Heat dissipation structure suitable for range hood driving chip
By setting up a heat dissipation structure with upper and lower windows and a heat-conducting layer on the PCB board of the range hood driver chip, and directly mounting it on the metal casing, the problem of increased costs associated with traditional heat dissipation structures is solved, achieving efficient heat dissipation and cost reduction.
Patent Information
- Application Number
- CN202422694353.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-06
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-11-06
AI Technical Summary
Traditional range hood driver chips require additional protective covers for heat dissipation, which increases costs, and the heat dissipation fin structure has limited efficiency.
The PCB board features opposing windows and a heat dissipation layer, combined with a heat-conducting layer and heat-dissipating sheet metal, and is directly mounted on the metal casing of the range hood. Heat dissipation is achieved through the heat-conducting layer and heat-dissipating sheet metal, eliminating the need for a protective cover.
This achieves efficient heat dissipation for the driver chip, reduces costs, simplifies the structure, and improves heat dissipation efficiency.
Smart Images
Figure CN223639433U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a kind of heat dissipation structure suitable for driving chip of range hood. BACKGROUND
[0002] The range hood is also called the extractor hood, which is a kind of kitchen appliance for purifying the kitchen environment. It is installed above the kitchen stove and can quickly extract the waste of the stove combustion and the oil fume harmful to human body generated in the cooking process, discharge it to the outdoor, reduce pollution, purify air, and have the safety guarantee function of preventing poison and explosion.
[0003] The most core component of the range hood is the motor, which has a great influence on the suction force, noise and service life of the range hood. The traditional range hood motor adopts the motor. Generally, the range hood has several gears for customers to choose, and different gears correspond to different motor speeds. The motor generally has three speed regulation methods: variable pole speed regulation, step-down speed regulation and tap speed regulation. Regardless of the speed regulation method used, once the gear is set, the motor will run at the torque of the set gear. The control box that controls the motor has a control circuit board, and the drive chip on the corresponding control circuit board needs to be cooled. Generally, heat dissipation fins are used to cool the drive chip. Although this operation meets the cooling requirement, an additional drive board protective cover needs to be installed based on the heat dissipation fins, thereby increasing the cost.
[0004] In view of the above defects, the present inventor actively researches and innovates to create a new structure of heat dissipation structure suitable for driving chip of range hood, which has more industrial utilization value. CONTENT OF THE UTILITY MODEL
[0005] To solve the above technical problems, the purpose of the utility model is to provide a heat dissipation structure suitable for driving chip of range hood.
[0006] To achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A heat dissipation structure suitable for driving chip of range hood, comprising a PCB board, a driving chip is connected to the top layer of the PCB board, an upper window is opened in the top layer of the PCB board, the heat dissipation area of the driving chip is attached in the upper window, a heat dissipation layer is opened on the bottom layer of the PCB board, the heat dissipation layer is arranged in an upper and lower opposite manner with the upper window, a heat conduction layer is connected to the bottom layer of the PCB board, the heat conduction layer covers all the heat dissipation layers, the bottom layer of the PCB board is connected to the heat dissipation sheet metal through a connecting column, a heat dissipation guide block is arranged on the heat dissipation sheet metal, and the heat dissipation guide block is in contact with the upper end surface of the heat conduction layer.
[0008] Preferably, the area of the upper window is greater than or equal to the heat dissipation area of the driving chip.
[0009] Preferably, the heat dissipation structure for the driving chip of the range hood, the number of the upper windows of the PCB is equal to the number of the driving chip.
[0010] Preferably, the heat dissipation structure for the driving chip of the range hood, the PCB is connected to the metal shell of the range hood through the heat dissipation sheet metal.
[0011] Preferably, the heat dissipation structure for the driving chip of the range hood, the thickness of the heat conduction layer is 2-3mm.
[0012] Preferably, the heat dissipation structure for the driving chip of the range hood, the heat dissipation guide block and the heat dissipation sheet metal are integrally formed.
[0013] Preferably, the heat dissipation structure for the driving chip of the range hood, the heat conduction layer is heat conduction silicone grease.
[0014] Preferably, the heat dissipation structure for the driving chip of the range hood, the heat dissipation area of the driving chip is welded on the upper window.
[0015] Preferably, the heat dissipation structure for the driving chip of the range hood, the heat dissipation layer is a cover heat dissipation layer or a lower window.
[0016] By the above scheme, the heat dissipation structure for the driving chip of the range hood has at least the following advantages:
[0017] The heat dissipation structure for the driving chip of the range hood can be directly installed on the metal shell, and can also ensure the heat dissipation of the driving chip, thereby effectively reducing the cost.
[0018] The above description is only a summary of the technical scheme of the heat dissipation structure for the driving chip of the range hood, in order to more clearly understand the technical means of the heat dissipation structure for the driving chip of the range hood, and the heat dissipation structure for the driving chip of the range hood can be implemented according to the content of the description. The following will describe the preferred embodiments of the heat dissipation structure for the driving chip of the range hood in detail with reference to the drawings. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical scheme of the embodiments of the heat dissipation structure for the driving chip of the range hood, the following will briefly introduce the drawings needed in the embodiments. It should be understood that the following drawings only show some embodiments of the heat dissipation structure for the driving chip of the range hood, and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.
[0020] Figure 1 is a structural schematic view of the heat dissipation structure for the driving chip of the range hood;
[0021] Figure 2 is Figure 1 the exploded view of the heat dissipation structure for the driving chip of the range hood;
[0022] Figure 3 is a sectional view of the PCB board of the utility model. DETAILED DESCRIPTION
[0023] To make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.
[0024] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the present application.
[0025] EMBODIMENT
[0026] As Figure 1 , Figure 2 and Figure 3 indicated, a heat dissipation structure suitable for an oil smoke machine driving chip, including PCB board 1, the top layer of the PCB board 1 is connected with driving chip 2, the top layer of the PCB board 1 is provided with upper window 3, the heat dissipation area of the driving chip 2 is attached in upper window 3, the bottom layer of the PCB board 1 is provided with heat dissipation layer 4, the heat dissipation layer 4 is arranged in upper and lower opposite with upper window 3, the bottom layer of the PCB board 1 is connected with heat conduction layer 5, the heat conduction layer 5 covers all heat dissipation layer 4, the bottom layer of the PCB board 1 is connected on heat dissipation sheet metal 7 through connecting column 6, the heat dissipation sheet metal 7 is provided with heat dissipation guide block 8, the heat dissipation guide block 8 is in contact with the upper end surface of heat conduction layer 5.
[0027] The driving chip 2 and the upper window 3 are connected by soldering tin in the utility model, so that the heat of the driving chip can be conducted through the tin and the PCB board.
[0028] The area of the upper window 3 is greater than or equal to the heat dissipation area of the driving chip 2, and the heat dissipation area of the driving chip 2 is welded on the upper window. The heat generated by the driving chip can be quickly absorbed and transferred to the PCB board.
[0029] The number of the upper windows 3 provided on the PCB board 1 is equal to the number of the driving chips 2, so that each window of the driving chip can correspond to the PCB board, and the heat of the driving chip can be transferred to the board, and then the heat can be transferred through the corresponding heat dissipation layer and heat conduction layer.
[0030] The PCB board 1 is connected to the metal shell of the range hood through the heat dissipation sheet metal, a protective cover is omitted, the PCB board 1 is directly installed on the metal shell, and heat dissipation is realized in a direct connection mode.
[0031] The heat conduction layer 5 is heat conduction silicone grease, and the thickness of the heat conduction layer 5 is 2-3 mm.
[0032] The heat dissipation guide block 8 and the heat dissipation sheet metal 7 are in an integral molding structure.
[0033] The heat dissipation layer 4 is a cover oil heat dissipation layer or a lower window, and the two structures can be conducted with the heat conduction layer, so that heat dissipation is ensured in time. Figures 1 to 3 The lower window is used to conduct heat with the upper window.
[0034] The working principle of the utility model is as follows:
[0035] In specific work, the heat of the driving chip is transmitted to the PCB board through the upper window, and the heat is received by the heat dissipation layer of the PCB board and transmitted to the heat dissipation sheet metal through the heat conduction layer (heat conduction silicone grease), and the heat dissipation sheet metal is directly installed on the oil smoke extractor, so that the heat dissipation condition is met, and direct installation can be realized, and the purpose of reducing cost is achieved.
[0036] The driving chip used in the utility model is a chip known by those skilled in the art, and the window opening mode can reduce cost while meeting the heat dissipation requirement.
[0037] It should be noted that: similar labels and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.
[0038] In the description of the present application, it should be noted that the orientation or position relationship indicated by the terms "vertical", "horizontal", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship of the product of the application when it is usually placed, and is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the application. In addition, the terms "first", "second" and the like are only used for differentiation, and cannot be understood as indicating or implying relative importance.
[0039] In addition, the terms "horizontal", "vertical", and the like, do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. As "horizontal" merely means that it is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but can be slightly inclined.
[0040] In the description of the present application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set", "install", "connect", "connect" should be understood broadly, for example, can be fixedly connected, or can be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0041] The above is only the preferred embodiment of the present application, and is not used to limit the present application. It should be pointed out that for ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and modifications can be made, and these improvements and modifications should also be considered as the protection scope of the present application.
Claims
1. A heat dissipation structure suitable for a driving chip of a range hood, comprising a PCB board (1), a driving chip (2) is connected to a top layer of the PCB board (1), characterized in that: The top layer of the PCB board (1) is provided with an upper window (3), and the heat dissipation area of the driving chip (2) is attached to the upper window (3); the bottom layer of the PCB board (1) is provided with a heat dissipation layer (4), and the heat dissipation layer (4) is arranged in an upper-lower opposite mode with the upper window (3); the bottom layer of the PCB board (1) is connected with a heat conduction layer (5), and the heat conduction layer (5) covers all the heat dissipation layers (4); the bottom layer of the PCB board (1) is connected to the heat dissipation sheet metal (7) through a connecting column (6), and the heat dissipation sheet metal (7) is provided with a heat dissipation guide block (8), and the heat dissipation guide block (8) is in contact with the upper end surface of the heat conduction layer (5).
2. The heat dissipation structure for the driving chip of the range hood according to claim 1, wherein: The area of the upper window (3) is greater than or equal to the heat dissipation area of the driving chip (2).
3. The heat dissipation structure for the driving chip of the range hood according to claim 1, wherein: The number of the upper windows (3) provided in the PCB board (1) is equal to the number of the driving chips (2).
4. The heat dissipation structure for the driving chip of the range hood according to claim 1, characterized in that: The PCB board (1) is connected to the metal shell of the range hood through the heat dissipation sheet metal.
5. The heat dissipation structure for the driving chip of the range hood according to claim 1, wherein: The thickness of the heat conduction layer (5) is 2-3 mm.
6. The heat dissipation structure for the driving chip of the range hood according to claim 1, characterized in that: The heat dissipation guide block (8) and the heat dissipation sheet metal (7) are in an integral molding structure.
7. The heat dissipation structure for the driving chip of the range hood according to claim 1 or 5, characterized in that: The heat conduction layer (5) is heat-conducting silicone grease.
8. The heat dissipation structure for the driving chip of the range hood according to claim 1, characterized in that: The heat dissipation area of the driving chip (2) is welded to the upper window.
9. The heat dissipation structure for a driving chip of a range hood according to claim 1, wherein: The heat dissipation layer (4) is a cover oil heat dissipation layer, or a lower window.