Spectrometer controller with heat dissipation structure
By using an aluminum alloy heat sink and heat concentration plate combined with a cooling fan in the fluorescence spectrometer, the problem of insufficient heat dissipation in the fluorescence spectrometer is solved, achieving rapid heat dissipation and dust prevention, and improving the stability and lifespan of the equipment.
Patent Information
- Application Number
- CN202423172705.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-12-23
AI Technical Summary
Existing fluorescence spectrometers have inefficient heat dissipation designs, leading to increased internal temperatures that affect performance and measurement accuracy, and may even damage critical components.
The heat dissipation component, consisting of an aluminum alloy heat sink and a heat concentration plate, combined with a cooling fan, enables rapid heat transfer and dissipation. The heat dissipation area is increased through the design of heat dissipation holes and connecting slots, and the double-layer dustproof mesh ensures both heat dissipation and dustproof performance.
It effectively reduces the internal temperature of the spectrometer, improves the operational stability and service life of the equipment, prevents circuit damage, and ensures high-precision long-term operation.
Smart Images

Figure CN223652575U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of spectrometer equipment technology, and more specifically to a spectrometer controller with a heat dissipation structure. Background Technology
[0002] A fluorescence spectrometer, also known as a fluorescence spectrophotometer, is an important instrument for qualitative and quantitative analysis, widely used in materials science, biomedicine, and chemical analysis. Through detection using a fluorescence spectrometer, key information such as excitation spectra, emission spectra, quantum yield, fluorescence intensity, fluorescence lifetime, Stokes shift, fluorescence polarization and depolarization characteristics, and fluorescence quenching can be obtained, providing crucial data support for scientific research and industrial production.
[0003] During operation, the internal laser source and electronic components of a fluorescence spectrometer continuously generate a significant amount of heat. If this heat cannot be dissipated effectively and promptly, the internal temperature of the equipment will rise, affecting the spectrometer's performance and measurement accuracy. More seriously, excessively high temperatures may damage critical components or even cause circuit burnout, rendering the instrument malfunction. For example, the EDX6600 fluorescence spectrometer, due to its lack of an efficient heat dissipation design, may experience heat dissipation problems that directly impact the equipment's reliability and lifespan.
[0004] Currently, most fluorescence spectrometers employ simple fan or heat sink designs for heat dissipation. However, these methods are insufficient in terms of heat dissipation efficiency and uniform heat distribution, making it difficult to meet the requirements of high precision and long-term operation of fluorescence spectrometers. Therefore, there is an urgent need to develop a spectrometer controller with an efficient heat dissipation structure to ensure rapid heat dissipation within the instrument, improve the operational stability and lifespan of the equipment, and meet the practical needs of high-performance fluorescence spectroscopy analysis. Utility Model Content
[0005] In view of the shortcomings of the existing technology, the purpose of this application is to provide a spectrometer controller with a heat dissipation structure to solve the problems mentioned in the background art.
[0006] According to one aspect of this application, a spectrometer controller with a heat dissipation structure includes a spectrometer controller body, supporting legs, and a heat dissipation assembly. Supporting legs are fixedly provided on both sides of the bottom of the spectrometer controller body. A heat dissipation assembly is fixedly provided on the bottom of the spectrometer controller body, the heat dissipation assembly including a heat sink, a heat concentration plate, and a cooling fan. Multiple heat sinks are fixedly provided on the bottom of the spectrometer controller body between the supporting legs on both sides. Each heat sink has a hollow internal structure, and the inner cavity of each heat sink communicates with the internal component cavity of the spectrometer controller body. A heat concentration plate is fixedly connected to both ends of each heat sink, and the end of each heat sink is fixedly connected to the side of the heat concentration plate. The heat concentration plate also has a hollow internal structure, and its inner cavity communicates with the inner cavity of each heat sink. Cooling fans are installed on the outer sides of the heat concentration plates on both sides of the bottom of the spectrometer controller body.
[0007] Preferably, a heat dissipation opening is provided on the outer side wall of the heat concentration plate away from the heat dissipation plate, and the heat dissipation opening is connected to the inner cavity of the heat concentration plate. A cooling fan is fixedly installed on the outer side wall of the heat concentration plate at the location of the heat dissipation opening.
[0008] Preferably, an outer dustproof net is installed on the outside of the cooling fan, and an inner dustproof net is installed between the cooling fan and the heat dissipation opening.
[0009] Preferably, the plurality of heat sinks are evenly and equidistantly distributed along the width direction of the spectrometer controller body, each heat sink is perpendicular to the bottom surface of the spectrometer controller body, and the plane of each heat sink is perpendicular to the plane of the heat concentration plate.
[0010] Preferably, each heat sink has multiple heat dissipation holes at both ends, and the heat concentration plate has a connecting slot at the connection position with the heat sink, and the connecting slot is connected to the heat dissipation hole at the corresponding position.
[0011] Preferably, both the heat sink and the heat concentration plate are made of aluminum alloy, the cavity wall thickness of the heat sink and the heat concentration plate is 0.2mm-0.4mm, and the distance between any two adjacent heat sinks is 2mm-4mm.
[0012] Preferably, the bottom surface of the heat sink is higher than the bottom surface of the support leg.
[0013] The advantages of this application compared to the prior art are as follows: This application provides a spectrometer controller with a heat dissipation structure. Through a heat dissipation component located at the bottom of the spectrometer controller, heat generated by the electronic components inside the controller is transferred to the inner cavity of the heat sink. This heat is then transferred along the inner cavity of the heat sink through heat dissipation holes at its ends and through connecting slots on the heat concentration plate to the inner cavity of the heat concentration plate. A cooling fan then dissipates the heat, thereby cooling the electronic components inside the spectrometer controller and ensuring its long-term normal operation, preventing damage to its internal circuitry. Furthermore, both the heat sink and the heat concentration plate are made of aluminum alloy and have a hollow structure. The use of aluminum alloy allows for better heat conduction, and the hollow structure design increases the relative heat dissipation area of the heat sink and the heat concentration plate, improving heat dissipation efficiency and further enhancing the heat dissipation effect on the electronic components inside the spectrometer controller. Attached Figure Description
[0014] Figure 1 This is a perspective view of a spectrometer controller with a heat dissipation structure according to an embodiment of this application.
[0015] Figure 2 This is a front cross-sectional view of a spectrometer controller with a heat dissipation structure according to an embodiment of this application.
[0016] Figure 3 This is a side sectional view of a spectrometer controller with a heat dissipation structure according to an embodiment of this application.
[0017] Figure 4 This is a split view of the cooling fan of a spectrometer controller with a heat dissipation structure according to an embodiment of this application.
[0018] Reference numerals in the attached diagram: 1. Spectrometer controller body; 2. Support leg; 3. Heat sink; 4. Heat concentration plate; 5. Cooling fan; 6. Heat dissipation opening; 7. Outer dustproof mesh; 8. Inner dustproof mesh; 9. Heat dissipation hole; 10. Connecting slot. Detailed Implementation
[0019] To make the content of this application easier to understand, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It should be noted that the terms "front," "rear," "left," "right," "upper," and "lower" used in the following description refer to the accompanying drawings. Figure 2 In the context of direction, the terms "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively.
[0020] like Figures 1-4As shown, a spectrometer controller with a heat dissipation structure includes a spectrometer controller body 1, support legs 2, and a heat dissipation assembly. Support legs 2 are fixedly mounted on both sides of the bottom of the spectrometer controller body 1. A heat dissipation assembly is fixedly mounted on the bottom of the spectrometer controller body 1, comprising a heat dissipation plate 3, a heat concentration plate 4, and a cooling fan 5. Multiple heat dissipation plates 3 are fixedly mounted on the bottom of the spectrometer controller body 1 between the support legs 2 on both sides. The bottom surface of the heat dissipation plate 3 is higher than the bottom surface of the support legs 2 to provide sufficient space for heat dissipation. Each heat dissipation plate 3 has a hollow cavity structure, and the cavity of each heat dissipation plate 3 is connected to the internal component cavity of the spectrometer controller body 1. Both ends of the heat dissipation plate 3 are... A heat concentration plate 4 is fixedly connected, and the ends of each heat sink 3 are fixedly connected to the side of the heat concentration plate 4. The heat concentration plate 4 has a hollow internal structure. Multiple heat sinks 3 are evenly and equidistantly distributed along the width direction of the spectrometer controller body 1. Each heat sink 3 is perpendicular to the bottom surface of the spectrometer controller body 1, and the plane of each heat sink 3 is perpendicular to the plane of the heat concentration plate 4. The inner cavity of the heat concentration plate 4 is connected to the inner cavity of each heat sink 3. Specifically, multiple heat dissipation holes 9 are opened at both ends of each heat sink 3. A connecting slot 10 is opened on the heat concentration plate 4 at the connection position with the heat sink 3. The connecting slot 10 is connected to the heat dissipation hole 9 at the corresponding position. This design facilitates… Heat generated by the electronic components inside the spectrometer controller body 1 is transferred to the inner cavity of the heat sink 3, and then along the inner cavity of the heat sink 3 through the heat dissipation holes 9 at its end and the connecting slots 10 on the heat concentration plate 4, and finally dissipated by the cooling fan 5. Furthermore, both the heat sink 3 and the heat concentration plate 4 are made of aluminum alloy, which allows for better heat conduction. The hollow structure design of the heat sink 3 and the heat concentration plate 4 increases their relative heat dissipation surface, and the cavity wall thickness is 0.2mm-0.4mm, resulting in better heat dissipation. The spacing between each adjacent heat sink 3 is 2mm-4mm. This design ensures a sufficient number of heat sinks while also... For easy heat dissipation, a heat dissipation opening 6 is provided on the outer wall of the heat concentration plate 4 away from the heat dissipation plate 3, and the heat dissipation opening 6 is connected to the inner cavity of the heat concentration plate 4. A cooling fan 5 is fixedly installed on the outer wall of the heat concentration plate 4 at the position of the heat dissipation opening 6. The power supply of the cooling fan 5 is provided through the inside of the spectrometer controller body 1. An outer dustproof net 7 is installed on the outside of the cooling fan 5, and an inner dustproof net 8 is installed between the cooling fan 5 and the heat dissipation opening 6. The double-layer dustproof setting can better prevent external dust and impurities from entering the spectrometer controller through the cooling fan 5, the inner cavity of the heat concentration plate 4 and the inner cavity of the heat dissipation plate 3, so that the spectrometer controller can have rapid heat dissipation performance while also ensuring the dustproof performance inside the spectrometer controller.
[0021] Working principle: The heat generated by the electronic components inside the spectrometer controller body 1 is transferred to the inner cavity of the heat sink 3, and then along the inner cavity of the heat sink 3 through the heat dissipation holes 9 at its end and the connecting slots 10 on the heat concentration plate 4 to the inner cavity of the heat concentration plate 4. The heat is then dissipated by the cooling fan 5, thereby cooling down the electronic components inside the spectrometer controller body 1, ensuring that the spectrometer controller can work normally for a long time and avoiding damage to its internal circuits. In addition, the double-layer dustproof design can better prevent external dust and impurities from entering the spectrometer controller through the cooling fan 5, the inner cavity of the heat concentration plate 4 and the inner cavity of the heat sink 3. This allows the spectrometer controller to have both rapid heat dissipation performance and dustproof performance. Furthermore, both the heat sink 3 and the heat concentration plate 4 are made of aluminum alloy and have a cavity structure. The choice of aluminum alloy can better conduct heat dissipation, and the cavity structure design increases the relative heat dissipation area of the heat sink 3 and the heat concentration plate 4, improving heat dissipation efficiency, thereby further improving the heat dissipation effect on the electronic components inside the spectrometer controller body 1.
[0022] The above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features, without departing from the spirit and scope defined by the claims of this application.
Claims
1. A spectrometer controller with a heat dissipation structure, comprising a spectrometer controller body (1), a support leg (2), and a heat dissipation assembly, characterized in that, The spectrometer controller body (1) has support legs (2) fixedly installed on both sides of its bottom. A heat dissipation assembly is fixedly installed on the bottom of the spectrometer controller body (1). The heat dissipation assembly includes a heat sink (3), a heat concentration plate (4), and a cooling fan (5). Multiple heat sinks (3) are fixedly installed on the bottom of the spectrometer controller body (1) between the support legs (2) on both sides. Each heat sink (3) has a hollow cavity structure inside, and the inner cavity of each heat sink (3) is connected to the internal component cavity of the spectrometer controller body (1). Both ends of the heat sink (3) are fixedly connected to the heat concentration plate (4). The end of each heat sink (3) is fixedly connected to the side of the heat concentration plate (4). The heat concentration plate (4) has a hollow cavity structure inside, and the inner cavity of the heat concentration plate (4) is connected to the inner cavity of each heat sink (3). Cooling fans (5) are installed on the outer sides of the heat concentration plates (4) on both sides of the bottom of the spectrometer controller body (1).
2. A spectrometer controller with a heat dissipation structure according to claim 1, characterized in that, The heat concentration plate (4) has a heat dissipation opening (6) on its outer side wall away from the heat dissipation plate (3), and the heat dissipation opening (6) is connected to the inner cavity of the heat concentration plate (4). A cooling fan (5) is fixedly installed on the outer side wall of the heat concentration plate (4) at the position of the heat dissipation opening (6).
3. A spectrometer controller with a heat dissipation structure according to claim 2, characterized in that, An outer dustproof net (7) is installed on the outside of the cooling fan (5), and an inner dustproof net (8) is installed between the cooling fan (5) and the heat dissipation opening (6).
4. A spectrometer controller with a heat dissipation structure according to claim 1, characterized in that, Multiple heat sinks (3) are evenly and equidistantly distributed along the width direction of the spectrometer controller body (1). Each heat sink (3) is perpendicular to the bottom surface of the spectrometer controller body (1), and the plane of each heat sink (3) is perpendicular to the plane of the heat concentration plate (4).
5. A spectrometer controller with a heat dissipation structure according to claim 1, characterized in that, Each heat sink (3) has multiple heat dissipation holes (9) at both ends. The heat concentration plate (4) has a connecting slot (10) at the connection position with the heat sink (3). The connecting slot (10) is connected to the heat dissipation hole (9) at the corresponding position.
6. A spectrometer controller with a heat dissipation structure according to claim 1, characterized in that, The heat sink (3) and the heat concentration plate (4) are both made of aluminum alloy. The cavity wall thickness of the heat sink (3) and the heat concentration plate (4) is 0.2mm-0.4mm, and the distance between each two adjacent heat sinks (3) is 2mm-4mm.
7. A spectrometer controller with a heat dissipation structure according to claim 1, characterized in that, The bottom surface of the heat sink (3) is higher than the bottom surface of the support leg (2).