Silicon wafer edge cleaning device

Abstract

The utility model discloses a silicon wafer edge cleaning device in the technical field of silicon wafer processing, which comprises a cleaning device main body, a cleaning ring is arranged on the top surface of the cleaning device main body, a cleaning block is fixed on the inner side of the cleaning ring, the silicon wafer main body is fixed in a bearing groove by an air suction port, and a servo motor is started to drive the silicon wafer main body to rotate. The servo motor drives the four belt pulleys to rotate, so that the belt pulleys drive the silicon wafer main body to rotate through the turntable, and the outer edge of the silicon wafer main body is cleaned through the cleaning block. Tiny fragments, cutting fluid residues and other pollutants are always left on the edge, if the pollutants are not effectively removed, the quality of subsequent processes such as photoetching and etching is seriously influenced, even device failure is caused, and the ideal cleaning effect is difficult to achieve by existing cleaning methods such as manual wiping and high-pressure water washing. And the surface of the silicon wafer may be damaged.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer edge cleaning device. BACKGROUND

[0002] Silicon wafer, also known as silicon wafer, is a basic material in the semiconductor and photovoltaic industry, mainly made of high-purity silicon, used for manufacturing electronic devices and solar cells, etc., and silicon wafer processing is a complex and delicate process, involving from raw material preparation to single crystal growth, silicon ingot preparation, and then to silicon wafer cutting and other key steps. The main raw material is high-purity polycrystalline silicon, which is prepared into a long strip-shaped single crystal silicon ingot through the melting and crystallization process in the single crystal furnace. Then, the silicon ingot is cut into thin silicon wafer by cutting equipment for subsequent application in the fields of semiconductor and photovoltaic, etc.

[0003] In semiconductor production, after cutting, the edge of the silicon wafer often has tiny fragments, cutting liquid residues and other contaminants. If these contaminants are not effectively removed, they will seriously affect the quality of subsequent processes such as photoetching, etching, etc., and even cause device failure. The existing cleaning methods such as manual wiping, high-pressure water washing, etc. are difficult to achieve ideal cleaning effect, and may damage the surface of the silicon wafer. Based on this, the utility model designs a silicon wafer edge cleaning device to solve the above problems. UTILITY MODEL CONTENTS

[0004] The utility model aims to provide a kind of silicon wafer edge cleaning device to solve the problem in the above background art that in semiconductor production, after cutting, the edge of the silicon wafer often has tiny fragments, cutting liquid residues and other contaminants. If these contaminants are not effectively removed, they will seriously affect the quality of subsequent processes such as photoetching, etching, etc., and even cause device failure. The existing cleaning methods such as manual wiping, high-pressure water washing, etc. are difficult to achieve ideal cleaning effect, and may damage the surface of the silicon wafer.

[0005] In order to achieve the above object, the utility model provides the following technical scheme: a kind of silicon wafer edge cleaning device, including cleaning device main part, the cleaning device main part is internally provided with support plate, support column is provided between the cleaning device main part and support plate, the cleaning device main part and support plate are fixedly connected by support column, the top surface of the support plate is provided with several support grooves, rotatingly connected with turntable in the support groove, the turntable is placed with silicon wafer main body, the bottom end of the support plate is fixed with servo motor, servo motor output end is fixed with pulley, the bottom end of the support plate is fixed with another four pulleys, five pulleys are drivenly connected by transmission belt, the top surface of four pulleys away from servo motor is all fixedly connected with turntable, the top surface of the turntable is provided with suction port, rotatingly connected with sealed bearing in the pulley away from servo motor, the bottom end of the sealed bearing is communicated with suction pipe, the top end of the sealed bearing is communicated with suction port, one end of the suction pipe away from sealed bearing is communicated with negative pressure device, the top surface of the cleaning device main part is rotatably connected with cleaning ring, the side of the cleaning ring close to the inside of cleaning device main part is fixed with cleaning block.

[0006] Preferably, the side of the cleaning ring close to the inside of cleaning device main part is fixed with edge grinding block, and the outer side of the cleaning ring is threadedly connected with control knob.

[0007] Preferably, the radius of the support groove is slightly larger than the radius of the silicon wafer main body, and the suction port is located at the center of the turntable.

[0008] Preferably, the material of the cleaning block is soft brush, and the cleaning block is attached to the silicon wafer main body.

[0009] Preferably, the sum of the number of edge grinding blocks and cleaning blocks corresponds to the number of support grooves, and the control knob is located close to one cleaning block.

[0010] Preferably, the shape of the control knob is "T" type, and the outer side of the control knob is provided with anti-slip stripes.

[0011] Compared with the prior art, the utility model has the beneficial effects that:

[0012] (1) The utility model discloses a cleaning ring is set up on the top surface of the cleaning device main part, and then the cleaning block is fixed to the inner side of the cleaning ring, and the suction port is used to fix the silicon wafer main part in the bearing groove, and the servo motor is started, and the servo motor drives the four belt pulleys to rotate, so that the belt pulley drives the silicon wafer main part to rotate through the rotating disc, so that the outer edge of the silicon wafer main part is cleaned through the cleaning block, and the problem that the edge of the silicon wafer is often left with tiny fragments, cutting fluid residues and other pollutants after cutting in the semiconductor production is solved, and if the pollutants cannot be effectively removed, the quality of subsequent processes such as photoetching, etching and the like will be seriously affected, and even the device fails, and the existing cleaning methods such as manual wiping, high-pressure water flushing and the like are difficult to achieve the ideal cleaning effect, and the silicon wafer surface can be damaged.

[0013] (2) By setting the edge grinding block in the cleaning ring, the silicon wafer main part is ground through the edge grinding block before being cleaned through the cleaning block, so that the sharp corners or irregular corners of the edge of the silicon wafer main part affect the cleaning efficiency of the silicon wafer, and the cleaning ring is fixedly connected with the cleaning device main part through the control knob, so that the worker can rotate the cleaning ring to switch the positions of the cleaning block and the edge grinding block, so that the silicon wafer main part is more convenient to replace, and the cleaning block and the edge grinding block are removed when the silicon wafer main part is taken out, so that the cleaning block and the edge grinding block are prevented from blocking the replacement of the silicon wafer main part. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for the ordinary skilled in the art, other drawings can be obtained according to these drawings without paying creative labor.

[0015] Figure 1 It is the three-dimensional schematic view of the structure of the utility model;

[0016] Figure 2 It is the three-dimensional schematic view of the box structure of the utility model;

[0017] Figure 3 It is the three-dimensional schematic view of the structure of the utility model when opening;

[0018] Figure 4 It is the three-dimensional schematic view of the structure of the utility model when opening.

[0019] In the drawings, the component list represented by each sign is as follows:

[0020] 1, cleaning device main body; 2, support plate; 3, support column; 4, support groove; 5, rotating disc; 6, silicon wafer main body; 7, servo motor; 8, pulley; 9, transmission belt; 10, sealed bearing; 11, suction pipe; 12, suction port; 13, cleaning ring; 14, cleaning block; 15, edge grinding block; 16, control knob. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0022] Please refer to Figures 1-4 The utility model provides a technical scheme: a kind of silicon wafer edge cleaning device, including cleaning device main body 1, support plate 2 is arranged in cleaning device main body 1, support column 3 is arranged between cleaning device main body 1 and support plate 2, cleaning device main body 1 and support plate 2 are fixedly connected by support column 3, the top surface of support plate 2 is provided with several support grooves 4, rotating disc 5 is rotatably connected in support groove 4, silicon wafer main body 6 is placed on rotating disc 5, servo motor 7 is fixed at the bottom of support plate 2, pulley 8 is fixed at the output end of servo motor 7, another four pulleys 8 are fixed symmetrically at the bottom of support plate 2, five pulleys 8 are transmissionally connected by transmission belt 9, the top surface of four pulleys 8 away from servo motor 7 is fixedly connected with rotating disc 5, suction port 12 is opened in the top surface of rotating disc 5, sealed bearing 10 is rotatably connected in the inside of pulley 8 away from servo motor 7, suction pipe 11 is communicated with the bottom end of sealed bearing 10, sealed bearing 10 top end is communicated with suction port 12, negative pressure device is communicated with the end of suction pipe 11 away from sealed bearing 10, cleaning ring 13 is rotatably connected on the top surface of cleaning device main body 1, cleaning block 14 is fixed on the side of cleaning ring 13 close to the inside of cleaning device main body 1, so that cleaning block 14 cleans silicon wafer main body 6.

[0023] Wherein, the radius of support groove 4 is slightly larger than the radius of silicon wafer main body 6, suction port 12 is located at the center of rotating disc 5, the material of cleaning block 14 is soft brush, cleaning block 14 is attached to silicon wafer main body 6, to improve the cleaning efficiency of cleaning block 14.

[0024] Please refer to Figures 1-4 Edge grinding block 15 is fixed on the side of cleaning ring 13 close to the inside of cleaning device main body 1, control knob 16 is screwedly connected on the outside of cleaning ring 13, so that silicon wafer main body 6 is ground by edge grinding block 15.

[0025] The sum of the number of the edge grinding blocks 15 and the number of the cleaning blocks 14 corresponds to the number of the bearing grooves 4, the position of the control knob 16 is close to one cleaning block 14, the control knob 16 is in the shape of a "T", and the outer side of the control knob 16 is provided with anti-skid stripes, so that the staff can fix the cleaning ring 13 on the cleaning device main body 1 through the control knob 16.

[0026] The working principle of the whole is that the silicon wafer body 6 is placed above the rotating disc 5 inside the bearing groove 4, then the locking of the control knob 16 is released, so that the cleaning ring 13 is fixed with the cleaning device main body 1, the cleaning ring 13 is rotated, so that the cleaning ring 13 drives the cleaning block 14 and the edge grinding block 15 to rotate, so that the staff moves the cleaning block 14 and the edge grinding block 15 to the corresponding position of the silicon wafer body 6, and then the control knob 16 is rotated, so that the cleaning ring 13 is fixed with the cleaning device main body 1, then the negative pressure device fixes the silicon wafer body 6 on the top surface of the rotating disc 5 through the suction pipe 11 and the suction port 12, and then the servo motor 7 is started, so that the servo motor 7 drives the belt pulley 8 to rotate, and the belt pulley 8 drives the other four belt pulleys 8 to rotate through the transmission belt 9, and the other four belt pulleys 8 drive the rotating disc 5 to rotate, so that the rotating disc 5 drives the silicon wafer body 6 to rotate, so that the cleaning block 14 and the edge grinding block 15 clean and edge grind different silicon wafer bodies 6 respectively, and then the locking of the control knob 16 is released, and the cleaning ring 13 is rotated, so that the cleaning block 14 and the edge grinding block 15 are moved away from the silicon wafer body 6, and then the negative pressure device is released to fix the silicon wafer body 6, so that the staff can replace the silicon wafer body 6 conveniently.

[0027] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0028] The preferred embodiments of the above disclosed application are only used to help explain the application. The preferred embodiments do not describe all the details, nor limit the application to the specific embodiments described. Obviously, according to the content of the specification, many modifications and changes can be made. The specification selects and describes these embodiments in order to better explain the principles and practical applications of the application, so that the skilled in the art can well understand and utilize the application. The application is limited by the claims and their entire scope and equivalents.

Claims

1. A silicon wafer edge cleaning device, comprising a cleaning device body (1), wherein a support plate (2) is disposed inside the cleaning device body (1), and a support column (3) is disposed between the cleaning device body (1) and the support plate (2), wherein the cleaning device body (1) and the support plate (2) are fixedly connected by the support column (3), characterized in that: The top surface of the support plate (2) is provided with several support grooves (4), and a turntable (5) is rotatably connected inside the support grooves (4). A silicon wafer body (6) is placed on the turntable (5). A servo motor (7) is fixed at the bottom of the support plate (2). A pulley (8) is fixed at the output end of the servo motor (7). Four other pulleys (8) are symmetrically fixed at the bottom of the support plate (2). The five pulleys (8) are connected by a transmission belt (9). The top surfaces of the four pulleys (8) away from the servo motor (7) are fixedly connected to the turntable (5). An air intake (12) is opened on the top surface of the turntable (5). A sealed bearing (10) is rotatably connected inside the pulleys (8) away from the servo motor (7). An air intake pipe (11) is connected to the bottom of the sealed bearing (10). The top of the sealed bearing (10) is connected to the air intake (12). A negative pressure device is connected to the end of the air intake pipe (11) away from the sealed bearing (10). A cleaning ring (13) is rotatably connected to the top surface of the main body (1) of the cleaning device, and a cleaning block (14) is fixed to the side of the cleaning ring (13) near the inside of the main body (1).

2. The silicon wafer edge cleaning device according to claim 1, characterized in that: The cleaning ring (13) has a grinding block (15) fixed on one side near the inside of the main body (1) of the cleaning device, and a control knob (16) is threaded to the outside of the cleaning ring (13).

3. The silicon wafer edge cleaning device according to claim 1, characterized in that: The radius of the support groove (4) is slightly larger than the radius of the silicon wafer body (6), and the air intake (12) is located at the center of the turntable (5).

4. The silicon wafer edge cleaning device according to claim 1, characterized in that: The cleaning block (14) is made of soft bristles and is attached to the silicon wafer body (6).

5. A silicon wafer edge cleaning device according to claim 2, characterized in that: The sum of the number of the grinding blocks (15) and the cleaning blocks (14) corresponds to the number of the support grooves (4), and the position of the control knob (16) is close to a cleaning block (14).

6. A silicon wafer edge cleaning device according to claim 2, characterized in that: The control knob (16) is T-shaped, and the outer side of the control knob (16) is provided with anti-slip stripes.

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