Multi-layer circuit board capable of preventing oxidation and corrosion

Abstract

The utility model relates to the technical field of circuit boards, and discloses an anti-oxidation and anti-corrosion multilayer circuit board, which comprises a board body and a ceramic layer, the board body is composed of multilayer circuit boards, components are arranged on the board body, the ceramic layer is coated on the outer side of the board body, a sleeve groove is arranged on the ceramic layer, the components are movably sleeved in the sleeve groove, and the ceramic layer is coated on the outer side of the board body. And a silica gel layer is fixed in the ceramic layer and is attached to the plate body. The silica gel layer is installed in the ceramic layer, when the ceramic layer wraps the circuit board, the silica gel layer can be attached to a component, fully seal edge gaps and prevent the edge gaps from leaking out, so that the circuit board can be better prevented from being oxidized and corroded, meanwhile, the silica gel layer can reduce the temperature rise speed of a heating piece and absorb a heat source, and the service life of the heating piece is prolonged. The ceramic layer is not influenced by a heat source, and the practicability is further improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a multilayer circuit board that is resistant to oxidation and corrosion. Background Technology

[0002] A multilayer circuit board (MWB) is a printed circuit board composed of multiple circuit patterns, typically used in high-density, high-performance electronic devices. Compared to single-sided and double-sided circuit boards, MWBs have more circuit layers, enabling more complex circuit designs and higher functional integration. They are an indispensable basic component in modern electronics technology, supporting higher-performance and more complex devices through the stacking and meticulous design of multiple circuits. Although their manufacturing cost is higher and their design is more challenging, they offer irreplaceable advantages in improving circuit performance, reducing size, and increasing integration.

[0003] Currently, existing multilayer circuit boards achieve oxidation and corrosion prevention by adding a ceramic layer on the outer layer. However, there are certain gaps between the ceramic layer and the components on the board, which cannot be completely adhered. Over time, this will still lead to oxidation and corrosion of the circuit board, which is a certain defect. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a multilayer circuit board that is resistant to oxidation and corrosion. It has the advantages of providing better protection against oxidation and corrosion to the circuit board when the ceramic layer is used for protection, thereby improving the service life of the circuit board. It solves the problems of the current stage where a single ceramic layer cannot seal the edges of components, resulting in the circuit board still being affected by oxidation and corrosion. Furthermore, when the heat-generating components on the circuit board are heated, the ceramic layer is affected by the heat-generating components on the circuit board and cannot quickly dissipate heat and cool down when the circuit board stops operating.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a multilayer circuit board for preventing oxidation and corrosion, comprising a board body and a ceramic layer. The board body is composed of multiple circuit boards, and components are disposed on the board body. At the same time, the outer side of the board body is covered with a ceramic layer, which provides protection for the board body and prevents oxidation.

[0006] The ceramic layer has grooves, and the components are movably fitted into the grooves. The ceramic layer has multiple grooves, and the size of the grooves matches the size of the corresponding components. When the ceramic layer covers the side of the component, the component is fitted into the corresponding groove, so that the side of the component is completely fitted into the inside of the groove, improving the stability and sealing of the board.

[0007] A silicone layer is fixed inside the ceramic layer and adheres to the plate. The silicone layer can fill the small gaps between the plate and the ceramic layer, improving the sealing of the plate.

[0008] In use, this anti-oxidation and anti-corrosion multilayer circuit board is constructed by covering the board body composed of multiple circuit boards with a ceramic layer. The slots opened in the ceramic layer are fitted onto the sides of the corresponding components, and the sleeves are inserted into the sleeve holes. During the pressing and installation, the barbs puncture the rubber ring, and the adhesive inside the rubber ring flows out, bonding and sealing the gaps between the components and the slots, as well as between the board body and the ceramic layer. The entire processed circuit board is installed in the mounting component. The ceramic layer and silicone layer provide anti-oxidation and anti-corrosion properties. At the same time, when the heat sink in the mounting component is in operation, the air generated cools the ceramic layer, and the air enters through the through holes to cool the silicone layer, thereby reducing the temperature of the board body and components.

[0009] As a further improvement to the above solution, positioning holes are provided on the plate.

[0010] With the above technical solution, positioning holes are provided at the four corner positions of the plate. Screws are passed through the positioning holes, and the front end of the screws is threaded onto the mounting part to fix the plate to the mounting part.

[0011] As a further improvement to the above solution, the ceramic layer is threaded with a positioning screw on its side, and one end of the positioning screw is threaded to the side of the plate.

[0012] Through the above technical solution, the edge of the plate is provided with a circular hole that matches the diameter of the positioning screw. The positioning screw passes through the ceramic layer and is threaded into the circular hole, thereby achieving the stability of the installation between the ceramic layer and the plate.

[0013] As a further improvement to the above solution, a through hole is provided on the side of the ceramic layer.

[0014] Through the above technical solution, the through hole penetrates the interior of the ceramic layer and is horizontally opposite to the silicone layer. When the heat dissipation component inside the mounting part is in operation, the airflow generated can enter through the through hole and cool the silicone layer, thereby achieving heat dissipation and cooling of the heat-generating components.

[0015] As a further improvement to the above solution, an edge groove is provided on the inner side of the sleeve groove, and a rubber ring is fixed in the edge groove. The rubber ring is fitted onto the side of the component.

[0016] With the above technical solution, the bottom of the rubber ring protrudes from the inner side of the ceramic layer and has elastic force. When the component passes through the slot, the plate presses the rubber ring, making the rubber ring flat and the inner side is squeezed against the side of the component to seal the edge of the component.

[0017] As a further improvement to the above solution, the rubber ring is filled with adhesive.

[0018] The above technical solution involves puncturing the rubber ring to allow the internal adhesive to flow out, thus sealing the connection between the component and the rubber ring and making the rubber ring a fixed part, preventing any hollow parts from forming.

[0019] As a further improvement to the above solution, a sleeve hole is provided on the ceramic layer, and a sleeve button is fixed on the plate body, with the sleeve button inserted into the sleeve hole.

[0020] With the above technical solution, the positions of the sleeve hole and the sleeve button are opposite. When the ceramic layer and the plate are closed and installed, the sleeve button is inserted into the sleeve hole, which avoids the phenomenon of misalignment during stacking and improves the installation accuracy.

[0021] As a further improvement to the above solution, the plate is provided with barbs that are attached to the bottom of the rubber ring.

[0022] With the above technical solution, when the plate and ceramic layer are pressed and closed, the barbs puncture the rubber ring, causing the internal adhesive to flow out, thus sealing the edge gaps.

[0023] Compared with the prior art, this utility model provides a multilayer circuit board that is resistant to oxidation and corrosion, and has the following beneficial effects:

[0024] 1. This anti-oxidation and anti-rust multilayer circuit board has a silicone layer installed inside the ceramic layer. When the ceramic layer covers the circuit board, the silicone layer can adhere to the components and fully seal the edge gaps to prevent leakage. This can better prevent the circuit board from oxidation and corrosion. At the same time, the silicone layer can reduce the heating rate of the heat-generating components and absorb the heat source, so that the ceramic layer is not affected by the heat source, further improving its practicality.

[0025] 2. This anti-oxidation and corrosion multilayer circuit board, when closed with the circuit board through the ceramic layer, compresses the rubber ring into a flat shape. Under the deformation force, the inner side of the rubber ring is tightly attached to the side of the component, thereby increasing the sealing at the gap. Furthermore, during the compression molding process, the barbs on the board can puncture the rubber ring, allowing the internal adhesive to leak out and bond the gap. At the same time, the rubber ring is cured, further improving the sealing of the circuit board and effectively preventing oxidation damage to the circuit board. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall external three-dimensional structure of the device of this utility model;

[0027] Figure 2 This is a schematic diagram of the top view of the external planar structure of the ceramic layer of this utility model;

[0028] Figure 3 This is a schematic diagram of the internal planar top view structure of the ceramic layer of this utility model;

[0029] Figure 4 This is a schematic diagram of the connection structure between the ceramic layer and the plate body of this utility model;

[0030] Figure 5 This utility model Figure 4 Schematic diagram of the structure at point A in the middle.

[0031] The attached diagram lists the components represented by each number as follows:

[0032] 1. Plate body; 101. Positioning hole; 102. Components; 103. Barb; 104. Button;

[0033] 2. Ceramic layer; 201. Positioning screw; 202. Through hole; 203. Sleeve groove; 204. Silicone layer; 206. Edge groove; 207. Rubber ring; 208. Adhesive; 209. Sleeve hole. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example 1

[0035] Please see Figures 1-5 As shown, the multilayer circuit board for preventing oxidation and corrosion proposed in this embodiment includes a board body 1 and a ceramic layer 2. The board body 1 is composed of multilayer circuit boards and components 102 are disposed on the board body 1. At the same time, the outer side of the board body 1 is covered with a ceramic layer 2, which is used to provide protection for the board body 1 and prevent the board body 1 from oxidizing.

[0036] A groove 203 is formed on the ceramic layer 2, and the component 102 is movably fitted into the groove 203. Multiple grooves 203 are formed on the ceramic layer 2, and the size of the groove 203 matches the size of the corresponding component 102. When the ceramic layer 2 covers the side of the component 102, the component 102 is fitted into the corresponding groove 203, so that the side of the component 102 is completely fitted into the inside of the groove 203, thereby improving the stability and sealing of the covering of the plate 1.

[0037] A silicone layer 204 is fixed inside the ceramic layer 2. The silicone layer 204 is attached to the plate 1. The silicone layer 204 can fill the small gaps between the plate 1 and the ceramic layer 2, thereby improving the sealing of the plate 1.

[0038] The working principle of the multilayer circuit board for oxidation and corrosion prevention proposed in this embodiment is as follows: In use, the ceramic layer 2 is wrapped around the board body 1 composed of multilayer circuit boards, and the slot 203 opened on the ceramic layer 2 is fitted onto the side of the corresponding component 102. At the same time, the sleeve 104 is inserted into the sleeve hole 209. During the pressing installation, the barb 103 punctures the rubber ring 207, and the adhesive 208 inside the rubber ring 207 flows out, which bonds and seals the gap between the component 102 and the slot 203, as well as between the board body 1 and the ceramic layer 2. By installing the entire processed circuit board in the mounting component, the ceramic layer 2 and the silicone layer 204 provide anti-oxidation and corrosion protection. At the same time, when the heat sink in the mounting component is in operation, the generated air cools the ceramic layer 2, and the air enters from the through hole 202 to cool the silicone layer 204, thereby reducing the temperature of the board body 1 and the component 102. Example 2

[0039] Please see Figures 1-5 As shown, the multilayer circuit board for oxidation and corrosion prevention proposed in this embodiment, based on the first embodiment, further includes: a positioning hole 101 on the board body 1; a positioning screw 201 threadedly connected to the side of the ceramic layer 2; one end of the positioning screw 201 threadedly connected to the side of the board body 1; a through hole 202 on the side of the ceramic layer 2; an edge groove 206 on the inner side of the sleeve groove 203; a rubber ring 207 fixed in the edge groove 206; the rubber ring 207 fitting on the side of the component 102; adhesive 208 inside the rubber ring 207; a sleeve hole 209 on the ceramic layer 2; a sleeve button 104 fixed on the board body 1; the sleeve button 104 inserted into the sleeve hole 209; and barbs 103 on the board body 1, which are attached to the bottom of the rubber ring 207.

[0040] In this design, positioning holes 101 are provided at the four corner positions of the board 1. Screws pass through the positioning holes 101, and the front ends of the screws are threaded onto the mounting parts to fix the board 1 to the mounting parts. Circular holes matching the diameter of the positioning screws 201 are provided on the edges of the board 1 (where no components are located). The positioning screws 201 pass through the ceramic layer 2 and are threaded into the circular holes to ensure the stability of the installation between the ceramic layer 2 and the board 1. Through holes 202 penetrate the interior of the ceramic layer 2 and are horizontally aligned with the silicone layer 204. When the heat dissipation components inside the mounting parts are operating, the airflow generated can enter through the through holes 202 and cool the silicone layer 204, thereby cooling the heat-generating components 102. The bottom of the rubber ring 207 protrudes from the inner side of the ceramic layer 2 and has elasticity. When component 102 passes through slot 203, plate 1 presses rubber ring 207, making rubber ring 207 flat and its inner side pressed against the side of component 102, sealing the edge of component 102. By puncturing rubber ring 207, the internal adhesive 208 flows out, bonding and sealing the connection between component 102 and rubber ring 207, and making rubber ring 207 fixed to avoid hollowness. The position of sleeve hole 209 and sleeve button 104 are opposite. When ceramic layer 2 is closed and installed with plate 1, sleeve button 104 is inserted into sleeve hole 209 to avoid misalignment during stacking and improve installation accuracy. When plate 1 and ceramic layer 2 are pressed and closed, barb 103 punctures rubber ring 207, allowing internal adhesive 208 to flow out, bonding and sealing the edge gaps.

[0041] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multilayer circuit board resistant to oxidation and corrosion, comprising a board body (1) and a ceramic layer (2), characterized in that, The board (1) is composed of multiple circuit boards, and components (102) are provided on the board (1). At the same time, the outer side of the board (1) is covered with a ceramic layer (2). A groove (203) is provided on the ceramic layer (2), and the component (102) is movably sleeved in the groove (203); A silicone layer (204) is fixed inside the ceramic layer (2), and the silicone layer (204) is attached to the plate (1).

2. The multilayer circuit board for oxidation and corrosion prevention according to claim 1, characterized in that: The plate (1) is provided with a positioning hole (101).

3. The multilayer circuit board for preventing oxidation and corrosion according to claim 1, characterized in that: The ceramic layer (2) is threaded with a positioning screw (201) on its side, and one end of the positioning screw (201) is threaded to the side of the plate (1).

4. The multilayer circuit board for preventing oxidation and corrosion according to claim 2, characterized in that: The ceramic layer (2) has through holes (202) on its side.

5. A multilayer circuit board for preventing oxidation and corrosion according to claim 1, characterized in that: An edge groove (206) is provided on the inner side of the sleeve groove (203), and a rubber ring (207) is fixed in the edge groove (206). The rubber ring (207) is fitted on the side of the component (102).

6. A multilayer circuit board for preventing oxidation and corrosion according to claim 5, characterized in that: The rubber ring (207) contains adhesive (208).

7. A multilayer circuit board for preventing oxidation and corrosion according to claim 4, characterized in that: The ceramic layer (2) has a sleeve hole (209), and a sleeve button (104) is fixed on the plate (1). The sleeve button (104) is inserted into the sleeve hole (209).

8. A multilayer circuit board for preventing oxidation and corrosion according to claim 7, characterized in that: The plate (1) is provided with barbs (103), which are attached to the bottom of the rubber ring (207).

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