Protection assembly for 5G module on double-layer circuit board

Abstract

The utility model relates to the field of double-layer circuit boards, and discloses a protection assembly for a 5G module on a double-layer circuit board. In the application, the upper surface of the heat conducting plate can directly contact with the bottom of the circuit board assembly, so that heat transfer is performed on the bottom of the circuit board more quickly, the heat pipe efficiently transfers heat by utilizing evaporation-condensation circulation, and the heat is transferred from the heat conducting plate to the heat dissipation fins far away from the heat source; the cooling fins provide a larger surface area to improve heat exchange with surrounding air, the cooling fins enhance the cooling effect of natural convection by increasing the surface area, the fan can force air to flow, the cooling efficiency is improved, the cooling process of the cooling assembly is accelerated by actively sucking cold air and discharging hot air, and the cooling efficiency is improved. By installing the assembly for conducting heat on the bottom of the circuit board assembly on the device, performance reduction of electronic components caused by temperature rise is avoided, so that performance stability of the circuit board assembly is effectively maintained, and reliability of the circuit board assembly is improved.

Description

Technical Field

[0001] This application belongs to the field of double-layer circuit board technology, specifically a protective component for 5G modules on a double-layer circuit board. Background Technology

[0002] Double-layer circuit boards (BLCBs) are an important component in electronic engineering, typically used in applications requiring high-density wiring and complex circuits. BLCBs offer excellent electrical performance and reliability, making them a fundamental component of many electronic products. Widely used in various electronic devices and products, BLCBs allow for the placement of more electronic components and connections within a limited space, increasing circuit complexity and functionality.

[0003] A protective component for 5G modules on a double-layer circuit board is a protective accessory specifically designed for 5G communication modules. It ensures stable operation of the 5G module under various environmental conditions. The protective component can extend the lifespan of the 5G module and reduce damage caused by environmental factors.

[0004] However, the existing device does not have a component for conducting heat to the bottom of the circuit board assembly. As the temperature rises, the performance of electronic components deteriorates, making it impossible to effectively maintain the performance stability of the circuit board assembly and thus reducing its reliability. Utility Model Content

[0005] The purpose of this application is to provide a protective component for 5G modules on a double-layer circuit board, in order to solve the problem that the device mentioned above does not have a component for heat conduction on the bottom of the circuit board assembly, which leads to a decrease in the performance of electronic components due to the increase in temperature, and thus cannot effectively maintain the performance stability of the circuit board assembly, resulting in a decrease in the reliability of the circuit board assembly.

[0006] The technical solution adopted in this application is as follows: it includes a mounting base, a heat-conducting plate is fixedly installed inside the mounting base, a plurality of heat pipes are fixedly installed on the lower surface of the heat-conducting plate, heat dissipation fins are fixedly installed on the outer upper surface of the heat pipes, fans are fixedly installed on the front and rear outer surfaces of the heat dissipation fins, ventilation protective covers are provided on the upper part of the outer surfaces of the heat dissipation fins and the fans, and bolts are installed through the inside of the mounting base.

[0007] By adopting the above technical solution, a heat-conducting plate is fixedly installed inside the mounting base. Multiple heat pipes are fixedly installed on the lower surface of the heat-conducting plate, and heat dissipation fins are fixedly installed on the upper outer surface of the heat pipes. Fans are fixedly installed on the front and rear outer surfaces of the heat dissipation fins. Ventilation protective covers are provided at the upper ends of the outer surfaces of the heat dissipation fins and fans. Mounting bolts pass through the interior of the mounting base. The mounting base serves as the mounting foundation for the protective and cooling components, connecting various parts. The upper surface of the heat-conducting plate can directly contact the bottom of the circuit board assembly, thereby transferring heat to the bottom of the circuit board more quickly. The heat pipes utilize an evaporation-condensation cycle to efficiently transfer heat from the heat-conducting plate to the heat dissipation fins, which are far from the heat source. The heat dissipation fins provide… The heat sink has a larger surface area to improve heat exchange with the surrounding air. The heat sink fins enhance the cooling effect of natural convection by increasing the surface area. The fan can force airflow to improve heat dissipation efficiency. By actively drawing in cold air and expelling hot air, it accelerates the cooling process of the cooling components. The ventilation shield can protect the upper surface of the heat sink fins and fan to prevent damage to the cooling components from external impacts. The bolts pass through the mounting base to fix the entire device to the holes opened on the external surface. By installing components for conducting heat to the bottom of the circuit board assembly, the performance of electronic components is prevented from degrading due to temperature rise, thereby effectively maintaining the performance stability of the circuit board assembly and providing reliability to the circuit board assembly.

[0008] In a preferred embodiment, a double-layer circuit board is disposed in the middle of the upper surface of the mounting base, and a cross screw is installed through the interior of the double-layer circuit board.

[0009] By adopting the above technical solution, a double-layer circuit board is set in the middle of the upper surface of the mounting base. A cross screw is installed through the inside of the double-layer circuit board. The double-layer circuit board serves as the mounting base for the circuit board assembly and the 5G module, which can provide a shorter signal path, reduce signal loss and interference, and improve space utilization through the double-layer design. The cross screw can pass through the double-layer circuit board and connect itself to the threaded hole inside the mounting base, thereby fixing the mounting base and the cross screw together.

[0010] In a preferred embodiment, a contact is fixedly mounted on the front side of the upper surface of the cross screw, and a Zener diode is disposed on the rear side of the contact.

[0011] By adopting the above technical solution, a contact is fixedly installed on the front side of the upper surface of the cross screw, and a Zener diode is set on the rear side of the contact. The contact can be connected to an external cable to realize the electrical connection between the circuit board assembly and the 5G module and other electronic components. The Zener diode is used to smooth the voltage output of the voltage regulator chip and reduce circuit noise.

[0012] In a preferred embodiment, a capacitor is disposed on the rear side of the Zener diode, and a resistor is disposed on the rear side of the capacitor.

[0013] By adopting the above technical solution, a capacitor is placed behind the Zener diode, and a resistor is placed behind the capacitor. The capacitor can ensure the stable voltage output required for the normal operation of each circuit module, while the resistor can limit and regulate the current and voltage in the circuit to meet the circuit design requirements.

[0014] In a preferred embodiment, a power management chip is disposed on the left side of the resistor, and a Bluetooth chip is disposed on the rear side of the power management chip.

[0015] By adopting the above technical solution, a power management chip is set on the left side of the resistor, and a Bluetooth chip is set on the back side of the power management chip. The power management chip is responsible for managing and protecting the power supply of each module on the board, such as overvoltage protection, undervoltage protection, and overcurrent protection. The Bluetooth chip can communicate with external devices through the Bluetooth protocol and is also responsible for transmitting and receiving radio frequency signals.

[0016] In a preferred embodiment, a microprocessor is disposed on the right side of the Bluetooth chip, and a 5G chip is disposed on the rear side of the microprocessor.

[0017] By adopting the above technical solution, a microprocessor is set on the right side of the Bluetooth chip, and a 5G chip is set on the rear side of the microprocessor. The microprocessor is responsible for processing the data in the circuit board assembly, executing algorithms and logic operations, and the 5G chip, as the main device of the 5G module, is responsible for establishing and maintaining wireless communication connections and realizing the transmission and reception of 5G data.

[0018] In a preferred embodiment, a circuit board protective cover is fixedly installed in the middle of the upper surface of the mounting base, and a protective cover plate is provided on the upper surface of the circuit board protective cover.

[0019] By adopting the above technical solution, a circuit board protective cover is fixedly installed in the middle of the upper surface of the mounting base. A protective cover plate is provided on the upper surface of the circuit board protective cover. The circuit board protective cover is used to provide protection for the circuit board assembly from all sides, and its interior contains a groove to provide a position for the connection of the protective cover plate. The protective cover plate contains a sealing ring inside, which can fit together with the upper surface of the circuit board protective cover and the groove inside, so that the protective cover plate and the circuit board protective cover form a whole to provide protection for the circuit board assembly.

[0020] In a preferred embodiment, a hook is provided between the ventilation shield and the outer surface of the shield cover, and a sealing sleeve is provided on the front outer surface of the mounting base.

[0021] By adopting the above technical solution, hooks are set between the ventilation protective cover and the outer surface of the protective cover plate, and a sealing sleeve is opened on the front outer surface of the mounting base. The hooks are used to fix the protective cover plate to the upper surface of the circuit board protective cover, so as to prevent the protective cover plate from detaching from the upper surface of the circuit board protective cover and causing the circuit board assembly to be directly exposed to the external environment. The sealing sleeve provides a position for the cables connected to the circuit board assembly to pass through the circuit board protective cover, and the sealing sleeve can fit the external cables, so as to prevent the external environment from affecting the circuit board assembly from the position where the cables pass through the circuit board protective cover.

[0022] In summary, due to the adoption of the above technical solution, the beneficial effects of this application are:

[0023] In this application, the upper surface of the heat-conducting plate can directly contact the bottom of the circuit board assembly, thereby transferring heat to the bottom of the circuit board more quickly. The heat pipe utilizes an evaporation-condensation cycle to efficiently transfer heat from the heat-conducting plate to the heat dissipation fins away from the heat source. The heat dissipation fins provide a larger surface area to improve heat exchange with the surrounding air. The heat dissipation fins enhance the cooling effect of natural convection by increasing the surface area. The fan can force airflow to improve heat dissipation efficiency. By actively drawing in cold air and expelling hot air, the cooling process of the cooling components is accelerated. By installing components for conducting heat to the bottom of the circuit board assembly in this device, the performance degradation of electronic components due to temperature rise is avoided, thereby effectively maintaining the performance stability of the circuit board assembly and providing reliability to the circuit board assembly. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the three-dimensional structure in this application;

[0025] Figure 2 This is a schematic cross-sectional view of the cooling component in this application;

[0026] Figure 3 This is a schematic diagram of the top view structure in this application;

[0027] Figure 4 This is a schematic diagram of the circuit board assembly structure in this application.

[0028] The markings in the diagram are: 1. Mounting base; 2. Heat-conducting plate; 3. Heat pipe; 4. Heat sink fins; 5. Fan; 6. Ventilation shield; 7. Bolt; 8. Double-layer circuit board; 9. Phillips head screw; 10. Contact; 11. Zener diode; 12. Capacitor; 13. Resistor; 14. Power management chip; 15. Bluetooth chip; 16. Microprocessor; 17. 5G chip; 18. Circuit board protective cover; 19. Protective cover plate; 20. Hook; 21. Sealing sleeve. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the embodiments of this application. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] Example:

[0031] Reference Figures 1-3 The system includes a mounting base 1 with mounting bolts 7 penetrating its interior. The mounting base 1 serves as the base for mounting the protective and cooling components, connecting various parts. The upper surface of the heat-conducting plate 2 directly contacts the bottom of the circuit board assembly, facilitating faster heat transfer. Heat pipes 3 utilize an evaporation-condensation cycle to efficiently transfer heat from the heat-conducting plate 2 to the heat dissipation fins 4, which are located away from the heat source. The heat dissipation fins 4 provide a larger surface area to enhance heat exchange with the surrounding air, thus improving the cooling effect of natural convection. A fan 5 forces airflow, improving heat dissipation efficiency by actively drawing in cool air and expelling hot air, accelerating the cooling process of the cooling components. A ventilation shield 6 protects the upper surfaces of the heat dissipation fins 4 and fan 5 from external impacts. Bolts 7, penetrating the mounting base 1, secure the entire device to holes on its external surface. By installing components for conducting heat to the bottom of the circuit board assembly, the system prevents performance degradation of electronic components due to temperature increases, effectively maintaining the stability and reliability of the circuit board assembly.

[0032] Reference Figure 2 and Figure 3 The double-layer circuit board 8 serves as the mounting base for the circuit board assembly and the 5G module. It can provide a shorter signal path, reduce signal loss and interference, and improve space utilization through the double-layer design. The cross screw 9 can penetrate the double-layer circuit board 8 and connect itself to the threaded hole inside the mounting base 1, thereby fixing the mounting base 1 and the cross screw 9 together.

[0033] Reference Figure 4 Contact 10 can be connected to an external cable to realize the electrical connection between the circuit board assembly and the 5G module and other electronic components. Zener diode 11 is used to smooth the voltage output of the voltage regulator chip and reduce circuit noise.

[0034] Reference Figure 4Capacitor 12 ensures a stable voltage output required for the normal operation of each circuit module, while resistor 13 limits and regulates the current and voltage in the circuit to meet the circuit design requirements.

[0035] Reference Figure 4 The power management chip 14 is responsible for managing and protecting the power supply of each module on the board, such as overvoltage protection, undervoltage protection, and overcurrent protection. The Bluetooth chip 15 can communicate with external devices through the Bluetooth protocol and is also responsible for transmitting and receiving radio frequency signals.

[0036] Reference Figure 4 The microprocessor 16 is responsible for processing data from the circuit board assembly, executing algorithms and logical operations. The 5G chip 17, as the main device of the 5G module, is responsible for establishing and maintaining wireless communication connections, and realizing the transmission and reception of 5G data.

[0037] Reference Figure 1 The circuit board cover 18 is used to provide protection around the circuit board assembly, and its interior contains a groove to provide a connection position for the cover plate 19. The cover plate 19 contains a sealing ring that can fit together with the upper surface of the circuit board cover 18 and the groove contained therein, so that the cover plate 19 and the circuit board cover 18 form a whole to provide protection for the circuit board assembly.

[0038] Reference Figure 1 The hook 20 is used to fix the protective cover 19 to the upper surface of the circuit board protective cover 18, so as to prevent the protective cover 19 from detaching from the upper surface of the circuit board protective cover 18 and causing the circuit board assembly to be directly exposed to the external environment. The sealing sleeve 21 provides a position for the cable connected to the circuit board assembly to pass through the circuit board protective cover 18, and the sealing sleeve 21 can fit the external cable, so as to prevent the external environment from affecting the circuit board assembly from the position where the cable passes through the circuit board protective cover 18.

[0039] The implementation principle of the protective component for a 5G module on a double-layer circuit board in this application is as follows: the mounting base 1 has a through mounting bolt 7, which serves as the mounting base for the protective component and the cooling component, and is used to connect the various components. The upper surface of the heat-conducting plate 2 can directly contact the bottom of the circuit board component, thereby transferring heat to the bottom of the circuit board more quickly. The heat pipe 3 uses an evaporation-condensation cycle to efficiently transfer heat, transferring heat from the heat-conducting plate 2 to the heat dissipation fins 4 away from the heat source. The heat dissipation fins 4 provide a larger surface area to improve heat exchange with the surrounding air. The heat dissipation fins 4 enhance the cooling effect of natural convection by increasing the surface area. The fan 5 can force airflow to improve heat dissipation efficiency. By actively drawing in cold air and expelling hot air, the cooling process of the cooling component is accelerated. The ventilation protective cover 6 can protect the upper surface of the heat dissipation fins 4 and the fan 5 to prevent external impact from damaging the cooling component. The bolt 7 passes through the mounting base 1 and can fix the entire device to the holes opened on the outer surface.

[0040] The double-layer circuit board 8 serves as the mounting base for the circuit board assembly and the 5G module. It can provide a shorter signal path, reduce signal loss and interference, and improve space utilization through the double-layer design. The cross screw 9 can penetrate the double-layer circuit board 8 and connect itself to the threaded hole inside the mounting base 1, thereby fixing the mounting base 1 and the cross screw 9 together.

[0041] By installing a component for conducting heat to the bottom of the circuit board assembly in this device, the performance of electronic components is prevented from deteriorating due to increased temperature, thereby effectively maintaining the performance stability of the circuit board assembly and providing reliability to the circuit board assembly.

[0042] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A protective assembly for a 5G module on a double-layer circuit board, comprising a mounting base (1), characterized in that: A heat-conducting plate (2) is fixedly installed inside the mounting base (1). Multiple heat pipes (3) are fixedly installed on the lower surface of the heat-conducting plate (2). Heat dissipation fins (4) are fixedly installed on the outer upper surface of the heat pipes (3). Fans (5) are fixedly installed on the front and rear outer surfaces of the heat dissipation fins (4). Ventilation protective covers (6) are provided on the upper surface of the outer surfaces of the heat dissipation fins (4) and the fans (5). Bolts (7) are installed through the inside of the mounting base (1).

2. The protective component for a 5G module on a double-layer circuit board as described in claim 1, characterized in that: A double-layer circuit board (8) is provided in the middle of the upper surface of the mounting base (1), and a cross screw (9) is installed through the interior of the double-layer circuit board (8).

3. The protective component for a 5G module on a double-layer circuit board as described in claim 2, characterized in that: A contact (10) is fixedly installed on the front side of the upper surface of the cross screw (9), and a Zener diode (11) is provided on the rear side of the contact (10).

4. The protective component for a 5G module on a double-layer circuit board as described in claim 3, characterized in that: A capacitor (12) is disposed on the rear side of the Zener diode (11), and a resistor (13) is disposed on the rear side of the capacitor (12).

5. A protective component for a 5G module on a double-layer circuit board as described in claim 4, characterized in that: A power management chip (14) is disposed on the left side of the resistor (13), and a Bluetooth chip (15) is disposed on the rear side of the power management chip (14).

6. The protective component for a 5G module on a double-layer circuit board as described in claim 5, characterized in that: A microprocessor (16) is disposed on the right side of the Bluetooth chip (15), and a 5G chip (17) is disposed on the rear side of the microprocessor (16).

7. A protective component for a 5G module on a double-layer circuit board as described in claim 1, characterized in that: A circuit board protective cover (18) is fixedly installed in the middle of the upper surface of the mounting base (1), and a protective cover plate (19) is provided on the upper surface of the circuit board protective cover (18).

8. A protective component for a 5G module on a double-layer circuit board as described in claim 1, characterized in that: A hook (20) is provided between the ventilation protective cover (6) and the outer surface of the protective cover plate (19), and a sealing sleeve (21) is provided on the front outer surface of the mounting base (1).

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