Embossing structure for thin film processing
By introducing a cleaning and collection mechanism into the embossing structure, the problem of uneven pressure caused by impurities adhering during the film embossing process is solved, achieving efficient cleaning and efficient production, and improving the quality and production efficiency of film products.
Patent Information
- Application Number
- CN202423229850.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-26
AI Technical Summary
During the film embossing process, impurities on the film surface or dust and particles in the air can easily adhere to the surface of the embossing roller, resulting in uneven pressure distribution, film deformation, and affecting product quality.
An embossing structure including a cleaning mechanism and a collection mechanism was designed. The cleaning mechanism drives the cleaning components through a slide rod, a threaded rod, and an electric telescopic rod, and cleans the impurities on the surface of the embossing roller in combination with an adsorption chamber and a brush head. The collection mechanism efficiently collects the attached materials through a centrifugal fan and a collection pipe, avoiding uneven pressure caused by incomplete cleaning.
It improves cleaning effectiveness and the cleanliness of the production environment, ensures product quality and stability, reduces production downtime, and increases production efficiency.
Smart Images

Figure CN223644272U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of thin film processing technology, and in particular to an embossing structure for thin film processing. Background Technology
[0002] Embossing is an important part of film processing. Embossing can create various beautiful patterns and designs on the surface of the film, thereby improving the film's decorative properties and added value. The realization of embossing depends on specialized embossing structures, which typically consist of embossing rollers, heaters, cooling devices, etc.
[0003] However, in traditional embossing structures used for film processing, impurities on the film surface or dust and particles in the air may adhere to the surface of the embossing roller during the embossing process, which can easily lead to uneven pressure distribution on the material surface, causing the film to deform during the embossing process and affecting product quality.
[0004] For example, these deposits may alter the pattern or texture on the surface of the embossing roller, causing deviations in the embossing pattern on the film, making the embossing effect unclear or irregular. Sharp particles or hard objects in the deposits may scratch or damage the film surface, which may affect the appearance and performance of the film. Utility Model Content
[0005] This utility model discloses an embossing structure for film processing, aiming to solve the technical problem that during the embossing process, impurities on the film surface or dust and particles in the air may adhere to the surface of the embossing roller, which can easily lead to uneven pressure distribution on the material surface, deformation of the film during the embossing process, and affect product quality.
[0006] To achieve the above objectives, the present invention adopts the following technical solution:
[0007] An embossing structure for thin film processing includes a frame and an embossing assembly, and further includes:
[0008] Cleaning mechanism: The cleaning mechanism is installed on the inner wall of the opposite side of the frame. Two sliding rods and two threaded rods are installed on the inner wall of the opposite side of the frame. Two sliders are installed on the outer wall of each sliding rod and the threaded rod. Two electric telescopic rods are installed on the bottom outer wall of each slider. The movable end of each electric telescopic rod is equipped with a cleaning component.
[0009] Collection mechanism: The collection mechanism is located on the bottom and top inner walls of the frame.
[0010] In this case, the cleaning mechanism is located on the inner wall of the opposite side of the frame. Through the cooperation of the slide bar and the threaded rod, the cleaning component can move and adjust its position flexibly in the horizontal direction. This design ensures that the cleaning component can cover every corner of the embossing roller, improving the comprehensiveness and flexibility of the cleaning. The electric telescopic rod at the bottom of the slide bar can drive the cleaning component to adjust its position, thereby ensuring that the cleaning component is always in contact with the surface of the embossing roller. This precise contact not only improves the cleaning effect, but also avoids uneven pressure distribution on the film substrate surface due to incomplete cleaning, resulting in unclear patterns. Through precise contact and comprehensive cleaning, the cleaning mechanism can ensure the cleanliness of the production environment and improve the quality and stability of the product.
[0011] In a preferred embodiment, the cleaning assembly includes a cleaning plate, the cleaning plate having an adsorption chamber inside, the bottom inner wall of the adsorption chamber having a plurality of adsorption ports arranged at equal intervals, and the bottom outer wall of the cleaning plate having a plurality of brush heads arranged at equal intervals.
[0012] The cleaning plate, as the main part of the cleaning assembly, is responsible for bearing and supporting other cleaning elements. The setting of the suction chamber and suction port enables the cleaning assembly to quickly and effectively remove impurities and dust from the embossing roller through suction, avoiding the tedious steps of manual wiping or blowing required in traditional cleaning methods. The physical cleaning action of the brush head can further clean the attached substances and improve the cleaning efficiency.
[0013] In a preferred embodiment, the collection mechanism includes two collection pipes disposed on the top outer wall of the cleaning plate. One end of each collection pipe is provided with a collection box. Two filters and two centrifugal fans are disposed on one outer wall of the collection box. An inner box is disposed on the inner wall of the collection box, and an assembly assembly is disposed on the top outer wall of the inner box.
[0014] During cleaning, the high-speed rotation of the centrifugal fan blades creates negative air pressure in the collection box, and the attached materials are collected by the collection pipe and transported to the inner box. When the waste accumulates to a certain level, only the inner box needs to be replaced or cleaned. The modular design makes the cleaning and maintenance of the collection mechanism simpler and more convenient. This efficient design for collecting and processing attached materials reduces downtime and maintenance time in the production process and improves production efficiency.
[0015] As described above, an embossing structure for film processing includes a frame and an embossing assembly, and further includes: a cleaning mechanism: the cleaning mechanism is disposed on the inner wall of opposite sides of the frame, and two sliding rods and two threaded rods are disposed on the inner wall of opposite sides of the frame. Two sliders are disposed on the outer walls of both the sliding rods and the threaded rods, and two electrically operated telescopic rods are disposed on the bottom outer walls of the sliders. The movable ends of the electrically operated telescopic rods are provided with the cleaning assembly; a collection mechanism: the collection mechanism is disposed on the bottom and top inner walls of the frame. The embossing structure for film processing provided by this utility model has the technical effect of improving product quality and stability. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the overall structure of an embossing structure for thin film processing proposed in this utility model.
[0017] Figure 2 This is a schematic diagram of a collection mechanism for an embossed structure used in film processing, as proposed in this utility model.
[0018] Figure 3 This is a cross-sectional schematic diagram of an embossing structure for thin film processing proposed in this utility model.
[0019] Figure 4 This is a schematic diagram of a cleaning mechanism for an embossed structure used in film processing, as proposed in this utility model.
[0020] Figure 5 This is a schematic diagram of the collection mechanism for an embossed structure used in film processing, as proposed in this utility model.
[0021] In the attached diagram: 1. Frame; 2. Film substrate; 3. Feeding roller; 4. Embossing roller; 5. Cooling roller; 6. Threaded rod; 7. Slide rod; 8. Collection pipe; 9. Collection box; 10. Centrifugal fan; 11. Receiving roller; 12. Heating roller; 13. Sliding block; 14. Cleaning plate; 15. Guide roller; 16. Inner box; 17. Electric telescopic rod; 18. Brush head; 19. Adsorption port; 21. Filter screen; 22. Mounting bracket; 23. Cover; 24. Fixing hole; 25. Fixing block. Detailed Implementation
[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and marked in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0023] The embossing structure disclosed in this utility model is mainly used in scenarios where impurities on the film surface or dust and particles in the air may adhere to the surface of the embossing roller during the embossing process, which can easily lead to uneven pressure distribution on the material surface, deformation of the film during the embossing process, and affect product quality.
[0024] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 An embossing structure for film processing includes a frame 1 and an embossing assembly, and further includes: a cleaning mechanism: the cleaning mechanism is disposed on the inner wall of opposite sides of the frame 1, and two slide rods 7 and two threaded rods 6 are disposed on the inner wall of opposite sides of the frame 1, and two sliders 13 are disposed on the outer wall of both the slide rods 7 and the threaded rods 6, and two electric telescopic rods 17 are disposed on the bottom outer wall of the sliders 13, and the movable end of the electric telescopic rods 17 is disposed with a cleaning assembly; a collection mechanism: the collection mechanism is disposed on the bottom and top inner walls of the frame 1.
[0025] The embossing assembly includes a feeding roller 3, a heating roller 12, two guide rollers 15, two embossing rollers 4, a cooling roller 5, a receiving roller 11, and a film substrate 2. The embossing assembly is set on the inner wall of the opposite side of the frame 1.
[0026] In a specific embodiment, the cleaning mechanism is set on the inner wall of the opposite side of the frame 1. Through the cooperation of the slide rod 7 and the threaded rod 6, the cleaning component can move and adjust its position flexibly in the horizontal direction. This design ensures that the cleaning component can cover all corners of the embossing roller 4, improving the comprehensiveness and flexibility of the cleaning. The electric telescopic rod 17 set at the bottom of the slider 13 can drive the cleaning component to adjust its position, thereby ensuring that the cleaning component is always in contact with the surface of the embossing roller 4. This precise contact not only improves the cleaning effect, but also avoids uneven pressure on the surface of the film substrate 2 due to inadequate cleaning, resulting in unclear local patterns. Through precise contact and comprehensive cleaning, the cleaning mechanism can ensure the cleanliness of the production environment and improve the quality and stability of the product.
[0027] Reference Figure 1 , Figure 3 and Figure 4 In a preferred embodiment, the cleaning assembly includes a cleaning plate 14, the cleaning plate 14 having an adsorption chamber inside, a plurality of adsorption ports 19 arranged at equal intervals on the bottom inner wall of the adsorption chamber, and a plurality of brush heads 18 arranged at equal intervals on the bottom outer wall of the cleaning plate 14.
[0028] The cleaning plate 14, as the main part of the cleaning assembly, is responsible for bearing and supporting other cleaning elements. The setting of the suction chamber and suction port 19 enables the cleaning assembly to quickly and effectively remove impurities and dust from the embossing roller 4 through suction, avoiding the tedious steps of manual wiping or blowing in the traditional cleaning method. The physical cleaning effect of the brush head 18 can further clean the attached substances and improve the cleaning efficiency.
[0029] Reference Figure 3 and Figure 4 In a preferred embodiment, the cleaning plate 14 has an arc-shaped structure, and the brush head 18 is made of silicone. The arc-shaped structure of the cleaning plate 14 fits the curved surface of the embossing roller 4 better, which can more effectively clean impurities on the embossing roller 4, avoid cleaning blind spots, and improve cleaning efficiency. The lengths of these brush heads 18 are different, which can better fit the uneven surface of the embossing roller 4. In addition, the silicone brush head 18 is relatively soft and wear-resistant, and can maintain good elasticity and durability during the cleaning process, and is not likely to cause scratches or damage to the pattern of the embossing roller 4.
[0030] Reference Figure 2 , Figure 3 and Figure 5 In a preferred embodiment, the collection mechanism includes two collection pipes 8, which are disposed on the top outer wall of the cleaning plate 14. A collection box 9 is disposed at one end of the collection pipe 8. Two filters 21 and two centrifugal fans 10 are disposed on one outer wall of the collection box 9. An inner box 16 is disposed on the inner wall of the collection box 9, and an assembly assembly is disposed on the top outer wall of the inner box 16.
[0031] During cleaning, the high-speed rotation of the blades of the centrifugal fan 10 generates negative air pressure in the collection box 9, and the attached material is collected by the collection pipe 8 and transported to the inner box 16. When the waste accumulates to a certain level, the inner box 16 only needs to be replaced or cleaned. The modular design makes the cleaning and maintenance of the collection mechanism simpler and more convenient. This efficient design for collecting and processing attached materials reduces the interruption time and downtime maintenance time in the production process and improves production efficiency.
[0032] Reference Figure 1 and Figure 5In a preferred embodiment, the assembly includes a cover 23, a mounting bracket 22 is provided on the bottom outer wall of the cover 23, a fixing hole 24 is provided on the top outer wall of the cover 23, buckles are hinged on both outer walls of the collection box 9, and a fixing block 25 is hinged on the top outer wall of the inner box 16. The fixing block 25 is used in conjunction with the fixing hole 24.
[0033] When it is necessary to clean up the collected residue, open the latch and pull out the inner box 16 with the cover 23 to prevent the collected residue from spilling out. Then, simply rotate the fixing block 25 to open the cover 23 for cleaning. This design reduces the difficulty and complexity of operation and improves the user experience.
[0034] Reference Figure 5 In a preferred embodiment, the inner box 16 has assembly holes and a number of equally spaced micro-holes on its two outer walls. The assembly holes and equally spaced micro-holes on the two outer walls of the inner box 16 enable the centrifugal fan 10 to function more effectively. The position of the micro-holes corresponds to the position of the filter screen 21, ensuring that the airflow can pass smoothly. The diameter of the micro-holes is small, which can block the adhering particles from entering the fan. If small adhering particles are encountered, filter cotton can be installed to prevent damage to the fan or performance degradation.
[0035] Working principle: During use, the operator opens the cleaning mechanism before the film substrate 2 is embossed by the embossing component. The horizontal position of the cleaning component is adjusted by the cooperation of the slide rod 7 and the threaded rod 6. Then, the cleaning plate 14 is sent to a position close to the embossing roller 4 by the electric telescopic rod 17, ensuring that the brush head 18 can fit against the surface of the embossing roller 4. The high-speed rotation of the blades of the centrifugal fan 10 generates negative air pressure in the collection box 9. The attached material adsorbed from the adsorption port 19 is transported to the inner box 16 by the collection pipe 8. When the waste accumulates to a certain extent, the inner box 16 only needs to be replaced or cleaned.
[0036] The above description is merely a preferred embodiment of this utility model, but the protection scope of this utility model is not limited thereto. The substitutions may be replacements of some structures, devices, or method steps, or they may be complete technical solutions. Equivalent substitutions or modifications made based on the technical solution and inventive concept of this utility model should all be covered within the protection scope of this utility model.
Claims
1. An embossing structure for thin film processing, comprising a frame (1) and an embossing assembly, characterized in that, Also includes: Cleaning mechanism: The cleaning mechanism is set on the inner wall of the opposite side of the frame (1). Two slide rods (7) and two threaded rods (6) are set on the inner wall of the opposite side of the frame (1). Two sliders (13) are set on the outer wall of the slide rods (7) and the threaded rods (6). Two electric telescopic rods (17) are set on the bottom outer wall of the sliders (13). The movable end of the electric telescopic rods (17) is provided with a cleaning component. Collection mechanism: The collection mechanism is located on the bottom and top inner walls of the frame (1).
2. The embossed structure for thin film processing according to claim 1, characterized in that, The cleaning assembly includes a cleaning plate (14), which has an adsorption chamber inside. The bottom inner wall of the adsorption chamber has several adsorption ports (19) arranged at equal distances. The bottom outer wall of the cleaning plate (14) has several brush heads (18) arranged at equal distances.
3. The embossing structure for thin film processing according to claim 2, characterized in that, The cleaning plate (14) has an arc-shaped structure, and the brush head (18) is made of silicone material.
4. An embossing structure for thin film processing according to claim 3, characterized in that, The collection mechanism includes two collection pipes (8), which are disposed on the top outer wall of the cleaning plate (14). A collection box (9) is disposed at one end of the collection pipe (8). Two filters (21) and two centrifugal fans (10) are disposed on one side outer wall of the collection box (9). An inner box (16) is disposed on the inner wall of the collection box (9). An assembly assembly is disposed on the top outer wall of the inner box (16).
5. An embossed structure for thin film processing according to claim 4, characterized in that, The assembly includes a cover (23), a mounting bracket (22) is provided on the bottom outer wall of the cover (23), a fixing hole (24) is provided on the top outer wall of the cover (23), buckles are hinged on both sides of the outer wall of the collection box (9), and a fixing block (25) is hinged on the top outer wall of the inner box (16). The fixing block (25) is used in conjunction with the fixing hole (24).
6. An embossing structure for thin film processing according to claim 5, characterized in that, The inner box (16) has assembly holes and several equally spaced microholes on its two outer walls.
7. An embossed structure for thin film processing according to claim 1, characterized in that, The embossing assembly includes a feeding roller (3), a heating roller (12), two guide rollers (15), two embossing rollers (4), a cooling roller (5), a receiving roller (11), and a film substrate (2). The embossing assembly is disposed on the inner wall of the opposite side of the frame (1).