Liquid cooling supporting device and processing equipment

Abstract

The utility model discloses a liquid cooling supporting device and processing equipment. The liquid cooling supporting device comprises a bottom plate, a flow guide plate and a top plate. The liquid cooling supporting device is internally provided with a liquid storage cavity, a plurality of first flow channels and a liquid drainage cavity, during heat dissipation, cold liquid firstly enters the liquid storage cavity and overflows after the liquid storage cavity is filled with the cold liquid, the overflowed cold liquid can more uniformly enter all the first flow channels at the same time, the flowing consistency of the cold liquid in the first flow channels is improved, and the heat dissipation effect can be obviously improved; by adopting the combined structure of the liquid storage cavity, the plurality of first flow channels and the liquid discharge cavity, liquid can quickly flow through the first flow channels from the liquid storage cavity and then is discharged from the liquid discharge cavity, and the liquid can quickly enter the next circulation, so that the wandering circulation time of the liquid in the liquid cooling supporting device is effectively shortened, and the heat dissipation efficiency is further improved. The bottom plate, the flow guide plate and the top plate form a three-layer stacked structure, so that materials and occupied space can be saved, and the manufacturing cost of the liquid cooling supporting device is effectively saved.

Description

Technical Field

[0001] This utility model relates to the field of component manufacturing technology, specifically to a liquid cooling support device and processing equipment. Background Technology

[0002] In the manufacturing processes of integrated circuits, microelectromechanical systems (MEMS), and optoelectronic devices, etching techniques are used to process components. During etching, the equipment generates a significant amount of heat. This heat not only affects the precision and uniformity of the etching process but also leads to overheating of the equipment, reducing its lifespan. Temperature control is particularly crucial under high-power and long-term operation conditions.

[0003] Existing cooling solutions mainly include air cooling (AC) and simple water cooling (WC) systems, but these methods have many shortcomings.

[0004] While air-cooling systems are simple in structure and inexpensive, their cooling effect is limited due to the low thermal conductivity of air, making them unsuitable for high-precision etching. During high-power etching, air-cooling systems often fail to dissipate the generated heat quickly enough, leading to localized overheating and affecting etching quality and equipment stability. Furthermore, air-cooling systems also have significant drawbacks in terms of noise and space requirements.

[0005] While simple water-cooling systems offer high cooling efficiency, they suffer from shortcomings in cooling uniformity and temperature control. Traditional water-cooling systems typically employ linear or simple spiral cooling channels. This design leads to inconsistent coolant flow rates in different areas, resulting in uneven temperature distribution. Especially within complex etching chambers, this uneven cooling effect can cause variations in etching rate and depth, impacting the quality of the final product. Utility Model Content

[0006] This invention provides a liquid cooling support device and processing equipment to solve the heat dissipation problem of workpieces during the etching process.

[0007] In one embodiment, a liquid cooling support device is provided, comprising:

[0008] Base plate with mounting groove;

[0009] A guide plate is installed in the mounting groove of the base plate. The guide plate has a hollowed-out section in the middle, which forms a liquid storage chamber with the base plate. The liquid storage chamber has a liquid inlet for introducing cold liquid. The side of the guide plate is spaced apart from the side of the mounting groove to form a drain chamber. The drain chamber has a first drain outlet for discharging hot liquid. The upper surface of the guide plate is covered with multiple spaced first channels. One end of the first channel communicates with the liquid storage chamber, and the other end of the first channel extends to communicate with the drain chamber.

[0010] And a top plate, installed on the upper surface of the guide plate, the top plate covers and seals the liquid storage chamber, the first flow channel and the liquid discharge chamber, the top plate is used to place the workpiece or install the workpiece's support.

[0011] In one embodiment, the first flow channel is a microchannel structure; and / or, multiple first flow channels are arranged parallel to each other at equal intervals; and / or, multiple first flow channels are arranged in a radial pattern.

[0012] In one embodiment, the mounting groove has a protrusion in the middle, the protrusion is located inside the hollow part, and the outer side of the protrusion is spaced apart from the inner side of the hollow part to form the liquid storage cavity.

[0013] In one embodiment, the protrusion includes multiple radially shaped protrusions, and the hollow portion includes multiple radially shaped grooves; the protrusion and the hollow portion together form a radially shaped water storage cavity.

[0014] In one embodiment, the strip groove divides the upper surface of the guide plate into multiple flow guiding areas, each of the flow guiding areas having multiple parallel first flow channels, and at least one extension line of the first flow channel passes through the center of the water storage cavity.

[0015] In one embodiment, the guide plate and the top plate are stacked and installed in the mounting groove, and the upper surface of the top plate is flush with the upper surface of the bottom plate.

[0016] In one embodiment, the lower surface of the guide plate is provided with a drainage channel, and the mounting groove of the base plate is provided with a second drainage port. One end of the drainage channel is connected to the first drainage port, and the other end of the drainage channel is connected to the second drainage port.

[0017] In one embodiment, the system further includes an inlet pipe and an outlet pipe, one end of the inlet pipe passing through the base plate and communicating with the inlet port, and one end of the outlet pipe passing through the base plate and communicating with the second outlet port.

[0018] In one embodiment, the guide plate is further provided with a second flow channel, one end of which is connected to the liquid storage chamber, and the other end of which extends to be connected to the liquid discharge chamber.

[0019] In one embodiment, a processing apparatus is provided, comprising:

[0020] A processing cabinet, which has a processing chamber;

[0021] A circulating cooling device is located outside the processing chamber;

[0022] The liquid cooling support device is installed inside the processing chamber. The liquid inlet and the first outlet of the liquid cooling support device are connected to the circulating cooling device. The circulating cooling device is used to drive liquid injection and discharge into the liquid cooling support device to achieve circulating cooling.

[0023] According to the liquid cooling support device and processing equipment in the above embodiments, since the liquid cooling support device is provided with a liquid storage chamber, multiple first flow channels and a liquid discharge chamber, during heat dissipation, the cold liquid first enters the liquid storage chamber. After the liquid storage chamber is full, it overflows. The overflowing cold liquid can enter all the first flow channels more evenly at the same time, improving the consistency of the cold liquid flow in the first flow channels and significantly improving the heat dissipation effect. The combined structure of the liquid storage chamber, multiple first flow channels and liquid discharge chamber allows the liquid to flow quickly from the liquid storage chamber through the first flow channels and then be discharged from the liquid discharge chamber. The liquid can quickly enter the next cycle, effectively reducing the time that the liquid circulates in the liquid cooling support device, ensuring that fresh liquid can quickly enter the liquid cooling support device for heat dissipation, thereby improving the heat dissipation efficiency.

[0024] Multiple first flow channels are distributed on the upper surface of the guide plate, which can achieve uniform heat dissipation over a larger area, further improve the heat dissipation effect, and thus meet the heat dissipation requirements of the workpiece during the etching process.

[0025] The base plate, guide plate, and top plate form a three-layer stacked structure, which is more compact and easier to install. It can save materials and space, effectively reduce the manufacturing cost of liquid cooling support devices, and improve the installation efficiency of liquid cooling support devices. Attached Figure Description

[0026] Figure 1 This is an exploded view of a liquid-cooled support device in one embodiment;

[0027] Figure 2 This is an exploded view of a liquid-cooled support device in one embodiment;

[0028] Figure 3 This is a top view of the liquid cooling support device with a hidden top plate in one embodiment;

[0029] Figure 4 This is a schematic diagram of the liquid flow direction in one embodiment of the liquid cooling support device with a hidden top plate.

[0030] Figure 5 This is a schematic diagram of the liquid flow direction on the exploded top plate of the liquid cooling support device in one embodiment;

[0031] Figure 6 This is a schematic diagram of the structure of the guide vane in one embodiment;

[0032] Figure 7 This is a schematic diagram of the processing equipment in one embodiment;

[0033] The accompanying diagrams are labeled as follows:

[0034] 1-Base plate, 11-Mounting groove, 12-Liquid storage chamber, 121-Liquid inlet, 13-Drainage chamber, 131-First drain outlet, 132-Second drain outlet, 14-Protrusion, 141-Slot hole;

[0035] 2-Guide plate, 21-Hollow section, 22-First flow channel, 23-Drainage channel, 24-Second flow channel;

[0036] 3-Top plate, 31-Opening;

[0037] 4-Inlet pipe;

[0038] 5-Drain pipe;

[0039] 100 - Machining cabinet 100, 101 - Machining cavity;

[0040] 200 - Circulating cooling device, 201 - Water outlet pipe, 202 - Water inlet pipe;

[0041] 300 - Liquid cooling support device. Detailed Implementation

[0042] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0043] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0044] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0045] In one embodiment, a liquid-cooled support device is provided, primarily used for supporting the etching process of thin sheet workpieces. This liquid-cooled support device also includes a liquid-cooling channel, which dissipates heat from the workpiece via a coolant, allowing the workpiece to complete the etching process at a suitable temperature. In this embodiment, a coolant can be injected into the liquid-cooling channel to achieve heat exchange and cool the workpiece. The coolant may include water. The coolant may also include other coolants with high thermal conductivity, such as aqueous ethylene glycol solutions, mineral oil, or special coolants. These coolants may have better thermal conductivity and lower freezing points in specific applications, making them suitable for low-temperature environments or applications requiring antifreeze protection. The coolant can also be a mixture, where water is mixed with other coolants to improve the coolant's thermal conductivity and flowability. For example, adding an appropriate amount of ethylene glycol can improve the coolant's antifreeze properties while maintaining good thermal conductivity.

[0046] In this embodiment, the liquid cooling support device has a three-layer stacked structure, forming a water storage chamber, flow channels, and a drain chamber. The water storage chamber is located in the center, and the drain chambers are located at the surrounding edges. The water storage chamber and the drain chamber are connected by multiple flow channels, which are connected to the upper ends of the water storage chamber and the drain chamber. This design allows the water to overflow into the flow channels only after the water storage chamber is full. This design allows the coolant to enter multiple flow channels simultaneously, avoiding uneven heat dissipation caused by the sequential flow of coolant in different channels, and greatly improving the heat dissipation uniformity of multiple flow channels. Furthermore, the three-layer stacked structure of the liquid cooling support device is more compact, easier to install, saves materials and space, effectively reduces the manufacturing cost of the liquid cooling support device, and improves the installation efficiency.

[0047] Furthermore, the flow channel can be configured as a microchannel structure, achieving efficient heat exchange through dense microchannels. The equal spacing between microchannels ensures that the flow rate of the coolant is consistent in different areas, while the elongated microchannels can increase the flow rate of the coolant, thereby improving heat dissipation uniformity and efficiency.

[0048] Furthermore, the flow channels within the liquid cooling support device can be distributed across one surface of the liquid cooling support device and positioned close to the support surface where the workpiece is placed. Multiple flow channels can be arranged radially or approximately radially, which not only increases the heat dissipation area but also improves the uniformity of heat dissipation.

[0049] Please refer to Figures 1 to 5 In one embodiment, a liquid cooling support device is provided, which mainly includes a base plate 1, a guide plate 2, and a top plate 3. The base plate 1, guide plate 2, and top plate 3 can all be disc structures for mounting and placing circular workpieces, achieving support and heat dissipation for the circular workpieces. The base plate 1, guide plate 2, and top plate 3 can also be square plates or other structures for mounting and placing workpieces of other shapes such as squares. In this embodiment, the example of the base plate 1, guide plate 2, and top plate 3 all being disc structures is used for illustration.

[0050] The base plate 1 has a mounting groove 11 in the middle, and the guide plate 2 and the top plate 3 are installed in the mounting groove 11. The shape of the mounting groove 11 is consistent with the shape of the base plate 1. The mounting groove 11 is a circular groove, and the center line of the mounting groove 11 coincides with the center line of the base plate 1, so that the base plate 1, the guide plate 2 and the top plate 3 can be aligned and installed along the center line. The structure is simpler and easier to process and install the base plate 1, the guide plate 2 and the top plate 3.

[0051] The guide plate 2 is installed at the bottom of the mounting groove 11, and the top plate 3 is installed on the upper surface of the guide plate 2. The top plate 3, the guide plate 2 and the bottom plate 1 form a three-layer structure stacked from top to bottom.

[0052] The mounting groove 11 has a protrusion 14 in the middle, and the guide plate 2 has a hollow part 21 in the middle. The volume of the protrusion 14 is smaller than the volume of the hollow part 21. The protrusion 14 and the hollow part 21 have the same or similar structure. The outer side of the protrusion 14 and the inner side of the hollow part 21 are spaced apart, and there is a certain gap between them, which forms a liquid storage chamber 12. The bottom or side of the liquid storage chamber 12 may be provided with a liquid inlet 121, through which liquid can be injected into the liquid storage chamber 12.

[0053] The upper surface of the guide plate 2 is covered with multiple evenly distributed first flow channels 22, all located at the same height, with one end of each first flow channel 22 connected to the liquid storage chamber 12. The height of the protrusion 14 is higher than the height of the first flow channels 22, allowing the highest point of the liquid storage chamber 12 formed by the protrusion 14 to connect with the first flow channels 22. When the liquid storage chamber 12 is full of liquid, the liquid can overflow into all the first flow channels 22 at the same height. The first flow channels 22 are heat exchange and heat dissipation areas; the liquid flowing through the first flow channels 22 will exchange heat with the workpiece above, thus providing liquid cooling for the workpiece.

[0054] The outer diameter of the guide plate 2 is smaller than the inner diameter of the mounting groove 11. The outer side of the guide plate 2 is spaced apart from the inner side of the mounting groove 11, forming a gap space that creates a drain chamber 13. The ends of all the first flow channels 22 away from the liquid storage chamber 12 are connected to the drain chamber 13. The bottom or side of the drain chamber 13 is provided with a first drain port 131 for discharging hot liquid.

[0055] The outer diameter of the top plate 3 is equal to or slightly larger than the inner diameter of the mounting groove 11. The top plate 3 covers the guide plate 2, completely covering it, and also covers the sealed liquid storage chamber 12, the first flow channel 22, and the drain chamber 13. When the top plate 3 is not installed, the upper ends of the liquid storage chamber 12, the first flow channel 22, and the drain chamber 13 are all open structures. When the top plate 3 is installed, it covers and seals the liquid storage chamber 12, the first flow channel 22, and the drain chamber 13, preventing liquid leakage and thus avoiding impact on processing equipment and workpieces. This configuration allows for multiple guide grooves on the guide plate 2, forming the first flow channel 22, and the liquid storage chamber 12 and drain chamber 13 being enclosed by multiple components. This simplifies the structure of the bottom plate 1, the guide plate 2, and the top plate 3, and reduces the manufacturing difficulty of these components.

[0056] The guide plate 2 can be fixedly connected to the base plate by means of screws, welding, or bonding. The top plate 3 can also be fixedly connected to the guide plate 2 by means of screws, welding, or bonding, and the top plate 3 can also be fixedly connected to the base plate 1 by means of welding or bonding. The base plate 1, guide plate 2, and top plate 3 are all made of high thermal conductivity materials, preferably metal matrix composites (MMC), such as copper and aluminum matrix composites. The base plate 1, guide plate 2, and top plate 3 can also be made of high thermal conductivity materials such as silver or gold. Although these materials are more expensive, they can provide better thermal conductivity in certain high-precision and high-performance applications. The base plate 1, guide plate 2, and top plate 3 have good heat transfer properties, allowing the heat generated by the processed workpiece to be transferred to the interior and exchange heat with the liquid.

[0057] The base plate 1, guide vane 2, and top plate 3 can also be made of corrosion-resistant materials to improve their corrosion resistance and extend their service life. The base plate 1, guide vane 2, and top plate 3 can be made of stainless steel or nickel-plated copper, or they can be made of titanium alloy or ceramic materials. These materials have higher corrosion resistance and high-temperature resistance, making them suitable for cooling needs in extreme environments.

[0058] The base plate 1, the guide plate 2, and the top plate 3 can also be made of composite materials. For example, the base plate 1, the guide plate 2, and the top plate 3 can also be made of copper-aluminum composite materials or copper-graphite composite materials. These composite materials combine the advantages of different materials, and have both high thermal conductivity and good mechanical properties and corrosion resistance.

[0059] The upper surface of the top plate 3 serves as a support surface. The upper surface of the top plate 3 can be used to directly place workpieces or to place load-bearing components for mounting workpieces. That is, during workpiece processing, the top plate 3 can be directly or indirectly connected to the workpiece, and the top plate 3 can transfer the heat generated during workpiece processing to the liquid in the first flow channel 22 to achieve liquid cooling.

[0060] In this embodiment, the first flow channel 22 is a microchannel structure, with multiple first flow channels 22 having the same spacing and being parallel to each other. The diameter of the first flow channel 22 is relatively small, and the spacing between adjacent first flow channels 22 can be smaller than the diameter of the first flow channel 22. Preferably, the spacing between adjacent first flow channels 22 is as small as possible, and the spacing can approach zero, so that the upper surface of the guide plate 2 is uniformly covered with more tiny first flow channels 22 to improve heat exchange efficiency.

[0061] The first flow channel 22 is a microchannel structure, forming a structure similar to a monolithically integrated manifold microchannel (mMMC). This microchannel structure reduces the cross-sectional area of ​​the pipe, thereby increasing the flow velocity at the same flow rate. As the flow velocity increases, the relative motion between the liquid and the solid surface accelerates, leading to a reduction in the boundary layer thickness. The boundary layer refers to the velocity gradient region formed by the fluid near a solid surface due to viscosity. The thinner the boundary layer between microchannels, the higher the efficiency of heat transfer through convection, thus increasing the convective heat transfer coefficient. A crucial factor in heat exchange is the contact area. In this microchannel structure, the contact area between the coolant and the heat exchange surface in the first flow channel 22 is significantly increased compared to traditional water-cooled structures, thereby improving cooling efficiency.

[0062] The increased liquid velocity in the first channel 22 of the microchannel structure helps to increase the Reynolds number, thereby generating turbulence and improving the convective heat transfer coefficient. At the same time, the liquid is more mixed in the turbulent state, which improves the heat transfer efficiency.

[0063] The upper surface of the guide plate 2 can be distributed with multiple radial or near-radial first flow channels 22, the shape of which can be straight or curved. The multiple radial or near-radial first flow channels 22 can further improve the uniformity of heat dissipation and avoid local overheating of the top plate 3; at the same time, the multiple radial or near-radial first flow channels 22 can also ensure that the flow velocity within the multiple first flow channels 22 is the same or similar, which is conducive to improving the uniformity of heat dissipation.

[0064] In other embodiments, the first flow channels 22 distributed on the upper surface of the guide plate 2 may also be in a spiral shape, or the shape of the first flow channels 22 may be a combination of one or more of straight lines, curves, and spirals. The first flow channels 22 covering the entire upper surface of the guide plate 2 can also achieve uniform heat dissipation and increase the heat dissipation area.

[0065] Please refer to Figure 4 and Figure 5 In this embodiment, the principle steps of one liquid cooling cycle of the liquid cooling support device are as follows:

[0066] Liquid injection and storage: Cold liquid is injected into the storage chamber 12 from the liquid inlet 121. After the storage chamber 12 is full of liquid, the liquid overflows from the storage chamber 12 into all the first flow channels 22 at the same time.

[0067] Heat exchange and heat dissipation: The liquid flows from the end of the first flow channel 22 near the liquid storage chamber 12 to the end near the liquid discharge chamber 13. When the liquid flows in the first flow channel 22, it exchanges heat with the top plate 3 to absorb the heat generated during the processing of the workpiece.

[0068] Liquid drainage: After heat exchange, all the liquid in the first flow channel 22 is drained into the drainage chamber 13 and then discharged from the first drainage port 131.

[0069] In this embodiment, since the liquid cooling support device is equipped with a liquid storage chamber 12, multiple first flow channels 22, and a drain chamber 13, during heat dissipation, the cold liquid first enters the liquid storage chamber 12. After the liquid storage chamber 12 is full, it overflows. The overflowing cold liquid can enter all the first flow channels 22 more evenly at the same time, improving the consistency of the cold liquid flow in the first flow channels and significantly improving the heat dissipation effect. The combined structure of the liquid storage chamber 12, multiple first flow channels 22, and drain chamber 13 allows the liquid to flow quickly from the liquid storage chamber 12 through the first flow channels 22 and then be discharged from the drain chamber 13. The liquid can quickly enter the next cycle, effectively reducing the time that the liquid circulates in the liquid cooling support device, ensuring that fresh liquid can quickly enter the liquid cooling support device for heat dissipation, thereby improving the heat dissipation efficiency.

[0070] The liquid in the liquid storage chamber 12 and the liquid discharge chamber 13 is also in contact with the guide plate 2. The liquid in the liquid storage chamber 12 and the liquid discharge chamber 13 can fully exchange heat with the guide plate 2, which is beneficial to heat dissipation efficiency.

[0071] Multiple first flow channels 22 are distributed on the upper surface of the guide plate 2, which can achieve uniform heat dissipation over a larger area, further improve the heat dissipation effect, and thus meet the heat dissipation requirements of the workpiece during the etching process.

[0072] The base plate 1, guide plate 2, and top plate 3 of the liquid cooling support device form a three-layer stacked structure, which is more compact, easier to install, saves materials and space, effectively reduces the manufacturing cost of the liquid cooling support device, and improves the installation efficiency of the liquid cooling support device.

[0073] In one embodiment, the protrusion 14 includes a plurality of radially arranged protrusions, and correspondingly, the hollow portion 21 includes a plurality of radially arranged slots. The number of protrusions in the protrusion 14 is the same as the number of slots in the hollow portion 21, and each slot has one protrusion.

[0074] Please refer to Figure 1 For example, the protrusion 14 includes three radial protrusions, which are evenly distributed to form a Y-shaped structure. Correspondingly, the hollowed-out portion 21 includes three radial grooves, which are evenly distributed to form a Y-shaped structure. The three protrusions and three grooves enclose a Y-shaped liquid storage cavity 12. Part of the liquid storage cavity 12 is located in the middle of the guide plate 2, and part extends to the edge of the guide plate 2. The radial liquid storage cavity 12 divides the upper surface of the guide plate 2 into multiple identical flow guiding areas. Water overflowing from the liquid storage cavity 12 can flow evenly into multiple flow guiding areas. The first flow channel 22 in each flow guiding area can be set as a straight line structure that is spaced apart and parallel to each other. The extension line of the first flow channel 22 located in the middle of each flow guiding area passes through the center of the liquid storage cavity 12. Multiple first flow channels 22 are arranged in an approximately radial pattern, forming a denser and more uniform heat dissipation first flow channel 22, which can improve the uniformity of heat dissipation.

[0075] In other embodiments, the protrusions of the protrusion 14 and the slots of the hollowed-out portion 21 can be of other quantities, such as four in a cross shape or eight in a star shape.

[0076] Please refer to Figure 1 In one embodiment, the protrusion 14 may also have a slot 141 in the middle, with a portion of the slot 141 penetrating through the protrusion 14 and the base plate 1. The top 3 has an opening 31 corresponding to the slot 141, and the slot 141 and the opening 31 are connected. The slot 141 in the middle of the protrusion 14 forms a hollow structure, which can be used to install other components. The slot 141 penetrates through the base plate 1, so that the slot 141 can serve as a mounting component to install the liquid cooling support device onto other components.

[0077] In other embodiments, the protrusion 14 may also be a solid structure, and the protrusion 14 may form a liquid storage cavity 12 with the hollowed-out portion 21.

[0078] In one embodiment, the protrusion 14 may not be provided in the middle of the base plate 1, and the hollow part 21 in the middle of the guide plate 2 can directly form the liquid storage cavity 12, which can also realize the simultaneous overflow of liquid into all the first flow channels 22, achieving more uniform heat dissipation.

[0079] In one embodiment, the total thickness of the guide plate 2 and the top plate 3 is equal to the depth of the mounting groove 11. When the guide plate 2 and the top plate 3 are installed in the mounting groove 11, the upper surface of the top plate 3 is flush with the upper surface of the bottom plate 1.

[0080] This configuration allows the upper surfaces of the base plate 1 and the top plate 3 to jointly form a support surface, increasing the area of ​​the support surface and enabling the installation of larger workpieces or larger load-bearing components. The fact that the top plate 3 is flush with the base plate 1 also allows for a more regular and compact liquid cooling support device, reducing the space it occupies.

[0081] Please refer to Figure 2 In one embodiment, the lower surface of the guide plate 2 may be provided with a drainage channel 23, and a second drainage port 132 is provided in the mounting groove 11 of the base plate 1. One end of the drainage channel 23 is connected to the first drainage port 131, and the other end of the drainage channel 23 is connected to the second drainage port 132. The second drainage port 132 and the inlet 121 are spaced apart and isolated from each other.

[0082] The guide plate 2 is equipped with a drainage channel 23, which allows the second drainage port 132 to be located close to the liquid inlet 121, so that the liquid inlet pipe and the liquid inlet pipe connected to the liquid cooling support device are closer together, which facilitates the layout and wiring of the liquid inlet pipe and the liquid inlet pipe.

[0083] Please refer to Figure 1 and Figure 2 In one embodiment, the liquid cooling support device may further include an inlet pipe 4 and a drain pipe 5. One end of the inlet pipe 4 is connected to the inlet port 121, and the other end is connected to the circulating cooling device. The inlet pipe 4 is used to inject cold liquid into the storage chamber 12. One end of the drain pipe 5 is connected to the second drain port 132, and the other end is connected to the circulating cooling device. The drain pipe 5 is used to discharge the hot liquid that has absorbed heat from the liquid cooling support device. The circulating cooling device can use a heat exchanger or other device to perform heat exchange on the recovered hot liquid again, turning the hot liquid back into cold liquid, and then drive the cold liquid into the liquid cooling support device for the next cycle of cooling.

[0084] In one embodiment, the volume relationship between the liquid storage chamber 12 and the liquid discharge chamber 13 can be set according to requirements. The flow rate of the liquid in the first flow channel 22 can be controlled by changing the volume relationship between the liquid storage chamber 12 and the liquid discharge chamber 13 to meet the required heat dissipation efficiency.

[0085] For example, the volume of the liquid storage chamber 12 is greater than the volume of the liquid discharge chamber 13, the area of ​​the upper surface of the liquid storage chamber 12 is greater than the area of ​​the upper surface of the liquid discharge chamber 13, and the hydraulic pressure formed in the liquid storage chamber 12 is greater than the hydraulic pressure formed in the liquid discharge chamber 13. This hydraulic pressure difference can drive the liquid in the first flow channel 22 to flow faster, which can speed up the liquid circulation speed and thus improve the heat dissipation efficiency.

[0086] In one embodiment, the density of the first flow channel 22 on the guide plate 2 can be arranged according to the heat dissipation requirements to meet the heat dissipation needs of different workpieces.

[0087] For example, when the workpiece supported on the liquid cooling support device is a circular workpiece, and the circular workpiece heats up uniformly, the upper surface of the guide plate 2 is covered with uniformly arranged first flow channels 22, such as equidistant radial first flow channels 22.

[0088] When the workpiece supported on the liquid cooling support device is irregularly shaped, or the local heat generation of the workpiece is significantly higher than that of other areas, a denser first flow channel 22 is locally set on the upper surface of the guide plate 2 directly below the heat generation area of ​​the workpiece to achieve rapid heat dissipation of the heat generation area of ​​the workpiece.

[0089] Please refer to Figure 6 In one embodiment, the middle part of the guide plate 2 may be provided with one or more second flow channels 24 to form a multi-layer flow channel structure. The second flow channels 24 located inside the guide plate 2 can achieve heat exchange and heat dissipation through the heat conduction of the guide plate 2. Providing more layers of flow channel structure inside the guide plate 2 can further improve heat dissipation efficiency.

[0090] Please refer to Figure 7 In one embodiment, a processing apparatus is provided, which can be used for etching. This processing apparatus mainly includes a processing cabinet 100, a circulating cooling device 200, and a liquid cooling support device 300 as described in any of the above embodiments.

[0091] The processing cabinet 100 has a box-type structure and a processing cavity 101 inside. The processing cavity 101 is a sealed cavity. The processing cabinet 100 may be equipped with a cabinet door, and the workpiece can be put in and taken out by opening and closing the cabinet door.

[0092] The circulating cooling device 200 is located outside the machining chamber 101, and the liquid cooling support device 300 is installed inside the machining chamber 101. The liquid cooling support device 300 is used to support the workpiece within the machining chamber 101 for machining. The circulating cooling device 200 and the machining cabinet 100 are relatively independent devices. The circulating cooling device 200 can be connected to the liquid cooling support device 300 by insertion, so that the machining cabinet 100 and the circulating cooling device 200 can be maintained separately.

[0093] The circulating cooling device 200 mainly includes components such as a water pump (not shown in the figure), a heat exchanger (not shown in the figure), an outlet pipe 201, and an inlet pipe 202. The outlet pipe 201 of the circulating cooling device 200 is connected to the inlet pipe 4 of the liquid cooling support device 300, and the inlet pipe 202 of the circulating cooling device 200 is connected to the outlet pipe 5 of the liquid cooling support device 300, forming a circulating liquid circuit with the liquid cooling support device 300. The water pump may include one of a positive displacement pump (PDP), a centrifugal pump (CP), or a turbine pump (TP), and the heat exchanger may include one of a plate heat exchanger, a volumetric heat exchanger, or a shell-and-tube heat exchanger.

[0094] The water pump in the circulating cooling device 200 injects a cooler liquid into the liquid cooling support device 300 through the outlet pipe 201, and then recovers the hot liquid discharged from the liquid cooling support device 300 through the inlet pipe 202. The heat exchanger in the circulating cooling device 200 converts the recovered hot liquid into cold liquid, which can then be injected back into the liquid cooling support device 300 for the next cooling cycle.

[0095] In this embodiment, the processing equipment has a liquid storage chamber 12, multiple first flow channels 22, and a drain chamber 13 within the liquid cooling support device 300. During heat dissipation, the coolant first enters the liquid storage chamber 12. After the liquid storage chamber 12 is full, it overflows. The overflowing coolant can enter all the first flow channels 22 more evenly at the same time, improving the consistency of the coolant flow within the first flow channels and significantly improving the heat dissipation effect. The combined structure of the liquid storage chamber 12, multiple first flow channels 22, and drain chamber 13 allows the liquid to flow quickly from the liquid storage chamber 12 through the first flow channels 22 and then be discharged from the drain chamber 13. The liquid can quickly enter the next cycle, effectively reducing the time the liquid lingers and circulates within the liquid cooling support device 300, ensuring that fresh liquid can quickly enter the liquid cooling support device 300 for heat dissipation, thereby improving the heat dissipation efficiency.

[0096] The liquid in the liquid storage chamber 12 and the liquid discharge chamber 13 is also in contact with the guide plate 2. The liquid in the liquid storage chamber 12 and the liquid discharge chamber 13 can fully exchange heat with the guide plate 2, which is beneficial to heat dissipation efficiency.

[0097] Multiple first flow channels 22 are distributed on the upper surface of the guide plate 2, which can achieve uniform heat dissipation over a larger area, further improve the heat dissipation effect, and thus meet the heat dissipation requirements of the workpiece during the etching process.

[0098] The liquid cooling support device 300 has a three-layer stacked structure consisting of a base plate 1, a guide plate 2, and a top plate 3. This structure is more compact, easier to install, saves materials and space, effectively reduces the manufacturing cost of the liquid cooling support device, and improves the installation efficiency of the liquid cooling support device.

[0099] The above-described specific examples are for illustrative purposes only and are not intended to limit the scope of this invention. Those skilled in the art to which this invention pertains can make various simple deductions, modifications, or substitutions based on the concept of this invention.

Claims

1. A liquid cooling support device, characterized in that, include: Base plate with mounting groove; A guide plate is installed in the mounting groove of the base plate. The guide plate has a hollowed-out section in the middle, which forms a liquid storage chamber with the base plate. The liquid storage chamber has a liquid inlet for introducing cold liquid. The side of the guide plate is spaced apart from the side of the mounting groove to form a drain chamber. The drain chamber has a first drain outlet for discharging hot liquid. The upper surface of the guide plate is covered with multiple spaced first channels. One end of the first channel communicates with the liquid storage chamber, and the other end of the first channel extends to communicate with the drain chamber. And a top plate, installed on the upper surface of the guide plate, the top plate covers and seals the liquid storage chamber, the first flow channel and the liquid discharge chamber, the top plate is used to place the workpiece or install the workpiece's support.

2. The liquid cooling support device as described in claim 1, characterized in that, The first flow channel is a microchannel structure; and / or, multiple first flow channels are arranged parallel to each other at equal intervals; and / or, multiple first flow channels are arranged in a radial pattern.

3. The liquid cooling support device as described in claim 1, characterized in that, The mounting groove has a protrusion in the middle, which is located inside the hollow part. The outer side of the protrusion is spaced apart from the inner side of the hollow part to form the liquid storage cavity.

4. The liquid cooling support device as described in claim 3, characterized in that, The protruding part includes multiple radially shaped protruding strips, and the hollow part includes multiple radially shaped grooves; the protruding part and the hollow part together form a radially shaped water storage cavity.

5. The liquid cooling support device as described in claim 4, characterized in that, The strip groove divides the upper surface of the guide plate into multiple flow guiding areas. Each flow guiding area is provided with multiple parallel first flow channels, and at least one extension line of the first flow channel passes through the center of the water storage cavity.

6. The liquid cooling support device as described in claim 1, characterized in that, The guide plate and the top plate are stacked and installed in the mounting groove, and the upper surface of the top plate is flush with the upper surface of the bottom plate.

7. The liquid cooling support device as described in claim 1, characterized in that, The lower surface of the guide plate is provided with a drainage channel, and the mounting groove of the base plate is provided with a second drainage port. One end of the drainage channel is connected to the first drainage port, and the other end of the drainage channel is connected to the second drainage port.

8. The liquid cooling support device as described in claim 7, characterized in that, It also includes an inlet pipe and an outlet pipe, one end of the inlet pipe passing through the base plate and communicating with the inlet port, and one end of the outlet pipe passing through the base plate and communicating with the second outlet port.

9. The liquid cooling support device as described in claim 1, characterized in that, The guide plate is also provided with a second flow channel. One end of the second flow channel is connected to the liquid storage chamber, and the other end of the second flow channel extends to be connected to the liquid discharge chamber.

10. A processing device, characterized in that, include: A processing cabinet, which has a processing chamber; A circulating cooling device is located outside the processing chamber; And the liquid cooling support device as described in any one of claims 1 to 9, wherein the liquid cooling support device is installed in the processing cavity, the liquid inlet and the first liquid outlet of the liquid cooling support device are connected to the circulating cooling device, and the circulating cooling device is used to drive liquid injection and discharge into the liquid cooling support device to achieve circulating cooling.

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