LED packaging substrate and LED packaging structure

Abstract

The utility model provides an LED packaging substrate and an LED packaging structure. The LED packaging substrate comprises a substrate main body; the at least one bearing part is arranged on the first side surface of the substrate main body and is used for bearing a light-emitting chip; the area of the at least one bearing part accounts for 5%-45% of the area of the first side face. Therefore, during processing, the size of the metal functional layer can be reduced, and the contact area between the packaging adhesive and the first side surface of the substrate main body is increased by removing the redundant part on the metal functional layer, so that the connection strength between the packaging adhesive and the substrate main body is improved, external harmful substances are prevented from permeating into the position of the light-emitting chip, and the product reliability is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED product, in particular to an LED packaging substrate and an LED packaging structure. BACKGROUND

[0002] With the continuous provision of airtightness requirements of small-size CH IP series packaged LEDs, the ordinary CHIP substrate structure on the market is prone to produce interfaces after epoxy resin packaging, resulting in insufficient bonding capacity, which will cause harmful substances to penetrate in long-term use, and ultimately lead to the decline of the reliability of LED products. Moreover, in the process of high-temperature reflow soldering, the solder paste is easy to penetrate into the LED functional area through the metal pad, and then lead to product failure. CONTENT OF THE UTILITY MODEL

[0003] Therefore, the present application provides an LED packaging substrate and an LED packaging structure, which can improve the packaging connection strength and avoid the penetration of harmful substances from the outside.

[0004] In order to achieve the above purpose, the present application provides the following technical scheme:

[0005] An LED packaging substrate comprises:

[0006] a substrate body;

[0007] at least one bearing portion arranged on a first side of the substrate body and used for bearing a light emitting chip;

[0008] wherein the area of the at least one bearing portion accounts for 5%-45% of the area of the first side.

[0009] Optionally, the area of the first side of the substrate body is set to 1.28-5.12 square millimeters, and the area of the at least one bearing portion is set to 0.1225-1.21 square millimeters.

[0010] Optionally, in at least one direction parallel to the first side, the size of the bearing portion is set to 0.35-0.55 millimeters.

[0011] Optionally, the bearing portion is set to a square shape, and the size of the bearing portion in the length direction and / or the width direction is set to 0.35-0.55 millimeters.

[0012] Optionally, a conductive layer is arranged on the substrate body, the conductive layer is arranged in a spaced manner with the bearing portion, and is electrically conducted through a strip-shaped connecting portion.

[0013] Optionally, the width of the connecting portion is set to 0.08-0.12 millimeters.

[0014] Optionally, the connecting portion is provided with a protruding portion extending from one side to the other side of the connecting portion.

[0015] Optionally, the connecting portion is provided with a recessed portion extending from one side to the other side of the connecting portion.

[0016] Optionally, the substrate body is provided as a square plate with a size of 1.6*1.7 square millimeters, and the at least one bearing portion is provided with a size of 0.49-1.21 square millimeters.

[0017] Optionally, the substrate body is provided as a square plate with a size of 3.2*1.6 square millimeters, and the at least one bearing portion is provided with a size of 0.49-1.21 square millimeters.

[0018] Optionally, the substrate body is provided with four square bearing portions arranged in a matrix, and the bearing portions are provided with a size of 0.35-0.55 millimeters in the length direction and the width direction.

[0019] Optionally, the substrate body is provided as a square plate with a size of 1.6*0.8 square millimeters, and the at least one bearing portion is provided with a size of 0.191-0.3 square millimeters.

[0020] Optionally, the substrate body is provided as a square plate with a size of 2*1.2 square millimeters, and the at least one bearing portion is provided with a size of 0.1225-0.3025 square millimeters.

[0021] Optionally, the substrate body is provided with one square bearing portion, and the bearing portion is provided with a size of 0.35-0.55 millimeters in the length direction and / or the width direction.

[0022] Optionally, the substrate body is further provided with a voltage stabilizing portion and at least one soldering wire portion, the voltage stabilizing portion is electrically connected with the bearing portion and used for bearing a Zener diode, and the soldering wire portion is electrically connected with a conductive layer provided on the substrate body through a strip-shaped connecting portion.

[0023] An LED packaging structure comprising the LED packaging substrate according to any one of the above.

[0024] The LED packaging substrate and the LED packaging structure provided in the application have an area of all the bearing portions being 15%-45% of the area of the first side surface. In processing, the size of the original functional area can be reduced to form a bearing portion with a smaller size, the contact area of the packaging glue and the first side surface of the substrate body is increased by removing the excess part on the original functional area, and the connection strength of the packaging glue and the substrate body is improved, so that harmful substances in the external environment cannot penetrate into the position of the light-emitting chip, and the product reliability is improved. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description only illustrate the embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of the provided drawings.

[0026] Figure 1 A schematic diagram of an LED packaging substrate encapsulating a chip for the first embodiment;

[0027] Figure 2 A schematic diagram of an LED packaging substrate covering encapsulation glue for the first embodiment;

[0028] Figure 3 A schematic diagram of an LED packaging substrate encapsulating a chip for the second embodiment;

[0029] Figure 4 A schematic diagram of an LED packaging substrate covering encapsulation glue for the second embodiment;

[0030] Figure 5 A schematic diagram of an LED packaging substrate encapsulating a chip for the third embodiment;

[0031] Figure 6 A schematic diagram of an LED packaging substrate covering encapsulation glue for the third embodiment;

[0032] Figure 7 A schematic diagram of an LED packaging substrate encapsulating a chip for the fourth embodiment;

[0033] Figure 8 A schematic diagram of an LED packaging substrate covering encapsulation glue for the fourth embodiment;

[0034] Figure 9 A structural schematic diagram of a protruding part for some embodiments;

[0035] Figure 10 A structural schematic diagram of a recessed part for some embodiments.

[0036] In the drawings: 1, substrate body; 2, bearing part; 3, first conductive part; 4, second conductive part; 5, connecting part; 6, light emitting chip; 7, wire part; 8, encapsulation glue; 9, protruding part; 10, recessed part; 11, voltage stabilizing part; 101, first side surface; 102, second side surface. DETAILED DESCRIPTION

[0037] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of the present application.

[0038] As shown in Figures 1-10 , the present application provides an LED packaging substrate, which comprises a substrate main body 1, and the substrate main body 1 is arranged as a BT plate. Specifically, the substrate main body 1 has opposite first and second side surfaces 101 and 102. Here, the first side surface 101 is the upper side surface in Figures 9-10 , that is, the side surface shown in Figures 1-8 , and the second side surface 102 is the lower side surface in Figures 9-10 .

[0039] The first side surface 101 of the substrate main body 1 is provided with at least one bearing part 2, and the size of all the bearing parts 2 is smaller than the size of the first side surface 101 of the substrate main body 1, so that part of the first side surface 101 is exposed, and another part of the first side surface 101 is covered by the bearing part 2. Here, the area of all the bearing parts 2 is 5%-45% of the area of the first side surface 101. In processing, the size of the original functional area can be reduced to form a bearing part with a smaller size. By removing the excess part on the original functional area, the contact area of the packaging glue 8 and the first side surface 101 of the substrate main body 1 is increased, and thus the connection strength of the packaging glue 8 and the substrate main body 1 is improved, the harmful substances in the external environment are prevented from penetrating into the position of the light-emitting chip 6, and the product reliability is improved.

[0040] It should be noted that the substrate main body 1 is further provided with a conductive layer, and the conductive layer is arranged at least at the edge position of the second side surface 102. For example, the conductive layer is arranged at the first and second side surfaces 101 and 102 of the substrate main body 1 and connected at the edge position of the substrate main body 1, and the conductive layer forms a semi-encapsulation of the substrate main body 1. Here, the conductive layers on the two sides of the substrate main body 1 are integrally formed, which is beneficial to improving the structural stability of the conductive layer. In this way, the arrangement of the conductive layer can improve the electrical connection stability and conduction efficiency of the conductive layer.

[0041] In some embodiments, the bearing part 2 is located at the middle part of the first side surface 101 of the substrate main body 1 and used for bearing the light-emitting chip 6. In packaging, the bearing part 2 is provided with the light-emitting chip 6 away from one side of the substrate main body 1, and the packaging glue 8 is packaged at the first side surface 101 of the substrate main body 1, and the packaging glue 8 covers the bearing part 2 and the light-emitting chip 6 at the same time. The packaging glue 8 can be arranged as an epoxy resin glue. The number of the bearing parts 2 is at least one, such as one, two, three or four.

[0042] The size of the bearing part 2 is set to match the size of the light-emitting chip 6, for example, the bearing part 2 and the light-emitting chip 6 are both square, the length of the bearing part 2 can match the length of the light-emitting chip 6, the width of the bearing part 2 can match the width of the light-emitting chip 6, or the length and width of the bearing part 2 can match the length and width of the light-emitting chip 6, so that the edge of the bearing part 2 is close to the edge of the light-emitting chip 6. In this way, the size of the bearing part 2 is reduced according to the size of the light-emitting chip 6, the contact area of the packaging glue 8 and the first side surface 101 of the substrate body 1 is increased by removing the excess part on the original functional area, and the connection strength of the packaging glue 8 and the substrate body 1 is improved, so that the harmful substances in the external environment cannot penetrate into the position of the light-emitting chip 6, and the product reliability is improved.

[0043] It can be understood that since the light-emitting chip 6 is installed on the bearing part 2, the size of the bearing part 2 should be slightly larger than the size of the light-emitting chip 6, so that the light-emitting chip 6 and the bearing part 2 are in full contact, and the installation stability of the light-emitting chip 6 is ensured.

[0044] In at least one direction parallel to the first side surface 101 of the substrate body 1, the size of the bearing part 2 is set to 0.35-0.55mm, when the bearing part 2 and the light-emitting chip 6 are both square, the direction can be the length direction of the bearing part 2, or the width direction of the bearing part 2, or the length direction or the width direction of the substrate body 1. When the size of the bearing part 2 is set to 0.35mm, the mainstream small-size single-electrode chip can be used for the light-emitting chip 6, the size of the light-emitting chip 6 is 6-7mil, and the sum of the minimum value of 0.15-0.18mm and the silver glue width 0.2mm is about 0.35mm. When the size of the bearing part 2 is set to 0.55mm, the mainstream double-electrode chip can be used for the light-emitting chip 6, the size of the light-emitting chip 6 is 8*18mil, and the sum of the minimum value and the silver glue width 0.2mm is about 0.55mm. In this way, by designing the size of the bearing part 2, the bearing part 2 can be suitable for single-electrode chips and double-electrode chips, and has good adaptability and good connection stability.

[0045] The substrate body 1 is set to be square, and the size of the bearing part 2 is set to 0.35-0.55mm, which can be the length direction of the substrate body 1, or the width direction of the substrate body 1, or the length direction and the width direction of the substrate body 1. In this way, different size forms of the bearing part 2 can be set according to different installation modes of the light-emitting chip 6.

[0046] In some embodiments, the substrate body 1 is provided with a conductive layer having a plurality of conductive portions, the number of the conductive portions is an even number, and the conductive portions are divided into first conductive portions 3 and second conductive portions 4, i.e., corresponding to positive electrodes and negative electrodes respectively. For example, the number of the conductive portions is two, four or six. Here, the first conductive portions 3 and the second conductive portions 4 are respectively arranged on opposite sides of the substrate body 1. Each bearing portion 2 is arranged apart from each conductive portion (i.e., the first conductive portions 3 and the second conductive portions 4), and a connecting portion 5 is arranged between each first conductive portion 3 and the bearing portion 2 and between each second conductive portion 4 and the bearing portion 2, so that the electrical connection between the two is realized through the conductive property of the connecting portion 5. The connecting portion 5 is arranged in a strip shape, i.e., one end of the connecting portion 5 is connected to one bearing portion 2, and the other end is connected to the first conductive portion 3 or the second conductive portion 4. For example, the first conductive portions 3, the second conductive portions 4, the connecting portions 5 and the bearing portions 2 are integrally formed. During packaging, the edge of the packaging glue 8 passes through the connecting portion 5. Since the connecting portion 5 is arranged in a strip shape, the intersection size of the edge of the packaging glue 8 and the connecting portion 5 can be reduced, thereby increasing the contact area of the packaging glue 8 and the substrate body 1, improving the bonding capacity, and avoiding the penetration of the solder paste into the bearing portion 2 during high-temperature soldering, which is conducive to improving the connection strength of the packaging glue 8.

[0047] In some embodiments, the width of the connecting portion 5 is 0.08-0.12 mm, i.e., the connecting portion 5 is arranged in a rectangular strip with equal width, which is convenient for processing and stable in structure. In addition, the connecting portion 5 can also be arranged in a spindle shape, an arc shape, a horn shape, a trapezoidal shape, etc.

[0048] In some preferred embodiments, the connecting portion 5 is provided with an anti-seepage structure extending from one side to the other side of the connecting portion 5. For example, the extension direction of the anti-seepage structure is perpendicular to the extension direction of the connecting portion 5, i.e., perpendicular to the direction from the bearing portion 2 to the first conductive portion 3 / second conductive portion 4. The anti-seepage structure increases the contact area of the packaging glue 8 and the connecting portion 5, which not only improves the connection strength of the connecting portion 5 and the packaging glue 8, but also prolongs the path of external impurities along the connecting portion 5 into the bearing portion 2, thereby having a good anti-seepage effect.

[0049] As shown in Figure 9 , the side of the connecting portion 5 away from the substrate body 1 is provided with a protruding portion 9 protruding from the surface of the connecting portion 5 to form the above-mentioned anti-seepage structure. The protruding portion 9 extends from one side to the other side of the connecting portion 5, for example, the extension direction of the protruding portion 9 is perpendicular to the extension direction of the connecting portion 5. When the packaging glue 8 is packaged on the substrate body 1, the protruding portion 9 is embedded in the packaging glue 8, thereby increasing the contact area of the connecting portion 5 and the packaging glue 8, which not only improves the connection strength of the connecting portion 5 and the packaging glue 8, but also prolongs the path of external impurities along the connecting portion 5 into the bearing portion 2, thereby having a good anti-seepage effect.

[0050] As shown in Figure 10As shown, a groove 10 is provided on the side of the connecting portion 5 away from the substrate body 1. The groove 10 is recessed into the surface of the connecting portion 5 to form the aforementioned anti-seepage structure. The groove 10 extends from one side of the connecting portion 5 to the other side; for example, the extending direction of the groove 10 is perpendicular to the extending direction of the connecting portion 5. Specifically, the groove 10 can be formed by bending the connecting portion 5, i.e., the upper surface of the connecting portion 5 away from the substrate body 1 is recessed towards the substrate body 1, while the lower surface of the connecting portion 5 near the substrate body 1 protrudes towards the substrate body 1, thus forming a recess on the upper surface of the connecting portion 5. When the encapsulating adhesive 8 is encapsulated on the substrate body 1, the encapsulating adhesive 8 is embedded in the groove 10, thereby increasing the contact area between the connecting portion 5 and the encapsulating adhesive 8. This not only improves the connection strength between the connecting portion 5 and the encapsulating adhesive 8 but also extends the path of external impurities along the connecting portion 5 into the carrier portion 2, resulting in a better anti-seepage effect.

[0051] Furthermore, due to the design of the protrusion 9 and the groove 10, the connecting part 5 and the encapsulating adhesive 8 are interlocked in the thickness direction of the substrate body 1, which can improve the connection strength of the encapsulating adhesive 8 in the length and width directions of the substrate. When the substrate body 1 is cut, the stability of the encapsulating adhesive 8 relative to the substrate body 1 can be improved.

[0052] In some embodiments, the area of ​​the first side surface 101 of the substrate body 1 is set to 1.28-5.12 square millimeters, and the area of ​​all the carrier portions 2 is set to 0.1225-0.21 square millimeters. The arrangement of the conductive layer, carrier portions, and light-emitting chip 6 will be described below with reference to specific schemes.

[0053] like Figures 1-4 As shown in the first and second embodiments, four carrier portions 2 are arranged in pairs in the middle of the substrate body 1. Each carrier portion 2 is square, with each side length set to 0.35-0.55 mm. The conductive layer has two first conductive portions 3 and two second conductive portions 4. The two first conductive portions 3 are spaced apart on the left side of the substrate body 1 and are connected to two of the carrier portions 2 via connecting portions 5. The two second conductive portions 4 are spaced apart on the right side of the substrate body 1 and are connected to the other two carrier portions 2 via connecting portions 5. The width of each connecting portion 5 is set to 0.08-0.12 mm. Three light-emitting chips 6 are provided, one of which is a single-electrode chip and the other two are dual-electrode chips. The three light-emitting chips 6 are respectively disposed on three adjacent carrier portions 2 and connected in series and parallel by leads. The encapsulating adhesive 8 covers the light-emitting chips 6 and the carrier portions 2, exposing the conductive layer. The edge of the encapsulating adhesive 8 passes through the substrate body 1 and only through the four connecting portions 5, which greatly improves the connection strength and sealing performance between the encapsulating adhesive 8 and the substrate body 1.

[0054] In the first embodiment, the substrate body 1 is set as a square plate of 1.6*1.7 square millimeters, the sum of the areas of the four bearing portions 2 is set as 0.49-1.21 square millimeters, and when the encapsulation glue 8 is encapsulated on the substrate body 1, the encapsulation glue 8 is set as a square structure of 1.2*1.7 square millimeters. Moreover, the electrode directions of the two double-electrode chips are perpendicular to the length direction of the substrate body 1, and here the length direction of the substrate body 1 is defined as the left-right direction in the figure. Figures 1-2

[0055] In the second embodiment, the substrate body 1 is set as a square plate of 3.2*1.6 square millimeters, the sum of the areas of the four bearing portions 2 is set as 0.49-1.21 square millimeters, and when the encapsulation glue 8 is encapsulated on the substrate body 1, the encapsulation glue 8 is set as a square structure of 2*1.6 square millimeters. Moreover, the electrode directions of the two double-electrode chips are parallel to the length direction of the substrate body 1, and here the length direction of the substrate body 1 is defined as the left-right direction in the figure. Figures 3-4

[0056] It should be noted that the edge portion or the corner portion of the substrate body is provided with a notch, and the corresponding conductive layer is also provided with a notch, and when the size is calculated, the size of the notch can be ignored.

[0057] As shown in Figures 5-8 ​​As shown, in the third and fourth embodiments, the carrier 2 is provided with one and is arranged in the middle of the substrate body 1, and the carrier 2 is arranged in a rectangular shape. The conductive layer has a first conductive part 3 and a second conductive part 4, the first conductive part 3 is arranged at the left part of the substrate body 1 and is connected to the carrier 2 through the connecting part 5, and the second conductive part 4 is arranged at the right part of the substrate body 1 and extends into the middle of the substrate body 1 through the connecting part 5. In addition, the middle of the substrate body 1 is also provided with a voltage stabilizing part 11 and a wire bonding part 7, the voltage stabilizing part 11 is electrically connected with the carrier 2, for example, the voltage stabilizing part 11 and the carrier 2 can be integrally formed, or can be arranged at intervals and electrically connected, and the voltage stabilizing part 11 is used to carry a Zener diode to realize the voltage stabilization in the circuit. The wire bonding part 7 is used to provide a wire bonding position, and the light emitting chip 6 carried on the carrier 2 is electrically connected with the wire bonding part 7 through a lead wire, and the second conductive part 4 is electrically connected with the wire bonding part 7 through the strip-shaped connecting part 5. Specifically, the wire bonding part 7 can be provided with one or two, and can be arranged in a square or circular shape. The width of each connecting part 5 is arranged to be 0.08-0.12 mm. The light emitting chip 6 is provided with a double electrode chip, the light emitting chip 6 is arranged on the carrier 2 and realizes series and parallel connection of the circuit through a lead wire. Among them, the electrode direction of the double electrode chip is perpendicular to the length direction of the substrate body 1, here the length direction of the substrate body 1 is defined as the left-right direction in the figure. The encapsulation glue 8 covers the light emitting chip 6 and the carrier 2 and exposes the conductive layer, and the edge of the encapsulation glue 8 only passes through the two connecting parts 5 on the left and right of the substrate body 1, greatly improving the connection strength and sealing performance of the encapsulation glue 8 and the substrate body 1.

[0058] In the third embodiment, the substrate body 1 is arranged in a square plate with a size of 1.6*0.8 square millimeters, the area of the carrier is arranged to be 0.191-0.3 square millimeters, and when the encapsulation glue 8 is encapsulated on the substrate body 1, the encapsulation glue 8 is arranged in a square structure with a size of 1.2*0.8 square millimeters. Moreover, in the length direction of the substrate, that is, the left-right direction in the figure, the side length of the carrier 2 is arranged to be 0.35-0.55 mm. Figures 5-6 The voltage stabilizing part 11 is spaced apart from and electrically connected with the carrier 2, and the wire bonding part 7 is provided with one and is arranged in a square shape.

[0059] In the fourth embodiment, the substrate body 1 is arranged in a square plate with a size of 2*1.2 square millimeters, the area of the carrier is arranged to be 0.1225-0.3025 square millimeters, and when the encapsulation glue 8 is encapsulated on the substrate body 1, the encapsulation glue 8 is arranged in a square structure with a size of 1.2*1.3 square millimeters. Moreover, in the length direction and the width direction of the substrate, that is, the up-down direction and the left-right direction in the figure, the side length of the carrier 2 is arranged to be 0.35-0.55 mm. The voltage stabilizing part 11 is integrally formed with the carrier 2, and the wire bonding part 7 is provided with two, one is arranged in a square shape, and the other is arranged in a circular shape.

[0060] The embodiment of the present application provides a LED packaging structure, comprising the LED packaging substrate in the above embodiment, so that the size of the bearing part 2 is reduced according to the size of the light emitting chip 6, the contact area of the packaging glue 8 and the first side surface 101 of the substrate main body 1 is increased by removing the excess part on the original functional area, and then the connection strength of the packaging glue 8 and the substrate main body 1 is improved, harmful substances in the external environment are prevented from penetrating into the position of the light emitting chip 6, and product reliability is improved.

[0061] The basic principle of the present application is described above in combination with specific embodiments, but it should be pointed out that the advantages, advantages, effects and the like mentioned in the present application are only examples and not limitations, and these advantages, advantages, effects and the like cannot be considered as the must-have of each embodiment of the present application. In addition, the above-mentioned specific details are only for the purpose of example and for the purpose of understanding, and are not limited to the present application, and the above-mentioned specific details are not limited to the present application.

[0062] The block diagram of the device, apparatus, equipment, system involved in the present application is only an illustrative example and is not intended to require or imply the connection, arrangement and configuration shown in the block diagram. As those skilled in the art will recognize, these devices, apparatus, equipment, system can be connected, arranged and configured in any way. Words such as "include", "contain", "have" and the like are open-ended words, which mean "including but not limited to", and can be used interchangeably. The words "or" and "and" used herein mean the word "and / or", and can be used interchangeably unless the context clearly indicates otherwise. The word "such as" used herein means the phrase "such as but not limited to", and can be used interchangeably.

[0063] It should also be noted that in the device, equipment and method of the present application, each component or each step can be decomposed and / or recombined. These decompositions and / or recombination should be considered as equivalent solutions of the present application.

[0064] The above description of the disclosed aspects is provided so that any person skilled in the art can make or use the present application. Various modifications to these aspects will be apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0065] It should be understood that the limiting words "first", "second", "third", "fourth", "fifth" and "sixth" used in the embodiment description of the present application are only used for clearer description of the technical solutions, and cannot be used to limit the protection scope of the present application.

[0066] The foregoing description has been presented for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of the application to the forms disclosed herein. Although various example aspects and embodiments have been discussed above, those of ordinary skill in the art will appreciate a variety of modifications, alternatives, permutations, additions, and sub-combinations, which fall within the scope of the application.

Claims

1. An LED package substrate, characterized by, The application relates to an LED packaging substrate, which comprises the following parts: a substrate body (1); at least one bearing part (2) arranged on a first side (101) of the substrate body (1) and used for bearing a light-emitting chip (6); wherein the area of the at least one bearing part (2) accounts for 5%-45% of the area of the first side (101).

2. The LED package substrate of claim 1, wherein, The area of the first side (101) of the substrate body (1) is arranged to be 1.28-5.12 square millimeters, and the area of the at least one bearing part (2) is arranged to be 0.1225-1.21 square millimeters.

3. The LED package substrate of claim 1, wherein, In at least one direction parallel to the first side (101), the size of the bearing part (2) is arranged to be 0.35-0.55 millimeters.

4. The LED package substrate of claim 3, wherein, The bearing part is arranged to be square, and the size of the bearing part (2) in the length direction and / or the width direction is arranged to be 0.35-0.55 millimeters.

5. The LED package substrate of claim 1, wherein, The substrate body is provided with a conductive layer, the conductive layer is arranged to be spaced from the bearing part (2), and is electrically connected through a strip-shaped connecting part (5).

6. The LED package substrate of claim 5, wherein, The width of the connecting part (5) is arranged to be 0.08-0.12 millimeters.

7. The LED package substrate of claim 5, wherein, The side of the connecting part away from the substrate body is provided with a protruding part, and the protruding part extends from one side of the connecting part to the other side.

8. The LED package substrate of claim 5, wherein, The side of the connecting part away from the substrate body is provided with a recessed part, and the recessed part extends from one side of the connecting part to the other side.

9. The LED package substrate of claim 1, wherein, The substrate body is arranged to be a square plate with a size of 1.6*1.7 square millimeters, and the at least one bearing part (2) is arranged to be 0.49-1.21 square millimeters.

10. The LED package substrate of claim 1, wherein, The substrate body is arranged to be a square plate with a size of 3.2*1.6 square millimeters, and the area of the at least one bearing part (2) is arranged to be 0.49-1.21 square millimeters.

11. The LED package substrate according to claim 9 or 10, wherein, The substrate body (1) is provided with four square bearing parts (2) arranged in a matrix, and the size of the bearing part in the length direction and the width direction is arranged to be 0.35-0.55 millimeters.

12. The LED package substrate of claim 1, wherein, The substrate body is arranged to be a square plate with a size of 1.6*0.8 square millimeters, and the area of the at least one bearing part (2) is arranged to be 0.191-0.3 square millimeters.

13. The LED package substrate of claim 1, wherein, The substrate body is arranged to be a square plate with a size of 2*1.2 square millimeters, and the area of the at least one bearing part (2) is arranged to be 0.1225-0.3025 square millimeters.

14. The LED package substrate according to claim 12 or 13, wherein, The substrate body (1) is provided with one square bearing part (2), and the size of the bearing part in the length direction and / or the width direction is arranged to be 0.35-0.55 millimeters.

15. The LED package substrate of claim 14, wherein, The substrate body (1) is further provided with a voltage stabilizing part and at least one soldering part, the voltage stabilizing part is electrically connected with the bearing part and used for bearing a Zener diode, and the soldering part is electrically connected with the conductive layer arranged on the substrate body through a strip-shaped connecting part.

16. An LED package structure, characterized in that, The application further relates to an LED packaging substrate as claimed in any one of claims 1-15.

Images