Heat dissipation assembly and electronic equipment

Abstract

The utility model provides a heat dissipation assembly and electronic equipment, and belongs to the technical field of heat dissipation of electronic equipment. The heat dissipation assembly comprises a support and a heat dissipation piece. The support is of a plate-shaped structure. The heat dissipation piece comprises a connecting part and a first heat dissipation part, the connecting part is connected with the support, the first heat dissipation part and the support are arranged in a spaced mode, the first heat dissipation part is connected with the connecting part, and the wall face, close to the support, of the first heat dissipation part is connected with a first heat source element of the electronic equipment. According to the invention, the contact area between the heat dissipation assembly and the heat source element in the electronic equipment can be increased, so that the heat dissipation efficiency of the electronic equipment is improved.

Description

TECHNICAL FIELD

[0001] The present disclosure belongs to the technical field of heat dissipation of electronic devices, and particularly relates to a heat dissipation assembly and an electronic device. BACKGROUND

[0002] The electronic device has heat source elements such as a loudspeaker, a flash, and a front camera inside the electronic device to realize different functions.

[0003] The heat source elements generate heat during use. To prevent the heat from accumulating inside the electronic device, a heat dissipation member is usually arranged inside the electronic device. One end of the heat dissipation member is connected to a support, and the other end is connected to the heat source elements.

[0004] However, for the above structure, the contact area between the heat dissipation member and the heat source elements is small, which leads to low heat dissipation efficiency of the electronic device. CONTENT OF THE UTILITY MODEL

[0005] The present disclosure provides a heat dissipation assembly and an electronic device, which can solve the technical problems in the related art. The technical solutions of the heat dissipation assembly and the electronic device are as follows.

[0006] In a first aspect, the present disclosure provides a heat dissipation assembly, which comprises a support and a heat dissipation member.

[0007] The support is a plate-shaped structure.

[0008] The heat dissipation member comprises a connecting portion and a first heat dissipation portion. The connecting portion is connected to the support. The first heat dissipation portion is arranged apart from the support and connected to the connecting portion. A wall surface of the first heat dissipation portion close to the support is connected to a first heat source element of the electronic device.

[0009] In a possible implementation manner, a wall surface of the first heat dissipation portion away from the support is connected to a second heat source element of the electronic device.

[0010] In a possible implementation manner, the first heat dissipation portion comprises a first part, a second part, and a third part.

[0011] The first part is a plate-shaped structure and is arranged apart from the support. One end of the first part is connected to the connecting portion.

[0012] One end of the second part is connected to the other end of the first part.

[0013] The third part is connected to the other end of the second part and the support, respectively.

[0014] In a possible implementation manner, the first part is parallel to the support.

[0015] In a possible implementation, the support has a clearance hole, and the connecting portion is connected to an inner wall of the clearance hole.

[0016] The heat dissipation member further comprises a second heat dissipation portion, which is located on a side of the support away from the first heat dissipation portion and connected to the connecting portion, and the second heat dissipation portion is connected to a third heat source element of the electronic device.

[0017] In a possible implementation, the second heat dissipation portion is connected to the support, and a wall surface of the second heat dissipation portion away from the support is connected to the third heat source element of the electronic device.

[0018] In a possible implementation, the second heat dissipation portion is spaced apart from the support, a wall surface of the second heat dissipation portion away from the support is connected to the third heat source element of the electronic device, and a wall surface of the second heat dissipation portion close to the support is connected to a fourth heat source element of the electronic device.

[0019] In a possible implementation, the connecting portion is bonded to the inner wall of the clearance hole.

[0020] In a possible implementation, the heat dissipation member is an integrally formed component.

[0021] In a possible implementation, the thickness of the heat dissipation member (2) is within the range of [0.1mm, 2.5mm].

[0022] In a second aspect, the disclosure provides an electronic device comprising the heat dissipation assembly of the first aspect and possible implementations thereof.

[0023] In a possible implementation, the electronic device comprises a loudspeaker, a flash, a camera, and the heat dissipation assembly of the first aspect.

[0024] The loudspeaker is located between the support and the first heat dissipation portion and connected to the first heat dissipation portion.

[0025] The flash is located on a side of the first heat dissipation portion away from the support and connected to the first heat dissipation portion.

[0026] The camera is located on a side of the second heat dissipation portion away from the support and connected to the second heat dissipation portion.

[0027] The technical solutions provided by the disclosure have at least the following beneficial effects:

[0028] The present disclosure provides a heat dissipation assembly, wherein a first heat dissipation part is arranged apart from a support and connected to the support through a connecting part, and a wall surface of the first heat dissipation part close to the support is connected to a first heat source element of an electronic device. In this way, compared with the technical solution in the related art in which the heat dissipation part is connected to the heat source element in the electronic device through an end part, the first heat dissipation part is connected to the heat source element of the electronic device through a wall surface, so that the contact area of the heat dissipation part and the heat source element can be effectively increased, thereby improving the heat dissipation efficiency of the electronic device.

[0029] It should be understood that the foregoing general description and the following detailed description are only exemplary and explanatory, and are not limiting to the present disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0030] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present disclosure and serve to explain the principles of the present disclosure. In the drawings:

[0031] Figure 1 is a structural schematic diagram of a heat dissipation assembly provided by an embodiment of the present disclosure;

[0032] Figure 2 is a structural schematic diagram of a heat dissipation assembly provided by an embodiment of the present disclosure;

[0033] Figure 3 is a structural schematic diagram of a heat dissipation assembly provided by an embodiment of the present disclosure;

[0034] Figure 4 is a structural schematic diagram of a heat dissipation assembly provided by an embodiment of the present disclosure.

[0035] LEGEND

[0036] 1, support;

[0037] 11, clearance hole;

[0038] 2, heat dissipation part;

[0039] 21, connecting part; 22, first heat dissipation part; 23, second heat dissipation part;

[0040] 221, first part; 222, second part; 223, third part;

[0041] 100, accommodating cavity;

[0042] 01, loudspeaker; 02, flash; 03, camera.

[0043] The specific embodiments of the present disclosure have been shown in the above drawings, and will be described in more detail hereinafter. These drawings and the written description are not intended to restrict the scope of the present disclosure in any way, but to explain the present disclosure to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0044] In order to make the purposes, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be further described in detail below with reference to the drawings.

[0045] Nowadays, the functions of electronic devices such as mobile phones and tablet computers are becoming more and more rich, and accordingly, the number of elements inside the electronic devices for realizing different functions is also increasing. For this, a reasonable heat dissipation scheme needs to be designed for the electronic devices to avoid heat accumulation inside the electronic devices. At present, in the electronic devices, heat dissipation is usually performed by setting heat dissipation members, the electronic devices include a plurality of heat dissipation members, one end of each heat dissipation member is connected with a support, and the other end is connected with a corresponding heat source element. However, for the above structure, on the one hand, the contact area of the heat dissipation member and the heat source element is small, which leads to low heat dissipation efficiency of the electronic device, and on the other hand, the plurality of heat dissipation members are connected with the support on one side, which makes the plurality of heat source elements only be able to be distributed in the length and width directions of the support, and the arrangement flexibility of the heat source elements in the electronic device is poor.

[0046] The embodiments of the present disclosure provide a heat dissipation assembly, as shown in Figure 1 The heat dissipation assembly includes a support 1 and a heat dissipation member 2.

[0047] Among them, referring to Figure 2 , the support 1 is a plate-shaped structure, the support 1 is usually arranged inside the electronic device, and the edge of the support 1 is in contact with the shell of the electronic device. The heat generated by the heat source element can be transmitted to the heat dissipation member 2, the support 1, the shell of the electronic device and the external environment in turn through heat conduction. The support 1 can be made of a metal material with good heat conduction performance, such as copper or aluminum, etc.

[0048] Among them, referring to Figure 2 , the heat dissipation member 2 includes a connecting portion 21 and a first heat dissipation portion 22, the connecting portion 21 is connected with the support 1, the first heat dissipation portion 22 is arranged in a spaced manner with the support 1 and connected with the connecting portion 21, and the wall surface of the first heat dissipation portion 22 close to the support 1 is connected with the first heat source element of the electronic device. The heat dissipation member 2 can be a graphite sheet.

[0049] According to the technical solution provided in the embodiment of the present disclosure, for the heat dissipation piece 2, the heat dissipation piece 2 is not connected with the heat source element in the electronic device through the end, but is connected with the first heat source element of the electronic device through the wall surface of the first heat dissipation part 22 close to the bracket 1, so that the contact area of the heat dissipation piece 2 and the heat source element can be effectively increased, and the heat dissipation efficiency of the electronic device is improved.

[0050] Specifically, the connecting part 21 can be arranged perpendicularly to the bracket 1, and the first heat dissipation part 22 can be arranged parallel to the bracket 1. In this way, the space utilization rate in the electronic device can be improved.

[0051] In some possible embodiments, the first heat dissipation part 22 is further configured to be connected with a second heat source element of the electronic device.

[0052] As shown in Figure 2 , the wall surface of the first heat dissipation part 22 away from the bracket 1 is connected with the second heat source element of the electronic device. The wall surface of the first heat dissipation part 22 close to the bracket 1 is connected with the first heat source element of the electronic device.

[0053] In this way, the heat dissipation piece 2 is no longer connected with the heat source element only on one side, and the wall surfaces of the first heat dissipation part 22 of the heat dissipation piece 2 close to and away from the bracket 1 are respectively connected with the heat source elements of the electronic device, so that the multiple heat source elements can be distributed in the thickness direction of the bracket 1, and the arrangement flexibility of the heat source elements in the electronic device is improved.

[0054] Further, the first heat source element and the second heat source element can be two different components in the electronic device, or can be two parts of one component in the electronic device. It can be understood that, in the case that the first heat source element and the second heat source element are two parts of one component in the electronic device, the first heat dissipation part 22 is equivalent to being embedded into the inside of the heat source element, so that the heat generated by the heat source element can be more effectively transferred, and the heat dissipation efficiency of the electronic device is improved.

[0055] In some possible embodiments, the first heat dissipation part 22 includes multiple parts.

[0056] As shown in Figure 1 , the first heat dissipation part 22 includes a first part 221, a second part 222 and a third part 223. The first part 221 is a plate-shaped structure and is arranged in a spaced manner with the bracket 1. One end of the first part 221 is connected with the connecting part 21, one end of the second part 222 is connected with the other end of the first part 221, and the third part 223 is connected with the other end of the second part 222 and the bracket 1 respectively.

[0057] In implementation, refer to Figure 2The first part 221 and the second part 222 form a bending structure, which is attached to two walls adjacent to the first heat source element respectively, so as to increase the contact area between the heat dissipation member 2 and the first heat source element and improve the heat dissipation efficiency.

[0058] Further, the first heat dissipation part 22 is connected to the bracket 1 through the third part 223, and the first heat dissipation part 22 is no longer connected to the bracket 1 only through the connecting part 21, which can improve the heat dissipation efficiency between the first heat dissipation part 22 and the bracket 1, and can improve the connection stability between the first heat dissipation part 22 and the bracket 1.

[0059] Referring to Figure 2 , the connecting part 21, the first part 221 and the second part 222 can be surrounded to form a containing cavity 100, which is used to contain at least one heat source element of an electronic device. In the containing cavity, two walls of the heat source part are attached to the heat dissipation member 2 respectively and are arranged apart from the bracket 1, so as to increase the contact area between the heat source element and the heat dissipation member 2 and improve the heat dissipation efficiency.

[0060] According to the experimental data, the heat dissipation member 2 and the heat source element in the electronic device can increase the contact area by about 85%, so as to effectively improve the heat dissipation efficiency.

[0061] In an example, referring to Figure 2 , the first part 221 is arranged in parallel with the bracket 1.

[0062] As shown in Figure 2 , the first part 221 is parallel to the bracket 1, so that the distance from the first part 221 to the bracket 1 can be kept constant, so as to avoid the first heat source element from contacting the bracket 1 during the assembly of the first heat source element.

[0063] In some possible embodiments, the bracket 1 has an avoidance hole 11, and the heat dissipation member 2 is distributed on both sides of the bracket 1 through the avoidance hole 11.

[0064] As shown in Figure 1 , the bracket 1 has an avoidance hole 11, which can be used to install a main camera. The avoidance hole 11 can be a square hole or a circular hole, and the embodiments of the present disclosure are not limited thereto. The avoidance hole 11 can be formed by a cutting process or a stamping process, and the embodiments of the present disclosure are not limited thereto.

[0065] Exemplarily, referring to Figure 1 , the avoidance hole 11 is a square hole.

[0066] As shown in Figure 2As shown, the connecting portion 21 of the heat dissipation member 2 has a plate structure, the connecting portion 21 is located in the hollow hole 11, and both ends of the connecting portion 21 extend out of the hollow hole 11. The side wall of the connecting portion 21 is attached to the inner wall of the hollow hole 11.

[0067] Further, the heat dissipation member 2 further comprises a second heat dissipation portion 23, as shown in Figure 3 As shown, the second heat dissipation portion 23 is located on the side of the bracket 1 away from the first connecting portion 21, and is arranged opposite to the first heat dissipation portion 22. The second heat dissipation portion 23 is used to be connected with the third heat source element of the electronic device.

[0068] In this way, the multiple heat source elements in the electronic device can be distributed in the thickness direction of the bracket 1, so that in the width and length directions of the bracket 1, more arrangement space can be provided for other elements, and the arrangement flexibility of the heat source elements in the electronic device is improved.

[0069] In some examples, the second heat dissipation portion 23 is connected with the bracket 1.

[0070] As shown in Figure 2 As shown, the second heat dissipation portion 23 has a plate structure, the second heat dissipation portion 23 is located on the side of the bracket 1 away from the first heat dissipation portion 22, and is attached to the bracket 1. The wall surface of the second heat dissipation portion 23 away from the bracket 1 is connected with the third heat source element of the electronic device.

[0071] In some examples, the second heat dissipation portion 23 is arranged spaced apart from the bracket 1.

[0072] As shown in Figure 4 As shown, the second heat dissipation portion 23 has a plate structure, the second heat dissipation portion 23 is located on the side of the bracket 1 away from the first heat dissipation portion 22, and is arranged spaced apart from the bracket 1. The wall surface of the second heat dissipation portion 23 away from the bracket 1 is connected with the third heat source element of the electronic device, and the wall surface of the second heat dissipation portion 23 close to the bracket 1 is connected with the fourth heat source element of the electronic device.

[0073] In this example, the two sides of the second heat dissipation portion 23 are respectively connected with the third heat source element and the fourth heat source element, so that the multiple heat source elements can be distributed in the thickness direction of the bracket 1, thereby in the width and length directions of the bracket 1, more arrangement space can be provided for other elements, and the arrangement flexibility of the heat source elements in the electronic device is improved.

[0074] In one example, the connecting portion 21 and the inner wall of the hollow hole 11 are fixed by adhesion. In this way, the connection difficulty between the heat dissipation member 2 and the bracket 1 can be reduced.

[0075] In one possible embodiment, the heat dissipation member 2 is an integrally formed component.

[0076] As shown in Figure 3As shown, the heat dissipation piece 2 includes a connecting portion 21, a first heat dissipation portion 22, and a second heat dissipation portion 23, which are integrally formed.

[0077] In an example, the thickness of the heat dissipation piece 2 is in the range of [0.1mm, 2.5mm].

[0078] Specifically, the heat dissipation piece 2 includes the connecting portion 21, the first heat dissipation portion 22, and the second heat dissipation portion 23, which can have the same or different thicknesses, which can be set by the skilled person as needed, and the embodiments of the present disclosure do not limit this.

[0079] With the technical solution provided by the embodiments of the present disclosure, the first heat dissipation portion 22 is used to connect with the first heat source element and the second heat source element in the electronic device, the second heat dissipation portion 23 is used to connect with the third heat dissipation element in the electronic device, and the first heat dissipation portion 22 and the second heat dissipation portion 23 are connected with the connecting portion 21. Compared with the solution in the related art that three heat source elements need to be equipped with three different graphite sheets to be respectively installed with the bracket 1, and the skilled person needs to assemble the three graphite sheets successively, the technical solution provided by the embodiments of the present disclosure is an integrally formed component, and only one assembly is needed, which can make the assembly between the heat dissipation piece 2 and the bracket 1 more simple, thereby reducing the assembly difficulty of the heat dissipation piece 2. In addition, since the graphite sheet has very good ductility, even if the graphite sheet in a plate structure is bent twice at 90°C to form the first heat dissipation portion 22 and the second heat dissipation portion 23, the edge cracking between the first heat dissipation portion 22 and the connecting portion 21 and between the second heat dissipation portion 23 and the connecting portion 21 is not easy to occur, and after the heat dissipation piece 2 is assembled with the bracket 1, the heat dissipation assembly can ensure a good yield rate.

[0080] The technical solution provided by the embodiments of the present disclosure at least has the following beneficial effects:

[0081] The embodiments of the present disclosure provide a heat dissipation assembly, in which the connecting portion 21 of the heat dissipation piece 2 is connected with the bracket 1, the first heat dissipation portion 22 of the heat dissipation piece 2 is arranged in a spaced manner with the bracket 1 and is connected with the connecting portion 21, and the wall surface of the first heat dissipation portion 22 close to the bracket 1 is connected with the first heat source element of the electronic device. In this way, compared with the technical solution in the related art that the heat dissipation piece is connected with the heat source element in the electronic device through an end portion, the wall surface of the first heat dissipation portion 22 close to the bracket 1 is connected with the first heat source element of the electronic device, and thus the contact area between the heat dissipation piece 2 and the heat source element can be effectively increased, thereby improving the heat dissipation efficiency of the electronic device.

[0082] The embodiments of the present disclosure provide an electronic device, which includes the heat dissipation assembly described above.

[0083] In some possible embodiments, the electronic device includes a speaker 01, a flash 02, and a camera 03, as shown in FIG. 1. Figure 2 The heat dissipation assembly includes a bracket 1 and a heat dissipation piece 2. The bracket 1 is in a plate shape. The heat dissipation piece 2 includes a connecting part 21, a first heat dissipation part 22, and a second heat dissipation part 23. The connecting part 21 is connected to the bracket 1. The first heat dissipation part 22 is arranged at a distance from the bracket 1 and is connected to the connecting part 21. A wall surface of the first heat dissipation part 22 close to the bracket 1 is connected to a first heat source element of the electronic device. A wall surface of the first heat dissipation part 22 away from the bracket 1 is connected to the first heat source element of the electronic device. The second heat dissipation part 23 is located on a side of the bracket 1 away from the first heat dissipation part 22 and is connected to the connecting part 21. The second heat dissipation part 23 is connected to a third heat source element of the electronic device.

[0084] Further, the speaker 01 is the first heat source element described above. The speaker 01 is located between the bracket 1 and the first heat dissipation part 22. The speaker 01 is arranged at a distance from the bracket 1 and is connected to the first heat dissipation part 22. The flash 02 is the second heat source element described above. The flash 02 is located on a side of the first heat dissipation part 22 away from the bracket 1 and is connected to the first heat dissipation part 22. The camera 03 is the third heat source element described above. The second heat dissipation part 23 is attached to the bracket 1. The camera 03 is located on a side of the second heat dissipation part 23 away from the bracket 1 and is connected to the second heat dissipation part 23.

[0085] For example, the speaker 01 can be an upper speaker of the electronic device. The flash 02 can be a flash of a main camera of the electronic device. The camera 03 can be a front camera of the electronic device.

[0086] Compared with the technical solution in the related art in which the end of the heat dissipation piece is connected to the corresponding heat source element, in the use process of the electronic device, the temperature of the speaker 01 decreases by about 4-5 ℃, and the temperature of the flash 02 decreases by about 15 ℃ after 100 cycles of exposure.

[0087] In the embodiments of the present disclosure, the electronic device can be a smart phone, a tablet computer, a notebook computer, or the like, which has a communication function. The present disclosure does not make specific limitations on the specific technology and specific device form of the electronic device.

[0088] In the description of the present disclosure, the description of the terms “certain embodiments”, “one embodiment”, “some embodiments”, “illustrative embodiments”, “example”, “specific example”, or “some examples” means that the specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present disclosure.

[0089] It can be understood that, in the present disclosure, "multiple" refers to two or more, and other quantifiers are similar. The "and / or" describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can represent: A exists alone, A and B exist together, and B exists alone. The character " / " generally represents that the front and rear associated objects are in an "or" relationship. The singular form "a", "said" and "the" are also intended to include the plural form, unless the context clearly indicates otherwise.

[0090] It can be further understood that the terms "first", "second", and the like are used to describe various information, but these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other, and do not indicate a particular order or importance. In fact, the expressions "first", "second", and the like can be completely interchangeable. For example, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information without departing from the scope of the present disclosure.

[0091] It can be further understood that the terms "center", "longitudinal", "transverse", "front", "back", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation.

[0092] It can be further understood that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrally formed; it can be mechanically connected, or it can be electrically connected or can communicate with each other; it can be directly connected between the two without other components, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances.

[0093] It can be further understood that, although the operations in the embodiments of the present disclosure are described in a specific order in the drawings, it should not be understood as requiring the operations to be performed in the specific order shown or in a serial order, or requiring all the operations to be performed to obtain the desired results. In a particular environment, multitasking and parallel processing can be advantageous.

[0094] Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the concepts disclosed herein. It is intended that the disclosure be construed as including any patents, patent applications, publications, publications, or other disclosure that modifies or adds to the function of the compositions or methods described herein or replaces purportedly equivalent elements with other known or later developed elements that do the same work in the same way to accomplish the same result. The specification and examples are to be considered exemplary only, with the true scope and spirit of the disclosure indicated by the following claims.

[0095] It is to be understood that the disclosure is not limited to the precise construction here described and illustrated in the drawings, and that various modifications and changes can be made by those skilled in the art without departing from the scope thereof. The scope of the disclosure is limited only by the claims that follow.

Claims

1. A heat dissipating assembly, characterized by, The heat dissipation assembly comprises a bracket (1) and a heat dissipation piece (2); The bracket (1) is a plate structure; The heat dissipation piece (2) comprises a connecting part (21) and a first heat dissipation part (22), the connecting part (21) is connected with the bracket (1), the first heat dissipation part (22) is arranged apart from the bracket (1) and connected with the connecting part (21), and the wall surface of the first heat dissipation part (22) close to the bracket (1) is connected with a first heat source element of the electronic device.

2. The heat dissipation assembly of claim 1, wherein, The wall surface of the first heat dissipation part (22) away from the bracket (1) is connected with a second heat source element of the electronic device.

3. The heat dissipation assembly of claim 1, wherein, The first heat dissipation part (22) comprises a first part (221), a second part (222) and a third part (223); The first part (221) is a plate structure and is arranged apart from the bracket (1), one end of the first part (221) is connected with the connecting part (21); One end of the second part (222) is connected with the other end of the first part (221); The third part (223) is connected with the other end of the second part (222) and the bracket (1) respectively.

4. The heat dissipation assembly of claim 3, wherein, The first part (221) is parallel to the bracket (1).

5. The heat dissipation assembly of claim 1, wherein, The bracket (1) has a clearance hole (11), and the connecting part (21) is connected with the inner wall of the clearance hole (11); The heat dissipation piece (2) further comprises a second heat dissipation part (23), the second heat dissipation part (23) is located on the side of the bracket (1) away from the first heat dissipation part (22) and connected with the connecting part (21), and the second heat dissipation part (23) is connected with a third heat source element of the electronic device.

6. The heat dissipating assembly of claim 5, wherein, The second heat dissipation part (23) is connected with the bracket (1), and the wall surface of the second heat dissipation part (23) away from the bracket (1) is connected with a third heat source element of the electronic device.

7. The heat dissipating assembly of claim 5, wherein, The second heat dissipation part (23) is arranged apart from the bracket (1), the wall surface of the second heat dissipation part (23) away from the bracket (1) is connected with a third heat source element of the electronic device, and the wall surface of the second heat dissipation part (23) close to the bracket (1) is connected with a fourth heat source element of the electronic device.

8. The heat dissipating assembly of claim 5, wherein, The connecting part (21) is bonded with the inner wall of the clearance hole (11).

9. The heat dissipating assembly according to any one of claims 1 to 8, wherein, The heat dissipation piece (2) is an integrally formed component.

10. The heat dissipating assembly according to any one of claims 1 to 8, wherein, The thickness of the heat dissipation piece (2) is within the interval [0.1mm, 2.5mm].

11. An electronic device, comprising: The electronic device comprises the heat dissipation assembly according to any one of claims 1 to 10.

12. The electronic device of claim 11, wherein, The electronic device comprises a loudspeaker (01), a flash (02), a camera (03) and the heat dissipation assembly according to claim 5; The loudspeaker (01) is located between the bracket (1) and the first heat dissipation part (22) and connected with the first heat dissipation part (22); The flash (02) is located on the side of the first heat dissipation part (22) away from the bracket (1) and connected with the first heat dissipation part (22); The flash (02) is located on the side of the first heat dissipation part (22) away from the bracket (1) and connected with the first heat dissipation part (22); The camera (03) is located on the side of the second heat dissipation part (23) away from the support (1) and is connected with the second heat dissipation part (23).

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