Numerical control surface grinding, chamfering and rounding all-in-one machine based on monocrystalline silicon

Abstract

The numerical control surface grinding, chamfering and rounding all-in-one machine comprises a machining all-in-one machine, a machining bin is formed in the upper left corner of the front end of the machining all-in-one machine, a bin door is connected to the upper side of the front end of the machining all-in-one machine in a sliding mode, and the bin door can slide to the front end of the machining bin for shielding. Storage mechanisms are arranged on the left side and the right side of the inner wall of the lower end of the machining bin correspondingly, a plurality of chamfering and rounding grooves with different inner diameters are formed in the cylindrical outer wall of a chamfering and grinding wheel, and the edge of a silicon wafer can be chamfered and rounded at different angles; chamfering rounding grooves with different inner diameters can be adjusted to be clamped at the two ends of a silicon wafer to meet different machining requirements, stretching and retracting between a clamping telescopic rod and a telescopic sliding sleeve are controlled through a hydraulic control mechanism, the clamping position and tightness can be controlled according to the radius of the silicon wafer, the chamfering rounding device is suitable for machining of the silicon wafers with different radiuses, the machining range is widened, and the machining quality is improved.

Description

Technical Field

[0001] This utility model belongs to the technical field of monocrystalline silicon processing, specifically relating to a CNC grinding, chamfering and rounding integrated machine based on monocrystalline silicon. Background Technology

[0002] In the field of monocrystalline silicon processing, there are increasingly higher requirements for the quality and processing efficiency of silicon wafers. Traditional monocrystalline silicon processing equipment is usually single-function, capable of performing only simple grinding, chamfering, or rounding operations. This requires multiple machines to perform different processing steps, which not only increases equipment costs and floor space but also reduces production efficiency.

[0003] Meanwhile, traditional equipment often lacks precision and efficiency in the transfer and positioning of silicon wafers during processing, which can easily lead to wafer damage or insufficient processing accuracy. Moreover, traditional equipment has poor adaptability to different specifications of silicon wafers, making it difficult to meet diverse production needs.

[0004] In chamfering and rounding processes, traditional equipment struggles to precisely control the chamfering angle and rounding effect, easily leading to uneven processing and affecting silicon wafer quality. Furthermore, traditional equipment has a relatively low level of automation, requiring significant manual intervention, which increases labor costs and the risk of operational errors.

[0005] In summary, in order to meet the demand of the monocrystalline silicon processing industry for high-quality, high-efficiency, and highly adaptable processing equipment, there is an urgent need for a new type of CNC grinding, chamfering, and rounding integrated machine based on monocrystalline silicon, so as to improve the processing quality and production efficiency of monocrystalline silicon wafers, reduce costs, and adapt to the processing needs of silicon wafers of different specifications. Utility Model Content

[0006] The purpose of this invention is to provide a CNC grinding, chamfering, and rounding integrated machine based on monocrystalline silicon, so as to solve the problems mentioned in the background art that traditional monocrystalline silicon processing equipment usually has single function, inaccurate positioning, and low degree of automation.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a CNC grinding, chamfering, and rounding integrated machine based on monocrystalline silicon, comprising an integrated processing machine, wherein a processing chamber is provided inside the upper left corner of the front end of the integrated processing machine, and a chamber door is slidably connected to the upper side of the front end of the integrated processing machine, and the chamber door can slide to the front end of the processing chamber for obstruction, and storage mechanisms are provided on both the left and right sides of the lower inner wall of the processing chamber, and a transfer robotic arm is provided between the two storage mechanisms, and the transfer robotic arm is rotatably connected inside the processing chamber and can extend and retract vertically inside the lower inner wall of the processing chamber, a processing mechanism is provided behind the transfer robotic arm, and the processing mechanism is located on the rear side of the lower inner wall of the processing chamber, a limit mechanism is rotatably connected inside the upper front side of the processing mechanism, and an adjustment slide column is slidably connected inside the upper rear side of the processing mechanism, and a grinding mechanism is fixedly connected to the front end of the adjustment slide column through a connecting frame, and chamfering grinding wheels are provided on both the left and right sides of the grinding mechanism.

[0008] Preferably, the grinding mechanism is fixedly connected to the front side of the lower end of the connecting frame and is located directly above the limiting mechanism, and the grinding mechanism consists of a grinding disc in the middle and multiple grinding plates around it.

[0009] Preferably, an adjustment chamber is fixedly connected to the front side of the upper end of the connecting frame, and the adjustment chamber is located directly above the grinding mechanism. An adjustment motor is provided at the center of the upper end of the adjustment chamber, and an adjustment shaft is rotatably connected to the center of the lower end of the adjustment motor.

[0010] Preferably, the lower end of the adjusting shaft is rotatably connected to the interior of the adjusting chamber, and the adjusting shaft is externally threaded with an adjusting connecting plate, which is slidably connected to the interior of the adjusting chamber.

[0011] Preferably, square clamping telescopic rods are fixedly connected to both ends of the adjustment connecting plate, and adjustment grooves are opened inside both ends of the adjustment chamber, with the two clamping telescopic rods passing through the two adjustment grooves to the outside of the left and right ends of the adjustment chamber respectively.

[0012] Preferably, the clamping telescopic rod is slidably connected inside the adjusting slide groove and fits against the inner walls of the front and rear ends of the adjusting slide groove. A telescopic sleeve is sleeved on the outside of the end of the clamping telescopic rod away from the adjusting chamber, and a square telescopic slide groove is opened inside the end of the telescopic sleeve near the adjusting chamber.

[0013] Preferably, the clamping telescopic rod is slidably connected inside the telescopic slide groove, and the lower end of the telescopic slide sleeve is fixedly connected to a connecting shaft on the side away from the adjustment chamber, and the chamfering grinding wheel is sleeved on the outside of the connecting shaft and rotatably connected to the connecting shaft.

[0014] Preferably, the inner wall of the chamfering grinding wheel cylinder has multiple chamfering and rounding grooves with different inner diameters, and the upper end of the telescopic sleeve is connected to a hydraulic adjustment pipe on the side away from the adjustment chamber, and the hydraulic adjustment pipe is connected to the telescopic groove inside the telescopic sleeve.

[0015] Compared with the prior art, this utility model provides a CNC grinding, chamfering and rounding integrated machine based on monocrystalline silicon, which has the following beneficial effects:

[0016] 1. Innovative overall design: The CNC integrated machine design combines grinding, chamfering and rounding functions, and is equipped with a transfer robotic arm to realize the automated transfer of silicon wafers between the storage mechanism and the processing mechanism, thereby improving the efficiency and quality of monocrystalline silicon processing.

[0017] 2. Innovative processing mechanism: The processing mechanism uses a limiting mechanism to adsorb the silicon wafer, ensuring the stability of the silicon wafer during processing. The adjusting slide column drives the grinding mechanism and chamfering grinding wheel to perform processing, which can achieve precise position adjustment. The grinding mechanism is composed of a grinding disc and a grinding plate, which can perform efficient grinding on the upper part of the silicon wafer.

[0018] 3. Innovation of chamfering grinding wheel: The inner wall of the cylindrical chamfering grinding wheel has multiple chamfering and rounding grooves with different inner diameters, which can chamfer and round the edges of silicon wafers at different angles. Through the adjustment connecting plate, clamping telescopic rod, telescopic sliding sleeve and other components, the chamfering and rounding grooves with different inner diameters can be adjusted to clamp the two ends of the silicon wafer to adapt to different processing needs.

[0019] 4. Hydraulic control innovation: The extension and retraction between the clamping telescopic rod and the telescopic sliding sleeve is controlled by a hydraulic control mechanism. The clamping position and tightness can be controlled according to the radius of the silicon wafer, adapting to the processing of silicon wafers of different radii and improving the processing range and processing quality. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the monocrystalline silicon grinding, chamfering, and rounding integrated machine of this utility model.

[0021] Figure 2 This is a schematic diagram of the connection structure of the processing mechanism of this utility model.

[0022] Figure 3 This is a schematic diagram of the adjustment chamber connection structure of this utility model.

[0023] Figure 4 This is a schematic diagram of the telescopic sliding sleeve connection structure of this utility model.

[0024] In the diagram: 1. Integrated processing machine; 2. Processing chamber; 3. Chamber door; 4. Storage mechanism; 5. Transfer robotic arm; 6. Processing mechanism; 7. Limiting mechanism; 8. Adjustment slide column; 9. Grinding mechanism; 10. Chamfering grinding wheel; 11. Adjustment chamber; 12. Adjustment motor; 13. Adjustment shaft; 14. Adjustment connecting plate; 15. Clamping telescopic rod; 16. Adjustment slide groove; 17. Telescopic slide sleeve; 18. Connecting shaft; 19. Chamfering rounding groove; 20. Hydraulic adjustment pipe. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] This utility model provides, for example Figures 1-4 The diagram illustrates a CNC grinding, chamfering, and rounding integrated machine based on monocrystalline silicon. It includes an integrated processing machine 1, with a processing chamber 2 located inside the upper left corner of the front end of the machine 1. A chamber door 3 is slidably connected to the upper front side of the machine 1, and the door 3 can slide to the front of the processing chamber 2 to provide cover. Storage mechanisms 4 are located on both the left and right sides of the lower inner wall of the processing chamber 2. A transfer robotic arm 5 is positioned between the two storage mechanisms 4, rotatably connected to the inside of the processing chamber 2, and capable of vertically extending and retracting within the lower inner wall of the processing chamber 2. A processing mechanism 6 is located behind the transfer robotic arm 5, situated on the rear side of the lower inner wall of the processing chamber 2. The upper front side is internally connected to a limiting mechanism 7, and the upper rear side of the processing mechanism 6 is internally slidably connected to an adjusting slide column 8. The front end of the adjusting slide column 8 is fixedly connected to a grinding mechanism 9 through a connecting frame. The grinding mechanism 9 is provided with chamfering grinding wheels 10 on both the left and right sides. The grinding mechanism 9 is fixedly connected to the lower front side of the connecting frame and is located directly above the limiting mechanism 7. The grinding mechanism 9 consists of a grinding disc in the middle and multiple grinding plates around it. During the processing of monocrystalline silicon, the integrated processing machine 1 can grind, chamfer, and round the cut silicon wafers to ensure that the thickness of the monocrystalline silicon rod is more uniform after it is subsequently cut into silicon wafers, which is beneficial to improving the quality and production efficiency of silicon wafers.

[0027] Preferably, the cut silicon wafers are placed inside the processing chamber 2 and then placed inside the storage mechanism 4 on one side. The unprocessed silicon wafers are guided to the upper end of the processing mechanism 6 by the transfer robotic arm 5. The processing mechanism 6 firmly holds the silicon wafers by the limiting mechanism 7. At the same time, the adjusting slide column 8 drives the grinding mechanism 9 to slide downwards and make the lower end of the grinding mechanism 9 fit against the silicon wafer. The chamfering grinding wheels 10 on both sides move towards the middle and clamp the two ends of the silicon wafer. At this time, the limiting mechanism 7 drives the silicon wafer to rotate and grinds the upper end of the silicon wafer by the grinding mechanism 9. The chamfering grinding wheels 10 at both ends chamfer and round the edges of the silicon wafer, thereby processing the silicon wafer. After processing, the transfer robotic arm 5 guides the silicon wafers from the upper end of the processing mechanism 6 into the storage mechanism 4 on the other side for storage, thereby completing the processing of monocrystalline silicon.

[0028] Preferably, an adjustment chamber 11 is fixedly connected to the front side of the upper end of the connecting frame, and the adjustment chamber 11 is located directly above the grinding mechanism 9. An adjustment motor 12 is set at the center of the upper end of the adjustment chamber 11, and an adjustment shaft 13 is rotatably connected to the center of the lower end of the adjustment motor 12. The lower end of the adjustment shaft 13 is rotatably connected inside the adjustment chamber 11. An adjustment connecting plate 14 is threadedly connected to the outside of the adjustment shaft 13, and the adjustment connecting plate 14 is slidably connected inside the adjustment chamber 11. Square clamping telescopic rods 15 are fixedly connected to both ends of the adjustment connecting plate 14. The interior of both ends of the adjustment chamber 11 is open. The device includes an adjustment groove 16, with two clamping telescopic rods 15 passing through the two adjustment grooves 16 and extending to the left and right ends of the adjustment chamber 11. The clamping telescopic rods 15 are slidably connected inside the adjustment grooves 16 and fit against the inner walls of the front and rear ends of the adjustment grooves 16. A telescopic sleeve 17 is fitted onto the outer side of the end of the clamping telescopic rod 15 away from the adjustment chamber 11. A square telescopic groove is formed inside the telescopic sleeve 17 at the end closest to the adjustment chamber 11, and the clamping telescopic rod 15 is slidably connected inside the telescopic groove. A connecting shaft 18 is fixedly connected to the lower end of the telescopic sleeve 17 away from the adjustment chamber 11. The chamfering grinding wheel 10 is sleeved on the outside of the connecting shaft 18 and rotatably connected to the connecting shaft 18. Multiple chamfering and rounding grooves 19 with different inner diameters are formed inside the cylindrical outer wall of the chamfering grinding wheel 10. A hydraulic adjusting pipe 20 is connected to the upper end of the telescopic sleeve 17 on the side away from the adjusting chamber 11, and the hydraulic adjusting pipe 20 is connected to the telescopic groove inside the telescopic sleeve 17. During the process of the chamfering grinding wheels 10 on both sides clamping towards the middle, because the chamfering grinding wheel 10 has multiple chamfering and rounding grooves 19 with different inner diameters inside its cylindrical shell, the chamfering grinding wheel 10 can pass through chamfers with different inner diameters. The rounding groove 19 chamfers and rounds the edges of the silicon wafer at different angles. Two chamfering grinding wheels 10 are connected to the lower ends of two telescopic sliding sleeves 17 via connecting shafts 18 and connected to both sides of the adjusting connecting plate 14 via clamping telescopic rods 15. The adjusting connecting plate 14 can slide up and down inside the adjusting chamber 11 by rotating the adjusting shaft 13, so that the chamfering grinding wheels 10 can adjust the chamfering rounding grooves 19 with different inner diameters clamped at both ends of the silicon wafer by sliding the adjusting connecting plate 14 up and down, thereby realizing chamfering and rounding of the silicon wafer at different angles and achieving processing of different specifications.

[0029] Preferably, since the telescopic groove inside the telescopic sleeve 17 is connected to the hydraulic regulating pipe 20, and hydraulic oil is provided inside the telescopic groove, and the other end of the hydraulic regulating pipe 20 is connected to the hydraulic control mechanism, the extension and retraction between the clamping telescopic rod 15 and the telescopic sleeve 17 can be controlled by the hydraulic control mechanism. The hydraulic control mechanism can control the extension and retraction of the clamping telescopic rod 15 and the telescopic sleeve 17 according to the radius of the silicon wafer, thereby controlling the clamping position and tightness of the chamfering grinding wheels 10 on both sides, so that the chamfering grinding wheels 10 can chamfer and round silicon wafers of different radii, improving the processing range and processing quality.

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A CNC grinding, chamfering, and rounding integrated machine based on monocrystalline silicon, characterized in that, The machine includes an integrated processing machine (1), which has a processing compartment (2) inside the upper left corner of its front end. A compartment door (3) is slidably connected to the upper front end of the integrated processing machine (1), and the compartment door (3) can slide to the front end of the processing compartment (2) to block it. Storage mechanisms (4) are provided on both the left and right sides of the lower inner wall of the processing compartment (2). A transfer robotic arm (5) is provided between the two storage mechanisms (4), and the transfer robotic arm (5) is rotatably connected to the inside of the processing compartment (2) and can be used in the processing compartment (2). The lower inner wall extends vertically. The transfer robotic arm (5) is equipped with a processing mechanism (6) on its rear side. The processing mechanism (6) is located on the rear side of the lower inner wall of the processing chamber (2). The upper front side of the processing mechanism (6) is rotatably connected to a limit mechanism (7). The upper rear side of the processing mechanism (6) is slidably connected to an adjustment slide column (8). The front end of the adjustment slide column (8) is fixedly connected to a grinding mechanism (9) through a connecting frame. The grinding mechanism (9) is equipped with chamfering grinding wheels (10) on both the left and right sides.

2. The CNC grinding, chamfering, and rounding integrated machine based on monocrystalline silicon according to claim 1, characterized in that: The grinding mechanism (9) is fixedly connected to the front side of the lower end of the connecting frame and is located directly above the limiting mechanism (7). The grinding mechanism (9) consists of a grinding disc in the middle and multiple grinding plates around it.

3. The integrated CNC grinding, chamfering, and rounding machine based on monocrystalline silicon according to claim 2, characterized in that: The upper front side of the connecting frame is fixedly connected to the adjustment chamber (11), and the adjustment chamber (11) is located directly above the grinding mechanism (9). The adjustment motor (12) is provided at the center of the upper end of the adjustment chamber (11), and the adjustment shaft (13) is rotatably connected at the center of the lower end of the adjustment motor (12).

4. The CNC grinding, chamfering, and rounding integrated machine based on monocrystalline silicon according to claim 3, characterized in that: The lower end of the adjustment shaft (13) is rotatably connected to the inside of the adjustment chamber (11), and the adjustment shaft (13) is threadedly connected to the outside of the adjustment connecting plate (14), and the adjustment connecting plate (14) is slidably connected to the inside of the adjustment chamber (11).

5. A CNC grinding, chamfering, and rounding integrated machine based on monocrystalline silicon according to claim 4, characterized in that: The adjustment connecting plate (14) is fixedly connected to square clamping telescopic rods (15) at both ends. The adjustment chamber (11) is provided with adjustment grooves (16) at both ends. The two clamping telescopic rods (15) pass through the two adjustment grooves (16) to the outside of the left and right ends of the adjustment chamber (11).

6. A CNC grinding, chamfering, and rounding integrated machine based on monocrystalline silicon according to claim 5, characterized in that: The clamping telescopic rod (15) is slidably connected inside the adjustment groove (16) and fits against the inner walls of the front and rear ends of the adjustment groove (16). A telescopic sleeve (17) is sleeved on the outside of the end of the clamping telescopic rod (15) away from the adjustment chamber (11). A square telescopic groove is opened inside the end of the telescopic sleeve (17) close to the adjustment chamber (11).

7. A CNC grinding, chamfering, and rounding integrated machine based on monocrystalline silicon according to claim 6, characterized in that: The clamping telescopic rod (15) is slidably connected inside the telescopic slide groove. The lower end of the telescopic slide sleeve (17) is fixedly connected to the connecting shaft (18) on the side away from the adjustment chamber (11). The chamfering grinding wheel (10) is sleeved on the outside of the connecting shaft (18) and rotatably connected to the connecting shaft (18).

8. A CNC grinding, chamfering, and rounding integrated machine based on monocrystalline silicon according to claim 7, characterized in that: The chamfering grinding wheel (10) has multiple chamfering and rolling grooves (19) with different inner diameters inside its cylindrical outer wall. The upper end of the telescopic sleeve (17) is connected to a hydraulic adjustment pipe (20) on the side away from the adjustment chamber (11), and the hydraulic adjustment pipe (20) is connected to the telescopic groove inside the telescopic sleeve (17).

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