Megasonic cleaning device for wafer processing

Abstract

The utility model relates to a megasonic cleaning device for wafer processing, and belongs to the technical field of wafer processing equipment. Wherein the upper rotating device is provided with a driving assembly and an infrared heater and is used for rotating and drying a wafer; the bonding device is provided with a pressure head with a pressure sensor and a driving mechanism, and pressure is applied to realize wafer bonding; the cleaning device comprises left and right swing arms and a cleaning nozzle and has megasonic cleaning and other functions; the buffer device supports and buffers the wafer; the lower rotating device drives the wafer to rotate; the alignment device, the vibration motor and the tilting device are matched, and wafer alignment is achieved after upper and lower wafers are cleaned and before bonding is completed; the up-and-down moving device adjusts the position of the wafer. According to the megasonic cleaning device, the megasonic technology is utilized, and efficient and accurate wafer cleaning can be ensured.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment technology, and in particular to a mega-sound cleaning device for wafer processing. Background Technology

[0002] With the development of the wafer processing field, semiconductor cleaning technology has emerged, which introduces a series of related equipment and methods to improve cleaning efficiency and wafer processing quality.

[0003] In related technologies, wafers are typically subjected to a multi-step cleaning process, including soaking, rinsing, and drying, and various mechanical or chemical methods are used to optimize these steps.

[0004] However, the aforementioned cleaning methods or related devices still have some shortcomings. For example, during wafer drying, temperature changes or uneven airflow may lead to poor drying results; wafer protection measures during processing may be inadequate, easily causing damage; the alignment accuracy of the upper and lower wafers before bonding may be insufficient, affecting the subsequent bonding quality; and the cleaning method itself may have limitations, such as the selection of cleaning solution, control of cleaning frequency and intensity, all of which may affect the cleaning effect and wafer performance.

[0005] To address these issues, it is urgent to develop a mega-acoustic cleaning device for wafer processing. Utility Model Content

[0006] In response to the shortcomings of the existing production technology, the applicant provides a mega-sound cleaning device for wafer processing, thereby protecting the wafer during the processing, aligning the upper and lower wafers before bonding, and offering high operability.

[0007] The technical solution adopted in this utility model is as follows: A mega-acoustic cleaning device for wafer processing, comprising:

[0008] The upper rotation device includes a drive assembly for driving the wafer to rotate and an infrared heater for drying the wafer;

[0009] A bonding apparatus includes a pressure head for applying pressure to a wafer and a drive mechanism for driving the pressure head to move, the pressure head being equipped with a pressure sensor;

[0010] The cleaning device includes a left swing arm and a right swing arm. The left swing arm is equipped with a pre-cleaning nozzle with two pipelines, and the right swing arm is equipped with a mega-sound cleaning nozzle and a purging nozzle.

[0011] A buffer device, located on the wafer transport path, is used to support and buffer the wafer;

[0012] The lower rotation device includes a drive assembly for driving the wafer to rotate;

[0013] Alignment device, used to align upper and lower wafers before wafer bonding;

[0014] A vertical movement device is used to adjust the position of the wafer in the vertical direction;

[0015] A tilting device used to adjust the tilt angle of the wafer on a horizontal plane;

[0016] The power supply provides electrical support for the entire megason cleaning unit.

[0017] In one embodiment, the drive assembly of the upper rotating device includes an upper servo motor and an upper silicon wafer chuck, the upper servo motor driving the upper silicon wafer chuck to rotate; the infrared heater is disposed in the upper shaft fixing chamber.

[0018] In one embodiment, the driving mechanism of the bonding device includes a motor and a transmission assembly, wherein the motor drives the pressure head to move up and down or rotate through the transmission assembly.

[0019] In one embodiment, the right swing arm also includes an ionized water and a purging mechanism; the left and right swing arms are driven by motors to achieve precise control over the cleaning area and cleaning time.

[0020] In one embodiment, the mega-sound cleaning nozzle on the right swing arm generates high-frequency vibrations through mega-sound technology, transforming tiny bubbles in the cleaning fluid into strong shock waves to clean the wafer surface.

[0021] In one embodiment, the buffer device includes a wafer tray and a waterproof sleeve for supporting the wafer and preventing leakage of cleaning fluid.

[0022] In one embodiment, the lower rotation device includes a lower servo motor and a lower silicon wafer suction cup, wherein the lower servo motor drives the lower silicon wafer suction cup to rotate.

[0023] In one embodiment, the alignment device includes an ejection assembly and a vibration motor. The ejection assembly is used to eject the wafer, and the vibration motor is used to perform vibration alignment after the wafer is ejected. The alignment device cooperates with a tilting device to align the upper and lower wafers after cleaning and before bonding.

[0024] In one embodiment, the infrared heater includes an infrared lamp cover with an infrared lamp built into it for rapidly drying the wafer.

[0025] In one embodiment, a main control unit is also included, which is electrically connected to the megasonic cleaning device. The main control unit sets specific operations to realize the cleaning process.

[0026] The beneficial effects of this utility model are as follows:

[0027] This invention has a reasonable structure and is easy to operate, enabling the wafer to operate stably and efficiently throughout the cleaning process, thus improving cleaning efficiency.

[0028] This utility model also has the following advantages:

[0029] (1) The cleaning device has multiple functions such as mega-sound cleaning, ion water cleaning and purging, which can be selected and adjusted according to actual needs, thus enhancing the flexibility of the device.

[0030] (2) The design of the buffer device and the alignment device effectively avoids damage to the wafer during the cleaning process and improves the quality of the wafer;

[0031] (3) By setting specific operations through the main control unit, a fully automatic cleaning process is achieved, which reduces manual intervention and improves production efficiency and consistency. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0033] Figure 2 This is a schematic diagram of the specific structure of the upper rotating mechanism of this utility model.

[0034] Figure 3 This is a cross-sectional schematic diagram of the working area of ​​the upper rotating mechanism of this utility model.

[0035] Figure 4 This is a view showing the bonding mechanism, cleaning mechanism, and buffer mechanism of this utility model in combination.

[0036] Figure 5 This is a schematic diagram of the bonding mechanism of this utility model.

[0037] Figure 6 This is a schematic diagram of the specific structure of the cleaning mechanism of this utility model.

[0038] Figure 7 This is a schematic diagram of the specific structure of the buffer mechanism of this utility model.

[0039] Figure 8 This is a schematic diagram of the specific structure of the lower rotating mechanism of this utility model.

[0040] Figure 9 This is a schematic diagram of the specific structure of the alignment mechanism of this utility model.

[0041] Figure 10 This is a schematic diagram of the specific structure of the ejector component in the alignment mechanism of this utility model.

[0042] Figure 11 This is a schematic diagram of the specific structure of the up-and-down moving mechanism of this utility model.

[0043] Figure 12 This is a schematic diagram of the tilting mechanism of this utility model.

[0044] The components include: 1. Upper rotating mechanism; 2. Bonding mechanism; 3. Cleaning mechanism; 4. Buffering mechanism; 5. Lower rotating mechanism; 6. Alignment mechanism; 7. Up and down moving mechanism; 8. Tilting mechanism; 9. Ventilation duct;

[0045] 101. Lower bearing housing; 102. Lower shaft cover plate; 103. Lip seal cover plate; 104. First air pipe connector; 105. Upper rotating shaft fixing plate; 106. Upper shaft fixing chamber; 107. Radiant lamp cover plate; 108. Quartz heater; 109. Infrared lamp cover; 110. Internal exhaust flange; 111. Upper silicon wafer suction cup; 112. Silicon wafer; 113. Upper adapter shaft; 114. Upper servo motor; 115. Upper shaft cover plate; 116. Upper bearing housing; 117. Protective cover; 118. First coupling; 119. Upper rotation induction plate;

[0046] 201. Screw; 202. Spring; 203. Pressure sensor; 204. Pressure head; 205. Pressure sensor pull rod; 206. Pressure head mounting plate; 207. Pressure head rotating rod; 208. Pressure head swing arm mechanism base plate; 209. Pressure head lifting fixing plate; 210. Pressure head swing arm photoelectric switch contact plate; 211. First slotted photoelectric switch; 212. Pressure head driven flange; 213. Pressure head motor suspension arm; 214. Second coupling; 215. Pressure head swing arm motor flange; 216. Swing arm motor; 217. Pressure head lifting motor fixing plate; 218. Pressure head photoelectric switch baffle; 219. Aluminum profile; 220. Second slotted photoelectric switch; 221. Stepper screw motor;

[0047] 301. Right arm swing; 302. Left arm swing;

[0048] 3011. Megasonic cleaning nozzle rotating rod; 3012. Megasonic cleaning swing rod sealing plug; 3013. Megasonic nozzle swing rod; 3014. Megasonic cleaning nozzle retaining ring; 3015. Megasonic cleaning nozzle;

[0049] 3021. Pre-cleaning swing arm sealing plug; 3022. Pre-cleaning nozzle rotating rod; 3023. Pre-cleaning nozzle mounting block; 3024. Air pipe; 3025. Pre-cleaning nozzle mounting rod; 3026. Pre-cleaning nozzle adjusting block; 3027. Pre-cleaning nozzle fixing block; 3028. Pre-cleaning nozzle pressure plate;

[0050] 401. Wafer tray; 402. Waterproof tray sleeve; 403. Tray motor shaft; 404. Bearing with mounting plate; 405. Synchronous pulley; 406. Flat key;

[0051] 501. First wafer positioning post; 502. Second wafer positioning post; 503. Third wafer positioning post; 504. Lower silicon wafer chuck; 505. Sealing ring; 506. Shaft fixing chamber; 507. Second air pipe connector; 508. Bearing housing; 509. Bearing housing cover plate; 510. Lower rotation sensor plate; 511. Lower adapter shaft; 512. Lower shaft fixing plate; 513. Third coupling; 514. Motor fixing plate; 515. Lower servo motor;

[0052] 601. Lower water baffle; 602. Visible glass pressure plate; 603. Visible window sealing gasket; 604. Visible glass; 605. L-tube; 606. Liquid level sensor; 607. Ejection assembly; 608. Upper inner plate; 609. Double-ear support; 610. Linear bearing; 611. Vibration motor;

[0053] 6071, Pen-shaped cylinder; 6072, Pressure reducing valve; 6073, Propulsion cylinder mounting bracket; 6074, Top head;

[0054] 701. Upper spindle working area; 702. Corundum-plated optical shaft; 703. Optical shaft connecting plate; 704. Lifting mechanism reinforcing rib; 705. Slider reinforcing rib; 706. Lifting module movable connecting plate; 707. Lifting module mounting back plate; 708. Lifting module base plate; 709. Module reinforcing rib;

[0055] 801. Cylinder frame; 802. Cylinder mounting base; 803. Tilting cylinder; 804. Output connection terminal. Detailed Implementation

[0056] The specific embodiments of this utility model are described below with reference to the accompanying drawings.

[0057] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0059] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0060] It should be understood that although the terms "first," "second," etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this invention, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0061] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0062] like Figure 1 The accompanying drawing shows a schematic diagram of the structure of a mega-acoustic cleaning device for wafer processing according to an embodiment of the present invention; for ease of description, the drawing only shows the structure related to the embodiment of the present invention.

[0063] In this embodiment, a megaphonic cleaning apparatus for wafer processing is provided, including an upper rotation mechanism 1, a bonding mechanism 2, a cleaning mechanism 3, a buffer mechanism 4, a lower rotation mechanism 5, an alignment mechanism 6, an up-down moving mechanism 7, a tilting mechanism 8, and a main control unit (not shown in the figure).

[0064] Combination Figures 2-3 The diagram shows the specific structure of the upper rotating mechanism 1, which includes:

[0065] Lower bearing housing 101: Supports the lower part of the upper rotating mechanism 1;

[0066] Lower shaft cover plate 102: Covers the lower bearing housing 101 and protects the internal components;

[0067] Lip seal 103: Prevents liquid or impurities from entering the bearing section;

[0068] First air pipe connector 104: Connects to the air source for pneumatic balance during wafer rotation;

[0069] Upper shaft fixing plate 105: Fixes the position of the upper shaft;

[0070] Upper shaft fixed chamber 106: accommodates and fixes the upper rotating assembly;

[0071] Radiant lamp cover 107: Protects the internal heating element;

[0072] Quartz heater 108: generates heat for wafer drying;

[0073] Infrared lamp cover 109: Built-in infrared lamp, which heats the wafer through infrared radiation;

[0074] Internal exhaust flange 110: Connects to the exhaust system to remove moisture generated by heating;

[0075] Silicon wafer chuck 111: Fixes the wafer by vacuum adsorption;

[0076] Silicon wafer 112: Wafer to be processed;

[0077] Upper adapter shaft 113: connects the upper servo motor 114 and the upper silicon wafer chuck 111;

[0078] Upper servo motor 114: drives the upper silicon wafer chuck 111 to rotate;

[0079] Upper shaft cover plate 115: covers the top of the upper shaft fixing chamber 106;

[0080] Upper bearing housing 116: supports the rotating shaft of the upper servo motor 114;

[0081] Protective cover 117: Protects the rotating mechanism from external interference;

[0082] First coupling 118: connects the upper servo motor 114 and the upper adapter shaft 113;

[0083] Upper rotation sensor 119: detects the rotational position of the upper rotation mechanism 1;

[0084] Specifically, the lower bearing housing 101 serves as a support structure and is installed at the bottom of the mechanism; the lower shaft cover 102 covers the lower bearing housing 101 to protect the internal components; the lip seal cover 103 is installed on the bearing section to prevent liquid or impurities from entering; the first air pipe connector 104 connects to the air source to provide pneumatic balance for the upper silicon wafer suction cup 111; the upper rotating shaft fixing plate 105 fixes the position of the upper rotating shaft, while the upper shaft fixing chamber 106 accommodates and fixes the upper rotating assembly; the radiation lamp cover 107 protects the internal quartz heater 108 and infrared lamp cover 109, the latter housing an infrared lamp for drying the silicon wafer 112; the internal exhaust... The air flange 110 is connected to the exhaust system to discharge the moisture generated by heating; the upper silicon wafer suction cup 111 fixes the silicon wafer 112 by vacuum adsorption, while the upper adapter shaft 113 connects the upper servo motor 114 and the upper silicon wafer suction cup 111, and is driven to rotate by the upper servo motor 114; the upper shaft cover plate 115 covers the top of the upper shaft fixing chamber 106, and the upper bearing box 116 supports the rotating shaft of the upper servo motor 114; the protective cover 117 protects the entire rotating mechanism from external interference; the first coupling 118 connects the upper servo motor 114 and the upper adapter shaft 113, while the upper rotation sensing plate 119 is used to detect the rotation position of the upper rotating mechanism 1.

[0085] In this embodiment, for example, a ventilation pipe 9 is connected to the outer housing of the upper rotating mechanism 1 on one side of the upper rotating mechanism 1.

[0086] Combination Figures 4-5 The diagram shows the specific structure of bonding mechanism 2, which includes:

[0087] Screw 201: Fixes the pressure head 204 in the bonding mechanism 2 onto the pressure head mounting plate 206;

[0088] Spring 202: Located on the upper part of the pressure head 204, providing cushioning for the movement of the pressure head 204;

[0089] Pressure sensor 203: Monitors the pressure exerted on the wafer by the pressure head 204;

[0090] Pressure head 204: applies pressure to the wafer to achieve bonding;

[0091] Pressure sensor pull rod 205: connects pressure sensor 203 and pressure head 204;

[0092] Pressure head mounting plate 206: Fixes the pressure head 204;

[0093] Indenter rotating rod 207: enables the indenter 204 to rotate;

[0094] The base plate 208 of the pressure head swing arm mechanism is located at the lower part of the pressure head rotating rod 207 and is used to support the swing arm mechanism.

[0095] Pressure head lifting fixing plate 209: a lifting mechanism for fixing the pressure head 204;

[0096] Contact plate 210 of photoelectric switch for pressure head swing arm: works with photoelectric switch to detect the position of pressure head 204;

[0097] First slotted photoelectric switch 211: detects the horizontal position of pressure head 204;

[0098] Pressure head driven flange 212: connects pressure head 204 and other transmission components;

[0099] Pressure head motor suspension arm 213: supports the drive motor;

[0100] Second coupling 214: connects the motor and the drive shaft;

[0101] Flange 215 for pressure head swing arm motor: Fixed swing arm motor 216;

[0102] Swing arm motor 216: drives the swing arm movement of pressure head 204;

[0103] Pressure head lifting motor fixing plate 217: Fixes stepper screw motor 221;

[0104] Pressure head photoelectric switch baffle 218: works in conjunction with the photoelectric switch to control the lifting and lowering of the pressure head 204;

[0105] Aluminum profile 219: Structural frame supporting and fixing bonding mechanism 2;

[0106] Second slotted photoelectric switch 220: detects the vertical position of pressure head 204;

[0107] Stepper screw motor 221: As a lifting motor, it drives the pressure head 204 to lift and lower via the screw.

[0108] Specifically, screw 201 is used to fix the pressure head 204 to the pressure head mounting plate 206; spring 202 is set on the upper part of the pressure head 204 to provide a buffering effect; pressure sensor 203 monitors the pressure of the pressure head 204 on the wafer and is connected to the pressure head 204 through pressure sensor pull rod 205; pressure head mounting plate 206 fixes the pressure head 204, while pressure head rotating rod 207 enables the pressure head 204 to rotate; pressure head swing arm mechanism base plate 208 supports the swing arm mechanism, and pressure head lifting fixing plate 209 fixes the lifting mechanism of the pressure head 204; pressure head swing arm photoelectric switch contact plate 210 cooperates with photoelectric switch to detect the position of pressure head 204; first slotted photoelectric switch 211 detects the horizontal position of pressure head 204. Position: The driven flange 212 of the pressure head connects the pressure head 204 and other transmission components; the pressure head motor suspension arm 213 supports the drive motor; the second coupling 214 connects the swing arm motor 216 and the drive shaft; the pressure head swing arm motor flange 215 fixes the swing arm motor 216, and the swing arm motor 216 drives the swing arm movement of the pressure head 204; the pressure head lifting motor fixing plate 217 fixes the stepper screw motor 221; the pressure head photoelectric switch baffle 218 cooperates with the photoelectric switch to control the lifting of the pressure head 204; the aluminum profile 219 supports and fixes the structural frame of the bonding mechanism 2; the second slotted photoelectric switch 220 detects the vertical position of the pressure head 204; the stepper screw motor 221 drives the pressure head 204 to lift through the screw.

[0109] Combination Figure 4 and Figure 6 The diagram shows the specific structure of the cleaning mechanism 3, which includes:

[0110] The right swing arm 301 is used to install the megasonic cleaning nozzle 3015, and the left swing arm 302 is used to install the pre-cleaning nozzle.

[0111] Specifically, the structure of the right swing arm 301 includes a mega-sound cleaning nozzle 3015 and a purge nozzle:

[0112] Megson cleaning nozzle rotating rod 3011: enables the Megson cleaning nozzle 3015 to rotate;

[0113] Zhaosheng Cleaning Swing Rod Sealing Plug 3012: Prevents cleaning fluid leakage;

[0114] Megasonic nozzle rocker arm 3013: Supports Megasonic cleaning nozzle 3015;

[0115] Megasonic cleaning nozzle retaining ring 3014: Secures the Megasonic cleaning nozzle 3015;

[0116] Megasonic Cleaning Nozzle 3015: Cleans wafers using megasonic technology;

[0117] Blow nozzle: Oriented towards the wafer for blowing;

[0118] Specifically, the structure of the left swing arm 302 includes:

[0119] Pre-cleaning swing arm sealing plug 3021: Prevents cleaning fluid leakage;

[0120] Pre-cleaning nozzle rotating rod 3022: Enables the pre-cleaning nozzle to rotate;

[0121] Pre-cleaning nozzle mounting block 3023: Fixes the pre-cleaning nozzle;

[0122] Air tube 3024: Connects to the air source to provide the gas required for cleaning;

[0123] Pre-cleaning nozzle mounting rod 3025: Supports the pre-cleaning nozzle;

[0124] Pre-cleaning nozzle adjusting block 3026: Adjusts the position of the pre-cleaning nozzle;

[0125] Pre-cleaning nozzle retainer 3027: Fixes the pre-cleaning nozzle;

[0126] Pre-cleaning nozzle clamping plate 3028: Presses the pre-cleaning nozzle tightly to ensure a seal.

[0127] Specifically, the right swing arm 301 is equipped with a mega-sound cleaning nozzle rotating rod 3011, enabling the mega-sound cleaning nozzle 3015 to rotate; the mega-sound cleaning swing rod sealing plug 3012 prevents cleaning fluid leakage; the mega-sound nozzle swing rod 3013 supports the mega-sound cleaning nozzle 3015; and the mega-sound cleaning nozzle fixing ring 3014 fixes the mega-sound cleaning nozzle 3015. The left swing arm 302 is equipped with a pre-cleaning swing rod sealing plug 3021, preventing cleaning fluid leakage; the pre-cleaning nozzle rotating rod 3022 enables the pre-cleaning nozzle to rotate; the pre-cleaning nozzle mounting block 3023 fixes the pre-cleaning nozzle; and the air pipe 3024 connects to an air source to provide the gas required for cleaning; the pre-cleaning nozzle mounting rod 3025 supports the pre-cleaning nozzle; the pre-cleaning nozzle adjusting block 3026 adjusts the position of the pre-cleaning nozzle; the pre-cleaning nozzle fixing block 3027 fixes the pre-cleaning nozzle; and the pre-cleaning nozzle pressure plate 3028 presses the pre-cleaning nozzle to ensure a seal.

[0128] Combination Figure 4 and Figure 7 The diagram shows the specific structure of the buffer mechanism 4, which includes:

[0129] Wafer tray 401: Supports wafers;

[0130] 402 waterproof tray sleeve: prevents cleaning fluid leakage;

[0131] Pallet motor shaft 403: drives the pallet to rotate;

[0132] Mounted bearing 404; Support plate motor shaft 403;

[0133] Synchronous pulley 405: transmits power to rotate the pallet;

[0134] Key 406: Connects the timing pulley 405 and the shaft.

[0135] Specifically, the buffer mechanism 4 includes a wafer tray 401 and a waterproof sleeve 402. The wafer tray 401 supports the wafer, and the waterproof sleeve 402 prevents the cleaning fluid from leaking out. The tray motor shaft 403 drives the tray to rotate, the seated bearing 404 supports the tray motor shaft 403, the synchronous pulley 405 transmits power to make the tray rotate, and the flat key 406 connects the synchronous pulley 405 and the shaft.

[0136] like Figure 8 The diagram shows the specific structure of the lower rotating mechanism 5, which includes:

[0137] The first wafer positioning post 501, the second wafer positioning post 502, and the third wafer positioning post 503, which are set sequentially, are used to position the wafer and ensure precise wafer alignment.

[0138] 504 wafer chuck: Used to fix wafers by vacuum adsorption;

[0139] Sealing ring 505: Prevents cleaning fluid from entering the interior of the lower rotating mechanism 5;

[0140] Shaft fixing chamber 506: accommodates and fixes the lower rotating assembly;

[0141] Second air pipe connector 507: Connects to the air source for pneumatic balance during wafer rotation;

[0142] Bearing housing 508: Supports the rotation of the lower rotating shaft;

[0143] Bearing housing cover 509: Protects the interior of bearing housing 508;

[0144] Lower rotation sensor 510: detects the rotational position of the lower rotation mechanism 5;

[0145] Lower adapter shaft 511: connects the lower servo motor 515 and the lower silicon wafer chuck 504;

[0146] Lower shaft fixing plate 512: Fixes the position of the lower shaft;

[0147] Third coupling 513: connects the lower servo motor 515 and the lower adapter shaft 511;

[0148] Motor mounting plate 514: Fixes the lower servo motor 515;

[0149] Lower servo motor 515: drives the lower silicon wafer chuck 504 to rotate.

[0150] Specifically, the lower rotation mechanism 5 includes a first wafer positioning post 501, a second wafer positioning post 502, and a third wafer positioning post 503, used to position the wafer; the lower silicon wafer chuck 504 fixes the wafer by vacuum adsorption, and the sealing ring 505 prevents cleaning fluid from entering the lower rotation mechanism 5; the shaft fixing chamber 506 accommodates and fixes the lower rotation assembly, and the second air pipe connector 507 connects to an air source for pneumatic balance during wafer rotation; the bearing box 508 supports the rotation of the lower rotation shaft, and the bearing box cover plate 509 protects the interior of the bearing box 508; the lower rotation sensor 510 detects the rotation position of the lower rotation mechanism 5; the lower adapter shaft 511 connects the lower servo motor 515 and the lower silicon wafer chuck 504; the lower rotating shaft fixing plate 512 fixes the position of the lower rotating shaft; the third coupling 513 connects the lower servo motor 515 and the lower adapter shaft 511; the motor fixing plate 514 fixes the lower servo motor 515; and the lower servo motor 515 drives the lower silicon wafer chuck 504 to rotate.

[0151] Combination Figure 9 and Figure 10 The diagram shows the specific structure of the alignment mechanism 6, which includes:

[0152] Lower water baffle 601: Prevents cleaning fluid from splashing out;

[0153] Viewing glass pressure plate 602: Fixes the viewing glass 604;

[0154] 603 viewing window sealing gasket: Prevents cleaning fluid from seeping into the viewing window;

[0155] 604 Stainless Steel Glass: Allows operators to observe the alignment process;

[0156] L-tube 605: Guides the flow of cleaning fluid;

[0157] Liquid level sensor 606: Monitors the level of cleaning fluid;

[0158] Ejection component 607: Used to eject the wafer

[0159] Upper inner plate 608: The upper structure supporting the alignment mechanism 6;

[0160] Dual-ear support 609: Fixes the position of the alignment mechanism 6;

[0161] Linear bearing 610: supports and guides the movement of ejector assembly 607;

[0162] Vibration motor 611: Generates vibrations to help align the wafer;

[0163] Specifically, the alignment mechanism 6 includes a lower water baffle 601 to prevent cleaning fluid from splashing out; a viewing glass pressure plate 602 to fix the viewing glass 604; a viewing window sealing gasket 603 to prevent cleaning fluid from seeping into the viewing window; an L-tube 605 to guide the flow of cleaning fluid; a liquid level sensor 606 to monitor the liquid level of cleaning fluid; an upper inner plate 608 to support the upper structure of the alignment mechanism 6; a double-ear support 609 to fix the position of the alignment mechanism 6; a linear bearing 610 to support and guide the movement of the ejection assembly 607; and a vibration motor 611 to generate vibration to help align the wafers.

[0164] The ejection assembly 607 includes a pen-shaped cylinder 6071 that generates thrust to eject the wafer, a pressure reducing valve 6072 that controls the pressure of the pen-shaped cylinder 6071, and a propulsion cylinder mounting bracket 6073 that fixes the pen-shaped cylinder 6071; the ejector head 6074 directly contacts the wafer and ejects it.

[0165] like Figure 11 The diagram shows the specific structure of the vertical moving mechanism 7, which includes:

[0166] Upper spindle working area 701: The main area for wafer processing;

[0167] Polkadot-plated optical axis 702: guides the movement of the lifting mechanism;

[0168] Optical axis connecting plate 703: Connects to chrome-plated optical axis 702 to increase stability;

[0169] 704 stiffener for lifting mechanism: increases the rigidity of the lifting mechanism;

[0170] 705 slider reinforcing rib: increases the slider's load-bearing capacity;

[0171] Lifting module movable connecting plate 706: connects the lifting module and the wafer tray 401;

[0172] Lifting module mounting backplate 707: Fixes the lifting module;

[0173] Lifting module base plate 708: Supports the lifting module;

[0174] Module reinforcing rib 709: Increases the structural strength of the module.

[0175] Specifically, the up-and-down moving mechanism 7 includes an upper spindle working area 701, which is the main area for wafer processing. A chrome-plated optical axis 702 guides the movement of the lifting mechanism, and an optical axis connecting plate 703 connects the chrome-plated optical axis 702 to increase stability; a lifting mechanism reinforcing rib 704 increases the rigidity of the lifting mechanism, and a slider reinforcing rib 705 increases the load-bearing capacity of the slider; a lifting module movable connecting plate 706 connects the lifting module and the wafer tray 401, a lifting module mounting back plate 707 fixes the lifting module, a lifting module base plate 708 supports the lifting module, and a module reinforcing rib 709 increases the structural strength of the module.

[0176] like Figure 12 The diagram shows the specific structure of the tilting mechanism 8, which includes:

[0177] Cylinder frame 801: Supports tilting cylinder 803;

[0178] Cylinder mounting bracket 802: Fixes the position of tilt cylinder 803;

[0179] Tilting cylinder 803: generates thrust;

[0180] Output connection terminal 804: Connects to the upper inner plate 608, transmits the thrust of the tilting cylinder 803, and adjusts the tilt angle of the wafer.

[0181] Specifically, the tilting mechanism 8 includes a cylinder frame 801 and a support tilting cylinder 803; wherein, the cylinder mounting seat 802 is used to fix the position of the tilting cylinder 803, the tilting cylinder 803 generates thrust, and the output connection end 804 is connected to the upper inner plate 608 to transmit the thrust of the tilting cylinder 803, so that the tilting angle of the wafer is adjusted.

[0182] In practical work, the workflow of this utility model is as follows:

[0183] During the cleaning process, firstly, the wafer is adjusted to an appropriate height by the lifting module of the up-down moving mechanism 7, and the tilt angle of the wafer on the horizontal plane is adjusted by the tilting cylinder 803 of the tilting mechanism 8 to ensure that the cleaning fluid can fully cover the wafer surface.

[0184] Next, the lower servo motor 515 drives the wafer to rotate through the lower silicon wafer suction cup 504, while the pre-cleaning nozzle on the left swing arm 302 of the cleaning mechanism 3 performs preliminary cleaning on the wafer to remove most of the dirt.

[0185] Subsequently, the mega-sound cleaning nozzle 3015 on the right swing arm 301 is activated, using mega-sound technology to generate high-frequency vibrations, which transform the tiny bubbles in the cleaning fluid into strong shock waves, deeply cleaning the tiny particles and contaminants on the wafer surface.

[0186] After cleaning, the wafer is supported and cushioned by the wafer tray 401 of the buffer mechanism 4 to prevent damage during subsequent processing. Then, the ejection assembly 607 of the alignment mechanism 6 ejects the wafer, and the vibration generated by the vibration motor 611 helps to precisely align the wafer with the wafer on the lower rotation mechanism 5.

[0187] Finally, the pressure head 204 of the bonding mechanism 2 applies pressure to the wafer under the coordinated action of the swing arm motor 216 and the stepper screw motor 221, completing the wafer bonding process. The entire cleaning, alignment, and bonding process is automatically completed under the control of the main controller, achieving efficient and precise wafer processing.

[0188] In summary, the mega-sound cleaning device for wafer processing in this invention has a reasonable structure and is easy to operate, which can ensure efficient and accurate wafer cleaning, thereby improving production efficiency and wafer quality.

[0189] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0190] The embodiments described above merely illustrate the implementation of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A mega-acoustic cleaning device for wafer processing, characterized in that, include: The upper rotation device includes a drive assembly for driving the wafer to rotate and an infrared heater for drying the wafer; A bonding apparatus includes a pressure head for applying pressure to a wafer and a drive mechanism for driving the pressure head to move, the pressure head being equipped with a pressure sensor; The cleaning device includes a left swing arm and a right swing arm. The left swing arm is equipped with a pre-cleaning nozzle with two pipelines, and the right swing arm is equipped with a mega-sound cleaning nozzle and a purging nozzle. A buffer device, located on the wafer transport path, is used to support and buffer the wafer; The lower rotation device includes a drive assembly for driving the wafer to rotate; Alignment device, used to align upper and lower wafers before wafer bonding; A vertical movement device is used to adjust the position of the wafer in the vertical direction; A tilting device used to adjust the tilt angle of the wafer on a horizontal plane; The power supply provides electrical support for the entire megason cleaning unit.

2. The mega-acoustic cleaning apparatus for wafer processing according to claim 1, characterized in that, The driving components of the upper rotating device include an upper servo motor and an upper silicon wafer suction cup, wherein the upper servo motor drives the upper silicon wafer suction cup to rotate; the infrared heater is disposed in the upper shaft fixed cavity.

3. The mega-acoustic cleaning apparatus for wafer processing according to claim 1, characterized in that, The driving mechanism of the bonding device includes a motor and a transmission assembly. The motor drives the pressure head to move up and down or rotate through the transmission assembly.

4. The mega-acoustic cleaning apparatus for wafer processing according to claim 1, characterized in that, The right swing arm also includes deionized water and a purging mechanism; The cleaning area and cleaning time are controlled by driving the left and right swing arms with motors.

5. The mega-acoustic cleaning apparatus for wafer processing according to claim 4, characterized in that, The mega-sound cleaning nozzle on the right swing arm generates high-frequency vibrations through mega-sound technology, which transforms the tiny bubbles in the cleaning fluid into strong shock waves, thereby cleaning the wafer surface.

6. The mega-acoustic cleaning apparatus for wafer processing according to claim 1, characterized in that, The buffer device includes a wafer tray and a waterproof sleeve for the tray. The wafer tray is used to support the wafer, and the waterproof sleeve is used to prevent the cleaning fluid from leaking out.

7. The mega-acoustic cleaning apparatus for wafer processing according to claim 1, characterized in that, The lower rotation device includes a lower servo motor and a lower silicon wafer suction cup, and the lower servo motor drives the lower silicon wafer suction cup to rotate.

8. The mega-acoustic cleaning apparatus for wafer processing according to claim 1, characterized in that, The alignment device includes an ejection assembly and a vibration motor. The ejection assembly is used to eject the wafer, and the vibration motor is used to perform vibration alignment after the wafer is ejected. The alignment device cooperates with a tilting device to align the upper and lower wafers after cleaning and before bonding.

9. The mega-acoustic cleaning apparatus for wafer processing according to claim 1 or 2, characterized in that, The infrared heater includes an infrared lamp cover, which houses an infrared lamp for rapid drying of the wafer.

10. The mega-acoustic cleaning apparatus for wafer processing according to claim 1, characterized in that, It also includes a main control unit, which is electrically connected to the megason cleaning device. The main control unit sets specific operations to realize the cleaning process.

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