Nanometer waterproof circuit board for brushless motor

Abstract

The utility model relates to the technical field of circuit boards, and particularly discloses a nanometer waterproof circuit board for a brushless motor, which comprises a circuit board main body. A nano protective film is arranged on the surface of the circuit board main body, so that a continuous protective layer is formed on the surface of the circuit board main body; the circuit board main body comprises a main board, and a controller, a Hall element, a level conversion circuit and a power transistor which are arranged on the main board, the nano protective film comprises a nano waterproof layer, and the nano waterproof layer is used for preventing external water from entering the circuit board main body to cause short circuit. According to the utility model, the nanometer protective film is arranged to block moisture, and a complete hydrophobic protective layer is formed, so that water cannot directly contact the circuit layer, and circuit damage caused by short circuit is avoided. Even if water drops exist on the surface of the circuit board, the water drops cannot be adsorbed and permeated, and the circuit board is kept dry and normal in function.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular discloses a nano-waterproof circuit board for brushless motors. Background Technology

[0002] Brushless motors are widely used in various industrial and consumer sectors, such as aerospace, electric vehicles, and home appliances. The control and drive of brushless motors typically rely on circuit boards; therefore, the performance and stability of the circuit board directly affect the operational reliability of the brushless motor. However, due to the diversity of application environments, circuit boards may be exposed to harsh conditions such as humidity, temperature fluctuations, and electromagnetic interference. Especially in humid climates in the south or environments with large temperature differences, condensation easily forms on the circuit board surface. These environmental factors not only affect the electrical performance of the circuit board but may also lead to short circuits, corrosion, and functional failure, thus affecting the normal operation of the brushless motor.

[0003] Traditional circuit board protection measures mainly include the use of sealants, simple waterproof coatings, or mechanical encapsulation. These solutions are effective in terms of waterproofing and interference resistance, but they often fail to provide comprehensive and durable protection in environments with high humidity and frequent temperature fluctuations. For example, waterproof coatings can only prevent short-term surface contact with moisture, but their effectiveness against persistent condensation is limited; while sealing measures can provide some physical isolation, the sealing performance of the seals may deteriorate over time. Furthermore, the thickness and hardness of traditional protective materials can affect heat dissipation during long-term use, thus impacting the circuit board's operating efficiency. Utility Model Content

[0004] In order to overcome the shortcomings and deficiencies of the existing technology, the purpose of this utility model is to provide a waterproof circuit board with good waterproof performance that is suitable for humid climates or environments with large temperature differences in the south.

[0005] To achieve the above objectives, this utility model provides a nano-waterproof circuit board for a brushless motor, comprising a circuit board body; a nano-protective film is provided on the surface of the circuit board body, forming a continuous protective layer on the surface of the circuit board body; the circuit board body includes a main board and a controller, Hall element, level conversion circuit, and power transistor mounted on the main board. The Hall element is used to detect the position of the external rotor, the controller is used to receive external commands and control the voltage applied to the external winding, the level conversion circuit is used to convert the controller signal into the signal of the power transistor, and the power transistor is used to construct the circuit for powering the brushless motor winding. The nano-protective film includes a nano-waterproof layer, which is used to prevent external water from entering the circuit board body and causing a short circuit. This utility model uses a nano-protective film to block moisture and form a complete hydrophobic protective layer, preventing water from directly contacting the circuit layer and avoiding circuit damage caused by short circuits. Even if water droplets are present on the surface of the circuit board, they will not be absorbed or penetrated, keeping the circuit board dry and functional. The shielding insulation layer can effectively block electromagnetic interference and ensure stable signal transmission. This structural design allows the circuit board to work safely and reliably in harsh environments, extending the service life of the circuit board and improving the stability of the equipment.

[0006] Furthermore, the thickness of the nano-protective film is 0.1-100 μm. Setting the thickness of the nano-protective film between 0.1-100 μm ensures protective effectiveness without affecting heat dissipation and the sensitivity of the circuit board, while also saving costs.

[0007] Furthermore, the nano-protective film also includes an anti-corrosion layer located between the nano-waterproof layer and the motherboard. This anti-corrosion layer can be any one or more of a nano-ceramic coating or a fluorocarbon coating. The nano-ceramic coating and fluorocarbon coating possess characteristics of acid and alkali resistance, as well as resistance to various organic solvents. When combined with the filled nano-waterproof layer, they enhance the overall structure's resistance, preventing corrosion from acidic salt spray during use and significantly extending the circuit board's lifespan.

[0008] Furthermore, the nano-protective film also includes a heat insulation layer located between the anti-corrosion layer and the motherboard. The heat insulation layer is any one or more of a ceramic-based composite coating and an aerogel coating. The heat insulation layer, made of ceramic-based composite materials, aerogel, or other heat-insulating materials, has high thermal resistance and low thermal conductivity, which can significantly reduce the surface temperature of the circuit board and improve its thermal stability and reliability.

[0009] Furthermore, the thickness of both the nano-waterproof layer and the anti-corrosion layer is 0.1-50 μm. Controlling the thickness of the nano-waterproof layer and the anti-corrosion layer within the range of 0.1-50 μm ensures that these two layers effectively perform their waterproof and anti-corrosion functions without becoming excessively thick, thus affecting structural compactness and heat dissipation.

[0010] Furthermore, the nano-waterproof layer is any one or more of the following: polyimide coating, polytetrafluoroethylene coating, sodium methylsiloxane coating, or methylsilicate coating. These materials all possess excellent waterproof performance and chemical stability, allowing for the selection of the most suitable waterproof material based on different environmental requirements. This ensures the nano-waterproof layer maintains excellent waterproof performance under various working conditions, flexibly adapting to diverse application scenarios.

[0011] Furthermore, the shielding insulation layer includes an epoxy resin layer and an electromagnetic shielding layer. The epoxy resin layer is coated on the side of the substrate layer away from the circuit layer and on the side of the circuit layer away from the substrate layer. The electromagnetic shielding layer is disposed on the surface of the epoxy resin layer. The epoxy resin and the electromagnetic shielding layer provide insulation and shielding effects, respectively, enhancing the stability of the circuit board in complex electromagnetic environments, ensuring signal transmission quality, and reducing malfunctions caused by electromagnetic interference.

[0012] Furthermore, the nano-protective film is deposited onto the circuit board substrate via electroplating, vacuum plating, or vapor deposition. Electroplating involves applying an electric current to an electrolyte, causing metal ions to deposit on the control board surface to form a thin film. This method can create a uniform and dense coating, providing excellent corrosion resistance, wear resistance, and decorative effects. Vacuum plating (also known as vacuum coating or vacuum electroplating) is a coating process performed under vacuum conditions. It utilizes the principle of physical vapor deposition, heating the coating material to an evaporation or sputtering state, and then depositing it on the control board surface under the influence of an electric or magnetic field. Vacuum plating can form high-quality films with excellent adhesion and gloss, while maintaining the original properties of the coating material. Finally, deposition methods include various physical and chemical methods, such as chemical vapor deposition (CVD) and physical vapor deposition (PVD). PVD can deposit coating materials onto the control board surface at low temperatures through a physical process, forming a thin film with excellent wear and corrosion resistance.

[0013] Furthermore, the nano-waterproof circuit board also includes a cover disposed on the circuit board body, with a sealing element on the inner wall of the cover, the cover abutting against the circuit board body via the sealing element. The sealing element can effectively block the ingress of external moisture and dust, further enhancing the sealing performance of the circuit board. The sealing element provides secondary protection at the cover, ensuring the protection effect of the circuit board in extreme environments.

[0014] Furthermore, a thermally conductive silicone grease layer is coated on the main body of the circuit board, and a thermally conductive copper plate is provided on the side of the thermally conductive silicone grease layer away from the main body of the circuit board. The thermally conductive copper plate is tightly connected to the thermally conductive silicone grease layer. By providing the thermally conductive silicone grease layer and the thermally conductive copper plate layer, the thermally conductive silicone grease layer facilitates the dissipation of heat from the circuit board substrate layer. The thermally conductive silicone grease layer transfers the heat from the circuit board substrate layer to the thermally conductive copper plate layer, which then dissipates the heat, thereby improving the heat dissipation effect and preventing the circuit board from being damaged by excessive temperature.

[0015] The beneficial effects of this invention are as follows: This invention features a nano-protective film that blocks moisture and forms a complete hydrophobic protective layer, preventing water from directly contacting the circuit layer and avoiding circuit damage caused by short circuits. Even if water droplets are present on the circuit board surface, they will not be absorbed or penetrated, keeping the circuit board dry and functioning normally. The shielding insulation layer effectively blocks electromagnetic interference, ensuring stable signal transmission. This structural design allows the circuit board to operate safely and reliably in harsh environments, extending its service life and improving equipment stability.

[0016] Through the use of nano-ceramic coating and fluorocarbon coating, it has the characteristics of acid and alkali resistance and resistance to various organic solvents. When combined with the filled nano-waterproof layer, the overall structure can be made more resistant and will not be affected by acid salt spray corrosion during use, thereby greatly improving the service life of the circuit board. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the main structure of the circuit board body of this utility model;

[0018] Figure 2 This is a cross-sectional view of a multifunctional massager according to the present invention;

[0019] Figure 3 for Figure 2 A partial view of A in the middle;

[0020] Figure 4 This is an exploded view of the main body of the circuit board of this utility model;

[0021] Figure 5 for Figure 3 A partial view of B in the middle.

[0022] The reference numerals in the figures include:

[0023] 1. Circuit board body; 2. Nano protective film; 3. Substrate layer; 4. Circuit layer; 5. Shielding insulation layer; 6. Nano waterproof layer; 7. Anti-corrosion layer; 8. Heat insulation layer; 9. Cover; 10. Seal; 11. Thermally conductive copper plate; 12. Thermally conductive silicone grease layer; 13. Heat dissipation fins. Detailed Implementation

[0024] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0025] Please see Figures 1 to 5As shown, this utility model discloses a nano-waterproof circuit board for a brushless motor, comprising a circuit board body 1. A nano-protective film 2 is provided on the surface of the circuit board body 1, forming a continuous protective layer. The circuit board body 1 includes a main board and a controller, Hall effect sensor, level conversion circuit, and power transistor mounted on the main board. The Hall effect sensor detects the position of the external rotor, the controller receives external commands and controls the voltage applied to the external windings, the level conversion circuit converts the controller's signal into a power transistor signal, and the power transistor constructs the circuit for powering the brushless motor windings. The nano-protective film 2 includes a nano-waterproof layer 6, which prevents external water from entering the circuit board body 1 and causing a short circuit. This utility model uses a nano-protective film 2 to block moisture and form a complete hydrophobic protective layer, preventing water from directly contacting the circuit layer 4 and avoiding circuit damage caused by short circuits. Even if there are water droplets on the surface of the circuit board, they will not be absorbed or penetrated, keeping the circuit board dry and functioning normally. The shielding insulation layer 5 can effectively block electromagnetic interference and ensure stable signal transmission. This structural design enables the circuit board to work safely and reliably in harsh environments, extending the service life of the circuit board and improving the stability of the equipment.

[0026] The thickness of the nano-protective film 2 is 0.1-100μm. Setting the thickness of the nano-protective film 2 between 0.1-100μm ensures the protective effect without affecting heat dissipation and the sensitivity of the circuit board, while also saving costs.

[0027] The nano-protective film 2 also includes an anti-corrosion layer 7, which is located between the nano-waterproof layer 6 and the motherboard. The anti-corrosion layer 7 can be any or more of a nano-ceramic coating or a fluorocarbon coating. The nano-ceramic coating or fluorocarbon coating provides resistance to acids, alkalis, and various organic solvents. Combined with the filled nano-waterproof layer 6, this enhances the overall structure's resistance, preventing corrosion from acidic salt spray during use and significantly extending the circuit board's lifespan.

[0028] The nano-protective film 2 also includes a heat insulation layer 8, which is located between the anti-corrosion layer 7 and the motherboard. The heat insulation layer 8 is any one or more of ceramic-based composite coatings and aerogel coatings. The heat insulation layer 8, made of heat insulation materials such as ceramic-based composite materials and aerogel, has high thermal resistance and low thermal conductivity, which can significantly reduce the temperature of the circuit board surface and improve the thermal stability and reliability of the circuit board.

[0029] The thickness of both the nano-waterproof layer 6 and the anti-corrosion layer 7 is 0.1-50μm. The thickness of the nano-waterproof layer 6 and the anti-corrosion layer 7 is controlled within the range of 0.1-50μm to ensure that these two layers can effectively perform waterproof and anti-corrosion functions without being excessively thickened, which would affect the structural compactness and heat dissipation.

[0030] The nano-waterproof layer 6 is any one or more of the following: polyimide coating, polytetrafluoroethylene coating, sodium methylsiloxane coating, or methylsilicate coating. These materials all possess excellent waterproof performance and chemical stability, allowing for the selection of the most suitable waterproof material based on different environmental requirements. This ensures that the nano-waterproof layer 6 maintains excellent waterproof performance under various working conditions, flexibly adapting to diverse application scenarios.

[0031] The motherboard includes a substrate layer 3, a circuit layer 4 disposed on the substrate layer 3, and a shielding and insulating layer 5. The substrate layer 3 carries the circuit layer 4, which transmits electrical signals. The shielding and insulating layer 5 isolates electromagnetic interference and moisture from the external environment. The shielding and insulating layer 5 includes an epoxy resin layer and an electromagnetic shielding layer. The epoxy resin layer is coated on the side of the substrate layer 3 away from the circuit layer 4 and the side of the circuit layer 4 away from the substrate layer 3. The electromagnetic shielding layer is disposed on the surface of the epoxy resin layer. The epoxy resin and the electromagnetic shielding layer provide insulation and shielding effects, respectively, enhancing the stability of the circuit board in complex electromagnetic environments, ensuring signal transmission quality, and reducing malfunctions caused by electromagnetic interference.

[0032] The nano-protective film 2 is deposited onto the circuit board body 1 via electroplating, vacuum plating, or vapor deposition. Electroplating involves applying an electric current to an electrolyte, causing metal ions to deposit on the control board surface to form a thin film. This method can create a uniform and dense coating, providing excellent corrosion resistance, wear resistance, and decorative effects. Vacuum plating (also known as vacuum coating or vacuum electroplating) is a coating process performed under vacuum conditions. It utilizes the principle of physical vapor deposition, heating the coating material to an evaporation or sputtering state, and then depositing it on the control board surface under the influence of an electric or magnetic field. Vacuum plating can form high-quality films with excellent adhesion and gloss, while maintaining the original properties of the coating material. Finally, deposition methods include various physical and chemical methods, such as chemical vapor deposition (CVD) and physical vapor deposition (PVD). PVD can deposit coating materials onto the control board surface at low temperatures through a physical process, forming a thin film with excellent wear and corrosion resistance.

[0033] The nano-waterproof circuit board also includes a cover 9 disposed on the circuit board body 1. A seal 10 is provided on the inner wall of the cover 9, and the cover 9 abuts against and seals the circuit board body 1 via the seal 10. The seal 10 can effectively block the ingress of external moisture and dust, further enhancing the sealing performance of the circuit board. The seal 10 provides secondary protection at the cover 9, ensuring the protection effect of the circuit board in extreme environments.

[0034] Specifically, the sealing element 10 is a silicone sealing ring.

[0035] A thermally conductive silicone grease layer 12 is coated on the circuit board body 1. A thermally conductive copper plate 11 is provided on the side of the thermally conductive silicone grease layer 12 away from the circuit board body 1, and the thermally conductive copper plate 11 is tightly connected to the thermally conductive silicone grease layer 12. By providing the thermally conductive silicone grease layer 12 and the thermally conductive copper plate 11, the thermally conductive silicone grease layer 12 facilitates the dissipation of heat from the circuit board substrate layer 3. The thermally conductive silicone grease layer 12 transfers the heat from the circuit board substrate layer 3 to the thermally conductive copper plate 11, which then dissipates the heat, thereby improving the heat dissipation effect and preventing the circuit board from being damaged due to excessive temperature.

[0036] Specifically, the heat-conducting copper plate 11 is provided with heat dissipation fins 13 at equal intervals. The heat-conducting copper plate 11 dissipates the heat of the circuit board body 1 through the heat dissipation fins 13. A heat dissipation space is formed between the heat dissipation fins 13 to facilitate heat dissipation, thereby improving the heat dissipation effect and preventing the circuit board temperature from becoming too high.

[0037] The substrate layer 3 of the circuit board is the foundation of the entire circuit board, used to support the circuit layer 4 and other protective layers. It is typically made of heat-resistant and insulating materials, such as fiberglass or ceramic substrates. The substrate layer 3 is cut to a shape suitable for the brushless motor installation. The circuit layer 4 is arranged on the substrate layer 3, and conductive circuits are formed on the substrate layer 3 through processes such as etching and electroplating. This circuit layer 4 is used to transmit electrical signals and connect to the control and drive system of the brushless motor, ensuring stable current transmission. A shielding insulating layer 5 is coated on the surface of the circuit layer 4. This layer typically includes an epoxy resin layer and an electromagnetic shielding layer. The epoxy resin layer is used for insulation and mechanical protection, while the electromagnetic shielding layer is used to isolate external electromagnetic interference, ensuring the stability of signal transmission on the circuit board. A nano-protective film 2 is uniformly coated on the outer layer of the circuit board body 1. The nano-protective film 2 includes a nano-waterproof layer 6, an anti-corrosion layer 7, and a heat insulation layer 8. The protective film is usually coated using vacuum coating, electroplating, or vapor deposition technology to ensure that the nanomaterials are uniformly adhered to the surface of the circuit board. A waterproof layer is formed using hydrophobic materials such as polyimide and polytetrafluoroethylene to prevent moisture from contacting the circuit board. An anti-corrosion layer 7 is set between the waterproof layer and the circuit board, using a nano-ceramic coating or fluorocarbon coating to prevent damage to the circuit board from corrosive gases such as acids and alkalis. A heat insulation layer 8 is added below the anti-corrosion layer 7, usually using a ceramic-based composite coating or aerogel coating, to isolate the circuit from the influence of external high temperatures. Thermal grease is coated on the back of the circuit board body 1 and tightly bonded to the thermally conductive copper plate 11 to form a thermally conductive layer structure. The thermal grease can improve the heat conduction efficiency and ensure the heat dissipation requirements of the circuit board under long-term operation. A cover 9 is added to the outside of the circuit board, and a seal 10 is installed on the inside of the cover 9 to enhance the sealing performance of the circuit board and prevent condensation and dust from entering the circuit board. The tight bond between the cover 9 and the seal 10 further enhances the waterproof effect of the circuit board.

[0038] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A nano-waterproof circuit board for a brushless motor, comprising a circuit board body (1); characterized in that: The circuit board body (1) is provided with a nano protective film (2) on its surface, so that a continuous protective layer is formed on the surface of the circuit board body. The circuit board body (1) includes a main board and a controller, Hall element, level conversion circuit and power transistor disposed on the main board. The Hall element is used to detect the position of the external rotor. The controller is used to receive external commands and control the voltage applied to the external winding. The level conversion circuit is used to convert the controller's signal into the signal of the power transistor. The power transistor is used to construct the circuit for powering the brushless motor winding. The nano protective film (2) includes a nano waterproof layer (6). The nano waterproof layer (6) is used to prevent external water from entering the circuit board body (1) and causing a short circuit.

2. The nano-waterproof circuit board for a brushless motor according to claim 1, characterized in that: The thickness of the nano-protective film (2) is 0.1-100 μm.

3. The nano-waterproof circuit board for a brushless motor according to claim 1, characterized in that: The nano protective film (2) also includes an anti-corrosion layer (7), which is located between the nano waterproof layer (6) and the main board. The anti-corrosion layer (7) is any one or more of the nano ceramic coating and fluorocarbon coating.

4. The nano-waterproof circuit board for a brushless motor according to claim 3, characterized in that: The nano-protective film (2) also includes a heat insulation layer (8), which is located between the anti-corrosion layer (7) and the main board. The heat insulation layer (8) is any one or more of ceramic-based composite coatings and aerogel coatings.

5. The nano-waterproof circuit board for a brushless motor according to claim 4, characterized in that: The thickness of both the nano-waterproof layer (6) and the anti-corrosion layer (7) is 0.1-50 μm.

6. The nano-waterproof circuit board for a brushless motor according to claim 1, characterized in that: The nano-waterproof layer (6) is any one or more of the following: polyimide coating, polytetrafluoroethylene coating, sodium methylsiloxane coating, or methylsilicate coating.

7. The nano-waterproof circuit board for a brushless motor according to claim 1, characterized in that: The motherboard includes a substrate layer (3), a circuit layer (4) disposed on the substrate layer (3), and a shielding insulation layer (5). The substrate layer (3) is used to carry the circuit layer (4), the circuit layer (4) is used to transmit electrical signals, and the shielding insulation layer (5) is used to isolate electromagnetic interference and moisture in the external environment. The shielding insulation layer (5) includes an epoxy resin layer and an electromagnetic shielding layer. The epoxy resin layer is coated on the side of the substrate layer (3) away from the circuit layer (4) and the side of the circuit layer (4) away from the substrate layer (3). The electromagnetic shielding layer is disposed on the surface of the epoxy resin layer.

8. The nano-waterproof circuit board for a brushless motor according to claim 1, characterized in that: The nano protective film (2) is deposited onto the circuit board body (1) by electroplating, vacuum plating or vapor deposition.

9. A nano-waterproof circuit board for a brushless motor according to claim 1, characterized in that: The nano waterproof circuit board also includes a cover (9) disposed on the circuit board body (1), and a sealing element (10) is provided on the inner wall of the cover (9). The cover (9) abuts against the circuit board body (1) via the sealing element (10).

10. A nano-waterproof circuit board for a brushless motor according to claim 1, characterized in that: The circuit board body (1) is coated with a thermal grease layer (12), and a thermal copper plate (11) is provided on the side of the thermal grease layer (12) away from the circuit board body (1). The thermal copper plate (11) is tightly connected to the thermal grease layer (12).

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