Silicon wafer cleaning device

Abstract

The utility model discloses a silicon wafer cleaning device which comprises a base, a cleaning tank is fixedly arranged at the top end of the base, first mounting blocks are fixedly arranged at the bottoms of the two sides of the cleaning tank, first air cylinders are fixedly connected to the top ends of the two first mounting blocks, and second mounting blocks are fixedly connected to the movable ends of the two first air cylinders. According to the silicon wafer cleaning device, the two second installation blocks are driven by the two first air cylinders to move upwards, then the sealing plate and other structures are driven to move upwards till a plurality of silicon wafers are separated from the liquid level, then the installation plates are pushed by the second air cylinders to move downwards, and the silicon wafers are cleaned. According to the silicon wafer cleaning and drying device, the plurality of air outlets move to the position over the plurality of silicon wafers, the hot air blower is powered on to generate hot air, and the hot air is divided into the plurality of branch pipes through the flow dividing pipe and then sprayed out through the plurality of air outlets, so that the integrated operation of cleaning and drying the plurality of silicon wafers is achieved, and the working efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer cleaning, in particular to a silicon wafer cleaning device. BACKGROUND

[0002] In the field of semiconductor manufacturing, silicon wafers as core materials, its surface cleanliness is directly related to the quality of subsequent processes and product performance. Silicon wafer cleaning aims to remove dirt, grease, dust and impurities on the surface of silicon wafer through various technical means, to ensure its surface clean, flat and defect free, this process is essential to improve the quality and reliability of silicon wafer, can effectively reduce the failure rate in the production process, so as to improve the overall production efficiency.

[0003] The common silicon wafer cleaning device in the market at present mainly relies on mechanical cleaning, chemical cleaning or ultrasonic cleaning technology, combined with the use of cleaning fluid and physical action to remove the surface contaminants of silicon wafer. Such devices are usually equipped with cleaning tank, spraying system and filter device and other basic components, can effectively complete the cleaning task of silicon wafer, the application of these technologies makes the silicon wafer cleaning process more efficient and thorough, adapts to the demand of current semiconductor manufacturing industry.

[0004] Although the existing silicon wafer cleaning device can meet the cleaning needs to some extent, but they have some limitations. First, these devices mostly only have cleaning function, lack of automatic drying capacity, which means that the cleaned silicon wafer needs additional steps for drying treatment, second, the separation type cleaning and drying process increases the operation complexity and time cost, in addition, due to the natural drying or manual transfer to the drying equipment way is easily affected by environmental factors, may cause the secondary pollution or physical damage of silicon wafer, and increase the space occupation and complexity of production line.

[0005] Therefore, it is urgent to need a kind of silicon wafer cleaning device that can integrate cleaning and drying function in one, to improve production efficiency and ensure the quality of silicon wafer. UTILITY MODEL CONTENT

[0006] The utility model is directed to provide a kind of silicon wafer cleaning device, to solve the problems raised in the above background.

[0007] In order to achieve the above object, the utility model provides the following technical scheme: a kind of silicon wafer cleaning device, including pedestal, the top of the pedestal is fixedly arranged with cleaning tank, the bottom of the both sides of the cleaning tank is fixedly arranged with first mounting block, the top of two first mounting blocks is fixedly connected with first cylinder, the movable end of two first cylinders is fixedly connected with second mounting block, two second mounting blocks are fixedly arranged with sealing plate between, the both sides of the bottom of the sealing plate are fixedly arranged with connecting rod, the bottom of two connecting rods is fixedly connected with connecting block, the connecting block is fixedly arranged with mounting bracket between two, the middle part of the top of the sealing plate is fixedly installed with second cylinder, the movable end of the second cylinder is fixedly connected with mounting plate passing through sealing plate, the top of the mounting plate is fixedly installed with hot air machine, the gas outlet of the hot air machine is fixedly connected with gas pipe, the end of the gas pipe away from hot air machine is fixedly communicated with shunt pipe, the side of the shunt pipe is fixedly communicated with several branch pipes, the top of several branch pipes is equipped with several gas outlets, the shunt pipe and several branch pipes are fixedly connected with mounting plate.

[0008] By being placed in the mounting bracket, the first cylinder drives the second mounting block to move down, and then drives the sealing plate to move down, so as to drive the mounting bracket and the silicon wafer to move down, until the sealing plate contacts with the cleaning tank, and then the liquid is introduced into the cleaning tank through the liquid inlet pipe, until the liquid completely covers the silicon wafer, and then the ultrasonic generator is powered to generate ultrasonic wave, so as to facilitate the cleaning of the silicon wafer, the first cylinder drives the second mounting block to move up, and then drives the sealing plate to move up, until the silicon wafer is separated from the liquid surface, and then the second cylinder drives the mounting plate to move down, until the gas outlet moves above the silicon wafer, and then the hot air machine is powered to generate hot air, and the hot air is divided into the branch pipe through the shunt pipe, and then is sprayed through the gas outlet, so as to realize the cleaning and drying of the silicon wafer, and improve the work efficiency.

[0009] Preferably, the air inlet of the hot air machine is fixedly communicated with the air inlet pipe, and the end of the air inlet pipe away from the hot air machine is fixedly communicated with the filter. In this structure, the air inlet of the hot air machine is fixedly communicated with the filter through the air inlet pipe, which purifies the air entering the hot air machine, removes dust and impurities, ensures the cleanliness of the hot air, avoids secondary pollution of the silicon wafer during drying, improves the cleanliness of the drying air, effectively reduces the dust entering the hot air machine, reduces the equipment failure rate, and prolongs the service life of the hot air machine.

[0010] Preferably, the top end of the sealing plate is provided with guide holes on both sides, and guide rods are inserted into the two guide holes, and the bottom ends of the two guide rods are fixedly connected with the mounting plate. In this structure, the top end of the sealing plate is provided with guide holes on both sides, and guide rods are inserted into the two guide holes, and the bottom ends of the two guide rods are fixedly connected with the mounting plate. The design advantages of this structure mainly include the following aspects: first, the cooperation of the guide rods and the guide holes can provide accurate guidance for the lifting movement of the sealing plate, ensure the stability of the sealing plate during lifting, avoid deviation or tilting, and thus improve the operation accuracy and reliability of the equipment; second, this guide structure can effectively reduce the friction and wear between the sealing plate and the cleaning tank, prolong the service life of the sealing plate and related components, and reduce the maintenance cost; in addition, the fixed connection mode of the guide rods makes the movement of the sealing plate more stable, reduces vibration and noise, and improves the overall operation experience of the equipment.

[0011] Preferably, the upper part of the side wall of the cleaning tank is fixedly connected with a liquid inlet pipe, and the lower part of the side wall of the cleaning tank is fixedly connected with a liquid outlet pipe. This design significantly improves the cleaning efficiency and operation convenience. The liquid inlet pipe is located at the upper part of the cleaning tank, which can ensure that the cleaning liquid flows uniformly into the tank, avoid damaging the silicon wafer due to liquid impact, and quickly cover the surface of the silicon wafer to improve the cleaning effect. The liquid outlet pipe is arranged at the lower part of the cleaning tank, which facilitates the complete emptying of the cleaning liquid and contaminants in the tank, prevents residual liquid from affecting the subsequent cleaning or drying process, ensures the cleanliness of the silicon wafer, and forms a circulating flow through the upper and lower layered liquid inlet and outlet design, thereby enhancing the flushing effect of the cleaning liquid and further improving the cleaning quality.

[0012] Preferably, the mounting frame includes a base plate, both sides of the base plate are fixedly provided with mesh plates, the top of the opposite side of each mesh plate is fixedly provided with a limiting strip, the opposite side of each limiting strip is provided with a plurality of limiting holes, and the top end of the base plate is provided with a plurality of limiting grooves corresponding to the limiting holes. In this structure, the design of the mounting frame realizes efficient fixation and protection of the silicon wafer through the cooperation of the base plate, mesh plate, limiting strip, limiting hole, and limiting groove. The base plate serves as the support main body, and the mesh plates fixedly arranged on both sides can effectively disperse the weight of the silicon wafer, reduce local pressure, and prevent the silicon wafer from being damaged due to uneven stress during cleaning and drying. The limiting strip and limiting hole provide precise positioning function for the silicon wafer, ensuring that the silicon wafer remains stable on the mounting frame and avoiding uneven cleaning or drying due to shaking or deviation. The limiting groove at the top end of the base plate is correspondingly arranged with the limiting hole, further enhancing the fixation effect of the silicon wafer and preventing it from shifting or falling off during operation. The structure of the mesh plate facilitates the circulation of cleaning liquid and hot air, ensuring that the surface of the silicon wafer can fully contact the cleaning liquid and hot air, and improving the cleaning and drying effect.

[0013] Preferably, each of the inner bottom sides of the plurality of limiting grooves is provided with a plurality of drainage holes. In this structure, the drainage holes can effectively drain the liquid remaining on the surface of the silicon wafer after cleaning, preventing liquid from accumulating in the limiting grooves and affecting the drying effect of the silicon wafer or causing secondary pollution. This design not only accelerates the drainage process of the silicon wafer and shortens the time required for subsequent drying, but also reduces the waste of cleaning fluid and improves resource utilization.

[0014] Preferably, shock-absorbing bases are fixedly installed on both sides of the bottom end of the base. In this structure, the shock-absorbing bases can effectively absorb the vibration and impact generated during equipment operation, reduce the interference of mechanical vibration on the silicon wafer cleaning and drying process, ensure that the silicon wafer remains stable during operation, and avoid displacement or damage caused by vibration. This design not only improves the operating accuracy and reliability of the equipment, but also reduces noise and improves the working environment.

[0015] Preferably, a control panel is fixedly mounted on the front of the base, and an ultrasonic generator electrically connected to the control panel is fixedly mounted on the bottom of the cleaning tank. In this structure, the control panel provides the user with an intuitive operating interface, facilitating precise control of the cleaning process, such as adjusting parameters like ultrasonic intensity, cleaning time, and temperature to meet different cleaning needs. The ultrasonic generator produces a cavitation effect in the cleaning fluid through high-frequency vibration, which can deeply remove stubborn dirt and microparticles from the silicon wafer surface, significantly improving the cleaning effect. The electrical connection between the control panel and the ultrasonic generator enables automated operation, reducing manual intervention and improving work efficiency and consistency.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows: By placing several silicon wafers separately in the mounting rack, and then using two first cylinders to drive two second mounting blocks downwards, which in turn drive the sealing plate downwards, thereby moving the mounting rack and several silicon wafers downwards until the sealing plate contacts the cleaning tank, cleaning fluid is introduced into the cleaning tank through the liquid inlet pipe until the liquid completely covers the several silicon wafers. Then, an ultrasonic generator is energized to generate ultrasonic waves, which facilitates the cleaning of several silicon wafers. The two first cylinders drive the two second mounting blocks upwards, which in turn drive the sealing plate and other structures upwards until the several silicon wafers are lifted off the liquid surface. Then, the second cylinder pushes the mounting plate downwards until several air outlets are moved directly above the several silicon wafers. Then, a hot air blower is energized to generate hot air, which is then distributed through a diversion pipe into several branch pipes and sprayed out through several air outlets, thereby realizing the integrated operation of cleaning and drying several silicon wafers, thus improving work efficiency. Attached Figure Description

[0017] Figure 1 This is a perspective view of the present utility model;

[0018] Figure 2It is a front view of the utility model.

[0019] Figure 3 It is an enlarged view of local A of the utility model.

[0020] Figure 4 It is a structure view of the utility model setting frame.

[0021] In the figure: 1, base; 2, ultrasonic generator; 3, cleaning tank; 4, first mounting block; 5, first air cylinder; 6, second mounting block; 7, sealing plate; 8, second air cylinder; 9, mounting plate; 10, connecting rod; 11, connecting block; 12, setting frame; 121, base plate; 122, limit slot; 123, drainage hole; 124, mesh plate; 125, limit strip; 126, limit hole; 13, guide hole; 14, guide rod; 15, hot air machine; 16, air outlet pipe; 17, shunt pipe; 18, branch pipe; 19, air outlet; 20, air inlet pipe; 21, filter; 22, control panel; 23, liquid inlet pipe; 24, liquid outlet pipe; 25, damping base. DETAILED DESCRIPTION

[0022] The technical scheme in the utility model embodiments will be clearly and completely described below with reference to the accompanying drawings in the utility model embodiments.

[0023] Please refer to Figures 1-4The utility model provides a kind of silicon wafer cleaning device, including pedestal 1, the top of pedestal 1 is fixedly provided with cleaning tank 3, the bottom of the both sides of cleaning tank 3 is fixedly provided with first mounting block 4, the top of two first mounting blocks 4 is fixedly connected with first cylinder 5, the movable end of two first cylinders 5 is fixedly connected with second mounting block 6, between two second mounting blocks 6, sealing plate 7 is fixedly provided, the both sides of sealing plate 7 bottom end are fixedly provided with connecting rod 10, the bottom of two connecting rods 10 is fixedly connected with connecting block 11, between two connecting blocks 11, fixedly provided with installation rack 12, the middle part of the top of sealing plate 7 is fixedly installed with second cylinder 8, the movable end of second cylinder 8 passes through sealing plate 7 and is fixedly connected with mounting plate 9, the top of mounting plate 9 is fixedly installed with hot air blower 15, the gas outlet end of hot air blower 15 is fixedly connected with gas outlet pipe 16, the end away from hot air blower 15 of gas outlet pipe 16 is fixedly communicated with shunt pipe 17, one side of shunt pipe 17 is fixedly communicated with several branch pipes 18, the top of several branch pipes 18 is provided with several gas outlets 19, shunt pipe 17 and several branch pipes 18 are fixedly connected with mounting plate 9, by several silicon wafers are placed in installation rack 12, then by two first cylinders 5 drive two second mounting blocks 6 to move downwards, in turn drive sealing plate 7 to move downwards, to drive installation rack 12 and several silicon wafers to move downwards, until sealing plate 7 is contacted with cleaning tank 3, then by liquid inlet pipe 23 pours cleaning fluid into cleaning tank 3, until liquid completely covers several silicon wafers, then by ultrasonic generator 2 power generation ultrasonic wave, in turn facilitate several silicon wafers to be cleaned, by two first cylinders 5 drive two second mounting blocks 6 to move upwards, in turn drive sealing plate 7 and other structures to move upwards, until several silicon wafers are separated from liquid level, then by second cylinder 8 promotes mounting plate 9 to move downwards, until several gas outlets 19 are moved to the just above of several silicon wafers, then by hot air blower 15 power generation hot air, and hot air is shunted to several branch pipes 18 by shunt pipe 17, then is sprayed by several gas outlets 19, to realize the cleaning, drying integrated operation of several silicon wafers, in turn improve work efficiency.

[0024] The air inlet end of hot air blower 15 is fixedly communicated with air inlet pipe 20, the end away from hot air blower 15 of air inlet pipe 20 is fixedly communicated with filter 21, the both sides of the top of sealing plate 7 are provided with guide hole 13, the inside of two guide holes 13 is provided with guide rod 14, the bottom of two guide rods 14 is fixedly connected with mounting plate 9, the top of one end of cleaning tank 3 side is fixedly communicated with liquid inlet pipe 23, the bottom of one end of cleaning tank 3 side is fixedly communicated with liquid outlet pipe 24.

[0025] When using, the air entering hot air blower 15 is filtered by filter 21, the stable up-and-down movement of mounting plate 9 is facilitated by the cooperation of two guide rods 14 and two guide holes 13, and the cleaning fluid is introduced into cleaning tank 3 by liquid inlet pipe 23.

[0026] The installation rack 12 comprises a base plate 121, both sides of the base plate 121 are fixedly provided with mesh plates 124, the top of the opposite side of each of the two mesh plates 124 is fixedly provided with a limiting strip 125, the opposite side of each of the two limiting strips 125 is provided with a plurality of limiting holes 126, the top of the base plate 121 is provided with a plurality of limiting grooves 122, the plurality of limiting grooves 122 are correspondingly provided with the plurality of limiting holes 126, the bottom of the inner side of each of the plurality of limiting grooves 122 is provided with a plurality of draining holes 123, the bottom of each of the two sides of the base 1 is fixedly provided with a damping base 25, the front of the base 1 is fixedly installed with a control panel 22, and the top of the inner side of the base 1 is fixedly installed with an ultrasonic generator 2.

[0027] In use, the plurality of limiting grooves 122 and the plurality of limiting holes 126 are matched to facilitate the separate placement of the plurality of silicon wafers, the plurality of draining holes 123 are arranged to facilitate the draining of water on the installation rack 12, the two damping bases 25 are arranged to provide damping and buffering, and the ultrasonic generator 2 generates ultrasonic waves when powered.

[0028] In use, the plurality of silicon wafers are placed separately in the installation rack 12, the two first air cylinders 5 drive the two second mounting blocks 6 to move downward, thereby driving the sealing plate 7 to move downward, so as to drive the installation rack 12 and the plurality of silicon wafers to move downward until the sealing plate 7 contacts the cleaning tank 3, then the liquid inlet pipe 23 pours cleaning liquid into the cleaning tank 3 until the liquid completely covers the plurality of silicon wafers, the ultrasonic generator 2 generates ultrasonic waves when powered, thereby facilitating the cleaning of the plurality of silicon wafers, after the cleaning is completed, the two first air cylinders 5 drive the two second mounting blocks 6 to move upward, thereby driving the sealing plate 7 and other structures to move upward until the plurality of silicon wafers are separated from the liquid surface, then the second air cylinder 8 drives the mounting plate 9 to move downward until the plurality of air outlets 19 are above the plurality of silicon wafers, the hot air generator 15 generates hot air when powered, the hot air is divided into the plurality of branch pipes 18 through the shunt pipe 17, and then is sprayed out through the plurality of air outlets 19, so as to realize the cleaning and drying of the plurality of silicon wafers, thereby improving the work efficiency.

[0029] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement to part of the technical features, any modification, equivalent replacement, improvement, etc. within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A silicon wafer cleaning device, comprising a base (1), characterized in that: A cleaning tank (3) is fixedly installed at the top of the base (1). First mounting blocks (4) are fixedly installed at the bottom of both sides of the cleaning tank (3). First cylinders (5) are fixedly connected to the top of the two first mounting blocks (4). Second mounting blocks (6) are fixedly connected to the movable ends of the two first cylinders (5). A sealing plate (7) is fixedly installed between the two second mounting blocks (6). Connecting rods (10) are fixedly installed on both sides of the bottom of the sealing plate (7). Connecting blocks (11) are fixedly connected to the bottom of the two connecting rods (10). A mounting frame (12) is fixedly installed between the two connecting blocks (11). A second cylinder (8) is fixedly installed at the middle of the top of the device. The movable end of the second cylinder (8) passes through the sealing plate (7) and is fixedly connected to the mounting plate (9). A hot air blower (15) is fixedly installed on the top of the mounting plate (9). An air outlet pipe (16) is fixedly connected to the air outlet end of the hot air blower (15). A diversion pipe (17) is fixedly connected to the end of the air outlet pipe (16) away from the hot air blower (15). Several branch pipes (18) are fixedly connected to one side of the diversion pipe (17). Several air outlets (19) are opened at the top of the several branch pipes (18). The diversion pipe (17) and the several branch pipes (18) are fixedly connected to the mounting plate (9).

2. The silicon wafer cleaning apparatus according to claim 1, characterized in that: The air inlet of the hot air blower (15) is fixedly connected to an air inlet pipe (20), and the end of the air inlet pipe (20) away from the hot air blower (15) is fixedly connected to a filter (21).

3. The silicon wafer cleaning apparatus according to claim 1, characterized in that: The sealing plate (7) has guide holes (13) on both sides of its top end. Guide rods (14) are inserted into the two guide holes (13). The bottom ends of the two guide rods (14) are fixedly connected to the mounting plate (9).

4. The silicon wafer cleaning apparatus according to claim 1, characterized in that: The upper part of the side wall of the cleaning tank (3) is fixedly connected to the liquid inlet pipe (23), and the lower part of the side wall of the cleaning tank (3) is fixedly connected to the liquid outlet pipe (24).

5. The silicon wafer cleaning apparatus according to claim 1, characterized in that: The mounting frame (12) includes a base plate (121). Mesh plates (124) are fixedly arranged on both sides of the base plate (121). Limiting strips (125) are fixedly arranged on the top of the opposite side of the two mesh plates (124). A plurality of limiting holes (126) are opened on the opposite side of the two limiting strips (125). A plurality of limiting grooves (122) are opened on the top of the base plate (121). The plurality of limiting grooves (122) are respectively arranged corresponding to the plurality of limiting holes (126).

6. A silicon wafer cleaning apparatus according to claim 5, characterized in that: Several drainage holes (123) are provided on the bottom of the inner side of several of the limiting grooves (122).

7. The silicon wafer cleaning apparatus according to claim 1, characterized in that: Both sides of the bottom end of the base (1) are fixedly provided with shock-absorbing bases (25).

8. The silicon wafer cleaning apparatus according to claim 1, characterized in that: A control panel (22) is fixedly installed on the front of the base (1), and an ultrasonic generator (2) electrically connected to the control panel (22) is fixedly installed at the bottom of the cleaning tank (3).

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