Silicon wafer processing and cleaning equipment

Abstract

The utility model discloses a silicon wafer processing and cleaning device which comprises a shell, a cleaning tank is fixed in the shell, an ultrasonic transducer is fixed on the inner bottom wall of the cleaning tank, an ultrasonic generator is installed on the inner bottom wall of the shell, a cleaning basket is fixed in the cleaning tank and comprises two semicircular plates and a U-shaped plate, and the two semicircular plates and the U-shaped plate are oppositely arranged. And the U-shaped plate is located above the two semicircular plates, and two square rods are jointly fixed to the two sides of the top ends of the two semicircular plates. According to the ultrasonic cleaning device, the shell, the cleaning tank, the ultrasonic transducer and the cleaning basket are arranged, the cleaning basket is composed of the semicircular plate, the square rod, the bottom rod, the U-shaped plate and the top rod, when silicon wafers are cleaned, the silicon wafers are directly placed in the cleaning basket, then the cleaning basket is fixed in the cleaning tank, ultrasonic cleaning is conducted, and the whole cleaning basket is taken out of the cleaning tank after cleaning is completed; and then another cleaning basket is replaced for continuous cleaning, so that the cleaning efficiency is improved.

Description

A silicon wafer processing and cleaning equipment Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, and in particular to a silicon wafer processing cleaning device. Background Technology

[0002] Silicon wafer cleaning is a critical process in semiconductor manufacturing, used to remove contaminants (such as particles, organic matter, metal ions, and oxides) from the silicon wafer surface to ensure yield and device performance in subsequent processes. Common cleaning methods include wet cleaning (such as RCA cleaning) and dry cleaning (such as plasma cleaning). RCA cleaning is an industry-standard process, primarily using SC1 (ammonia + hydrogen peroxide + deionized water) to remove particles and organic matter, SC2 (hydrochloric acid + hydrogen peroxide + deionized water) to remove metallic impurities, and finally dilute hydrofluoric acid (HF) to remove the oxide layer. Ultrasonic cleaning and megasonic cleaning are also commonly used to enhance particle removal, but power must be controlled to avoid damaging the silicon wafer.

[0003] Patent CN222856121U discloses a silicon wafer processing and cleaning device. It uses a cleaning structure to hold silicon wafers, and a motor drives the structure to rotate, which in turn rinses the wafers with a nozzle. However, when removing the wafers, clamps are needed to remove them individually, and the next batch of wafers cannot be cleaned until all wafers are removed, resulting in low work efficiency. Furthermore, the mesh frame obstructs the water sprayed from the nozzle from rinsing the wafers, leading to poor cleaning results, and the contact area between the mesh frame and the wafer is not cleaned. Existing cleaning baskets for holding silicon wafers also fail to clean the contact area between the wafer and the basket, thus requiring further improvement. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a silicon wafer processing and cleaning device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a silicon wafer processing and cleaning device, comprising a housing, a cleaning tank fixed inside the housing, an ultrasonic transducer fixed on the bottom wall of the cleaning tank, an ultrasonic generator installed on the bottom wall of the housing, a cleaning basket fixed inside the cleaning tank, the cleaning basket comprising two semicircular plates and a U-shaped plate, with the U-shaped plate located above the two semicircular plates, two square rods fixed on both sides of the top of the two semicircular plates, two bottom rods for supporting silicon wafers rotatably connected to both sides of the bottom of the two semicircular plates via bearings, vertical rods fixed at the bottom of both ends of the U-shaped plate, slots for inserting vertical rods opened at the top of the two semicircular plates, a top rod rotatably connected inside the U-shaped plate via bearings, and a rubber roller rotatably connected to the bottom of the cleaning tank and below the cleaning basket via bearings.

[0006] Furthermore, a drain pipe is fixedly connected to the bottom wall of the cleaning tank, and the other end of the drain pipe extends through the side wall of the outer shell to the outside of the outer shell, and a valve is installed at the end of the drain pipe located outside the outer shell.

[0007] Furthermore, several slots are provided on the adjacent sides of the two square rods, and the slots on the two square rods are arranged symmetrically.

[0008] Furthermore, each of the card slots has multiple hemispherical grooves on its inner sidewall, and ball bearings are rotatably connected inside the hemispherical grooves.

[0009] Furthermore, the slot sidewall is connected by a fastening bolt through a threaded connection, and one end of the fastening bolt located inside the slot is in contact with the surface of the vertical rod.

[0010] Furthermore, vertical plates are fixed on both sides of the upper surface of the U-shaped plate, and a side plate is fixed on the side of the vertical plate away from the U-shaped plate. A through hole is opened in the middle of the side plate. Screws are fixed on both sides of the top of the outer shell. The top of the screw passes through the through hole and is rotatably connected to an internal threaded cap. A hand hole is opened at the top of the vertical plate.

[0011] Furthermore, a motor is fixed to the outer wall of the bottom end of the cleaning tank, and the output shaft of the motor passes through the side wall of the cleaning tank and is fixedly connected to the rubber roller.

[0012] The beneficial effects of this utility model are:

[0013] 1. In use, this utility model provides a silicon wafer processing and cleaning equipment, which includes a shell, a cleaning tank, an ultrasonic transducer, and a cleaning basket. The cleaning basket consists of a semi-circular plate, a square rod, a bottom rod, a U-shaped plate, and a top rod. During silicon wafer cleaning, the silicon wafer is placed directly inside the cleaning basket, and then the cleaning basket is fixed inside the cleaning tank. Ultrasonic cleaning is performed. After cleaning, the entire cleaning basket is removed from the cleaning tank, and then another cleaning basket is used to continue cleaning, thereby improving the cleaning efficiency.

[0014] 2. In use, this utility model is a silicon wafer processing and cleaning equipment, which is equipped with a motor, a rubber roller and a cleaning basket. The silicon wafer fixed inside the cleaning basket can rotate. When the cleaning basket is fixed inside the cleaning tank, the bottom of the silicon wafer is in contact with the surface of the rubber roller. After the motor drives the rubber roller to rotate, the rubber roller can drive the silicon wafer to rotate, so that any part of the silicon wafer can be cleaned, thereby improving the cleaning effect. Attached Figure Description

[0015] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1: Overall sectional view of the present invention;

[0017] Figure 2: Partial perspective view of this utility model;

[0018] Figure 3: Enlarged view of point A in Figure 1 of this utility model;

[0019] Figure 4: Enlarged view of section B in Figure 1 of this utility model.

[0020] The attached figures are labeled as follows:

[0021] 1. Outer shell; 2. Cleaning tank; 3. Ultrasonic transducer; 4. Ultrasonic generator; 5. Cleaning basket; 51. Semicircular plate; 52. Square rod; 521. Slot; 522. Hemispherical groove; 523. Ball bearing; 53. Bottom rod; 54. U-shaped plate; 55. Vertical rod; 56. Slot; 57. Fastening bolt; 58. Top rod; 59. Vertical plate; 510. Side plate; 511. Through hole; 512. Hand hole; 6. Screw; 7. Internal thread cap; 8. Rubber roller; 9. Motor; 10. Drain pipe. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] As shown in Figures 1-4, a silicon wafer processing and cleaning device is disclosed, comprising a housing 1, a cleaning tank 2 fixed inside the housing 1, an ultrasonic transducer 3 fixed to the bottom wall of the cleaning tank 2, an ultrasonic generator 4 installed on the bottom wall of the housing 1, a cleaning basket 5 fixed inside the cleaning tank 2, the cleaning basket 5 comprising two semi-circular plates 51 and a U-shaped plate 54, with the U-shaped plate 54 located above the two semi-circular plates 51, two square rods 52 fixed to the top sides of the two semi-circular plates 51, two bottom rods 53 for supporting silicon wafers rotatably connected to the bottom sides of the two semi-circular plates 51 via bearings, vertical rods 55 fixed to the bottom of both ends of the U-shaped plate 54, slots 56 for inserting vertical rods 55 opened at the top of the two semi-circular plates 51, a top rod 58 rotatably connected to the inside of the U-shaped plate 54 via bearings, and a rubber roller 8 rotatably connected to the bottom of the cleaning tank 2 and below the cleaning basket 5 via bearings.

[0024] In this embodiment, the ultrasonic transducer 3 and the ultrasonic generator 4 are model TBL-40A20 and USG-2000W-40K, respectively. The ultrasonic transducer 3 is connected to the ultrasonic generator 4 via a high-frequency cable, and its wiring and working principle are the same as those of existing ultrasonic cleaning machines. This equipment is only for cleaning circular silicon wafers.

[0025] A drain pipe 10 is fixedly connected to the bottom wall of the cleaning tank 2. The other end of the drain pipe 10 extends through the side wall of the outer casing 1 to the outside of the outer casing 1, and a valve is installed at the end of the drain pipe 10 located outside the outer casing 1.

[0026] In this embodiment, the water inside the cleaning tank 2 can be drained through the drain pipe 10, making it convenient to replace the water in the cleaning tank 2.

[0027] Several slots 521 are provided on the adjacent sides of the two square rods 52, and the slots 521 on the two square rods 52 are arranged symmetrically.

[0028] When it is necessary to place a silicon wafer inside the cleaning basket 5, insert the silicon wafer into the cleaning basket 5 from above, so that the two sides of the silicon wafer are inserted into the slots 521 on the two square rods 52, and the two bottom rods 53 at the bottom support the silicon wafer.

[0029] Each slot 521 has multiple hemispherical grooves 522 on its inner sidewall, and ball bearings 523 are rotatably connected inside the hemispherical grooves 522.

[0030] Since the two base rods 53 can rotate, and the ball bearings 523 can also reduce the friction between the silicon wafer and the slot 521, the silicon wafer placed inside the cleaning basket 5 can rotate inside the cleaning basket 5.

[0031] The sidewall of the slot 56 is connected by a fastening bolt 57 via a threaded connection. One end of the fastening bolt 57 inside the slot 56 is in contact with the surface of the vertical rod 55.

[0032] After the silicon wafer is inserted between the two square rods 52, the vertical rods 55 on both sides of the U-shaped plate 54 are inserted into the slots 56 at the top of the semicircular plates 51 on both sides until the top rod 58 is in contact with the top of the silicon wafer. Then, the fastening bolts 57 are tightened to press and fix the vertical rods 55, thus completing the fixed installation of the U-shaped plate 54. At this time, the two square rods 52, the two bottom rods 53, and the top rod 58 achieve the clamping and positioning of the silicon wafer. And since the top rod 58 can also rotate, the silicon wafer can still rotate inside the cleaning basket 5.

[0033] Vertical plates 59 are fixed on both sides of the upper surface of the U-shaped plate 54. A side plate 510 is fixed on the side of the vertical plate 59 away from the U-shaped plate 54. A through hole 511 is opened in the middle of the side plate 510. Screws 6 are fixed on both sides of the top of the outer shell 1. The top of the screws 6 passes through the through hole 511 and is rotatably connected to the surface of the screws with internal thread caps 7. A hand hole 512 is opened at the top of the vertical plate 59.

[0034] After the cleaning basket 5 is placed inside the cleaning tank 2, the through holes 511 on the side plates 510 on both sides fit onto the surface of the screw 6. Then, the internal thread cap 7 is screwed onto the surface of the screw 6 to fix the cleaning basket 5. A hand hole 512 is provided to facilitate lifting the entire cleaning basket 5.

[0035] A motor 9 is fixed to the outer wall of the bottom end of the cleaning tank 2. The output shaft of the motor 9 passes through the side wall of the cleaning tank 2 and is fixedly connected to the rubber roller 8.

[0036] After the cleaning basket 5 is fixed inside the cleaning tank 2, the bottom of the silicon wafer is in contact with the surface of the rubber roller 8. At this time, the motor 9 is started to drive the rubber roller 8 to rotate. Under the action of friction, the rubber roller 8 drives the silicon wafer to rotate, so that the contact position between the silicon wafer and the square rod 52, the bottom rod 53 and the top rod 58 changes continuously, thereby ensuring that every position of the silicon wafer can be cleaned.

[0037] In this embodiment, motor 9 is a geared motor. A controller is installed on the outer side of the housing 1. The controller model is an S7-1200 series CPU 1214C (6ES7214-1BG40-0XB0). The controller is used to control the operation of motor 9 and ultrasonic generator 4.

[0038] Working Principle: In use, first insert the silicon wafer between the two square rods 52 of the cleaning basket 5. After insertion, install and fix the U-shaped plate 54 on the top of the two semi-circular plates 51, thus completing the assembly of the cleaning basket 5. Then, place the assembled cleaning basket 5 into the cleaning tank 2 and fix it with the screw 6 and the internal thread cap 7. At this point, the bottom of the silicon wafer is in close contact with the rubber roller 8. When cleaning begins, start the motor 9 and the ultrasonic generator 4 to clean the silicon wafer using ultrasonic waves. During the cleaning process, the motor 9 drives the rubber roller 8 to rotate. Under the action of friction, the rubber roller 8 drives the silicon wafer to rotate, causing the contact position between the silicon wafer and the square rods 52, bottom rod 53, and top rod 58 to continuously change, avoiding cleaning dead zones. After cleaning, first unscrew the internal thread cap 7, then remove the entire cleaning basket 5 from the cleaning tank 2 and replace it with another cleaning basket 5 containing silicon wafers to continue cleaning.

[0039] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A silicon wafer processing and cleaning device, comprising a housing (1), characterized in that: The outer shell (1) has a cleaning tank (2) fixed inside. An ultrasonic transducer (3) is fixed to the bottom wall of the inner wall of the cleaning tank (2). An ultrasonic generator (4) is installed on the bottom wall of the inner wall of the outer shell (1). A cleaning basket (5) is fixed inside the cleaning tank (2). The cleaning basket (5) includes two semi-circular plates (51) and a U-shaped plate (54). The U-shaped plate (54) is located above the two semi-circular plates (51). Two square rods (52) are fixed to both sides of the top of the two semi-circular plates (51). The bottom ends of the two semicircular plates (51) are rotatably connected by bearings to two bottom rods (53) for supporting silicon wafers. The bottom ends of the U-shaped plate (54) are fixed with vertical rods (55). The top of the two semicircular plates (51) are provided with slots (56) for inserting vertical rods (55). The U-shaped plate (54) is rotatably connected by bearings to a top rod (58). The bottom of the cleaning tank (2) and below the cleaning basket (5) is rotatably connected by bearings to a rubber roller (8).

2. The silicon wafer processing and cleaning equipment according to claim 1, characterized in that: The bottom wall of the cleaning tank (2) is fixedly connected to a drain pipe (10), the other end of which extends through the side wall of the outer shell (1) to the outside of the outer shell (1), and a valve is installed at the end of the drain pipe (10) located outside the outer shell (1).

3. The silicon wafer processing and cleaning equipment according to claim 1, characterized in that: Several slots (521) are provided on the adjacent sides of the two square rods (52), and the slots (521) on the two square rods (52) are arranged symmetrically.

4. The silicon wafer processing and cleaning equipment according to claim 3, characterized in that: Each of the card slots (521) has multiple hemispherical grooves (522) on its inner sidewall, and ball bearings (523) are rotatably connected inside the hemispherical grooves (522).

5. The silicon wafer processing and cleaning equipment according to claim 1, characterized in that: The slot (56) has a through-wall fastening bolt (57) that is rotatably connected by a thread. One end of the fastening bolt (57) inside the slot (56) is in contact with the surface of the vertical rod (55).

6. The silicon wafer processing and cleaning equipment according to claim 1, characterized in that: Vertical plates (59) are fixed on both sides of the upper surface of the U-shaped plate (54). A side plate (510) is fixed on the side of the vertical plate (59) away from the U-shaped plate (54). A through hole (511) is opened in the middle of the side plate (510). Screws (6) are fixed on both sides of the top of the outer shell (1). The top of the screw (6) passes through the through hole (511) and is rotatably connected to an internal thread cap (7). A hand hole (512) is opened at the top of the vertical plate (59).

7. The silicon wafer processing and cleaning equipment according to claim 1, characterized in that: A motor (9) is fixed to the outer wall of the bottom end of the cleaning tank (2), and the output shaft of the motor (9) passes through the side wall of the cleaning tank (2) and is fixedly connected to the rubber roller (8).

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