High-speed data transmission core wire
By forming a cavity on the inner conductor and filling it with coolant, combined with the design of a shielding layer and an outer sheath, the problem of low utilization of the inner conductor is solved, achieving higher electrical performance and reduced production costs.
Patent Information
- Application Number
- CN202423045208.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-10
AI Technical Summary
Existing transmission core wires have low inner conductor utilization when transmitting high-frequency signals, resulting in poor electrical performance.
A cavity extending along the length direction is formed on the inner conductor and filled with coolant. A shielding layer and an outer sheath are added. The ground wire can be set between the insulation layer and the shielding layer or between the shielding layer and the outer sheath. The ground wire can also form a cavity.
This improves the utilization rate of the inner conductor, reduces the overall weight and production cost of the high-speed data transmission core wire, and maintains transmission performance without affecting it.
Smart Images
Figure CN223651171U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of communication wires and cables, specifically to a high-speed data transmission core wire. Background Technology
[0002] With the rapid development of the information industry, the requirements for the transmission performance of electronic devices are getting higher and higher, and the requirements for transmission core wires are also getting higher and higher, with a desire for smaller transmission core wires and higher electrical performance.
[0003] In the prior art, transmission core wire generally includes an inner conductor and an insulating layer covering the inner conductor. When transmitting high-frequency signals, due to the skin effect of high-frequency signals, the high-frequency signals are only transmitted on the surface of the inner conductor, resulting in low utilization of the inner conductor. Utility Model Content
[0004] This application provides a high-speed data transmission core wire to solve the technical problem of low utilization rate of existing inner conductors.
[0005] To address the aforementioned technical problems, this application provides a high-speed data transmission core wire, comprising at least one inner conductor and an insulating layer covering the inner conductor, wherein the inner conductor forms a cavity extending along the length direction of the inner conductor.
[0006] In one embodiment, the cavity is filled with coolant.
[0007] In one embodiment, the cavity is coaxially arranged with the inner conductor.
[0008] In one embodiment, the high-speed data transmission core wire further includes a shielding layer, an outer sheath, and at least one ground wire. The shielding layer covers the insulating layer, the outer sheath covers the shielding layer, and the ground wire is disposed between the insulating layer and the shielding layer, or between the shielding layer and the outer sheath.
[0009] In one embodiment, the ground wire has an inner cavity extending along the length of the ground wire.
[0010] In one embodiment, the insulating layer is any one of polyethylene insulating layer, foamed polyethylene insulating layer, polypropylene insulating layer, foamed polypropylene insulating layer, perfluoroethylene propylene insulating layer, foamed perfluoroethylene propylene insulating layer, polytetrafluoroethylene insulating layer, foamed polytetrafluoroethylene insulating layer, microporous polytetrafluoroethylene insulating layer, and fusible polytetrafluoroethylene insulating layer.
[0011] In one embodiment, the insulating layer includes a first sub-insulating layer and a second sub-insulating layer, the first sub-insulating layer covering the inner conductor, the second sub-insulating layer covering the first sub-insulating layer, and the shielding layer covering the second sub-insulating layer.
[0012] In one embodiment, the shielding layer includes a hot-melt self-adhesive aluminum foil layer, a hot-melt self-adhesive copper foil layer, a hot-melt self-adhesive silver-plated copper foil layer, a hot-melt self-adhesive tin-plated copper foil layer, or a hot-melt self-adhesive tin-plated aluminum foil layer.
[0013] In one embodiment, the cross-sectional area of the cavity is greater than or equal to one-eighth of the cross-sectional area of the inner conductor and less than or equal to four-fifths of the cross-sectional area of the inner conductor.
[0014] In one embodiment, there are multiple inner conductors, which are arranged in parallel and spaced apart, and each inner conductor has a cavity.
[0015] The beneficial effects of this application are: the high-speed data transmission core wire provided by this application has a cavity extending along the length of the inner conductor, which not only does not affect the transmission performance of the high-speed data transmission core wire, but also improves the utilization rate of the inner conductor and significantly reduces the overall weight of the high-speed data transmission core wire, thereby reducing production costs. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0017] Figure 1 This is a cross-sectional schematic diagram of a high-speed data transmission core wire according to one embodiment of this application;
[0018] Figure 2 This is a cross-sectional schematic diagram of a high-speed data transmission core wire according to another embodiment of this application;
[0019] Figure 3 This is a cross-sectional schematic diagram of a high-speed data transmission core wire in another embodiment of this application. Detailed Implementation
[0020] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.
[0021] The terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. A process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.
[0022] In this document, the term "implementation" means that a specific feature, structure, or characteristic described in connection with an implementation may be included in at least one implementation of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same implementation, nor is it a separate or alternative implementation mutually exclusive with other implementations. It will be explicitly and implicitly understood by those skilled in the art that the implementations described herein can be combined with other implementations.
[0023] Please see Figure 1 This application provides a high-speed data transmission core wire 10, which includes at least one inner conductor 100 and an insulating layer 200 covering the inner conductor 100. Each inner conductor 100 has a cavity 110 extending along its length, meaning each inner conductor 100 is a hollow structure. Compared with the prior art, the high-speed data transmission core wire 10 provided by this application, because the inner conductor 100 has a cavity 110 extending along its length, does not affect the transmission performance of the high-speed data transmission core wire 10, improves the utilization rate of the inner conductor 100, and significantly reduces the overall weight of the high-speed data transmission core wire 10, thereby reducing production costs.
[0024] Optionally, the material used to make the inner conductor 100 may include, but is not limited to, any one of silver-plated copper, tin-plated copper, bare copper, tin-plated copper-clad steel, tin-plated copper-clad aluminum, silver-plated copper-clad steel, silver-plated copper-clad aluminum, and aluminum-magnesium alloy conductors; and the cross-sectional shape of the inner conductor 100 may be any one of circular, elliptical, flat, or other shapes.
[0025] The number of inner conductors 100 can be multiple, and these multiple inner conductors 100 are arranged in parallel and spaced apart. For example, in... Figure 2 In the middle, there are two inner conductors 100, which are arranged in parallel and spaced apart, and each inner conductor 100 forms a cavity 110.
[0026] Optionally, the cavity 110 and the inner conductor 100 are coaxially arranged. For example, if the cross-sectional shape of the inner conductor 100 is circular, then the cross-sectional shape of the cavity 110 is also circular, and the center of the cross-section of the inner conductor 100 overlaps with the center of the cross-section of the cavity 110, so that the thickness of the inner conductor 100 remains consistent in all directions, thus avoiding affecting the transmission performance of the high-speed data transmission core wire 10.
[0027] Optionally, the cross-sectional area of the cavity 110 is greater than or equal to one-eighth of the cross-sectional area of the inner conductor 100 and less than or equal to four-fifths of the cross-sectional area of the inner conductor 100. For example, if the inner conductor 100 is a tubular hollow structure, its inner diameter is greater than or equal to one-third of its outer diameter and less than or equal to two-thirds of its outer diameter.
[0028] Furthermore, the cavity 110 is filled with coolant, which is a non-conductive liquid to prevent interference with the signal transmission of the inner conductor 100. The coolant can absorb the heat generated by the inner conductor 100 during signal transmission, ensuring that the high-speed data transmission core wire 10 transmits signals in a low-temperature environment and reducing wire attenuation.
[0029] Furthermore, the coolant filling the cavity 110 is a circulating coolant. For example, cooling pipes are connected to both ends of the inner conductor 100, with coolant filling one end of the inner conductor 100 and coolant exiting the other end, thereby carrying away the heat generated by the inner conductor 100 during signal transmission and further improving heat dissipation efficiency.
[0030] Optionally, the insulation layer 200 may be any one of the following: polyethylene insulation layer, foamed polyethylene insulation layer, polypropylene insulation layer, foamed polypropylene insulation layer, perfluoroethylene propylene insulation layer, foamed perfluoroethylene propylene insulation layer, polytetrafluoroethylene insulation layer, foamed polytetrafluoroethylene insulation layer, microporous polytetrafluoroethylene insulation layer, and fusible polytetrafluoroethylene insulation layer.
[0031] Furthermore, such as Figure 2As shown, the high-speed data transmission core wire 10 also includes a shielding layer 300, an outer sheath 400, and at least one ground wire 500. The shielding layer 300 covers the insulation layer 200, the outer sheath 400 covers the shielding layer 300, and the ground wire 500 can be disposed between the shielding layer 300 and the outer sheath 400. It should be noted that in other embodiments, the ground wire 500 can also be disposed between the insulation layer 200 and the shielding layer 300.
[0032] Furthermore, such as Figure 3 As shown, the insulating layer 200 includes a first sub-insulating layer 210 and a second sub-insulating layer 220. The first sub-insulating layer 210 covers the inner conductor 11, and the second sub-insulating layer 220 covers the first sub-insulating layer 210. The shielding layer 300 covers the second sub-insulating layer 220. The first sub-insulating layer 210 and the second sub-insulating layer 220 can further improve the security of the data transmission line 100.
[0033] Optionally, the shielding layer 300 can be any one of the following: a hot-melt self-adhesive aluminum foil layer, a hot-melt self-adhesive copper foil layer, a hot-melt self-adhesive silver-plated copper foil layer, a hot-melt self-adhesive tin-plated copper foil layer, or a hot-melt self-adhesive tin-plated aluminum foil layer. The shielding layer 300 can be wrapped around the second sub-insulating layer 220 or directly wrapped.
[0034] Furthermore, the shielding layer 300 includes a first metal strip, a plastic base strip, and a second metal strip, which are sequentially stacked, with the first metal strip positioned on the side of the plastic base strip closest to the second sub-insulation layer 220. This shielding layer 300 reduces the amount of metal material used, lowering the production cost of the shielding layer 300, thereby making the high-speed data transmission core wire 10 low-cost and widely applicable.
[0035] Optionally, the first metal strip may include a copper-based strip or a silver-based strip, which may be electroplated onto the plastic base strip or hot-dip plated onto the plastic base strip, thereby ensuring good conductivity of the shielding layer 300. It should be noted that in other embodiments, the first metal strip may also include a copper base layer and a silver base layer, with the copper base layer and the silver base layer stacked together.
[0036] Optionally, the thickness of the first metal strip is less than or equal to 3 μm, thereby further controlling the production cost of the shielding layer 300.
[0037] Optionally, the plastic base tape may include a PET film layer, a PP film layer, or other polymer film layers, thereby reducing the production cost of the shielding layer 300. It should be noted that in other embodiments, the plastic base tape may also include a PET film layer and a PP film layer, with the PET film layer and PP film layer stacked together.
[0038] Optionally, the second metal strip includes an aluminum base strip, which can be electroplated onto the plastic base strip or hot-dip galvanized onto the plastic base strip, thereby ensuring that the shielding layer 300 has sufficient mechanical strength and good bending resistance.
[0039] Optionally, the thickness of the second metal strip is greater than or equal to 7 μm, thereby further controlling the production cost of the shielding layer 300.
[0040] Optionally, the outer sheath 400 can be any one of the following: a plastic Mylar tape outer sheath, a polyethylene outer sheath, a polytetrafluoroethylene outer sheath, a perfluoroethylene propylene outer sheath, or a polyolefin outer sheath.
[0041] Optionally, the materials used to make the ground wire 500 include, but are not limited to, any one of the following: silver-plated copper, tin-plated copper, bare copper, tin-plated copper-clad steel, tin-plated copper-clad aluminum, silver-plated copper-clad steel, silver-plated copper-clad aluminum, and aluminum-magnesium alloy conductors. The cross-sectional shape of the ground wire 500 can be any one of the following: circular, elliptical, flat, or other shapes.
[0042] It is understandable that when the ground wire 500 is located between the shielding layer 300 and the outer sheath 400, the ground wire 500 is electrically connected to the second metal; when the ground wire 500 is located between the insulating layer 200 and the shielding layer 300, the ground wire 500 is electrically connected to the first metal.
[0043] Furthermore, the ground wire 500 has an inner cavity 510 extending along the length of the ground wire 500, that is, the ground wire 500 is also a hollow structure, thereby further reducing the overall weight of the high-speed data transmission core wire 10 and reducing production costs.
[0044] Compared with the prior art, the high-speed data transmission core wire 10 provided in this application has a cavity 110 extending along the length direction of the inner conductor 100, which not only does not affect the transmission performance of the high-speed data transmission core wire 10, but also improves the utilization rate of the inner conductor 100 and significantly reduces the overall weight of the high-speed data transmission core wire 10, thereby reducing production costs.
[0045] The above description is only a partial embodiment of this application and does not limit the scope of protection of this application. Any equivalent device or equivalent process transformation made based on the content of this application specification and drawings, or directly or indirectly applied to other related technical fields, are similarly included within the scope of patent protection of this application.
Claims
1. A high-speed data transmission core wire, characterized in that, It includes at least one inner conductor and an insulating layer covering the inner conductor, wherein the inner conductor forms a cavity extending along the length direction of the inner conductor.
2. The high-speed data transmission core wire according to claim 1, characterized in that, The cavity is filled with coolant.
3. The high-speed data transmission core wire according to claim 1, characterized in that, The cavity is coaxially arranged with the inner conductor.
4. The high-speed data transmission core wire according to claim 1, characterized in that, The high-speed data transmission core wire further includes a shielding layer, an outer sheath, and at least one ground wire. The shielding layer covers the insulating layer, the outer sheath covers the shielding layer, and the ground wire is disposed between the insulating layer and the shielding layer, or between the shielding layer and the outer sheath.
5. The high-speed data transmission core wire according to claim 4, characterized in that, The ground wire has an inner cavity extending along its length.
6. The high-speed data transmission core wire according to claim 4, characterized in that, The insulation layer is any one of the following: polyethylene insulation layer, foamed polyethylene insulation layer, polypropylene insulation layer, foamed polypropylene insulation layer, perfluoroethylene propylene insulation layer, foamed perfluoroethylene propylene insulation layer, polytetrafluoroethylene insulation layer, foamed polytetrafluoroethylene insulation layer, microporous polytetrafluoroethylene insulation layer, and fusible polytetrafluoroethylene insulation layer.
7. The high-speed data transmission core wire according to claim 4, characterized in that, The insulating layer includes a first sub-insulating layer and a second sub-insulating layer. The first sub-insulating layer covers the inner conductor, the second sub-insulating layer covers the first sub-insulating layer, and the shielding layer covers the second sub-insulating layer.
8. The high-speed data transmission core wire according to claim 4, characterized in that, The shielding layer includes a hot-melt self-adhesive aluminum foil layer, a hot-melt self-adhesive copper foil layer, a hot-melt self-adhesive silver-plated copper foil layer, a hot-melt self-adhesive tin-plated copper foil layer, or a hot-melt self-adhesive tin-plated aluminum foil layer.
9. The high-speed data transmission core wire according to claim 1, characterized in that, The cross-sectional area of the cavity is greater than or equal to one-eighth of the cross-sectional area of the inner conductor and less than or equal to four-fifths of the cross-sectional area of the inner conductor.
10. The high-speed data transmission core wire according to claim 1, characterized in that, The number of inner conductors is multiple, and the multiple inner conductors are arranged in parallel and spaced apart, and each inner conductor forms a cavity.