Chip overturning tool

Abstract

The utility model discloses a chip overturning tool, and relates to the technical field of flip interconnection, the chip overturning tool comprises an overturning structure, the overturning structure is provided with a chip groove, the chip groove is used for accommodating a chip, the overturning structure is used for cooperating with a chip feeding disc, and the chip is inverted on the chip feeding disc through overturning. According to the chip overturning tool, by designing the overturning structure with the chip groove, accurate positioning and protection of the chip in the overturning process are achieved, introduction of foreign matter is effectively avoided, and the safety and reliability of chip overturning are improved.

Description

Technical Field

[0001] This application relates to the field of flip-chip interconnect technology, and in particular to a chip flipping fixture. Background Technology

[0002] Flip-chip interconnect technology mainly involves bonding infrared detector chips and readout circuit chips together using indium pillars to achieve efficient transmission and processing of optical signals.

[0003] In existing flip-chip interconnect technologies, detector chips are often handled using soft materials such as lint-free cloths during the flipping process. While this method is simple, it is highly susceptible to introducing foreign matter. This foreign matter may originate from the handling material itself or the surrounding environment. Once it adheres to the chip, it can lead to a decrease in the quality of the interconnected product or even cause product failure. Utility Model Content

[0004] The purpose of this application is to provide a chip flipping fixture. By designing a flipping structure with chip grooves, the fixture achieves precise positioning and protection of the chip during the flipping process, effectively avoiding the introduction of foreign objects and improving the safety and reliability of chip flipping.

[0005] To achieve the above objectives, this application provides a chip flipping fixture, including a flipping structure. The flipping structure is provided with a chip groove for accommodating a chip. The flipping structure is used to cooperate with a chip loading tray to flip the chip upside down onto the chip loading tray.

[0006] In some embodiments, the flipping structure includes:

[0007] The first flipping mechanism is provided with the chip groove;

[0008] A mating structure is connected to the first flipping mechanism, and the mating structure is used to mate with the chip loading tray.

[0009] In some embodiments, the first flipping mechanism includes:

[0010] The first flip component has a chip hole;

[0011] A second flipper is connected to the first flipper, and the second flipper blocks one side of the chip hole to form the chip recess.

[0012] In some embodiments, the first flipper and the second flipper are flat plate structures, and the first flipper and the second flipper are stacked together.

[0013] In some embodiments, the mating structure is located at the edge of the first flipping mechanism, the mating structure protrudes from the surface of the first flipping mechanism in the opening direction of the chip groove, and the mating structure has a mating end face that mates with the chip loading tray.

[0014] In some embodiments, the mating structure has a retaining wall connected to the mating end face, and the connection between the retaining wall and the mating end face forms a mating step, which is used to mate with the chip loading tray.

[0015] In some embodiments, the flipping structure further includes:

[0016] A buffer structure is provided on the mating end face. The buffer structure is used to compress and deform under the action of the chip loading tray. The deformation of the buffer structure is used to fix the chip between the first flipping mechanism and the chip loading tray.

[0017] In some embodiments, the chip recess is provided with an inclined guide surface, which forms an flared shape to accommodate chips of different sizes.

[0018] In some embodiments, the material of the flipping structure is polytetrafluoroethylene.

[0019] In some embodiments, the number of chip recesses is multiple, and the multiple chip recesses are distributed at intervals.

[0020] Compared with the above background technology, the chip flipping fixture provided in this application mainly includes a flipping structure. The flipping structure is provided with a chip groove for accommodating the chip. The flipping structure is used to cooperate with the chip loading tray to flip the chip onto the chip loading tray.

[0021] The drawback of existing technologies is that, in flip-chip interconnect technology, detector chips are often handled using soft materials such as lint-free cloths during the flipping process. This method easily introduces foreign objects, leading to a decrease in the quality of the interconnected product and even causing product failure. To address this issue, this technical solution provides a chip flipping fixture, the core design of which is the integration of chip recesses into the flipping structure. This design directly addresses the problem of foreign object introduction in existing technologies.

[0022] The chip recesses in the flip structure are specifically designed to accommodate the chip, meaning the chip remains within a predetermined, controlled space throughout the flipping process. This design ensures the chip does not come into direct contact with the external environment during flipping, effectively reducing the risk of foreign matter adhering to the chip. Because the size and shape of the chip recesses match the chip, the chip can be precisely positioned during flipping, reducing the possibility of damage or contamination due to improper positioning.

[0023] The combination of the flip structure and the chip loading tray makes the chip flipping process more stable and controllable. Thanks to the flip structure design, chips can be directly placed upside down on the chip loading tray without the need for additional tools, such as lint-free cloths, thus avoiding potential contamination. The precise fit between the flip structure and the chip loading tray also ensures the stability of the chips during flipping and placement, reducing chip damage caused by improper operation.

[0024] Based on the above structural and process descriptions, it can be seen that the chip flipping fixture has at least the following beneficial effects: by designing a flipping structure with chip grooves, the chip flipping fixture achieves precise positioning and protection of the chip during the flipping process, effectively avoids the introduction of foreign objects, and improves the safety and reliability of chip flipping. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0026] Figure 1 A schematic diagram of the chip flipping fixture provided in an embodiment of this application;

[0027] Figure 2 A schematic diagram of the first flipper and mating structure provided in the embodiments of this application;

[0028] Figure 3 This is a diagram illustrating the use of the chip flipping fixture provided in an embodiment of this application.

[0029] in:

[0030] Flip structure 1, chip recess 101, inclined guide surface 1011

[0031] First flipping mechanism 11, first flipping component 111, chip hole 1111, second flipping component 112

[0032] Fitting structure 12, fitting end face 121, enclosure wall surface 122, fitting step 123.

[0033] Buffer structure 13

[0034] Chip 2

[0035] Chip loading tray 3. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0038] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a chip flipping fixture provided in an embodiment of this application.

[0039] In a first specific embodiment, the chip flipping fixture provided in this application mainly includes a flipping structure 1. The flipping structure 1 is provided with a chip groove 101, which is used to accommodate a chip 2. The flipping structure 1 is used to cooperate with a chip loading tray 3 to flip the chip 2 onto the chip loading tray 3.

[0040] In this embodiment, the chip flipping fixture is used in the chip preprocessing flipping process before the chip flip interconnect process. The chip flipping fixture is used to transfer the chip 2 to the chip loading tray 3 so that the subsequent chip flip interconnect process can be carried out.

[0041] In some cases, for the process of transferring chip 2 to chip loading tray 3 using a chip flipping fixture, firstly, the flipping structure 1 is placed stably with the chip recess 101 of the flipping structure 1 exposed upwards; then, chip 2 is placed into the chip recess 101, and the position and orientation of chip 2 are maintained by the chip recess 101, with the front of chip 2 facing upwards; next, the chip loading tray 3 is inverted and placed on the flipping structure 1, so that the chip loading tray 3 and the flipping structure 1 cooperate, and the position and orientation of chip 2 remain stable, with the front of chip 2 facing the chip loading tray 3; finally, the stable flipping structure 1 and chip loading tray 3 are flipped, so that chip 2 falls onto the chip loading tray 3, and chip 2 is in an inverted state, with the front of chip 2 facing downwards. Since the front of chip 2 does not come into contact with other materials, but is directly transferred to the chip loading tray 3, it can effectively avoid the introduction of foreign objects in this step, avoid chip 2 failure due to foreign objects, and reduce the scrap rate of chip 2.

[0042] The drawback of existing technologies is that, in flip-chip interconnect technology, the detector chip 2 is often handled using soft materials such as lint-free cloths during the flipping process. This method easily introduces foreign objects, leading to a decrease in the quality of the interconnected product, or even causing product failure. To address this issue, this technical solution provides a chip flipping fixture, the core design of which is that a chip recess 101 is integrated into the flipping structure 1. This design directly addresses the problem of foreign object introduction in existing technologies.

[0043] The chip recess 101 in the flip structure 1 is specifically designed to accommodate the chip 2, meaning that the chip 2 remains within a predetermined, controlled space throughout the flipping process. This design ensures that the chip 2 does not come into direct contact with the external environment during the flipping process, effectively reducing the risk of foreign matter adhering to the chip 2. Because the size and shape of the chip recess 101 match the chip 2, the chip 2 can be precisely positioned during the flipping process, reducing the possibility of damage or contamination due to improper positioning.

[0044] The combined use of the flipping structure 1 and the chip loading tray 3 makes the chip 2 flipping process more stable and controllable. Through the design of the flipping structure 1, the chip 2 can be directly placed upside down on the chip loading tray 3. This process does not require additional tools, such as lint-free cloths, thus avoiding potential contamination from these tools. The precise fit between the flipping structure 1 and the chip loading tray 3 also ensures the stability of the chip 2 during flipping and placement, reducing damage to the chip 2 caused by improper operation.

[0045] Based on the above structural and process descriptions, it can be seen that the chip flipping fixture has at least the following beneficial effects: by designing a flipping structure 1 with a chip groove 101, the chip flipping fixture achieves precise positioning and protection of the chip 2 during the flipping process, effectively avoids the introduction of foreign objects, and improves the safety and reliability of the chip 2 flipping.

[0046] Please continue to refer to this. Figure 1 In some embodiments, the flipping structure 1 includes:

[0047] The first flipping mechanism 11 is provided with a chip groove 101;

[0048] The mating structure 12 is connected to the first flipping mechanism 11 and is used to mate with the chip loading tray 3.

[0049] In this embodiment, the design of the flip structure 1 includes two key parts: a first flip mechanism 11 and a mating structure 12. The first flip mechanism 11 is provided with a chip recess 101, which is specifically designed to accommodate the chip 2, ensuring that the chip can be kept in a predetermined and controlled space during the flipping process, thereby reducing the risk of introducing foreign objects due to external contact.

[0050] The main function of the mating structure 12 is to cooperate with the chip loading tray 3 to maintain the stability of the flipping structure 1 and the chip loading tray 3 during assembly. This design improves the stability of both during the flipping process, ensuring that the chip 2 can be flipped smoothly. Through precise cooperation with the chip loading tray 3, the mating structure 12 not only enhances the stability of the flipping structure 1, but also ensures the stability of the chip 2's position during flipping and placement, reducing the possibility of chip damage due to improper operation.

[0051] Please refer to Figure 2 , Figure 2 This is a schematic diagram of the first flipper and mating structure provided in the embodiments of this application.

[0052] In some embodiments, the first flipping mechanism 11 includes:

[0053] The first flipping component 111 is provided with a chip hole 1111;

[0054] The second flipper 112 is connected to the first flipper 111. The second flipper 112 blocks one side of the chip hole 1111 to form a chip recess 101.

[0055] In this embodiment, the design details of the first flipping mechanism 11 further clarify the formation method of the chip recess 101. The first flipping mechanism 11 consists of two main parts: a first flipping member 111 and a second flipping member 112. The first flipping member 111 has a chip hole 1111, which is the opening for positioning the chip 2. The second flipping member 112 is connected to the first flipping member 111 and blocks one side of the chip hole 1111, forming the chip recess 101 together with the first flipping member 111.

[0056] This design gives the chip recess 101 a specific shape and size to fit and hold the chip 2. When the chip 2 is placed in the chip recess 101, its bottom is supported by the second flipping member 112, while its sides are limited by the chip hole 1111. This structure not only ensures the stability of the chip 2 during the flipping process, but also provides precise positioning to prevent the chip from shifting or rotating during flipping.

[0057] This design provides comprehensive support and protection for chip 2 during the flipping process, reducing the risk of damage caused by improper flipping or external interference. Simultaneously, due to the enclosed design of the chip recess 101, chip 2 does not directly contact the outside environment during flipping, effectively preventing the introduction of foreign objects and improving the cleanliness of the flipping process and the reliability of the chip.

[0058] In some embodiments, the first flipper 111 and the second flipper 112 are flat plate structures, and the first flipper 111 and the second flipper 112 are stacked.

[0059] In this embodiment, this design simplifies the structure of the entire first flipping mechanism 11, making the manufacturing and assembly process simpler and more economical. The flat plate structure design also facilitates precise control of the size and shape of the chip recess 101 to ensure a perfect match with the chip 2.

[0060] Since the first flipper 111 and the second flipper 112 are stacked, they together define the space of the chip recess 101. The first flipper 111 provides the chip hole 1111, while the second flipper 112 blocks one side of the chip hole 1111, forming a recess for placing and fixing the chip 2. This stacked flat structure is not only simple in structure but also easy to implement because it reduces the need for complex curved surfaces or multi-part splicing, thus reducing manufacturing difficulty and cost.

[0061] Furthermore, the flat panel design helps improve the stability and durability of the flip structure 1. During the flipping operation, the flat panel structure provides uniform support, reducing the risk of chip damage due to structural deformation. At the same time, this structure is also easy to clean and maintain, as dust and contaminants do not easily accumulate on the flat panel surface, helping to maintain cleanliness during the flipping process.

[0062] In some embodiments, the mating structure 12 is located at the edge of the first flipping mechanism 11, and the mating structure 12 protrudes from the surface of the first flipping mechanism 11 in the opening direction of the chip groove 101. The mating structure 12 is provided with a mating end face 121 that mates with the chip loading tray 3.

[0063] In this embodiment, the mating structure 12 is designed to be located at the edge of the first flipping mechanism 11, and it protrudes from the surface of the first flipping mechanism 11 in the opening direction of the chip recess 101. This design makes the mating structure 12 resemble a ring plate, increasing the mating area between the flipping structure 1 and the chip loading tray 3, and improving the stability when the flipping structure 1 and the chip loading tray 3 are combined.

[0064] The protruding design of the mating structure 12 also has another important function: it allows the flipping structure 1 to avoid any protruding structures on the surface of the chip loading tray 3 when mating with it. This design takes into account possible design differences in the chip loading tray 3, such as surface protrusions or other features. By adjusting the appropriate height of the mating structure 12, it can prevent bumps or damage during flipping and placement, thus protecting the integrity of the chip 2 and the chip loading tray 3.

[0065] In some embodiments, the mating structure 12 is provided with a retaining wall 122 connected to the mating end face 121. The connection between the retaining wall 122 and the mating end face 121 forms a mating step 123, which is used to mate with the chip loading tray 3.

[0066] In this embodiment, the design of the mating structure 12 is further refined. It not only includes a mating end face 121 that mates with the chip loading tray 3, but also a retaining wall 122 connected to the mating end face 121. The retaining wall 122 extends from the mating end face 121, and the connection between the two forms a mating step 123. This design provides more precise positioning and constraint for the mating between the flipping structure 1 and the chip loading tray 3.

[0067] The mating end face 121 can be seen as a limiting surface after the flip structure 1 and the chip loading tray 3 come into contact in the axial direction, ensuring that the flip structure 1 and the chip loading tray 3 are precisely aligned in the axial direction. The mating step 123 adds a radial positioning function on the basis of the mating end face 121, so that the flip structure 1 and the chip loading tray 3 can achieve precise mating and limiting in both the axial and radial directions.

[0068] The presence of steps 123 allows the flipping structure 1 to not only stably align axially but also be fixed radially when it engages with the chip loading tray 3, thus providing richer positioning constraints. This dual positioning mechanism enhances the stability of the combination of the flipping structure 1 and the chip loading tray 3, ensuring precise transfer of the chip 2 during the flipping process and reducing the risk of chip damage or flipping failure due to inaccurate positioning.

[0069] In some embodiments, the flip structure 1 further includes:

[0070] The buffer structure 13 is laid on the mating end face 121. The buffer structure 13 is used to compress and deform under the action of the chip loading tray 3. The chip 2 is fixed between the first flipping mechanism 11 and the chip loading tray 3 through the deformation of the buffer structure 13.

[0071] In this embodiment, the design of the flip structure 1 also includes a buffer structure 13, which is laid on the mating end face 121. The main function of the buffer structure 13 is to mitigate the impact through its own compression deformation when the chip loading tray 3 and the flip structure 1 are mated, thereby protecting the chip 2 from damage. The buffer structure 13 is made of an elastic material, which can deform under force and return to its original shape after the pressure is removed.

[0072] Furthermore, the deformation margin of the buffer structure 13 is designed to be greater than the distance between the chip loading tray 3 and the chip 2. This means that when the chip loading tray 3 is engaged with the flipping structure 1, the buffer structure 13 can reduce the movement of the chip loading tray 3 through its own deformation until the distance between the chip loading tray 3 and the chip 2 is reduced to a level that can fix the chip 2. This design ensures that the chip 2 can be securely fixed between the flipping structure 1 and the chip loading tray 3 during the flipping process, preventing chip displacement or detachment due to improper engagement.

[0073] In some embodiments, the chip recess 101 is provided with an inclined guide surface 1011, which forms an flared shape to accommodate chips 2 of different sizes.

[0074] In this embodiment, the design of the chip recess 101 is specifically designed to accommodate chips 2 of different sizes. To achieve this, the chip recess 101 is specially provided with an inclined guide surface 1011, which makes the chip recess 101 flare outward.

[0075] The advantage of this design lies in its flexibility and versatility. Through the flared structure formed by the inclined guide surface 1011, the chip recess 101 can accommodate chips 2 of various sizes without requiring a dedicated recess for each chip size. This design allows the chip flipping fixture to be used in different production scenarios, improving the fixture's applicability and cost-effectiveness.

[0076] The inclined guide surface 1011 not only facilitates the placement of chips 2 of different sizes, but may also provide a certain guiding effect during the flipping process, helping the chip 2 to slide smoothly into or out of the chip recess 101, reducing the risk of damage to the chip 2 during the flipping process. This design takes into account both the ease of operation and the safety of the chip, making the chip flipping fixture more practical and efficient.

[0077] In some embodiments, the flip structure 1 is made of polytetrafluoroethylene.

[0078] In this embodiment, the material chosen for the flipping structure 1 is polytetrafluoroethylene (PTFE), specifically the first flipping mechanism 11 and the second mating structure 12. PTFE is an ideal choice for manufacturing the flipping structure 1 due to its excellent antistatic properties, chemical stability, low coefficient of friction, heat resistance, and non-stickiness.

[0079] Polytetrafluoroethylene (PTFE) effectively reduces static electricity buildup, protecting chip 2 from electrostatic damage. It also exhibits high resistance to most chemicals, maintaining stable performance in various chemical environments. Its low coefficient of friction facilitates smooth movement of chip 2 during flipping, reducing the risk of damage. Furthermore, PTFE's heat resistance allows it to maintain performance over a wide temperature range, and its non-stick surface helps keep chip 2 clean, reducing contaminant adhesion. These properties collectively ensure the reliability of the chip flipping fixture during operation and the safety of chip 2, improving the fixture's usability and efficiency.

[0080] In some embodiments, there are multiple chip recesses 101, which are distributed at intervals.

[0081] In this embodiment, the flip structure 1 is designed with multiple chip recesses 101, which are spaced apart to provide greater flexibility and efficiency. Specifically, the chip recesses 101 can be arranged according to... Figure 1 The arrangement is set in two columns, three in each column, which allows for the simultaneous flipping of multiple chips 2. Of course, the number and distribution of chip recesses 101 can be adjusted according to actual production needs, and are not limited to a configuration of two columns with three in each column.

[0082] The advantage of this design is that it improves production efficiency because it allows multiple chips 2 to be processed simultaneously. Furthermore, the spaced-out chip recesses 101 help ensure that each chip 2 has sufficient space during flipping, avoiding mutual interference, thereby improving operational accuracy and the safety of the chip 2.

[0083] Please refer to Figure 3 , Figure 3 This is a diagram illustrating the use of the chip flipping fixture provided in an embodiment of this application.

[0084] exist Figure 3 The diagram illustrates the operation process of the chip flipping fixture through three stages.

[0085] The first image shows the initial state, where the flip structure 1 is in a state without chip 2. At this time, the chip recess 101 of the flip structure 1 is clearly visible, ready for subsequent operations. This view shows the design and structure of the flip structure 1, providing a reference for subsequent operations.

[0086] The second image shows the pre-flush state. At this stage, chip 2 has been placed in the chip recess 101 of the flip structure 1, with the front of chip 2 facing upwards. Simultaneously, the chip loading tray 3 is inverted and positioned above the flip structure 1, ready to engage with it. This view demonstrates how the chip loading tray 3 and the flip structure 1 precisely align, and the initial position of chip 2 before flipping.

[0087] The third image shows the completed flipping state. At this stage, flipping structure 1 has been removed from chip loading tray 3, completing the flipping operation. At this point, chip 2 remains on chip loading tray 3, inverted, with its front facing down. This view shows the final result of the flipping operation: chip 2 has successfully been transferred from flipping structure 1 to chip loading tray 3, and its state is correct.

[0088] In some cases, the chip loading tray 3 is made of cast iron, such as FC300, i.e., ductile iron grade 300. Chip 2 is an infrared detector chip used in infrared focal plane detectors.

[0089] It should be noted that flip-chip interconnect technology is one of the key technologies for fabricating infrared focal plane detectors. Its main process involves bonding the infrared detector chip and the readout circuit chip together with indium pillars, so that the light signal detected by the infrared detector is processed and output by the readout circuit chip.

[0090] It should be noted that many of the components mentioned in this application are general standard parts or components known to those skilled in the art, and their structure and principle can be learned by those skilled in the art through technical manuals or through conventional experimental methods.

[0091] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0092] The chip flipping fixture provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A chip flipping fixture, characterized in that, It includes a flip structure (1), which has a chip groove (101) for accommodating a chip (2). The flip structure (1) is used to cooperate with a chip loading tray (3) to flip the chip (2) upside down onto the chip loading tray (3).

2. The chip flipping fixture according to claim 1, characterized in that, The flip structure (1) includes: The first flipping mechanism (11) is provided with the chip groove (101). The mating structure (12) is connected to the first flipping mechanism (11) and is used to mate with the chip loading tray (3).

3. The chip flipping fixture according to claim 2, characterized in that, The first flipping mechanism (11) includes: The first flipping component (111) is provided with a chip hole (1111). The second flip member (112) is connected to the first flip member (111), and the second flip member (112) blocks one side of the chip hole (1111) to form the chip recess (101).

4. The chip flipping fixture according to claim 3, characterized in that, The first flipper (111) and the second flipper (112) are flat structures, and the first flipper (111) and the second flipper (112) are stacked.

5. The chip flipping fixture according to claim 2, characterized in that, The mating structure (12) is located at the edge of the first flipping mechanism (11). The mating structure (12) protrudes from the surface of the first flipping mechanism (11) in the opening direction of the chip groove (101). The mating structure (12) is provided with a mating end face (121) that mates with the chip loading tray (3).

6. The chip flipping fixture according to claim 5, characterized in that, The mating structure (12) is provided with a enclosure wall (122) connected to the mating end face (121). The connection between the enclosure wall (122) and the mating end face (121) forms a mating step (123). The mating step (123) is used to mate with the chip loading tray (3).

7. The chip flipping fixture according to claim 5, characterized in that, The flip structure (1) further includes: A buffer structure (13) is laid on the mating end face (121). The buffer structure (13) is used to compress and deform under the action of the chip loading tray (3). The chip (2) is fixed between the first flipping mechanism (11) and the chip loading tray (3) through the deformation of the buffer structure (13).

8. The chip flipping fixture according to claim 1, characterized in that, The chip recess (101) is provided with an inclined guide surface (1011), which forms the flared shape of the chip recess (101) to accommodate chips (2) of different sizes.

9. The chip flipping fixture according to claim 1, characterized in that, The material of the flip structure (1) is polytetrafluoroethylene.

10. The chip flipping fixture according to claim 1, characterized in that, The number of chip grooves (101) is multiple, and the multiple chip grooves (101) are distributed at intervals.

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