Multifunctional test equipment
By introducing an indexing plate and lifting module into the testing equipment, combined with RF and ICT testing devices and SIM card insertion devices, the problem that existing equipment cannot complete multiple tests simultaneously is solved, and efficient completion of multi-functional testing is achieved.
Patent Information
- Application Number
- CN202422870906.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-11-25
AI Technical Summary
Existing testing equipment cannot simultaneously perform SIM card insertion/removal testing, RF electromagnetic frequency testing, and ICT electrical function testing, thus failing to meet multi-functional testing requirements.
Design a multifunctional testing device, including an indexing plate, a carrier module, an RF testing device, an ICT testing device, and a SIM card insertion device. The indexing plate rotates to complete three types of tests at two testing stations. The lifting module is used to achieve mold closing between the carrier module and the testing device, and the SIM card insertion device is used to achieve SIM card insertion and removal tests.
It enables the same device to complete SIM card insertion and removal tests, RF electromagnetic frequency tests, and ICT electrical function tests at two test stations. The structure is simple and compact, and it occupies little space.
Smart Images

Figure CN223650638U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of testing equipment technology, and in particular relates to a multifunctional testing device. Background Technology
[0002] After the functional components are manufactured, they need to be tested using testing equipment to perform SIM card insertion / removal tests, RF electromagnetic frequency tests, and ICT electrical function tests. The testing equipment disclosed in Chinese Patent Publication No. CN218158145U has two test modules: a first test mechanism and a second test mechanism. The first test mechanism is used for RF electromagnetic frequency testing of the functional components, and the second test mechanism is used for ICT electrical function testing. While this equipment can perform RF and ICT tests, it cannot simulate SIM card insertion / removal testing, and therefore cannot meet the testing requirements.
[0003] Therefore, it is necessary to provide a multifunctional testing device to solve the above-mentioned technical problems. Utility Model Content
[0004] The main purpose of this utility model is to provide a multifunctional testing device that can complete three tests at two testing stations. The overall structure is simple, the design is compact, and it occupies little space.
[0005] The present invention achieves the above objectives through the following technical solution: a multifunctional testing device, comprising a frame, an indexing plate disposed within the frame, and a plurality of load modules disposed in a ring at equal angles on the indexing plate, wherein loading and unloading stations, a first testing station, and a second testing station are provided along the rotation direction of the indexing plate.
[0006] The first test station includes an RF test device disposed above the loading module, a first SIM card insertion device disposed on the RF test device, and a first lifting module disposed below the indexing plate that pushes the loading module upward to achieve mold closing between the loading module and the RF test device.
[0007] The second testing station includes an ICT testing device disposed above the loading module, a second SIM card insertion device disposed on the ICT testing device, and a second lifting module disposed below the indexing plate that pushes the loading module upward to achieve mold closing between the loading module and the ICT testing device.
[0008] Furthermore, the loading module includes a carrier located above the indexing plate, a plurality of first guide posts fixed at the upper end on the carrier and movably disposed on the indexing plate, and a plurality of elastic elements for resetting the carrier downward. The lower end of the first guide post is provided with a connecting plate. The elastic element is sleeved on the intermediate post, the upper end of the elastic element abuts against the lower surface of the indexing plate, and the lower end abuts against the upper surface of the connecting plate. The upper end of the intermediate post passes through the indexing plate, and the lower end is connected to the connecting plate.
[0009] Furthermore, the carrier is provided with a slot for accommodating the product, and the slot is provided with a contour positioning structure for positioning the product; the upper edge of the carrier is provided with a plurality of first positioning holes, and the side is provided with second positioning holes; a first sensor is provided at the bottom of the carrier to sense whether a product is placed inside the carrier, and the carrier is provided with an clearance opening for the detection beam of the first sensor to pass through.
[0010] Furthermore, the first lifting module and the second lifting module have the same structure and both include a first cylinder and a lifting plate that is driven by the first cylinder to move up and down. The lifting plate pushes the connecting plate to move upward, and a second sensor that senses the rotation of the vehicle into position is provided on the side of the lifting plate.
[0011] Furthermore, the RF testing device includes an RF test board mounted on the frame and an RF test piece mounted on the RF test board that can contact and conduct with the product. The lower surface of the RF test board is provided with a first positioning pin that mates with the first positioning hole.
[0012] Furthermore, the ICT testing device includes an ICT test board mounted on the rack and an ICT test piece mounted on the ICT test board that can contact and communicate with the product. The lower surface of the ICT test board is provided with a second positioning pin that mates with the first positioning hole.
[0013] Furthermore, the first SIM card insertion device includes a first driving component disposed on the RF test board and a first movable frame that moves horizontally driven by the first driving component. The first movable frame is movably disposed below the RF test board via a slide rail slider. A first pressure sensor and a first mounting base are sequentially disposed horizontally on the side of the first movable frame near the RF test board. A first connector is disposed at the upper end of the first mounting base and a third positioning pin that mates with the second positioning hole is disposed on the side of the first connector. A first SIM card that extends into the product and contacts and communicates with the product is disposed on the side of the first connector near the carrier.
[0014] Furthermore, the first movable frame is provided with a clamping assembly, which includes a second cylinder and a pair of grippers driven by the second cylinder to clamp or open.
[0015] Furthermore, the second SIM card insertion device includes a second driving component disposed on the ICT test board and a second moving frame that moves horizontally driven by the second driving component. The second moving frame is movably disposed below the ICT test board via a slide rail slider. On the side of the second moving frame near the ICT test board, a second pressure sensor and a second mounting base are arranged in sequence in a horizontal direction. The upper end of the second mounting base is provided with a second connector, and the side is provided with a fourth positioning pin that cooperates with the second positioning hole. On the side of the second connector near the carrier, a second SIM card is provided that extends into the product and contacts and communicates with the product.
[0016] Furthermore, the bottom of the indexing plate is provided with a rotary drive component for driving the indexing plate to rotate, the upper surface of the indexing plate is provided with a pneumatic slip ring, and the indexing plate is provided with a first through hole for the first guide post to move up and down and a second through hole for the intermediate post to move up and down.
[0017] Compared with the prior art, the advantages of this multifunctional testing equipment are: it can perform SIM card insertion and removal tests, RF electromagnetic frequency tests and ICT electrical function tests on products. The same equipment can complete three functional tests, and the three tests can be completed at two test stations. The overall structure is simple, compact, and occupies little space. Attached Figure Description
[0018] Figure 1 This is a three-dimensional structural diagram of the multifunctional testing device according to an embodiment of the present utility model;
[0019] Figure 2 This is a three-dimensional structural diagram of the multifunctional testing device according to an embodiment of the present utility model;
[0020] Figure 3 This is a three-dimensional structural diagram of the loading module according to an embodiment of the present invention;
[0021] Figure 4 This is a three-dimensional structural diagram of the RF testing device and the first SIM card insertion device according to an embodiment of the present invention;
[0022] Figure 5 This is a three-dimensional structural diagram of the RF testing device and the first SIM card insertion device according to an embodiment of the present invention;
[0023] Figure 6This is a three-dimensional structural diagram of the ICT testing device and the second SIM card insertion device according to an embodiment of the present invention;
[0024] Figure 7 This is a three-dimensional structural diagram of the ICT testing device and the second SIM card insertion device according to an embodiment of the present invention;
[0025] The numbers in the image represent:
[0026] 100 - Multifunctional testing equipment; 30 - Loading and unloading stations; 40 - First testing station; 50 - Second testing station;
[0027] 1-Indexing plate, 11-Rotary drive component, 12-Pneumatic slip ring;
[0028] 2-Cargo module, 21-Carrier, 22-First guide post, 24-Connecting plate, 25-First linear bearing, 26-Intermediate post, 27-Groove, 28-First sensor, 29-Allowing opening, 210-First positioning hole, 211-Second positioning hole;
[0029] 3-RF test apparatus, 31-RF test board, 32-RF test piece, 33-First positioning pin;
[0030] 4-First SIM card insertion device, 41-First driving component, 42-First moving frame, 43-First pressure sensor, 44-First mounting base, 45-First insertion component, 46-First SIM card, 47-Second cylinder, 48-Gripper, 49-Third positioning pin;
[0031] 5-First lifting module, 51-First cylinder, 52-Lifting plate, 53-Second sensor;
[0032] 6-ICT test device, 61-ICT test board, 62-ICT test piece, 63-Second positioning pin;
[0033] 7-Second SIM card insertion device, 71-Second driving component, 72-Second moving frame, 73-Second pressure sensor, 74-Second mounting base, 75-Second insertion component, 76-Fourth positioning pin, 77-Second SIM card;
[0034] 8-Second lifting module; 9-Frame. Detailed Implementation
[0035] Please refer to Figures 1-7 This embodiment is a multi-functional testing device 100. The multi-functional testing device 100 includes a frame 9, an indexing plate 1 disposed in the frame 9, and a plurality of loading modules 2 disposed in a ring at equal angles on the indexing plate 1. A loading and unloading station 30, a first testing station 40 and a second testing station 50 are provided along the rotation direction of the indexing plate 1.
[0036] The first test station 40 includes an RF test device 3 disposed above the loading module 2, a first SIM card insertion device 4 disposed on the RF test device 3, and a first lifting module 5 disposed below the indexing plate 1 and which pushes the loading module 2 upward to achieve mold closing between the loading module 2 and the RF test device 3.
[0037] The second testing station 50 includes an ICT testing device 6 disposed above the loading module 2, a second SIM card insertion device 7 disposed on the ICT testing device 6, and a second lifting module 8 disposed below the indexing plate 1, which pushes the loading module 2 upward to achieve mold closing between the loading module 2 and the ICT testing device 6.
[0038] The bottom of the indexing plate 1 is provided with a rotary drive component 11 that drives the indexing plate 1 to rotate. The upper surface of the indexing plate 1 is provided with a pneumatic slip ring 12. The pneumatic slip ring 12 rotates with the indexing plate 1. The function of the pneumatic slip ring 12 is to rotate 360° to conduct electricity or transmit signals.
[0039] The loading module 2 includes a carrier 21 located above the indexing plate 1, a plurality of first guide posts 22 fixed at the upper end on the carrier 21 and movably mounted on the indexing plate 1, and a plurality of elastic elements that cause the carrier 21 to return to its downward position. The lower end of the first guide post 22 is provided with a connecting plate 24. The upper end of the first guide post 22 is fixed to the carrier 21 by screws, and the lower end is fixed to the connecting plate 24 by screws. The upper end of the elastic element abuts against the lower surface of the indexing plate 1, and the lower end abuts against the upper surface of the connecting plate 24. The indexing plate 1 is provided with a first through hole for the first guide post 22 to move up and down. In order to facilitate the stable up and down movement of the first guide post 22, a first linear bearing 25 is provided in the first through hole. The first guide post 22 is movably mounted in the first through hole through the first linear bearing 25. The elastic element is a spring. To ensure the stability of the elastic element's up-and-down movement, the elastic element is sleeved on the intermediate column 26. The upper end of the intermediate column 26 passes through the indexing plate 1, and the lower end is connected to the connecting plate 24. The indexing plate 1 is provided with a second through hole for the intermediate column 26 to move up and down. When the loading module 2 rotates from the loading / unloading station 30 to the testing station, the lifting module lifts the connecting plate 24, thereby lifting the carrier 21 upward. At this time, the elastic element is compressed. After the test is completed, the lifting module resets, and the compressed elastic element expands, causing the carrier 21 to return to its original position downward and be located on the indexing plate 1.
[0040] The upper edge of the carrier 21 is provided with several first positioning holes 210 and the side is provided with second positioning holes 211; the lower part of the carrier 21 is provided with a first sensor 28 to sense whether a product is placed inside the carrier 21, and the carrier 21 is provided with a clearance opening 29 for the first sensor 28 to pass through the detection beam; the carrier 21 is provided with a slot 27 for accommodating the product, and the slot 27 is provided with a contour positioning structure for positioning the product. The contour positioning structure includes a positioning block, a positioning rod, a positioning groove, etc. The specific structure of the positioning block, positioning rod, and positioning groove is set according to the contour of the product, and the specific layout of the positioning block, positioning rod, and positioning groove is set according to the extension direction of the product, which is not limited here.
[0041] The first lifting module 5 and the second lifting module 8 have the same structure and both include a first cylinder 51 and a lifting plate 52 that is driven by the first cylinder to move up and down. The lifting plate 52 pushes the connecting plate 24 to move upward. A second sensor 53 that senses the rotation of the carrier 21 into position is provided on the side of the lifting plate 52.
[0042] The RF testing device 3 includes an RF test board 31 mounted on a frame 9 and an RF test piece 32 mounted on the RF test board 31 that can make contact with and conduct electricity with the product. The lower surface of the RF test board 31 is provided with a first positioning pin 33 that mates with the first positioning hole 210. The test piece 32 is a first test probe. The first test probe makes contact with the pin corner on the product and is electrically connected. The upper end of the first test probe is connected to an RF test line, which is placed at the upper end of the frame 9.
[0043] The ICT testing device 6 includes an ICT test board 61 mounted on a rack 9 and an ICT test piece 62 mounted on the ICT test board 61 that can make contact with and conduct electricity with the product. The lower surface of the ICT test board 61 is provided with a second positioning pin 63 that mates with the first positioning hole 210. The test piece ICT is a second test probe. The second test probe makes contact with the pin corner on the product and is electrically connected. The upper end of the second test probe is connected to an ICT test line, which is placed at the upper end of the rack 9.
[0044] The first SIM card insertion device 4 includes a first driving member 41 mounted on an RF test board 31 and a first moving frame 42 driven by the first driving member 41 to move horizontally. The first moving frame 42 is movably mounted below the RF test board 31 via a sliding rail slider. A first pressure sensor 43 and a first mounting base 44 are sequentially arranged horizontally on the side of the first moving frame 42 closest to the RF test board 31. A first insertion member 45 is mounted on the upper end of the first mounting base 44, and a third positioning pin 49, which mates with a second positioning hole 211, is mounted on the side of the first insertion member 45. A first SIM card 46, which extends into the product and makes contact with it, is mounted on the side of the first insertion member 45 closest to the carrier 21. The third positioning pin 49 precisely guides and positions the carrier 21, allowing the first SIM card 46 to be smoothly inserted into the product. The first pressure sensor 43 detects the pressure of the first SIM card 46 inserted into the product, preventing excessive pressure from damaging the product. The first driving member 41 is preferably a servo motor, capable of precisely controlling the insertion depth of the first SIM card 46.
[0045] Since the first connector 45 needs to be clamped up and down to trigger electrical conduction, a clamping assembly is provided on the first movable frame 42. The clamping assembly includes a second cylinder 47 and a pair of grippers 48 driven by the second cylinder 47 to clamp up and down or open.
[0046] The second SIM card insertion device 7 includes a second driving component 71 mounted on the ICT test board 61 and a second moving frame 72 driven by the second driving component 71 to move horizontally. The second moving frame 72 is movably mounted below the ICT test board 61 via a slide rail slider. A second pressure sensor 73 and a second mounting base 74 are sequentially arranged horizontally on the side of the second moving frame 72 closest to the ICT test board 61. A second insertion component 75 is mounted on the upper end of the second mounting base 74, and a fourth positioning pin 76, which mates with the second positioning hole 211, is mounted on the side of the second insertion component 75. A second SIM card 77, which extends into the product and makes contact with it, is mounted on the side of the second insertion component 75 closest to the carrier 21. The fourth positioning pin 76 precisely guides and positions the second SIM card 77 within the carrier 21, allowing it to be smoothly inserted into the product. The second pressure sensor 73 detects the pressure of the second SIM card 77 inserted into the product, preventing excessive pressure from damaging the product. The second driving component 71 is preferably a servo motor, capable of precisely controlling the insertion depth of the second SIM card 77.
[0047] When using the multifunctional testing equipment 100 provided in this solution, at the loading / unloading station 30, the product is placed into the slot 27 of the carrier 21. The contour positioning structure in the slot 27 positions the product. After the first sensor 28 detects that a product is placed in the carrier 21, the rotary drive 11 drives the indexing plate 1 to rotate, and the carrier 21 with the product rotates to the first testing station 40. After the second sensor 53 detects that the carrier 21 has rotated into place, the first cylinder drives the lifting plate 52 to push the connecting plate 24 upward, thereby pushing the carrier 21 upward so that the carrier 21 contacts the RF test plate 31 to close the mold. The first positioning pin 33 is inserted into the first positioning hole 210 for positioning. The RF test piece 32 is inserted into the product and makes contact with the product to conduct electricity. The first driving component 41 drives the first moving frame 42 to move horizontally, causing the third positioning pin 49 to insert into the second positioning hole 211 for positioning. The first SIM card 46 is inserted into the product and contacts the product. The first pressure sensor 43 detects the pressure of the first SIM card 46 inserted into the product. The second cylinder 47 drives the gripper 48 to clamp the first connector 45, causing the first connector 45 to be electrically connected. The other end of the RF test piece 32 and the first connector 45 are both connected to test leads. The product with the first SIM card 46 inserted is tested. After the test is completed, the first driving component 41 drives the first moving frame 42 to move horizontally, causing the first SIM card 46 to detach from the product. The first lifting module 5 resets downward, and the compressed elastic element extends, causing the carrier 21 to reset downward and be located on the indexing plate 1. The indexing plate 1 rotates, and the carrier 21 with the product on it rotates to the second test station 50. The first cylinder drives the lifting plate 52 to push the connecting plate 24 upward, thereby pushing the carrier 21 upward so that the carrier 21 is in contact with the ICT test board. 61. Contact mold closing, second positioning pin 63 is inserted into first positioning hole 210 for positioning, ICT test piece 62 is inserted into product and makes contact with product for electrical conduction, second drive piece 71 drives second moving frame 72 to move horizontally, so that fourth positioning pin 76 is inserted into second positioning hole 211 for positioning, second SIM card 77 is inserted into product and makes contact with product, second pressure sensor 73 detects the pressure of second SIM card 77 inserted into product, test wires are connected to the other end of ICT test piece 62 and second plug-in piece 75, the product with second SIM card 77 inserted is tested, after the test is completed, second drive piece 71 drives second moving frame 72 to move horizontally, so that second SIM card 77 is removed from product, second lifting module 8 is reset downward, compressed elastic element is stretched, so that carrier 21 is reset downward and located on indexing plate 1, indexing plate 1 is rotated, carrier 21 with product is rotated to loading and unloading station 30, the tested product is taken out, and a new product is put in for the next round of testing.
[0048] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.
Claims
1. A multifunctional testing device, characterized in that: It includes a frame, an indexing plate disposed within the frame, and several load modules arranged in a ring at equal angles on the indexing plate. Along the rotation direction of the indexing plate, there are loading and unloading stations, a first testing station, and a second testing station. The first test station includes an RF test device disposed above the loading module, a first SIM card insertion device disposed on the RF test device, and a first lifting module disposed below the indexing plate that pushes the loading module upward to achieve mold closing between the loading module and the RF test device. The second testing station includes an ICT testing device disposed above the loading module, a second SIM card insertion device disposed on the ICT testing device, and a second lifting module disposed below the indexing plate that pushes the loading module upward to achieve mold closing between the loading module and the ICT testing device.
2. The multifunctional testing device as described in claim 1, characterized in that: The loading module includes a carrier located above the indexing plate, a plurality of first guide posts fixed at the upper end on the carrier and movably arranged on the indexing plate, and a plurality of elastic elements for resetting the carrier downward. The lower end of the first guide post is provided with a connecting plate. The elastic elements are sleeved on the intermediate post, with the upper end of the elastic element abutting against the lower surface of the indexing plate and the lower end abutting against the upper surface of the connecting plate. The upper end of the intermediate post passes through the indexing plate and the lower end is connected to the connecting plate.
3. The multifunctional testing device as described in claim 2, characterized in that: The carrier is provided with a slot for accommodating the product, and the slot is provided with a contour positioning structure for positioning the product; the upper edge of the carrier is provided with a plurality of first positioning holes and the side is provided with second positioning holes; the lower part of the carrier is provided with a first sensor for sensing whether a product is placed inside the carrier, and the carrier is provided with an obstruction opening for the detection beam of the first sensor to pass through.
4. The multifunctional testing device as described in claim 2, characterized in that: The first lifting module and the second lifting module have the same structure and both include a first cylinder and a lifting plate that is driven by the first cylinder to move up and down. The lifting plate pushes the connecting plate to move upward. A second sensor that senses the rotation of the vehicle into position is provided on the side of the lifting plate.
5. The multifunctional testing device as described in claim 3, characterized in that: The RF testing device includes an RF test board mounted on the frame and an RF test piece mounted on the RF test board that can contact and conduct with the product. The lower surface of the RF test board is provided with a first positioning pin that mates with the first positioning hole.
6. The multifunctional testing device as described in claim 3, characterized in that: The ICT testing device includes an ICT test board mounted on the rack and an ICT test piece mounted on the ICT test board that can contact and communicate with the product. The lower surface of the ICT test board is provided with a second positioning pin that cooperates with the first positioning hole.
7. The multifunctional testing device as described in claim 5, characterized in that: The first SIM card insertion device includes a first driving component disposed on the RF test board and a first movable frame that moves horizontally driven by the first driving component. The first movable frame is movably disposed below the RF test board via a slide rail slider. A first pressure sensor and a first mounting base are sequentially disposed horizontally on the side of the first movable frame near the RF test board. A first connector is disposed at the upper end of the first mounting base and a third positioning pin that mates with the second positioning hole is disposed on the side of the first connector. A first SIM card that extends into the product and contacts and communicates with the product is disposed on the side of the first connector near the carrier.
8. The multifunctional testing device as described in claim 7, characterized in that: The first movable frame is provided with a clamping assembly, which includes a second cylinder and a pair of grippers that are driven by the second cylinder to clamp or open.
9. A multifunctional testing device as described in claim 6, characterized in that: The second SIM card insertion device includes a second driving component disposed on the ICT test board and a second moving frame that moves horizontally driven by the second driving component. The second moving frame is movably disposed below the ICT test board via a slide rail slider. A second pressure sensor and a second mounting base are sequentially disposed horizontally on the side of the second moving frame near the ICT test board. A second connector is disposed at the upper end of the second mounting base and a fourth positioning pin that mates with the second positioning hole is disposed on the side. A second SIM card that extends into the product and contacts and communicates with the product is disposed on the side of the second connector near the carrier.
10. A multifunctional testing device as described in claim 2, characterized in that: The bottom of the indexing plate is provided with a rotary drive component for driving the indexing plate to rotate. The upper surface of the indexing plate is provided with a pneumatic slip ring. The indexing plate is provided with a first through hole for the first guide post to move up and down and a second through hole for the intermediate post to move up and down.
Citation Information
Patent Citations
Test device
CN218158145U
Cited By
Apparatus for micro module testing
CN122449329A