Anti-reverse-installation packaging module

Abstract

The module comprises a bottom shell and an upper cover, the bottom shell is provided with an accommodating cavity used for placing a circuit board assembly, the circuit board assembly is provided with pins, the bottom shell is provided with marks corresponding to the pins, the upper cover is arranged at an opening of the accommodating cavity, and the upper cover is arranged at the opening of the accommodating cavity. The upper cover is provided with a first limiting part used for positioning the installation direction of the circuit board assembly, the upper cover is further provided with a second limiting part, the bottom shell is provided with a third limiting part, and the third limiting part and the second limiting part are matched to position the installation directions of the upper cover and the bottom shell. And the pins are in one-to-one correspondence with the marks. According to the utility model, through the arrangement of the first limiting part, the second limiting part and the third limiting part, the circuit board assembly is correctly installed on the upper cover and the bottom shell, the fool-proof design does not need to be checked through observation, the pins are ensured to be always in one-to-one correspondence with the marks, and thus the phenomenon of reverse installation is effectively prevented.

Description

Technical Field

[0001] This utility model relates to the field of power module technology, and more specifically, to an anti-reverse mounting packaging module. Background Technology

[0002] When using a modular power supply, the pin functions are usually determined by the silkscreen markings. These markings are typically printed on the bottom of the power supply, while the function pins are on the top cover. When installing the modular power supply, the pins face inward and the silkscreen faces outward, allowing for better visual inspection of the silkscreen and thus understanding the function of each pin.

[0003] However, ensuring a one-to-one correspondence between pin positions and silkscreen printing positions during assembly becomes a problem. As power density increases and power supply size decreases, the internal PCB is already crammed with components, making it impossible to implement foolproof designs using PCB limits or notches. Therefore, reverse assembly frequently occurs during final assembly, leading to misaligned pin and silkscreen printing positions, resulting in defective products requiring rework or scrapping. If pins are assembled before silkscreen printing, additional steps such as silkscreen printing, baking, packaging, storage, and transportation are required. This not only easily causes secondary scratches and cosmetic defects but also increases the risk of product damage, reduces assembly efficiency, and significantly increases costs.

[0004] Therefore, it is necessary to address the issue of ensuring a one-to-one correspondence between functional pins and silkscreen markings during assembly of such power supplies from the design perspective, in order to avoid product damage caused by reverse assembly and potential safety hazards to users. Summary of the Invention

[0005] To address or mitigate the problem of misalignment of functional pins and silkscreen annotations during the assembly of existing power supply packaging modules, this invention provides an anti-reverse assembly packaging module.

[0006] The technical solution of this utility model is as follows:

[0007] An anti-reverse mounting packaging module includes a bottom shell and a top cover. The bottom shell has a receiving cavity for placing a circuit board assembly. The circuit board assembly has pins, and the bottom shell has markings corresponding to the pins. The top cover is located at the opening of the receiving cavity. The top cover has a first limiting part for positioning the mounting direction of the circuit board assembly, a second limiting part, and a third limiting part. The third limiting part and the second limiting part cooperate to position the mounting direction of the top cover and the bottom shell, so that the pins correspond one-to-one with the markings.

[0008] In the aforementioned anti-reverse mounting packaging module, multiple pins are provided, and the multiple pins are arranged asymmetrically. The first limiting part is a through hole provided on the upper cover, and the through hole corresponds one-to-one with the pin so that the pin can pass through.

[0009] Furthermore, a sealing element is provided between the pin and the through hole.

[0010] Furthermore, the sealant is adhesive that fills the space between the pin and the through hole.

[0011] In the aforementioned anti-reverse mounting packaging module, one of the second limiting part and the third limiting part is a protrusion, and the other is a groove that mates with the protrusion.

[0012] In the aforementioned anti-reverse mounting packaging module, the cross-sectional dimensions of the circuit board assembly are approximately equal to the cross-sectional dimensions of the accommodating cavity.

[0013] In the aforementioned anti-reverse mounting packaging module, a flange is provided on the upper cover, and the outer wall of the flange fits against the inner wall of the accommodating cavity.

[0014] Furthermore, the second limiting portion is connected to the flange.

[0015] In the aforementioned anti-reverse mounting packaging module, the upper cover is bonded to the bottom shell.

[0016] In the aforementioned anti-reverse mounting packaging module, the accommodating cavity is filled with sealant.

[0017] According to the above-described solution, the beneficial effects of this utility model are as follows: By setting the first limiting part, the second limiting part, and the third limiting part, the circuit board assembly is correctly installed on the top cover and bottom shell. This foolproof design eliminates the need for visual inspection, ensuring that the pins and marks always correspond one-to-one, thus effectively preventing reverse installation. Due to the foolproof design, workers do not need to frequently check or adjust the module's orientation during assembly, greatly improving production efficiency. Simultaneously, it reduces rework and scrap caused by reverse installation, further lowering production costs. Through the design of this packaging module, it ensures that each pin can be accurately connected to the corresponding circuit or device, thereby avoiding circuit failures or equipment damage caused by incorrect connections and improving product safety. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a frontal perspective view of the present invention.

[0020] Figure 2 This is a schematic diagram of the bottom three-dimensional structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the frontal exploded structure of this utility model;

[0022] Figure 4 This is a schematic diagram of the exploded bottom structure of this utility model.

[0023] In the figure, the reference numerals are as follows: 1. Bottom shell; 101. Mark; 102. Third limiting part; 103. Accommodating cavity; 2. Top cover; 201. First limiting part; 202. Second limiting part; 203. Flange; 3. Circuit board assembly; 301. Pin. Detailed Implementation

[0024] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0025] It should be noted that when a component is referred to as "fixed," "set," or "connected" to another component, it may be located directly or indirectly on that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or position based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first," "second," etc., are used for ease of description only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "Many" means two or more, unless otherwise explicitly specified. "Several" means one or more, unless otherwise explicitly specified.

[0026] like Figures 1 to 4As shown in the figure, an anti-reverse mounting packaging module according to one embodiment of the present invention includes a bottom shell 1 and a top cover 2. The bottom shell 1 is provided with a receiving cavity 103 for placing a circuit board assembly 3. The circuit board assembly 3 is provided with pins 301. The bottom shell 1 is provided with a mark 101 corresponding to the pins 301. The top cover 2 is provided at the opening of the receiving cavity 103. The top cover 2 is provided with a first limiting part 201 for positioning the mounting direction of the circuit board assembly 3. The top cover 2 is also provided with a second limiting part 202. The bottom shell 1 is provided with a third limiting part 102. The third limiting part 102 and the second limiting part 202 cooperate to position the mounting direction of the top cover 2 and the bottom shell 1, so that the pins 301 correspond one-to-one with the marks 101.

[0027] During assembly, the circuit board assembly 3 and the upper cover 2 are first combined. The first limiting part 201 positions the circuit board assembly 3 on the upper cover 2 in the correct position and orientation. Next, the circuit board assembly 3 is placed into the receiving cavity 103 of the bottom shell 1, and the upper cover 2 is placed over the opening of the bottom shell 1. The second limiting part 202 and the third limiting part 102 cooperate to position the upper cover 2 and the bottom shell 1 in the correct orientation, so that the circuit board assembly is correctly installed in the bottom shell 1. The bottom shell 1 has markings 101 that correspond to the pins 301 on the circuit board assembly 3, so that the markings 101 and the pins 301 are correctly matched.

[0028] In this embodiment, by setting the first limiting part 201, the second limiting part 202, and the third limiting part 102, the circuit board assembly 3 is correctly installed on the upper cover 2 and the bottom shell 1. This foolproof design eliminates the need for visual inspection, ensuring that pins 301 and markings 101 always correspond one-to-one, thus effectively preventing reverse installation. Due to this foolproof design, workers do not need to frequently check or adjust the module's orientation during assembly, greatly improving production efficiency. Simultaneously, it reduces rework and scrap caused by reverse installation, further lowering production costs. Through the design of this packaging module, it is ensured that each pin 301 can be accurately connected to the corresponding circuit or device, thereby avoiding circuit failures or equipment damage caused by incorrect connections and improving product safety.

[0029] like Figure 3 As shown, in a preferred embodiment, there are multiple pins 301, which are asymmetrically arranged. The first limiting part 201 is a through hole provided on the upper cover 2, and the through hole corresponds one-to-one with the pin 301 so that the pin 301 can pass through.

[0030] Since pins 301 are asymmetrical and directional, they help to initially determine the mounting direction of the circuit board assembly 3. Next, the through holes on the top cover 2 are matched one-to-one with the pins 301 on the circuit board assembly 3, so that each pin 301 can pass smoothly through the corresponding through hole, thereby positioning the top cover 2 and the bottom shell 1.

[0031] In this embodiment, the asymmetrical arrangement of pins 301 and the one-to-one correspondence between the through holes on the top cover 2 and pins 301 achieve precise error prevention, facilitate positioning, and thus simplify installation, improving installation accuracy and ensuring the correct correspondence between pins 301 and the markings 101 on the bottom shell 1. Furthermore, the cooperation between the through holes and pins 301 provides additional restraint, helping to prevent loosening of the module during subsequent use or transportation, ensuring the safety and reliability of the product.

[0032] In a preferred embodiment, a seal is provided between pin 301 and the through hole. Specifically, the seal is adhesive that fills the space between pin 301 and the through hole.

[0033] During assembly, ensure that pin 301 is precisely aligned with and has passed through the through-hole, then inject an appropriate amount of adhesive into the gap between pin 301 and the through-hole. After injecting the adhesive, wait for a period of time to allow it to fully penetrate and cure, ensuring a tight seal is formed between pin 301 and the through-hole. After the adhesive has cured, proceed with the steps of fixing the top cover 2 and the bottom shell 1 to complete the assembly of the entire encapsulation module.

[0034] In this embodiment, the seal effectively prevents moisture, dust, and other contaminants from seeping into the module through the gap between pin 301 and the through hole, thereby protecting the electronic components inside the module and improving the module's reliability and service life. Secondly, the seal also enhances the module's mechanical strength and durability, especially under vibration or impact environments, preventing loosening between pin 301 and the through hole.

[0035] In a preferred embodiment, the receiving cavity 103 is filled with sealant.

[0036] In this embodiment, the use of sealant effectively isolates moisture, dust, and corrosive substances from the external environment, preventing them from penetrating the module and damaging electronic components. This significantly improves the module's moisture-proof, dust-proof, and corrosion-proof capabilities. Simultaneously, the sealant also acts as a shock absorber and buffer, effectively dispersing and absorbing energy when the module is subjected to vibration or impact, protecting internal electronic components from mechanical damage.

[0037] like Figures 1 to 4 As shown, in a preferred embodiment, one of the second limiting portion 202 and the third limiting portion 102 is a protrusion, and the other is a groove that mates with the protrusion. Specifically, in this embodiment, the second limiting portion 202 is a protrusion, and the third limiting portion 102 is a groove.

[0038] In this embodiment, by designing the second limiting part 202 as a protrusion and the third limiting part 102 as a corresponding groove, a precise and stable assembly effect is achieved, ensuring the accurate positioning of the upper cover 2 and the bottom shell 1 during the assembly process and avoiding assembly errors caused by misalignment. The tight fit between the protrusion and the groove prevents the upper cover 2 and the bottom shell 1 from loosening or separating, enhancing the stability and firmness of the connection, thereby improving the reliability and durability of the entire structure. In addition, the protrusion and groove structures are simple and easy to manufacture.

[0039] like Figure 3 As shown, in a preferred embodiment, the cross-sectional dimensions of the circuit board assembly 3 are comparable to the cross-sectional dimensions of the accommodating cavity 103.

[0040] In this embodiment, the cross-sectional dimensions of the circuit board assembly 3 are comparable to those of the accommodating cavity 103, ensuring a tight fit between the two. On one hand, this tight fit allows the circuit board assembly 3 to be securely installed within the accommodating cavity 103, effectively preventing shaking and enhancing structural stability. On the other hand, it maximizes the use of the space in the accommodating cavity 103, avoiding wasted space and thus helping to reduce the overall size of the device and improve the product's compactness.

[0041] like Figure 4 As shown, in a preferred embodiment, the upper cover 2 is provided with a flange 203, and the outer wall of the flange 203 fits against the inner wall of the receiving cavity 103.

[0042] The second limiting part 202 is connected to the flange 203.

[0043] The top cover 2 is bonded to the bottom shell 1.

[0044] In this embodiment, the upper cover 2 and the bottom shell 1 are firmly connected by a flange 203 that fits tightly against the accommodating cavity 103, enhancing the connection strength between the upper cover 2 and the bottom shell 1 and improving the overall sealing performance. Furthermore, the adhesive connection between the upper cover 2 and the bottom shell 1 further enhances the structural stability and sealing, effectively preventing interference from the external environment, such as moisture and dust, from entering the interior, thereby protecting the normal operation of the internal electronic components. In addition, the adhesive connection eliminates the need for fasteners, making the overall structure simpler, more aesthetically pleasing, and reducing manufacturing costs.

[0045] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A reverse-mount packaging module, characterized in that, The device includes a bottom shell and a top cover. The bottom shell has a cavity for housing a circuit board assembly. The circuit board assembly has pins. The bottom shell has markings corresponding to the pins. The top cover is located at the opening of the cavity. The top cover has a first limiting part for positioning the mounting direction of the circuit board assembly. The top cover also has a second limiting part. The bottom shell has a third limiting part. The third limiting part and the second limiting part cooperate to position the mounting direction of the top cover and the bottom shell, so that the pins correspond one-to-one with the markings.

2. The anti-reverse mounting packaging module according to claim 1, characterized in that, The pins are provided in multiple ways, and the multiple pins are arranged asymmetrically. The first limiting part is a through hole provided on the upper cover. The through hole corresponds to each pin so that the pin can pass through.

3. The anti-reverse mounting packaging module according to claim 2, characterized in that, A sealing element is provided between the pin and the through hole.

4. The anti-reverse mounting packaging module according to claim 3, characterized in that, The sealant is adhesive that fills the space between the pin and the through hole.

5. The anti-reverse mounting packaging module according to claim 1, characterized in that, One of the second limiting part and the third limiting part is a protrusion, and the other is a groove that mates with the protrusion.

6. The anti-reverse mounting packaging module according to claim 1, characterized in that, The cross-sectional dimensions of the circuit board assembly are comparable to those of the accommodating cavity.

7. The anti-reverse mounting packaging module according to claim 1, characterized in that, The upper cover is provided with a flange, and the outer wall of the flange is in contact with the inner wall of the accommodating cavity.

8. The anti-reverse mounting packaging module according to claim 7, characterized in that, The second limiting part is connected to the flange.

9. The anti-reverse mounting packaging module according to claim 1, characterized in that, The top cover is bonded to the bottom shell.

10. The anti-reverse mounting packaging module according to claim 1, characterized in that, The cavity is filled with sealant.

Images