Manual patch alignment device

Abstract

The utility model relates to the technical field of weldability tests of surface mount devices, in particular to a manual patch alignment device. The manual patch alignment device is used for welding a semiconductor device to a printed board in a solderability test, and comprises a base which is provided with a mounting surface used for mounting the printed board with a welding position; the steel mesh is used for being installed on the base and provided with mesh holes, and the mesh holes are aligned with the welding positions when the steel mesh is installed on the base so that solder paste can be smeared to the corresponding welding positions; and the mold is used for being installed on the base and is provided with a through hole, and the through hole is aligned with the welding position when the mold is installed on the base so as to enable the semiconductor device to fall on the corresponding solder paste. According to the scheme, rapid and accurate alignment of the device pin or the bonding pad and the pre-coating solder paste can be realized in the manual surface mounting process, and the technical level of an operator does not need to be depended on.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solderability test of surface mounted device, in particular to a manual patch alignment device. BACKGROUND

[0002] Surface mounted device (SMD) is a kind of semiconductor device with small size, light weight and high assembly density. The assembly and welding process of SMD device generally uses reflow soldering method to melt the solder paste pre-distributed on the printed board by high-temperature gas flow in the equipment, so as to realize the connection between the pads or pins of SMD device and the solder paste on the printed board.

[0003] Solderability test is to verify the solderability of semiconductor device when it is welded to PCB. If the solderability of the device is poor, it will cause problems such as poor wetting, cracking, false welding, welding rejection and poor welding strength.

[0004] Solderability test is usually carried out in the laboratory. Therefore, in order to reduce the cost of equipment, manual patching method is generally used to mount semiconductor devices. However, manual mounting mainly relies on the technical level of technicians using tweezers or vacuum suction pen for mounting. The slight inclination of solder paste will cause problems such as abnormal combination and soldering. In addition, it cannot guarantee the accuracy and mounting speed. CONTENT OF THE INVENTION

[0005] The embodiment of the present application at least provides a manual patch alignment device, which can realize rapid and accurate alignment of device pins or pads and pre-coated solder paste during manual patching, and does not need to rely on the technical level of operators.

[0006] The embodiment of the present application provides a manual patch alignment device for welding semiconductor device to printed board in solderability test, comprising:

[0007] a base having a mounting surface for mounting a printed board having a welding position;

[0008] a steel mesh for mounting on the base and having a mesh hole, the mesh hole being aligned with the welding position when the steel mesh is mounted on the base, for applying solder paste to the corresponding welding position;

[0009] a mold for mounting on the base and having a through hole, the through hole being aligned with the welding position when the mold is mounted on the base, for dropping semiconductor device on the corresponding solder paste.

[0010] In an optional embodiment, the mounting surface is provided with a limiting groove for mounting the printed board to limit the position of the printed board relative to the mounting surface.

[0011] In an alternative embodiment, the mounting surface is provided with a suction cup for connecting a vacuum system, the suction cup being used to adhere the printed board to the mounting surface when the vacuum system is in vacuum.

[0012] In an alternative embodiment, the base is provided with a first connecting part, and the steel mesh and the mold are each provided with a second connecting part;

[0013] The first connecting part is used to connect with the second connecting part, so as to mount the steel mesh / mold on the base.

[0014] In an alternative embodiment, one of the first connecting part and the second connecting part is a buckle, and the other is a hook.

[0015] In an alternative embodiment, the base is provided with a first limiting part, and the steel mesh and the mold are each provided with a second limiting part;

[0016] The first limiting part is used to cooperate with the second limiting part, so as to limit the position of the steel mesh / mold relative to the base.

[0017] In an alternative embodiment, one of the first limiting part and the second limiting part is a boss, and the other is a groove.

[0018] In an alternative embodiment, the mounting surface is located on the top surface / bottom surface of the first limiting part.

[0019] In an alternative embodiment, the mold comprises a shell and a detachable part, the shell being used to mount on the base and having a mounting opening, and the detachable part being detachably mounted on the mounting opening and having the through hole.

[0020] In an alternative embodiment, the detachable part is used to connect an air suction device, the air suction device being used to suck air to suck the semiconductor device into the through hole.

[0021] The above technical solutions of the present application have the following beneficial technical effects:

[0022] The manual patch alignment device of the present application can first mount the printed board on the mounting surface, then mount the steel mesh on the base, and then use the mesh holes on the steel mesh to apply solder paste on the welding position of the printed board, and then remove the steel mesh to mount the mold, and then drop the semiconductor device through the through hole on the corresponding solder paste. In this way, the device pin or pad can be quickly and accurately aligned with the pre-applied solder paste during manual patching, and the technical level of the operator does not need to be relied on.

[0023] In order to make the above objectives, characteristics and advantages of the present application more apparent, more comprehensible, the following will specifically describe a preferred embodiment in conjunction with the accompanying drawings, and make a detailed description as follows. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments, the drawings herein are incorporated into the description and form a part of the description, which show the embodiments consistent with the present application, and are used to illustrate the technical solutions of the present application together with the description. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without paying creative labor on the basis of the drawings.

[0025] Figure 1 An exploded view of a manual patch alignment device provided by the embodiments of the present application is shown;

[0026] Figure 2 An exploded view of a manual patch alignment device provided by the embodiments of the present application is shown; Figure 1 A schematic view of the middle shell from another perspective is shown;

[0027] Figure 3 An exploded view of a manual patch alignment device provided by the embodiments of the present application is shown; Figure 1 A perspective view of the middle mounting and dismounting part is shown;

[0028] Figure 4 An X-ray examination view after manual patching is shown;

[0029] Figure 5 A combination view of the solder paste and the device pad after the weldability experiment is shown;

[0030] Reference signs:

[0031] 1, base; 11, mounting surface; 12, limiting groove; 13, suction cup; 14, external pipeline; 101, first connecting part; 102, first limiting part; 2, steel mesh; 21, mesh sheet; 211, mesh hole; 22, frame; 3, mold; 31, shell; 311, mounting port; 32, mounting and dismounting part; 321, through hole; 322, suction nozzle; 301, second connecting part; 302, second limiting part. DETAILED DESCRIPTION

[0032] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement, numerical expressions and values of the components and steps set forth in these embodiments do not limit the scope of the present application unless otherwise specifically stated.

[0033] The embodiments of the present application will be described in detail below with reference to the drawings, in which the same or similar components have the same or similar designations and functions throughout. The embodiments described below are examples in which the present application is applied. These are merely given by way of example, and the scope of the application is not understood as being limited thereto. Based on the embodiments of the present application described above, all other embodiments that can be derived by those skilled in the art without creative work falling within the scope of the present application belong to the scope of the present application.

[0034] The terms "first", "second" in the specification and claims of the present application can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specified. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally means that the front and rear associated objects are in an "or" relationship.

[0035] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0036] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0037] Reference Figures 1 to 3 The embodiments of the present application at least provide a manual patch alignment device, which is used for welding a semiconductor device to a printed board in a solderability test, and can also realize rapid and accurate alignment of device pins or pads with pre-coated solder paste during manual patching, without relying on the technical level of the operator.

[0038] In some embodiments, the manual patch alignment device comprises a base 1, a steel mesh 2 and a mold 3. The base 1 is a rectangular block structure, and an upper surface of the base 1 forms a mounting surface 11 for mounting a printed board having soldering positions. The steel mesh 2 is mounted on the base 1 and comprises a frame 22 and a mesh 21 arranged in the frame 22, the mesh 21 having mesh holes 211 which are aligned with the soldering positions when the steel mesh 2 is mounted on the base 1, for applying solder paste to the corresponding soldering positions. The mold 3 is mounted on the base 1 and has through holes 321 which are aligned with the soldering positions when the mold 3 is mounted on the base 1, for dropping semiconductor devices on the corresponding solder paste. In use, the printed board can be mounted on the mounting surface 11 first, then the steel mesh 2 is mounted on the base 1, and the solder paste is applied to the soldering positions of the printed board by using the mesh holes 211 on the steel mesh 2, then the steel mesh 2 is removed and the mold 3 is mounted, and the semiconductor devices are dropped on the corresponding solder paste through the through holes 321. In this way, the device pins or pads can be quickly and accurately aligned with the pre-applied solder paste during manual patching, and the technical level of the operator does not need to be relied on.

[0039] In some embodiments, the mounting surface 11 is provided with a limiting groove 12 for mounting the printed board to limit the position of the printed board relative to the mounting surface 11. Specifically, the size of the limiting groove 12 is consistent with the size of the printed board, and when the printed board is mounted in the limiting groove 12, the limiting groove 12 can limit the position of the printed board so that the soldering positions of the printed board correspond to the mesh holes 211 or the through holes 321, avoiding the problem of device mounting precision caused by position error of the printed board. However, the embodiments of the present application do not make any limitation in this regard.

[0040] It should be understood that in specific implementation, the limiting groove 12 can be formed by providing a boss on the mounting surface 11, or by digging a groove on the mounting surface 11.

[0041] In some embodiments, the mounting surface 11 is provided with a suction cup 13, the suction cup 13 is connected to a vacuum system, and the suction cup 13 is used to adsorb the printed board to make it adhere to the mounting surface 11 when the vacuum system is in vacuum state. Specifically, when the printed board is mounted on the mounting surface 11, the suction cup 13 can adsorb the printed board under the action of the vacuum system to make it adhere to the mounting surface 11, which can realize the relative fixation of the printed board and the mounting surface 11, preventing the printed board from being misaligned when applying solder paste, thereby avoiding the problem of device mounting precision. However, the embodiments of the present application do not make any limitation in this regard.

[0042] It should be understood that in specific implementation, the base 1 can be provided with an external pipe 14 at the bottom thereof, one end of the external pipe 14 is connected to the suction cup 13, and the other end is used to connect the vacuum system.

[0043] In some embodiments, the base 1 is provided with a first connecting part 101. The steel mesh 2 and the mold 3 are both provided with a second connecting part 301. The first connecting part 101 is used to connect with the second connecting part 301 to mount the steel mesh 2 / mold 3 on the base 1. Specifically, when the steel mesh 2 / mold 3 is placed on the base 1, the steel mesh 2 / mold 3 and the base 1 can be connected through the first connecting part 101 and the second connecting part 301 to mount the steel mesh 2 / mold 3 on the base 1. In this way, the standardized connection between the base 1 and the steel mesh 2 / mold 3 can be achieved, and the types of connecting parts can be reduced compared with using different connecting structures. The installer only needs to be familiar with the installation and maintenance method of one set of connecting parts, which reduces the types of tools required for installation and maintenance, and reduces the training time and cost. However, the embodiments of the present application do not make any limitation in this regard.

[0044] In some embodiments, one of the first connecting part 101 and the second connecting part 301 is a snap lock, and the other is a hook. For example, in the present embodiment, the first connecting part 101 is a snap lock, and the second connecting part 301 is a hook. In this way, the steel mesh 2 / mold 3 can be easily disassembled and assembled, which is conducive to improving the test efficiency. However, the embodiments of the present application do not make any limitation in this regard.

[0045] In some embodiments, the base 1 is provided with a first limiting part 102. The steel mesh 2 and the mold 3 are both provided with a second limiting part 302. The first limiting part 102 is used to cooperate with the second limiting part 302 to limit the position of the steel mesh 2 / mold 3 relative to the base 1. Specifically, when the steel mesh 2 / mold 3 is mounted on the base 1, the steel mesh 2 / mold 3 and the base 1 can be positioned through the first limiting part 102 and the second limiting part 302 to limit the movement of the steel mesh 2 / mold 3 relative to the base 1. In this way, on the one hand, the corresponding accuracy of the mesh hole 211 / through hole 321 and the welding position can be easily controlled, and on the other hand, the first connecting part 101 and the second connecting part 301 can be easily aligned and connected. However, the embodiments of the present application do not make any limitation in this regard.

[0046] In some embodiments, one of the first limiting part 102 and the second limiting part 302 is a boss, and the other is a groove. For example, in the present embodiment, the first limiting part 102 is a boss, and the second limiting part 302 is a groove. However, the embodiments of the present application do not make any limitation in this regard.

[0047] In some embodiments, the mounting surface 11 is located on the top surface / bottom surface of the first limiting part 102. Specifically, when the first limiting part 102 is a boss, the mounting surface 11 can be located on the top surface of the boss, and when the first limiting part 102 is a groove, the mounting surface 11 can be located on the bottom surface of the groove. However, the embodiments of the present application do not make any limitation in this regard.

[0048] In some embodiments, the mold 3 comprises a shell 31 and a detachable part 32. The shell 31 is configured to be mounted on the base 1 and has a plurality of mounting holes 311. The detachable part 32 is configured to be detachably mounted on the mounting holes 311 and has a plurality of through holes 321. In particular, the shell 31 has a plurality of mounting holes 311 corresponding to a plurality of soldering positions on the printed board. In the process of mounting the semiconductor devices, the shell 31 is first mounted on the base 1, and then the detachable part 32 is mounted on the different mounting holes 311 in sequence, so that the semiconductor devices are placed on the corresponding solder paste through the through holes 321 of the detachable part 32. Compared with the way of mounting the detachable part 32 on each mounting hole 311, this way can reduce the number of detachable parts 32 on the mold 3, which is conducive to reducing the cost of the equipment.

[0049] In some embodiments, the detachable part 32 can be mounted on the mounting hole 311 of the shell 31 in a clamping or sleeving manner. In this way, the detachable part 32 can be easily disassembled and assembled, which is conducive to improving the test efficiency.

[0050] In some embodiments, the detachable part 32 is configured to be connected to an air suction device. The air suction device is configured to suck air to suck the semiconductor devices into the through holes 321. For example, the detachable part 32 is provided with a suction nozzle 322 at the outer end (upper end). The suction nozzle 322 is in communication with the through hole 321, and the suction nozzle 322 can be connected to the air suction device. When the air suction device sucks air, the semiconductor devices can be sucked into the suction nozzle 322 from the lower end of the through hole 321 under the action of the suction force. Subsequently, when the detachable part 32 is mounted on the mounting hole 311 of the shell 31, the air suction device is closed, and the semiconductor devices can fall on the solder paste at the corresponding soldering position along the through hole 321. In this way, it is not necessary to additionally configure a picking tool for the semiconductor devices, such as tweezers or a vacuum suction pen, and the operation process can be simplified.

[0051] When the above-mentioned manual patch alignment device is used for solderability test, the steps include:

[0052] 1. Place the printed board in the limiting groove 12 of the mounting surface 11 of the base 1, and control the external vacuum system to make the suction disc 13 of the mounting surface 11 adsorb the printed board.

[0053] 2. Cover the steel mesh 2 on the printed board, and mount the steel mesh 2 on the base 1 through the buckle lock and the lock hook.

[0054] 3. Apply the pretreated solder paste at the position of the mesh hole 211 of the steel mesh 2, and then remove the excess solder paste using a scraper.

[0055] 4. Unlock the buckle lock, and remove the steel mesh 2 vertically upward.

[0056] 5. Cover the shell 31 of the mold 3 on the printed board, and mount the shell 31 on the base 1 through the buckle lock and the lock hook.

[0057] 6. Align the handling portion 32 of the mold 3 to the semiconductor device, turn on the external air pump (suction device), and make the semiconductor device enter the through hole 321 of the handling portion 32 and be adsorbed in the suction nozzle 322.

[0058] 7. Install the handling portion 32 to the installation port 311 of the shell 31, turn off the external air pump, and make the semiconductor device fall along the through hole 321 to the solder paste of the corresponding welding position.

[0059] 8. Take out the handling portion 32, repeat steps 6-7, and complete the manual patching of the remaining semiconductor device.

[0060] 9. Interface the snap lock, and remove the mold 3 vertically upward.

[0061] 10. Check the precision of the patching by using X-ray, as shown in FIG. 10, the solder paste falls in the pad area. Figure 4

[0062] 11. Put the sample in the reflow oven for reflow soldering, and check the sample after reflow soldering by using optical microscope, as shown in FIG. 11, determine the solderability result. Figure 5

[0063] The manual patching alignment device of the embodiment of the present application can first install the printed board to the installation surface 11, then install the steel mesh 2 to the base 1, and use the mesh hole 211 on the steel mesh 2 to smear the solder paste at the welding position of the printed board, then take down the steel mesh 2 and install the mold 3, and make the semiconductor device fall to the corresponding solder paste through the through hole 321. In this way, the device pin or pad can be quickly and accurately aligned with the pre-smearing solder paste in the manual patching process, and it does not need to rely on the technical level of the operator.

[0064] The specification one or more embodiments are intended to cover all such alternatives, modifications and variations falling within the broad scope of the appended claims. Therefore, any omission, modification, equivalent replacement, improvement, etc. made in the spirit and principle of the specification one or more embodiments should be included in the protection scope of the present application.

[0065] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.​​

Claims

1. A manual patch alignment device for soldering a semiconductor device to a printed board in a solderability test, characterized in that, The application relates to a soldering device for mounting a printed board on a base, comprising: a base having a mounting surface for mounting a printed board having soldering positions; a steel mesh for mounting on the base and having mesh holes which are aligned with the soldering positions when the steel mesh is mounted on the base for applying soldering paste to the corresponding soldering positions; a mold for mounting on the base and having a through hole which is aligned with the soldering positions when the mold is mounted on the base for dropping semiconductor devices on the corresponding soldering paste.

2. The manual patch alignment device of claim 1, wherein, The mounting surface is provided with a limiting groove for mounting the printed board to limit the position of the printed board relative to the mounting surface.

3. The manual patch alignment device of claim 1, wherein, The mounting surface is provided with a suction disc for connecting a vacuum system, and the suction disc is used for adsorbing the printed board to attach the printed board to the mounting surface when the vacuum system is vacuumized.

4. The manual patch alignment device of claim 1, wherein, The base is provided with a first connecting part, and the steel mesh and the mold are provided with a second connecting part; wherein the first connecting part is used for connecting the second connecting part to mount the steel mesh / the mold on the base.

5. The manual patch alignment device of claim 4, wherein, One of the first connecting part and the second connecting part is a buckle lock, and the other is a lock hook.

6. The manual patch alignment device of claim 1, wherein, The base is provided with a first limiting part, and the steel mesh and the mold are provided with a second limiting part; wherein the first limiting part is used for cooperating with the second limiting part to limit the position of the steel mesh / the mold relative to the base.

7. The manual patch alignment device of claim 6, wherein, One of the first limiting part and the second limiting part is a convex, and the other is a concave.

8. The manual patch alignment device of claim 6, wherein, The mounting surface is located on the top surface / bottom surface of the first limiting part.

9. The manual patch alignment device of claim 1, wherein, The mold comprises a shell and a detachable part, the shell is used for mounting on the base and has a mounting port, and the detachable part is detachably mounted on the mounting port and has the through hole.

10. The manual patch alignment device of claim 9, wherein, The detachable part is used for connecting an air suction device, and the air suction device is used for sucking air to suck semiconductor devices into the through hole.

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