Deposition system for display device

Abstract

The utility model relates to a deposition system for a display device. A deposition system for a display device includes: a process chamber including a deposition region portion and a deposition standby portion; a deposition source device movably mounted between the deposition reserve part and the substrate table, in which a substrate mounted on the substrate table is arranged in a linear form above the deposition region part; a deposition prevention unit provided between the deposition source apparatus and the substrate; and a cooling unit directly coupled to the periphery of the substrate. A deposition system for a display device is configured to continuously perform a deposition process on at least two substrates arranged in a linear direction in a process chamber.

Description

[0001] Cross Reference to Related Applications

[0002] This application claims priority to and all the benefits of Korean Patent Application No. 10-2023-0143976, filed on October 25, 2023, the contents of which are incorporated herein in their entirety. TECHNICAL FIELD

[0003] Embodiments of the disclosure relate to a deposition system and a deposition method for a display device, and more particularly, to a deposition system and a deposition method for a display device including a cooling device for a deposition chamber, in which the deposition system and the deposition method support reducing a temperature of a display substrate or a deposition mask in an in-line deposition apparatus. BACKGROUND

[0004] In response to recent demands and needs for miniaturization, slimness, and high integration of electrical and electronic products and various application fields, research on organic light emitting diodes is being conducted.

[0005] Unlike existing liquid crystal displays, some organic light emitting devices can be implemented without a backlight device and can emit light by themselves. Thus, for example, organic light emitting devices can be lightweight and ultra-thin, consume a low amount of power, have a simplified structure supporting reduced manufacturing complexity and increased manufacturing convenience, and be economically efficient. Due to their advantages, organic light emitting devices are being particularly highlighted as next-generation display devices.

[0006] In some approaches, manufacturing such organic light emitting devices can include many manufacturing steps. Recently, research has been conducted on in-line deposition systems, which can deposit organic films and metal films on an upper layer of a substrate while allowing linear evaporation sources or point evaporation sources to be arranged at specified intervals within a process chamber to pass at a constant speed.

[0007] In particular, for example, each process chamber can be generally equipped with a deposition source device including a crucible and a heating unit such as a heater. In an example in which a deposition source is placed within the crucible and the crucible is heated by the heating unit, the deposition source material inside can evaporate and vaporize in response to heat and be deposited on a substrate located at an opposite side.

[0008] Here, the heating related to heating the crucible provided by the heater is high enough to vaporize the deposition source within the crucible, and heat is transferred to the substrate located at the opposite side of the crucible, resulting in damage and deformation of the substrate. Not only can defects in the thin film increase, but there is a problem in that the thin film can not be properly implemented when deposited at a certain thickness. To solve this problem, in some approaches in the past, a shield plate is placed between the crucible and the substrate or a shield plate is attached to the heater region of the top of the crucible to prevent the transfer of heat from the heater to the substrate / mask.

[0009] However, in the case of a relatively long deposition shield plate, not only can the deposition shield plate be bent due to heat, but there is a problem in that the heat blocking effect of the deposition shield plate can be insufficient in the case of a relatively thin deposition shield plate.

[0010] Korean Intellectual Property Office Publication No. 10-2011-0032695 "Induction-heated metal deposition source" provides an improved technology. In the technology, a cooling shield is formed adjacent to the opening of the crucible and the upper side of the heating unit, which includes a heater block with an internal heater coil. The cooling shield blocks the high heat of the crucible caused by the heating unit from being directly transferred to the substrate / mask, which can prevent damage to the substrate.

[0011] However, in some cases, the method can have the disadvantage that the heat blocking effect can be insufficient due to the use of a single plate, and the heat blocking effect can be insufficient due to the bending phenomenon of the cooling shield at high temperatures.

[0012] In some aspects, the above-described technology has the disadvantage that the cooling shield is in direct contact with the upper side of the heating unit, so that heat from the heating unit is directly transferred to the cooling shield, and the heat blocking effect on the substrate / mask is insufficient (e.g., below a threshold value). Utility Model Content

[0013] In relation to solving the described problems, embodiments of the present disclosure reduce the temperature of the substrate / mask compared to the prior art, improve the thermal expansion of the substrate / mask, and enable the use of a higher resolution mask compared to what is currently available, and embodiments of the present disclosure support the production of high resolution products.

[0014] In relation to solving the described problems, embodiments of the present disclosure reduce the temperature of the substrate / mask compared to other approaches, which supports reducing the distance between the substrate and the deposition source, thereby improving deposition material efficiency and allowing for reduced production costs.

[0015] According to embodiments supported by the present disclosure, a deposition system for a display device, in which a process is continuously performed on at least two substrates arranged in a linear form in a process chamber including a deposition source device for thin film deposition. The deposition system includes a process chamber including a deposition area part and a deposition standby part, the deposition area part being disposed between the deposition standby parts; a deposition source device for thin film deposition, the deposition source device being movably installed between the deposition area part and a substrate stage on which a substrate is installed above the deposition area part, the substrate being arranged in a linear form; a deposition prevention unit disposed between the deposition source device and the substrate installed on the substrate stage; and a cooling unit, the cooling unit being interlocked with the deposition prevention unit, and the cooling unit being directly coupled to the periphery of the substrate and protruding upward. The deposition system for a display device is configured to continuously perform a deposition process on at least two substrates arranged in a linear direction in the process chamber, wherein the at least two substrates include a substrate installed on a substrate stage.

[0016] The heat effect distribution measurement unit is closely coupled to the substrate or the second substrate and measures a heat effect distribution around a mask while elevating a deposition source in the deposition source device to a depositable temperature, and the heat effect distribution measurement unit can include a cooling control device configured to control the deposition prevention unit or the cooling unit depending on the influence distribution.

[0017] According to embodiments supported by the present disclosure, a deposition method for a display device, the deposition method including continuously performing a set of operations on at least two substrates arranged in a linear form in a process chamber including a deposition source device for thin film deposition. The set of operations includes measuring a temperature of a surrounding area of a substrate by a heat distribution measurement unit while heating a deposition source of the deposition source device to a depositable temperature in a deposition standby part; determining a heat influence distribution on the substrate or a mask depending on a measurement result provided by the heat distribution measurement unit; designing a cooling unit on top of the substrate or the mask to reduce the heat influence distribution on the substrate or the mask; installing or controlling the cooling unit to reduce the heat influence distribution; and performing thin film deposition on the substrate while moving the deposition source device from the deposition standby part to a deposition area part.

[0018] The deposition method for a display device according to another aspect of embodiments supported by the present disclosure includes the steps of: arranging a deposition source device in a deposition standby part in a process chamber; heating a deposition source of the deposition source device in relation to increasing a temperature of the deposition source to a depositable temperature; fixing and installing a substrate on a substrate stage above the deposition source device; measuring a heat influence distribution around the substrate or a lower mask of the substrate; performing a heat effect distribution offset cooling design on a heat effect distribution of a cooling unit in thermal contact with the substrate or the lower mask of the substrate; and performing a thin film deposition process by driving the deposition source device on the substrate or the lower mask of the substrate.

[0019] The heat effect distribution measurement unit can be a thermal imaging camera or a temperature sensor that measures a representative temperature of a region having the highest temperature in the deposition region among the surrounding regions of the substrate or the lower mask.

[0020] In the step of performing the heat effect distribution offset cooling design, the cooling plate of the cooling unit can be formed as a barrier such that the cooling plate of the cooling unit protrudes upward at an angle of 90 degrees or more on all sides of the substrate or the lower mask.

[0021] The deposition method can further include moving the cooling plate of the cooling unit along the linear movement direction of the deposition source device, and selectively controlling the supply of the coolant to the local cooling tube installed inside the cooling plate.

[0022] The deposition source device performs deposition on the substrate by alternately moving back and forth between the deposition region part and the deposition standby part formed at both edges of the deposition region part, and when a predetermined number of substrates are processed, the deposition source device can turn off the power supply during the deposition standby period for temperature reset.

[0023] According to the deposition system and method for a display device as described herein, the system and method support reducing the temperature of the substrate / mask, which can improve the thermal expansion of the substrate / mask, compared to other approaches. Accordingly, for example, the system and method support using a higher resolution mask (e.g., a mask having a higher resolution than the resolution of the mask currently available), and thus, support the production of a high resolution product, compared to some other approaches.

[0024] According to the deposition system and the deposition method for a display device as described herein, the deposition system and the deposition method support reducing the temperature of the substrate / mask, which can support reducing the distance between the substrate and the deposition source, thereby improving the deposition material efficiency, compared to other approaches. Accordingly, for example, the deposition system and the deposition method described herein support a reduction in production costs. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 is a schematic perspective view of main parts of a conventional display device deposition system for suppressing an increase in substrate / mask temperature according to the related art.

[0026] Figure 2 is a schematic perspective view showing a deposition system for a display device according to an embodiment supported by the present disclosure.

[0027] Figure 3 is a graph showing a temperature distribution in adjacent portions of a substrate.

[0028] Figure 4is a detailed view of main components of a deposition system for a display device according to an embodiment supported by the present disclosure. Figure 2 is a plan view.

[0029] Figure 5 is Figure 2 is a detailed view of main components of a deposition system for a display device according to an embodiment supported by the present disclosure.

[0030] Figure 6 and Figure 7 are graphs respectively showing a cooling improvement effect in a stage of a deposition system of a display device according to an embodiment supported by the present disclosure.

[0031] Figure 8 is a perspective view of a deposition system for a display device according to a modification example of an embodiment supported by aspects of the present disclosure.

[0032] Figure 9 is a graph showing a structure of a cooling plate of Figure 8

[0033] Figure 10 is a flowchart of a deposition method for a display device according to an embodiment supported by the present disclosure.

[0034] Figure 11 are plan and cross-sectional views of a display device manufactured using a deposition system and a deposition method according to an embodiment supported by the present disclosure. DETAILED DESCRIPTION

[0035] Hereinafter, example embodiments supported by aspects of the present disclosure will be described with reference to the accompanying drawings.

[0036] Embodiments supported by the present disclosure will now be described more fully with reference to the accompanying drawings, in which one or more example embodiments supported by aspects of the present disclosure are shown. However, aspects supported by the present disclosure can be implemented in various forms, and should not be construed as being limited to the embodiments set forth herein. Rather, these example embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the example aspects of the present application to those skilled in the art.

[0037] For example, terms such as first and second can be used to describe various components, but the components should not be limited by these terms. Terms as used herein can distinguish one component from another component, and the components are not limited by these terms. For example, a first component can be referred to as a second component, and similarly, a second component can also be referred to as a first component, without departing from the scope of the present disclosure. Unless otherwise specified, a singular form of a term can include a plural form.

[0038] ​The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, "a," "an," "the," and "at least one" are not intended to refer to a quantity of less than one, and are intended to be synonymous with "one or more." For example, "a" element is intended to mean "one or more" elements. "One or more" is not to be interpreted as limiting "one" or "a." "Or" means "and / or." As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It will be further understood that the terms "comprises" and / or "comprising," or "includes" and / or "including" when used in this specification, specify the presence of stated features, regions, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and / or groups thereof.

[0039] For ease of description, spatially relative terms, such as "below," "beneath," "lower," "above," and "upper," can be used herein for the purpose of describing the orientation of one element or feature relative to another element or feature, as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation, in addition to the orientation depicted in the figures. For example, if a device is inverted, then the element described as "below" or "beneath" another element or feature would be oriented "above" the other element or feature. Thus, the term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative terms used herein interpreted accordingly.

[0040] Embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of exemplary embodiments. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, embodiments described herein are not to be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, a region illustrated or described as flat can often have rough and / or nonlinear features. Moreover, sharp angles that are illustrated can be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the present claims.

[0041] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and this disclosure and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0042] It will be appreciated that various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to particular embodiments, but include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, the same or similar components can be provided with the same or similar reference numbers, and repeated explanation of these components can not be repeated. In the description of the drawings, it should be understood that, when the size of the component is notomerically expressed, the size can be expressed in various forms such as mm, cm, meters, μm, mm, etc., and the size expressed in one dimension can be applied to three dimensions of the component unless otherwise defined in the related context.

[0043] It should be understood that if an element (for example, a first element) is referred to as being "coupled with" or "coupled to" another element (for example, a second element), it means that the first element can be coupled with the second element directly (for example, wiredly), wirelessly, or via a third element, whether or not the term "operatively" or "communicatively" is used in connection with the element.

[0044] However, the following embodiments and examples described herein include example configurations, and do not limit the scope of embodiments of the present disclosure to the example configurations.

[0045] In some aspects, especially unless specifically stated otherwise, in the following description, hardware configurations and software configurations of devices, process flows, manufacturing conditions, sizes, materials, shapes, and other example implementation details are not intended to limit the scope of embodiments of the present disclosure to such a degree.

[0046] Embodiments of the present disclosure include an evaporation source apparatus for forming a thin film on a deposition body by vapor deposition and a control method of the evaporation source apparatus, and the embodiments of the present disclosure can also be understood as a program for causing a computer to execute the control method or a storage medium storing the program.

[0047] The storage medium can be a non-transitory storage medium that can be read by a computer.

[0048] For example, embodiments of the present disclosure can be appropriately applied to an apparatus for forming a thin film (material layer) having a desired pattern by vacuum deposition on a surface of a substrate as a vapor deposition target.

[0049] As a material of the substrate, for example, any material such as glass, resin, or metal can be selected.

[0050] In some aspects, the deposition body of the film forming apparatus is not limited to a flat substrate.

[0051] For example, a mechanical component having unevenness or an opening can be used as a vapor deposition target.

[0052] In some aspects, for example, embodiments of the present disclosure include selecting any material such as an organic material or an inorganic material (metal or metal oxide, etc.) as a deposition material.

[0053] In some aspects, embodiments of the present disclosure support the formation of organic films and metal films.

[0054] Specifically, the technology according to one or more embodiments of the present disclosure is applicable to manufacturing equipment for organic electronic devices (e.g., organic electroluminescence (EL) displays, thin-film solar cells) and optical members.

[0055] First, referring to Figure 1 The main components of a conventional display device deposition system that suppresses an increase in substrate / mask temperature will be described.

[0056] Figure 1 is a schematic perspective view of the main components of a conventional display device deposition system that suppresses an increase in substrate / mask temperature according to the related art.

[0057] As shown in Figure 1 The deposition system of the conventional display device has a process chamber 10 including a deposition source apparatus 20 for thin film deposition arranged in a linear form, and the process is continuously performed on a substrate. In this case, a double reflector consisting of a first reflector 30 and a second reflector 40 is formed above the deposition source apparatus 20 away from the periphery of a deposition area of the deposition source apparatus 20.

[0058] In other words, the first reflector 30 is formed at a specific distance from the deposition source apparatus 20, and the second reflector 40 is formed on top of the first reflector 30 separately from the first reflector 30. Unlike the conventional cooling shield, the first reflector 30 and the second reflector 40 are not in contact with the deposition source apparatus 20, but are formed at a specific distance, and the first reflector 30 and the second reflector 40 can be used to reflect and block convective and radiant heat transferred from the deposition source, thereby suppressing an increase in temperature of the substrate.

[0059] In some aspects, the first and second reflectors 30 and 40 are formed on the upper side of the deposition source device 20, and the first and second reflectors 30 and 40 are formed around the deposition area so as not to interfere with the movement of the deposition material ejected from the deposition source.

[0060] Here, the deposition area refers to an area in which the deposition material is ejected from the deposition source to reach the substrate located on the opposite side with a specific kinetic energy and is deposited, and there is a path for the deposition material to reach the substrate.

[0061] As such, the deposition area is formed to be spaced apart from the deposition source device 20 or the substrate, efficiently diffusing the convection and radiation heat without being in direct contact with the deposition source device 20 or the substrate to block the heat or suppress the temperature rise of the substrate; the purpose is to suppress the temperature rise of the substrate by blocking the deposition area.

[0062] In some embodiments, the deposition source device 20 has a source 21 for providing a dopant material when an organic thin film is deposited on the substrate and a source 22 for providing a host material on both sides of the source 21, and a plurality of nozzles 23 can be formed or disposed on the upper side of the sources 21 and 22 to provide uniform dopant material and host material from the sources 21 and 22 to the substrate.

[0063] The deposition source device 20 has a heating unit including a heater block to melt and vaporize the deposition material.

[0064] The first and second reflectors 30 and 40 are each formed in the shape of a square frame corresponding to the inner shape of the process chamber 10, and a middle portion must be formed so as not to interfere with the movement of the deposition material to the deposition area. In the example, the middle portion is in the form of a boundary formed around the deposition area. In some cases, the middle portion is in the form of a boundary formed only around the deposition area.

[0065] A cooling portion is also mounted on the lower surface of one or both of the first and second reflectors 30 and 40, and the cooling portion is formed in the form of a cooling pipe 51 through which a refrigerant can move, which effectively blocks the heat transferred from the deposition source device 20.

[0066] Here, the term "refrigerant" refers to a substance or material having a temperature capable of reducing the temperature of the first and second reflectors 30 and 40 to a degree that does not affect the deposition temperature of the deposition material, and can be water-cooled or air-cooled.

[0067] The deposition source device 20 is formed to completely cover the sources 21 and 22 while exposing the nozzles 23, and the deposition source device 20 is formed with a cooling shield 60 formed of a plate to block the heat from the sources 21 and 22.

[0068] The cooling shield 60 is formed in a shape corresponding to the shape of the top parts of the sources 21 and 22, and is formed in contact with or almost adjacent to the top of the sources 21 and 22, thereby primarily blocking heat transferred from the heat generating parts at the bottom of the sources 21 and 22; for example, the cooling shield 60 is formed of a material having low thermal conductivity such as ceramic, stainless steel, duplex stainless steel, or duplex aluminum alloy.

[0069] The first reflector 30 and the second reflector 40 are fixed to the upper side of the cooling shield 60. Specifically, the first reflector 30 is connected to the cooling shield 60 by the first fixing means 70, the first reflector 30 is fixed and spaced apart from the cooling shield 60, and the second reflector 40 is formed to be fixed and spaced apart from the first reflector 30 by the second fixing means 80.

[0070] According to Figure 1 the deposition system of the conventional display apparatus shown in FIG. 1, the first reflector 30 and the second reflector 40 must be formed of a material having good luminosity. In the example in which the cooling pipe 51 is installed at the bottom of each of the first reflector 30 and the second reflector 40, the first reflector 30 and the second reflector 40 are covered, and the cooling shield 60 must be fixed using the first fixing means 70 and the second fixing means 80, and the second reflector 40 is not only shielded but also has a problem that it is not easily fixed.

[0071] In some aspects, in a linear transfer deposition method according to some other approaches (for example, as described with reference to Figure 1 In order to prevent the substrate from contacting and damaging the mask during transportation, a gap is maintained between the substrate and the mask during deposition, the gap must be perpendicular to the transportation direction of the substrate (perpendicular to the ground), which is good if all organic materials move in the same direction to form a normal pattern, but it can be considered that due to the speed component of the substrate transfer direction, they move beyond the predetermined range and reach a place significantly deviated from the mask opening, the first reflector 30 and the second reflector 40 cannot collect the organic substances in this abnormal path, and the materials accumulated on the first reflector 30 and the second reflector 40 fall and block the nozzle 23, or there is a problem that the organic materials can be contaminated.

[0072] In some aspects, the first reflector 30 and the second reflector 40 are formed to be spaced apart from the deposition source device 20 or the substrate to block convection and radiant heat, to suppress the temperature rise of the substrate, but are limited to the periphery of the deposition area. In addition, compared with heat conduction which leads to direct and rapid cooling, the configuration can be less efficient in terms of heat shielding.

[0073] Now, referring to Figures 2 to 5A deposition system for a display device according to embodiments supported by the present disclosure will be described.

[0074] Figure 2 is a schematic perspective view showing a deposition system for a display device according to embodiments supported by the present disclosure, Figure 3 is a schematic view showing a temperature distribution in adjacent portions of a substrate, Figure 4 is a flowchart showing a method of operating main components of a deposition system for a display device according to embodiments supported by the present disclosure, Figure 2 is a plan view, and Figure 5 is Figure 2 is a detailed view of main components of

[0075] As shown in Figure 2 and Figure 3 , a deposition system 1 of a display device according to embodiments supported by the present disclosure includes at least two substrates S1 and S2 disposed inside a process chamber 100 (herein also referred to as a deposition chamber) in a deposition area portion 150 in which at least two substrate stages 100A and 100B are formed and fixed apart from each other, and the at least two substrates S1 and S2 and a mask M disposed below the at least two substrates S1 and S2 are in a stationary state.

[0076] Each substrate S (e.g., substrate S1, substrate S2) can be provided in an assembly form with the mask M, and the substrate S can be mounted on the mask M frame. In some aspects, the substrate S can be fixed in place so that the substrate S does not move, which can reduce the risk of damage due to contact with the mask M, and the reduction of the gap between the substrate S and the mask M can support precise pattern formation.

[0077] More specifically, since the at least two substrates S1, S2 can be fixed with respect to the deposition source device 200 in the deposition area portion 150, embodiments of the present disclosure support avoiding mounting the at least two substrates S1, S2 with a gap with respect to the mask M. This reduces the risk of damage to the at least two substrates S1, S2 and the mask M, and prevents misalignment of the at least two substrates S1, S2 and the mask M, allowing highly precise standard pattern formation compared to conventional methods.

[0078] In the deposition area portion 150 placed at the center of the process chamber 100, deposition standby portions 110, 130 are provided at both ends in the X-axis direction. In some aspects, the deposition source device 200 maintains standby for a certain period of time while raising the temperature of the deposition sources 210, 230 to a state in which a deposition process can be performed in the deposition standby portions 110, 130. The description herein of the temperature and state in which the deposition process can be performed can be referred to as a temperature supporting the deposition process described herein or as a depositable temperature.

[0079] As Figure 3 indicated in FIG. 1, a deposition system 1 of a display device according to embodiments supported by the present disclosure has a deposition source device 200 that raises the temperature of deposition sources 210 and 230 in deposition standby portions 110 and 130. In an example in which it is confirmed by a thermal distribution measurement unit 700A (see FIG. 2) (i.e., a temperature sensor or a thermal imaging camera 700A) that the temperature has been raised to a state in which a deposition process can be performed, the deposition source device 200 operates in a deposition area portion 150. That is, for example, while moving in a deposition direction (Y-axis direction) of a first substrate S1 and a mask M among the above-described substrates S1 and S2, the deposition source device 200 can perform at least the above-described two deposition steps on the first substrate S1 among at least two substrates S1 and S2. Figure 5

[0080] The deposition source device 200 further includes a linear drive unit 250 composed of a stepper motor and other components featuring one or more of the linear drive unit 250. The linear drive unit 250 can move in a deposition direction in the deposition area portion 150 and can be disposed perpendicular to the deposition area portion 150. Embodiments of the present disclosure include performing a deposition process on a second substrate S2 by moving the linear drive unit 250 (and the deposition source device 200) in an X-axis direction in the deposition standby portions 110 and 130.

[0081] In an example, the deposition source device 200 moves the deposition area portion 150 in a Y-axis direction after waiting in the deposition standby portions 110 and 130, moves in an X-axis direction in the deposition standby portions 110 and 130, and then moves back to the Y-axis. Using one deposition source device 200 to form deposition films on at least two substrates S1 and S2, the deposition films are formed on the at least two substrates S1 and S2 while moving in a Y-axis direction opposite to the axial direction.

[0082] As Figure 3 and Figure 4 indicated in FIG. 1, the deposition source device 200 can reduce the tact time by traveling through the deposition standby portions 110 and 130 and the deposition area portion 150 in the order of ①, ②, ③, and ④ in a zigzag manner as indicated in FIG. 3. Figure 3

[0083] When a deposition film is formed on a first substrate S1 among at least two substrates S1 and S2 on one of at least two substrate stages 100A and 100B, a second substrate S2 is deposited on the other of the at least two substrate stages 100A and 100B.

[0084] As Figure 3 ​​As shown in FIG. 1, in the deposition standby portions 110 and 130, the deposition source device 200 waits until the temperatures of the deposition sources 210 and 230 can be raised to a state in which a process can be performed; at this time, the temperature of the structure between the deposition source device 200 and at least two substrates S1 and S2 is increased.

[0085] For example, among the at least two substrates S1 and S2 adjacent to the deposition source device 200, the deposition prevention unit 600 (cooling shield) disposed adjacent to the first substrate S1 can be the deposition source device 200. Depending on its structure, it can be seen that depending on the distance from the heating member, the temperature is unevenly raised to a level of 70 to 100°C.

[0086] The deposition system 1 of the display device according to an embodiment supported by the present disclosure heats the mask M or mask frame on which the first substrate S1 is located according to the radiation heat distribution confirmed through the above-described temperature sensor or thermal imaging camera 700A, and is characterized in that landing units (for example, deposition prevention units 600) that can respond according to the heat transfer distribution to prevent the temperature of the first substrate S1 from rising are installed for at least two substrate tables 100A and 100B.

[0087] As Figure 5 As shown in FIG. 1, in the deposition standby portions 110 and 130, the deposition source device 200 waits until the temperatures of the deposition sources 210 and 230 can be raised to a state in which a process can be performed; at this time, the temperature of the structure between the deposition source device 200 and at least two substrates S1 and S2 is increased.

[0088] The deposition prevention unit 600 and the cooling unit 300 can be arranged to be offset with respect to respective center lines of the deposition prevention unit 600 and the cooling unit 300.

[0089] The deposition prevention unit 600 can include a deposition prevention space 610 (also referred to herein as a separate deposition prevention space or a spaced deposition prevention space) related to preventing radiant heat or convective heat transfer from the deposition source device 200 to the first substrate S1. A radiant heat shield plate member 630 (also referred to herein as a radiant heat shield member) forming the deposition prevention space 610 shields the radiant heat from the deposition source device 200 and directs the radiant heat toward the deposition source device 200 and a contact coupling member 650 (also referred to herein as a thermal contact coupling member) that allows direct or indirect heat conduction to the first substrate S1 or a mask M or mask frame through the process chamber 100.

[0090] The contact coupling member 650 can be formed such that the contact coupling member 650 is attached to one end of the radiant heat shield plate member 630. In some embodiments, the radiant heat shield plate member 630 can be formed such that the deposition prevention space 610 forms a heat shield space. The contact coupling member 650 can be bent at 90 degrees, and in some embodiments, the contact coupling member 650 can be bent at 90 degrees with respect to the radiant heat shield plate member 630.

[0091] The contact coupling member 650 is rotatable and movable at a predetermined angle with respect to the housing 200a of the deposition source device 200 through a hinge portion 650a.

[0092] The cooling unit 300 includes a fixedly placed cooling plate 310 on the top of the first substrate S1. The cooling unit 300 includes a cooling plate coupling member 330 that couples the cooling plate 310 to the first substrate stage 100A and the second substrate stage 100B around the first substrate S1.

[0093] The cooling plate coupling member 330 can be directly contact-coupled to the first substrate S1 or a mask M or mask frame for heat conduction, and heat from the deposition source device 200 can be deviated from the edge of the first substrate S1 by more than 90 degrees to minimize thermal shock to the first substrate S1.

[0094] For this purpose, the cooling plate coupling member 330 can also have a hinge portion 330a.

[0095] Here, the deposition area portion 150 refers to an area in which there is a path for deposition material to arrive at a substrate S located on a facing surface. The deposition material can be ejected from the deposition source device 200 with a certain kinetic energy and deposited on the substrate S upon incidence on the substrate S.

[0096] As such, the deposition source apparatus 200 is installed in direct contact with the first substrate S1 or the mask M to block heat or suppress temperature rise of the substrate S (the first substrate S1). Meanwhile, by forming a gap between the deposition source apparatus 200 or the substrate S, the cooling plate coupling member 330 supports suppression of temperature rise of the substrate S by efficiently blocking convective and radiative heat.

[0097] In some embodiments, the deposition source apparatus 200 includes a source 210 for providing a dopant material when depositing an organic thin film on the substrate S, and the deposition source apparatus 200 includes a source 220 for providing a host material on both sides of the source 210. The deposition source apparatus 200 can include a plurality of deposition sources 230 (e.g., nozzles) formed above (disposed above) the source 210 to provide uniform dopant material and host material from the deposition sources 230 to the substrate S.

[0098] The deposition source apparatus 200 can be formed with a heating unit including a heater block to melt and vaporize a deposition material.

[0099] Accordingly, according to embodiments supported by the present disclosure, by the deposition system for a display device, indirect convective and radiative heat transferred from the deposition source apparatus 200 is reflected and blocked by the radiative heat shielding plate member 630 forming the deposition prevention space 610, thereby suppressing temperature rise of the substrate S. In some aspects, by the contact coupling member 650 in contact with the deposition source apparatus 200 and the cooling unit 300, it is to directly contact the process chamber 100 housing the first substrate S1 or the mask M, thereby blocking conductive heat directly transferred from the deposition source apparatus 200 to further suppress temperature rise of the substrate S or the mask M.

[0100] For example, the inside of the process chamber 100 is maintained as a vacuum environment or an inert gas environment such as nitrogen.

[0101] After being transported into the process chamber 100 by a transport robot (not shown), at least two substrates S1, S2 are deposited and supported by the substrate stages 100A, 100B, and are fixed to be parallel to the horizontal XY plane during film formation.

[0102] The mask M is a mask having an opening pattern corresponding to a thin film pattern of a specific pattern formed on the first substrate S1 and the second substrate S2, for example, the substrate S is placed on the mask M during deposition film formation with a metal mask.

[0103] In some embodiments, as Figure 5As shown in FIG. 1, the deposition system 1 of the display apparatus according to the embodiments supported by the present disclosure has a deposition source apparatus 200 that can deposit the temperature of the deposition source in the deposition standby part 110 and the deposition standby part 130. The heat influence distribution on the first substrate S1 or the mask M during the lift is confirmed by the temperature sensor or the thermal imaging camera 700A and the deposition prevention unit 600 or the cooling unit 300. The deposition system 1 further includes a cooling control apparatus 700 that communicates with and controls the temperature sensor or the thermal imaging camera 700A, the deposition prevention unit 600 or the cooling unit 300.

[0104] The cooling control apparatus 700 includes a temperature sensor control unit 710 configured to control the measurement of the temperature sensor or the thermal imaging camera 700A, a heat distribution determination unit 730 (herein also referred to as a heat shock distribution determination unit) that determines the heat shock distribution of the first substrate S1 or the mask M, and a first substrate S1 determined by the heat distribution determination unit 730, and the cooling control apparatus 700 transmits and receives the measurement data and the temperature distribution measured by the temperature sensor control unit 710. In some aspects, the cooling control apparatus 700 includes a cooling plate movement control unit 750 configured to control the movement of the cooling plate 310 of the cooling unit 300 to efficiently reduce the heat influence distribution on the mask M and to efficiently reduce the temperature of the cooling part installed in the cooling plate 310. In addition, the cooling control apparatus 700 includes a cooling unit temperature distribution control unit 770 configured to control the heat influence distribution, a radiation heat shield control unit 780 configured to control the rotation of the radiation heat shield plate part 630 (for example, control the radiation heat shield plate part 630 to rotate at a predetermined angle so that the radiation heat shield plate part 630 can collect the deposition source and effectively shield the radiation heat). The cooling control apparatus 700 can include a deposition source apparatus driver 790 (herein also referred to as a deposition source apparatus movement control part) configured to control the sawtooth-shaped movement of the deposition source apparatus 200 between the deposition standby parts 110 and 130 and the deposition area part 150.

[0105] The deposition source apparatus driver 790 can operate the aforementioned deposition source apparatus 200 within the process chamber 100 at a speed that minimizes the heat influence on the first substrate S1 or the mask M.

[0106] Figure 6 And Figure 7 are graphs respectively showing the cooling improvement effect in the stage of the deposition system of the display apparatus according to the embodiments supported by the present disclosure.

[0107] As Figure 6 shown in FIG. 1 and in conjunction with Figure 2 andFigure 4 In the conventional method, when the total of five deposition area portions 150 are reciprocated after a deposition standby period in the stage A, the deposition prevention units 600 around and connected to the deposition sources 210 and 230 are heated due to the radiant heat, which becomes a factor of raising the temperature of the substrate S or the mask M. However, according to one or more embodiments of the present disclosure, the techniques described herein can include using the deposition prevention units 600 and the cooling units 300 to heat the substrate S. Alternatively, it can be seen that the mask M is disposed in response to the heat influence distribution and provides heat shielding to reduce the temperature of the mask during the deposition process.

[0108] Also, as shown in FIGS. 1A and 1B and in conjunction with FIGS. 2A and 2B, Figure 7 Figure 2 and Figure 4 In the conventional method, in the stage B adjacent to the stage A, when the total of five deposition area portions 150 are reciprocated after a deposition standby period, the deposition prevention units 600 around the deposition sources 210 and 230 are heated due to the radiant heat from the deposition sources 210 and 230, which causes the temperature of the substrate S or the mask M to rise. However, according to one or more embodiments of the present disclosure, the deposition prevention units 600 and the cooling units 300 are arranged based on the heat influence distribution of the substrate S or the mask M to provide heat shielding and reduce the temperature of the mask during the deposition process.

[0109] In both FIGS. 3A and 3B, the effect is verified using thermal analysis. The “A-scan” indicates that one scan is performed in one direction and one cycle, and the “B-scan” indicates that another scan is performed in another direction and another cycle. That is, it is indicated that the “A-scan” is different from the “B-scan”. Figure 6 Figure 7 As a result of simulating the deposition process for five substrates, it is confirmed that the temperature of the substrate S or the mask M gradually decreases as the deposition process continues compared to the conventional method.

[0110] Therefore, during mass production, after the deposition process of a predetermined number of substrates (e.g., 50 to 60 substrates), it is recommended to replace the mask M and reset the temperature of the cooling units 300 or the deposition prevention units 600 in the process chamber 100 by using at least two substrates S1, S2, and the thermal effect of the mask M can be prevented. This process allows the formation of a high-precision standard pattern. In some examples, resetting the temperature of the cooling units 300 or the deposition prevention units 600 can include (e.g., based on one or more conditions) turning off the power of the deposition source device 200.

[0111] Now, reference will be made to

[0112] FIGS. 4A and 4B show a schematic diagram of a deposition process according to one or more embodiments of the present disclosure. Figure 8 Figure 9 ​​​A deposition system for a display device according to a modified example according to one or more embodiments of the present disclosure is described.

[0113] Figure 8 is a perspective view of a deposition system for a display device according to a modified example according to one or more embodiments of the present disclosure, and Figure 9 is a view showing Figure 8 the structure of a cooling plate.

[0114] In conjunction with Figure 2 , 3 , 4 and Figure 5 Referring to Figure 8 and Figure 9 , as with the deposition system 1 of a display device according to an embodiment supported by the present disclosure, the deposition system 1' of a display device according to a modified example according to one or more embodiments of the present disclosure includes a deposition source device 200 and a first substrate S1, between which a deposition prevention unit 600 is placed. A cooling unit 300 associated with the deposition prevention unit 600 corresponds to a heat transfer distribution on the first substrate S1, and directly contacts the substrate S to efficiently cool the substrate S.

[0115] In some aspects, the deposition prevention unit 600 includes a deposition prevention space 610 that prevents radiant heat or convective heat from being transferred from the deposition source device 200 to the first substrate S1 and the deposition source device 200, a radiant heat shielding plate part 630 that shields radiant heat from the deposition source device 200 and conducts the radiant heat toward the deposition source device 200, and the heat shielding plate part 630 is on the first substrate S1 or a mask M or a mask frame, a contact coupling part 650 that is contact-coupled to directly conduct heat or directly conduct heat through the process chamber 100.

[0116] The above-described cooling unit 300 includes a cooling plate 310 placed on top of the first substrate S1 fixedly arranged, and a cooling plate coupling part 330 that couples the cooling plate 310 to the first substrate stage 100A and the second substrate stage 100B around the first substrate S1.

[0117] The deposition system 1' of a display device according to a modified example according to one or more embodiments of the present disclosure mounts the cooling plate 310 on all sides of the first substrate S1 through the cooling plate coupling part 330, the cooling plate 310 can include a pair of first and second cooling plates 311 and 313 for the short sides of the first substrate S1 and a pair of third and fourth cooling plates 315 and 316 for the long sides, which are mounted like a barrier in the height direction, and they are mounted at a predetermined angle (preferably 90 degrees or more).

[0118] In some aspects, the deposition system 1' of the display apparatus according to the modified example of one or more embodiments of the present disclosure has a local cooling tube along the lower portion of the cooling plate 310 for the portion in thermal contact with the substrate S or mask M, and can further include a cooling plate coupling member 330 (e.g., cooling tube, cooling channel).

[0119] The cooling liquid for selectively and locally cooling the portion in thermal contact with the substrate S or mask M can flow through the cooling plate coupling member 330.

[0120] The cooling agent can be water, alcohol, or any evaporable liquid.

[0121] The cooling plate coupling member 330 has an input end and an output end, and the cooling liquid in the cooling plate coupling member 330 flows from the input end to the output end along the cooling plate coupling member 330, and the output end is connected to a circulation pump 350 for circulation, the cooling plate coupling member 330 can be controlled, and a radiator or other type of heat exchanger 370 can be installed in the circulation pump 350 to help diffuse the cooling agent heat.

[0122] The process chamber 100 is a container that forms a space for vacuum deposition, and when the deposition source apparatus 200 performs deposition, the inside of the process chamber 100 is evacuated (decompressed) by a vacuum pump to at least allow deposition. During this period, the process chamber 100 is maintained in a high vacuum state (e.g., vacuum achieved: 1 x 10 -2 Pa or less).

[0123] The deposition source apparatus 200 is controlled by a deposition source apparatus driver 790 to linearly move in the X-axis and Y-axis directions by a linear movement mechanism. For example, the linear movement mechanism can include a straight guide extending in the Y-axis direction, a ball screw extending in the Y-axis direction, a ball nut screwed onto the ball screw, a driving motor (electric motor) of the rotating ball screw such as a servo motor or a stepping motor, and a motor drive control portion electrically connected to the driving motor.

[0124] In some embodiments, as shown in Figure 9 The cooling plate 310 includes a thermal contact member 310a coupled to the periphery of the substrate S or mask M, and heat is conducted from the thermal contact member 310a; the cooling plate 310 can be formed by adhering the thermal contact member 310a and the heat diffusion member 310c by applying a heat-conducting grease 310d as an adhesive between the thermal contact member 310a and the heat diffusion member 310c.

[0125] A heat exchanger coupled to the thermal contact member 310a by a lead 310b can be additionally attached to the heat diffusion member 310c by an electrically insulating layer.

[0126] The heat diffusion member 310c is composed of at least two layers, and the heat diffusion plates 310ca and 310cb in different directions can be stacked.

[0127] The heat diffusion member 310c can be formed by stacking and integrating thin plates made entirely of graphite.

[0128] In the present specification, the type of the deposition sources 210 and 230 is not particularly limited, and can be, for example, a point deposition source (point source), a line deposition source (line source), or a surface deposition source.

[0129] In some aspects, the heating method of the deposition sources 210 and 230 is not particularly limited, and includes, for example, a resistance heating method, an electron beam method, a laser deposition method, a high-frequency induction heating method, and an arc method.

[0130] In some aspects, the arrangement of the nozzles is not particularly limited; for example, multiple rows of nozzles can be arranged in the Y-axis direction.

[0131] Now, a deposition method for a display device according to embodiments supported by the present disclosure will be described with reference to Figure 10 and in conjunction with Figure 2 , 3 , 4, and Figure 5 .

[0132] Figure 10 is a flowchart of a deposition method for a display device according to embodiments supported by the present disclosure.

[0133] Hereinafter, a deposition method for a display device according to embodiments supported by the present disclosure will be described based on a deposition system for a display device according to embodiments supported by the present disclosure, which is used in a light-emitting layer deposition process.

[0134] In the light-emitting layer deposition process, the method can include reducing the pressure within the process chamber 100 and placing the process chamber 100 in a high vacuum state (for example, a vacuum achieved: 1 x 10 -2 Pa or less).

[0135] At step S10, the method can include placing the deposition source device 200 in the deposition standby part 110, 130 within the process chamber 100, filling the deposition sources 210, 230 of the deposition source device 200 with a material, and heating the deposition sources 210, 230 (and / or the material) to a predetermined temperature at which deposition can be performed. In some aspects, at step S10, during the deposition standby, the deposition source device 200 can increase the temperature of the deposition sources 210, 230 (and / or the deposition material) to a certain degree in the deposition standby part 110.

[0136] At step S20, the method can include introducing the first substrate S1 from an introduction port (not shown) into the process chamber such that the first substrate S1 is supported on the first substrate table 100A and measuring a thermal shock profile on the first substrate S1 or a mask edge region below the first substrate S1 using the temperature sensor or thermal imaging camera 700A. The method can include transmitting the thermal shock profile on the mask edge region to the temperature sensor control component of the cooling control device 700 for data processing. In some aspects, at step S20, the method can include measuring a thermal effect profile on the substrate / mask edge region.

[0137] At step S30, the method can include designing a thermal effect profile offset cooling design (also referred to herein as configuring a thermal effect profile offset) to offset a thermal effect profile on the first substrate S1 or the mask M by selectively controlling a supply of coolant to the cooling plate coupling components 330 of the cooling plates 310 installed in the cooling unit 300 in thermal contact with the first substrate S1 or the mask M around the first substrate S1. Additionally, or alternatively, at step S30, the method can include designing a thermal effect profile offset cooling design by selectively controlling an arrangement of the cooling plates 310. In some aspects, at step S30, the method can include configuring a movable cooling plate (e.g., the cooling plate 310), configuring a cooling block, and configuring a substrate / mask edge region thermal effect profile offset.

[0138] At step S40, the method can include moving the cooling plates 310 and installing the cooling plates 310 around the first substrate S1 or the mask M according to the thermal effect profile offset cooling design. In some aspects, the method can include moving the cooling plates 310 to be placed in the most effective position according to the thermal effect profile offset cooling design on the upper region of the plate / mask edge.

[0139] At step S50, the method can include selectively controlling a circulation of coolant in the cooling plate coupling components 330 within the cooling plates 310. In some aspects, at step S50, the method can include controlling a refrigerant circulation, wherein the control is driven by a thermoelectric device.

[0140] At step S60, the method can include determining whether a representative temperature measured by the temperature sensor 700A around the first substrate S1 is lower than a predetermined temperature. Based on a determination that the representative temperature is lower than the predetermined temperature, the method can include proceeding to step S70. In some aspects, at step S60, the method can include comparing the representative temperature to the predetermined temperature (also referred to herein as a specified temperature).

[0141] At step S70, the method can include performing deposition on the first substrate S1 by linearly moving the deposition source device 200 in the deposition area portion 150. In some aspects, at step S70, the method can include controlling the linear movement of the deposition source device 200 in the deposition area portion 150 (also referred to herein as a deposition portion) by the deposition source device driver 790 configured to control the deposition source device driver 270.

[0142] According to the deposition source device driver 790 configured to control the deposition source device driver 270, the deposition source device driver 270 is repeatedly linearly moved in the deposition standby portions 110, 130 and the deposition area portion 150 by controlling the driving speed and direction of the deposition source device driver 270. In other words, at step S70, the method can include repeatedly linearly moving the deposition source device 200 in the deposition standby portions 110, 130 and the deposition area portion 150.

[0143] The method can include moving the cooling plate 310 of the cooling unit 300 in response to the movement of the heat effect distribution corresponding to the driving speed delivered from the deposition source device driver 790 configured to control the deposition source device driver 270. In some aspects, at step S80, the method can include selectively controlling the supply of refrigerant flowing through the cooling plate coupling member 330 installed inside the cooling plate 310. In some aspects, at step S80, the method can include linearly moving the deposition source device 200, wherein the linear movement is associated with the cooling plate 310 (movable cooling plate).

[0144] According to one or more embodiments of the present disclosure, the method can include continuously performing deposition on the first substrate S1, on the second substrate S2, up to a threshold number of pieces (e.g., up to 50 to 70 pieces) according to the operating speed of the deposition source device 200 on the first substrate S1, so that the heat effect distribution remains uniform.

[0145] The method can include discharging the deposition material (by the deposition source device 200) so that the deposition material passes through the mask openings in the deposition area of the first substrate S1 and the particles can be attached one by one to form a bar pattern (deposition film) while the deposition source device 200 is moved at a constant speed with respect to the first substrate S1 or the mask M along the Y axis.

[0146] After the first deposition, the method can include linearly moving the deposition source device 200 in the X axis direction, and the method can perform the second deposition in the same manner as the first deposition.

[0147] Specifically, while the deposition source device 200 is moved at a constant speed in a direction opposite to the moving direction related to the first deposition to form a bar pattern (deposition film), the deposition particles are attached to the deposition area of the first substrate S1 in which the area where the pattern is not formed by the first deposition.

[0148] As a result, a striped pattern of light-emitting layer is formed throughout the deposition area of ​​the first substrate S1.

[0149] In some respects, the method may include performing the process multiple times in relation to achieving a pattern thickness equal to or greater than the desired layer thickness.

[0150] Figure 11 These are plan and cross-sectional views of a display device manufactured using a deposition system and method according to embodiments supported by this disclosure. Specifically, Figure 11 (a) is a plan view of a display device manufactured using a deposition system and method according to embodiments supported by this disclosure, and Figure 11 (b) in the middle is along Figure 11 The cross-sectional view taken by line AB in (a) is shown.

[0151] like Figure 11 As shown in (a), the display device 6 may be an organic electroluminescent display device, and in the display area 6a, a plurality of pixels 62 having a plurality of light-emitting devices are arranged in a matrix shape.

[0152] Details will be explained below, but each light-emitting element has a structure that includes an organic layer sandwiched between a pair of electrodes.

[0153] In some respects, the term "pixel" refers to the smallest unit capable of displaying the desired color within the display area 6a.

[0154] In the case of the organic electroluminescent display device according to this embodiment, the pixel 62 is formed by a combination of a first light-emitting device 62R, a second light-emitting device 62G, and a third light-emitting device 62B that emit different lights.

[0155] In some respects, pixel 62 may consist of a combination of red, green, and blue light-emitting devices, but is not limited thereto. For example, pixel 62 may be a combination of yellow, cyan, and white light-emitting devices, but is not limited thereto. Pixel 62 is not particularly limited to the examples described herein, and pixel 62 may include light-emitting devices of at least one color or more colors.

[0156] like Figure 11 As shown in (b), pixel 62 includes an organic electroluminescent element on substrate 63, the organic electroluminescent element including a first electrode (anode) 64, a hole transport layer 65, light-emitting layers 66R, 66G and 66B, an electron transport layer 67 and a second electrode (cathode) 68.

[0157] Among these, hole transport layer 65, light-emitting layers 66R, 66G and 66B, and electron transport layer 67 correspond to organic layers.

[0158] In some aspects, in the present embodiment, the light-emitting layer 66R is an organic electroluminescent layer that emits red light, the light-emitting layer 66G is an organic electroluminescent layer that emits green light, and the light-emitting layer 66B is an organic electroluminescent layer that emits blue light.

[0159] The light-emitting layers 66R, 66G, and 66B are formed in a pattern corresponding to light-emitting devices (sometimes referred to as organic electroluminescent elements) that emit red, green, and blue light, respectively.

[0160] In some aspects, the first electrode 64 is formed individually for each light-emitting device.

[0161] The hole-transporting layer 65, the electron-transporting layer 67, and the second electrode 68 can be formed commonly to the plurality of light-emitting devices 62R, 62G, and 62B, or can be formed for each light-emitting device.

[0162] In some aspects, in order to prevent the first electrode 64 and the second electrode 68 from short-circuiting due to foreign matter, an insulating layer 69 is provided between the first electrodes 64.

[0163] In some aspects, since the organic electroluminescent layer deteriorates due to moisture and oxygen, a protective layer 70 is provided to protect the organic electroluminescent element from moisture and oxygen.

Claims

1. A deposition system for a display device, characterized in that, The deposition system includes: The process chamber includes a deposition area and a deposition reserve area, wherein the deposition area is disposed between the deposition reserve areas; A deposition source device for thin film deposition, wherein the deposition source device is movably mounted between the deposition preparation section and the substrate stage, wherein the substrate mounted on the substrate stage is above the deposition area and arranged in a linear manner; A deposition prevention unit is disposed between the deposition source device and the substrate mounted on the substrate platform; and A cooling unit, interlocked with the deposition prevention unit, and directly coupled to the periphery of the substrate, wherein the cooling unit protrudes upward; The deposition system for the display device is configured to continuously perform deposition processes on at least two substrates arranged in a linear direction in the process chamber, wherein the at least two substrates include the substrate mounted on the substrate stage.

2. The deposition system according to claim 1, characterized in that, The deposition system also includes: A thermal effect distribution measurement unit is closely coupled to the substrate or a second substrate and configured to measure the thermal effect distribution around the mask while raising the temperature of the deposition source included in the deposition source device to a depositable temperature; A cooling control device is configured to control the deposition prevention unit or the cooling unit based on the thermal effect distribution measured by the thermal effect distribution measurement unit.

3. The deposition system according to claim 2, characterized in that: The deposition prevention unit includes: Interval deposition prevention spaces are provided to prevent radiant or convective heat transfer from the deposition source device to the substrate or the second substrate; and A radiative heat shielding component forms a deposition prevention space in the aforementioned interval.

4. The deposition system according to claim 3, characterized in that: The deposition prevention unit includes a contact coupling component configured to directly contact the peripheral portion of the substrate or the mask in association with thermal conductivity. The contact coupling component is configured to rotate the radiative heat shielding component in association with changing the size of the deposition prevention space of the interval.

5. The deposition system according to claim 2, characterized in that: The cooling unit includes: A cooling plate, configured such that the cooling plate protrudes upward from the periphery of the substrate or the mask; and The cooling plate coupling unit is configured to detachably couple the cooling plate to the periphery of the substrate or the mask in a component manner.

6. The deposition system according to claim 5, characterized in that: The angle between the cooling plate and the periphery of the substrate or the mask is equal to or greater than 90 degrees.

7. The deposition system according to claim 2, characterized in that: The thermal effect distribution measurement unit is a thermal imaging camera or temperature sensor configured to measure the representative temperature of the region with the highest temperature in the deposition region within the periphery of the substrate or the mask.

8. The deposition system according to claim 2, characterized in that, The deposition system also includes: Cooling plate, including: A localized cooling pipe, wherein the localized cooling pipe is in thermal contact with the bottom portion of the periphery of the substrate or the mask; and A circulation pump is configured to circulate the refrigerant flowing inside the local cooling pipe.

9. The deposition system according to claim 8, characterized in that: The cooling plate includes: A thermal contact member that is in thermal contact with the peripheral portion of the substrate or the mask; and A heat diffusion component is configured to diffuse heat from the heat contact component.

10. The deposition system according to claim 9, characterized in that: The heat diffusion member is formed in two layers of multiple heat diffusion plates in different directions, and the heat diffusion member is disposed on all sides of the substrate or the mask. The deposition system is configured to bond the heat contact member and the heat diffusion member by applying a thermally conductive grease as an adhesive between the heat contact member and the heat diffusion member. The display device is an organic electroluminescent display device, and the deposition process is a light-emitting layer deposition process.

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