generating component, and the opposite second end surface of the heat insulation piece 110 is connected to the second heat generating component. The holding piece 120 is oppositely arranged on the opposite two sides of the heat insulation piece 110. The heat insulation piece 110 is provided with a containing groove 1110. The first end of the containing groove 1110 is connected to the first end surface of the heat insulation piece 110, and the opposite second end of the containing groove 1110 is connected to the second end surface of the heat insulation piece 110.

[0038] The heat insulation piece 110 can be a functional piece arranged between the first heat generating component and the second heat generating component in the laser, which can isolate the first heat generating component from the inside of the cooling container 210 and isolate the second heat generating component from the outside of the cooling container 210 while ensuring the normal connection of the first heat generating component and the second heat generating component. The holding piece 120 can be a functional piece arranged on the opposite two sides of the heat insulation piece 110, which can hold and adjust the position of the heat insulation unit 10 and the cooling mechanism 20. The containing groove 1110 can be a groove body arranged inside the heat insulation piece 110, which can provide a containing space for the connection relationship between the first heat generating component and the second heat generating component in the laser. Optionally, the heat insulation piece 110 can be a heat insulation plate or a heat insulation block. The holding piece 120 can be a holding handle or a holding bracket.

[0039] Through the heat insulation piece 110 in the heat insulation unit 10, the first heat generating component and the second heat generating component can be isolated and divided in different positions according to the actual heat generation situation while ensuring the normal connection and use of the first heat generating component and the second heat generating component in the laser, so as to improve the cooling and heat dissipation efficiency of the first heat generating component which mainly generates heat, while ensuring the working stability and reliability of the whole laser. In addition, cooperating with the holding piece 120 in the heat insulation unit 10, the mobility of the heat insulation unit 10 and the cooling mechanism 20 is effectively ensured, thereby improving the portability of the laser cooling device and expanding the application scenarios of the laser cooling device.

[0040] In the laser processing process, the first heat generating component in the laser is isolated below the heat insulation piece 110 in the heat insulation unit 10, so that the heat generated by the first heat generating component does not affect the work of the second heat generating component on the upper surface of the heat insulation piece 110 in the heat insulation unit 10, and the first heat generating component on the lower surface of the heat insulation piece 110 in the heat insulation unit 10 is cooled by the cooling medium flowing in the cooling mechanism 20. The cooling medium flowing in the cooling mechanism 20 is continuously updated and flows to maintain the temperature of the first heat generating component and the second heat generating component at the optimum working temperature. In addition, cooperating with the holding piece 120 in the heat insulation unit 10, the laser cooling device can be conveniently moved to different places, and different cooling media flowing in different cooling mechanisms 20 can be used to cool and dissipate heat for the first heat generating component in the laser.

[0041] Compared with the existing water-cooling plate water-cooling heat dissipation method, the cooling medium flow channel in the cooling mechanism 20 can be selected in any size, effectively improving the problem of easy blockage and difficult cleaning of the flow channel due to the narrow built-in heat dissipation flow channel of the water-cooling plate water-cooling heat dissipation, having higher cooling and heat dissipation efficiency, and making all devices of the laser to be in the optimal working temperature range, ensuring the working efficiency of the laser. In addition, the space and cooling medium requirements for cooling and heat dissipation are lower, effectively saving the cost required for cooling and heat dissipation of the laser.

[0042] The application also provides a processing equipment comprising the laser cooling device in the above embodiments.

[0043] The division of each module in the above laser cooling device is only for illustration, and in other embodiments, the laser cooling device can be divided into different modules as needed to complete all or part of the functions of the above laser cooling device.

[0044] The laser cooling device and the processing equipment provided in the above embodiments, during the laser processing, the cooling medium flows into the cooling mechanism through the medium inflow port arranged on one side of the cooling mechanism, and soaks the cooling container and the first heat generating component in the laser which is isolated in the inside of the cooling container by the heat insulation unit, directly cools the first heat generating component in the laser, and indirectly cools the second heat generating component in the laser which is isolated outside the cooling container by the heat insulation unit. The cooled cooling medium flows out of the cooling mechanism through the medium outflow port arranged on the opposite side of the cooling mechanism, that is, the continuously flowing cooling medium effectively cools the laser, effectively improves the problem of easy blockage and difficult cleaning of the flow channel due to the narrow built-in heat dissipation flow channel of the water-cooling plate water-cooling heat dissipation, improves the cooling effect of the laser, and ensures the efficiency of the laser cooling and heat dissipation process, thereby meeting the heat dissipation demand of the laser during the laser processing, and further meeting the higher requirements of the laser processing, having important economic value and practical value.

[0045] Each technical feature of the above embodiments can be combined arbitrarily, and to make the description concise, each technical feature in the above embodiments is not described in all possible combinations, however, as long as the combination of these technical features does not exist contradictory, it should be considered as the scope of the description.

[0046] The above embodiments only express several implementation manners of the application, the description is more specific and detailed, but it should not be understood as a limitation on the patent application scope. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the application, several modifications and improvements can be made, which all belong to the protection scope of the application. Therefore, the patent protection scope of the application should be subject to the appended claims.

Claims

1. A laser cooling device, the laser comprising a first heating element and a second heating element, wherein the heat generated by the first heating element per unit time is greater than the heat generated by the second heating element per unit time, characterized in that, The laser cooling device includes: Thermal insulation unit; Cooling mechanism, including cooling container; The first heating element is isolated inside the cooling container by the heat insulation unit, and the second heating element is isolated outside the cooling container by the heat insulation unit. A medium inlet is provided on one side of the cooling mechanism, and a medium outlet is provided on the opposite side of the cooling mechanism. The cooling medium can flow into the cooling mechanism through the medium inlet and soak the cooling container, and then flow out of the cooling mechanism through the medium outlet.

2. The laser cooling device according to claim 1, characterized in that, The cooling mechanism further includes a heat dissipation component disposed on the exposed side of the cooling container.

3. The laser cooling device according to claim 1, characterized in that, The number of cooling containers is multiple, and the multiple cooling containers are arranged at intervals inside the cooling mechanism.

4. The laser cooling device according to claim 1, characterized in that, The medium flow inlet is located close to the top of the cooling mechanism along the height direction, and the medium flow outlet is located close to the bottom of the cooling mechanism along the height direction.

5. The laser cooling device according to claim 1, characterized in that, The immersion height of the cooling medium along the height direction of the cooling container is less than the height of the cooling container.

6. The laser cooling device according to claim 1, characterized in that, The heat insulation unit includes a heat insulation component, the first end face of which is connected to the first heating component, and the opposite second end face of which is connected to the second heating component.

7. The laser cooling device according to claim 6, characterized in that, The heat insulation unit also includes a gripping member, which is disposed opposite to each other on opposite sides of the heat insulation member.

8. The laser cooling device according to claim 6, characterized in that, The heat insulation component is provided with a receiving groove, the first end of the receiving groove is connected to the first end face of the heat insulation component, and the opposite second end of the receiving groove is connected to the second end face of the heat insulation component.

9. The laser cooling device according to claim 1, characterized in that, The first heating component includes an optical fiber amplifier and a pump source, and the second heating component includes a driving circuit and a main control circuit.

10. A processing device, characterized in that, include: The laser cooling device as described in any one of claims 1 to 9.

Images