Chip bonding device facilitating key alignment

Abstract

The utility model discloses a chip bonding device convenient for key alignment, which belongs to the technical field of chips and comprises a supporting seat, the top surface of the supporting seat is connected with a lighting assembly, the supporting seat is connected with a fixing assembly, the fixing assembly is connected with a rotating assembly, and the rotating assembly is connected with a clamping assembly. Through the fixing assembly and the clamping assembly, the distance between the two fixing frames can be adjusted, a chip is fixedly clamped, the device can adapt to processing and manufacturing of chips of different sizes, the practicability is improved, when the chip needs to be overturned, the two fixing frames can be rotated through the rotating assembly, and the chip can be conveniently rotated to a specified angle position.

Description

Technical Field

[0001] This utility model relates to the field of chip technology, and in particular to a chip bonding device that facilitates alignment keys. Background Technology

[0002] Bonding is a crucial step in chip manufacturing and packaging. Chips, as integrated circuits or microcircuits, require bonding machines to connect gold wires or other metal wires to metal pads on the chip, forming a miniaturized circuit. This step is essential for ensuring the chip's electrical performance, reliability, and lifespan.

[0003] A search revealed that utility model CN215496673U discloses a chip bonding device with alignment and bonding components. The device includes a bonding machine and a bonding base at the lower end of the bonding machine. A bonding component is also located at the lower end of the bonding machine. A placement groove is formed at the upper end of the bonding base, and an air groove is formed within the inner cavity of the bonding base. A clamping rod is inserted through one side of the inner wall of the air groove. An air pipe is provided on the outer surface of the bonding base, with one end connected to the bottom surface of the air groove and the other end connected to the bonding machine. A first return spring is sleeved on the outer surface of the clamping rod. A first telescopic groove is formed within the inner wall of the placement groove, and one end of the first return spring is inserted into the first telescopic groove. When the pressure inside the air groove changes, four sets of clamping rods can extend simultaneously to clamp the chip, thereby aligning the chip with the bonding component and facilitating bonding of the chip by the bonding component.

[0004] The chip bonding apparatus still suffers from the following drawbacks in use: it is difficult to adapt to chips of different sizes and lacks flexibility; furthermore, it is difficult to rotate the chip to a specified angular position, which may affect the alignment accuracy between the chip and the alignment bonding components, thereby reducing the reliability of the entire process. Therefore, those skilled in the art have provided a chip bonding apparatus that facilitates alignment bonding to solve the problems mentioned in the background art. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a chip bonding device that facilitates key alignment.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: It includes a support base, a lighting component connected to the top surface of the support base, a fixing component connected to the support base, a rotating component connected to the fixing component, and a clamping component connected to the rotating component; the fixing component includes a cavity formed within the support base, a cylinder fixedly connected to the bottom surface of the cavity, a connecting plate fixedly connected to the free end of the cylinder, adjusting rods rotatably connected to both sides of the connecting plate, movable blocks rotatably connected to the ends of the two adjusting rods away from the connecting plate, a sliding column horizontally fixedly connected inside the cavity, two movable blocks slidably connected to both sides of the sliding column, a moving block fixedly connected to the top of each of the two movable blocks, and the tops of the two moving blocks extending through to the top of the support base and fixedly connected to a moving plate.

[0007] As a further description of the above technical solution:

[0008] The lighting assembly includes a U-shaped frame fixed to the top surface of the support base, and a lighting lamp is connected to the inner top surface of the U-shaped frame.

[0009] As a further description of the above technical solution:

[0010] The rotating assembly includes a motor fixed to the outside of a movable plate, the output end of the motor passing through the movable plate and extending to the other side of the movable plate and fixed to a second rotating column, and a first rotating column rotatably connected to the inside of another movable plate.

[0011] As a further description of the above technical solution:

[0012] The clamping assembly includes two fixed frames respectively fixed to one end and the other end of the rotating column. The inner bottom surfaces of the two fixed frames are each fixed with a lower clamping plate. The top of the two fixed frames is connected to a rotating block. The bottom surface of the two rotating blocks is fixed with a threaded rod. The bottom ends of the two threaded rods are threaded through the top wall of the corresponding fixed frame and extend into the interior of the corresponding fixed frame, and are rotatably connected to an upper clamping plate.

[0013] As a further description of the above technical solution:

[0014] Rubber pads are fixed to the sides of the upper and lower clamping plates that are close to each other.

[0015] As a further description of the above technical solution:

[0016] Both sides of the top wall of the support base are provided with elongated through holes, and the two moving blocks slide through the two elongated through holes respectively.

[0017] As a further description of the above technical solution:

[0018] Both movable blocks are provided with sliding holes, and the sliding column is slidably connected in the sliding holes.

[0019] This utility model has the following beneficial effects:

[0020] 1. In this utility model, when using the device, the distance between the two fixing frames can be adjusted by the fixing component and the clamping component to fix and clamp the chip, which can adapt to chips of different sizes and improve flexibility and adaptability.

[0021] 2. In this utility model, the two fixed frames are rotated by the rotating component, thereby rotating the chip to a specified angle position, so that the chip can be aligned with the bonding component, making it convenient for the bonding component to bond the chip. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the internal structure of the support base of a chip bonding device for facilitating alignment keys, as proposed in this utility model.

[0023] Figure 2 This is a front view of a chip bonding device for facilitating key alignment according to the present invention.

[0024] Figure 3 This is a side view of a chip bonding device for facilitating key alignment proposed in this utility model;

[0025] Figure 4 This is a top view schematic diagram of a chip bonding device for facilitating key alignment proposed in this utility model.

[0026] Legend:

[0027] 1. Support base; 2. U-shaped frame; 3. Lighting lamp; 4. Motor; 5. Moving plate; 6. Fixed frame; 7. Rotating block; 8. Threaded rod; 9. Upper clamping plate; 10. Lower clamping plate; 11. Long through hole; 12. Moving block; 13. Cavity; 14. Sliding column; 15. Movable block; 16. Adjusting rod; 17. Connecting plate; 18. Cylinder; 19. Rotating column one; 20. Rotating column two. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Reference Figures 1-4An embodiment of this utility model includes a support base 1, with an illumination component connected to the top surface of the support base 1. A fixing component is connected to the support base 1, a rotating component is connected to the fixing component, and a clamping component is connected to the rotating component. The distance between the two fixing frames 6 can be adjusted through the fixing component and the clamping component to fix and clamp the chip, which can adapt to the processing and manufacturing of chips of different sizes and improve practicality. The fixing component includes a cavity 13 opened in the support base 1. A cylinder 18 is fixedly connected to the bottom surface of the cavity 13. A connecting plate 17 is fixedly connected to the free end of the cylinder 18. Adjusting rods 16 are rotatably connected to both sides of the connecting plate 17. Movable blocks 15 are rotatably connected to the ends of the two adjusting rods 16 away from the connecting plate 17. A sliding column 14 is horizontally fixed inside the cavity 13. Two movable blocks 15 are slidably connected to both sides of the sliding column 14. Moving blocks 12 are fixedly connected to the top of the two movable blocks 15. The tops of the two moving blocks 12 extend through to the top of the support base 1 and are fixedly connected to the moving plates 5.

[0030] The lighting assembly includes a U-shaped frame 2 fixed to the top surface of the support base 1, with a lighting lamp 3 connected to the inner top surface of the U-shaped frame 2. The rotating assembly includes a motor 4 fixed to the outside of a movable plate 5, with the output end of the motor 4 passing through the movable plate 5 and extending to the other side of the movable plate 5 and fixedly connected to a rotating post 20. A rotating post 19 is rotatably connected to the inner side of another movable plate 5. The clamping assembly includes two fixed frames 6 fixed to the ends of rotating post 19 and rotating post 20, respectively. When the chip needs to be flipped, the two fixed frames 6 can be rotated by the rotating assembly to rotate the chip to a specified angle position, thereby aligning the chip with the bonding component. The bonding components bond the chip. The inner bottom surfaces of the two fixed frames 6 are fixed with lower clamping plates 10. The top of the two fixed frames 6 is connected with rotating blocks 7. The bottom surfaces of the two rotating blocks 7 are fixed with threaded rods 8. The bottom ends of the two threaded rods 8 are threaded through the top walls of the corresponding fixed frames 6 and extend into the interior of the corresponding fixed frames 6. They are rotatably connected with upper clamping plates 9. Rubber pads are fixed on the sides of the upper clamping plates 9 and lower clamping plates 10 that are close to each other. The top walls of the support base 1 are provided with elongated through holes 11 on both sides. The two moving blocks 12 slide through the two elongated through holes 11 respectively. The two movable blocks 15 are provided with sliding holes. The sliding column 14 is slidably connected in the sliding hole.

[0031] Working principle: When using this device, according to the actual size of the chip, the cylinder 18 is activated, causing the connecting plate 17 to move down or up. This movement of the connecting plate 17, via the two adjusting rods 16, causes the two movable blocks 15 to move closer or further apart along the sliding column 14. This movement of the two movable blocks 15, in turn, causes the two moving blocks 12 to move closer or further apart, which in turn causes the two moving plates 5 to move closer or further apart. This allows adjustment of the distance between the two fixed frames 6, placing both ends of the chip in the two lower clamps respectively. The chip is positioned above the plate 10 and within the fixed frame 6. Then, the rotating block 7 is rotated, causing the threaded rod 8 to rotate. The threaded rod 8 then moves the upper clamping plate 9 downward. With the cooperation of the upper clamping plate 9 and the lower clamping plate 10, the chip is fixedly clamped, which can accommodate chips of different sizes. By starting the motor 4, the motor 4 drives the two fixed frames 6, the second rotating column 20, and the first rotating column 19 to rotate, thereby rotating the chip to a specified angle position so that the chip can be aligned with the bonding component, which facilitates the bonding component to bond the chip. The bonding component used in this solution is existing technology.

[0032] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device such as a computer for control. The detailed description of known functions and components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0033] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A chip bonding device for facilitating key alignment, comprising a support (1), characterized in that: A lighting component is connected to the top surface of the support base (1), a fixing component is connected to the support base (1), a rotating component is connected to the fixing component, and a clamping component is connected to the rotating component. The fixing component includes a cavity (13) opened in the support base (1). A cylinder (18) is fixedly connected to the bottom surface of the cavity (13). A connecting plate (17) is fixedly connected to the free end of the cylinder (18). Adjusting rods (16) are rotatably connected to both sides of the connecting plate (17). Movable blocks (15) are rotatably connected to the ends of the two adjusting rods (16) away from the connecting plate (17). A sliding column (14) is horizontally fixed inside the cavity (13). The two movable blocks (15) are slidably connected to both sides of the sliding column (14). A moving block (12) is fixedly connected to the top of the two movable blocks (15). The tops of the two moving blocks (12) extend to the top of the support base (1) and are fixedly connected to a moving plate (5).

2. The chip bonding device for facilitating alignment keys according to claim 1, characterized in that: The lighting assembly includes a U-shaped frame (2) fixed to the top surface of the support base (1), and a lighting lamp (3) is connected to the inner top surface of the U-shaped frame (2).

3. The chip bonding device for facilitating alignment keys according to claim 1, characterized in that: The rotating assembly includes a motor (4) fixed to the outside of a movable plate (5), the output end of the motor (4) passing through the movable plate (5) and extending to the other side of the movable plate (5) and fixed to a rotating column two (20), and a rotating column one (19) rotatably connected to the inside of another movable plate (5).

4. A chip bonding device for facilitating alignment keys according to claim 3, characterized in that: The clamping assembly includes two fixed frames (6) respectively fixed to the end of rotating column one (19) and the end of rotating column two (20). The inner bottom surfaces of the two fixed frames (6) are fixed with lower clamping plates (10). The upper surfaces of the two fixed frames (6) are connected with rotating blocks (7). The bottom surfaces of the two rotating blocks (7) are fixed with threaded rods (8). The bottom ends of the two threaded rods (8) are threaded through the top wall of the corresponding fixed frame (6) and extend into the interior of the corresponding fixed frame (6), and are rotatably connected with upper clamping plates (9).

5. A chip bonding device for facilitating key alignment according to claim 4, characterized in that: Rubber pads are fixed to the sides of the upper clamping plate (9) and the lower clamping plate (10) that are close to each other.

6. A chip bonding device for facilitating alignment keys according to claim 1, characterized in that: The support base (1) has elongated through holes (11) on both sides of its top wall, and the two moving blocks (12) slide through the two elongated through holes (11) respectively.

7. A chip bonding device for facilitating alignment keys according to claim 1, characterized in that: Both movable blocks (15) are provided with sliding holes, and the sliding column (14) is slidably connected in the sliding holes.

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