Temperature control device of small spectrometer

Abstract

The utility model relates to a small-sized spectrograph, in particular to a temperature control device for the small-sized spectrograph, which comprises a heat preservation component, a temperature control component, a temperature control component and a temperature control component, wherein the heat preservation component is provided with an open slot and a heat preservation cavity communicated with the open slot for placing the small-sized spectrograph; the heat insulation piece is arranged in the open slot and connected with the small spectrometer, and a heat insulation hole is formed in the heat insulation piece; the TEC temperature control assembly is arranged in the heat insulation hole, is connected with the small spectrograph and is used for controlling the temperature of the small spectrograph; the heat dissipation assembly is arranged on the TEC temperature control assembly; the temperature sensor is arranged on the small spectrograph; the controller is arranged on the TEC temperature control assembly and electrically connected with the TEC temperature control assembly, the heat dissipation assembly and the temperature sensor. According to the temperature control device, a small spectrometer is combined to carry out heat preservation structure design of a heat preservation cavity, the heating and refrigeration characteristics of a semiconductor refrigeration sheet are utilized to manufacture a temperature control module, and temperature control is carried out on equipment through the temperature control module; meanwhile, a heat preservation structure is designed, internal temperature fluctuation can be reduced, and it is ensured that the spectrometer works under the constant-temperature condition.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of small spectrometer, especially a temperature control device of small spectrometer. BACKGROUND

[0002] Spectrometer is a kind of precision instrument for measuring the spectral distribution and optical performance of target to be measured. Spectrometer has very wide application scenarios, covering crop spectral monitoring, metal and alloy analysis, non-metal and compound analysis, environmental monitoring, medical applications, scientific research and industrial applications, etc. In the measurement results of spectrometer, temperature is a very key factor, because it can cause the thermal effect of light machine structure, resulting in the error of measurement results.

[0003] Traditional temperature control means mostly uses passive heat dissipation or electric heating wire heating combined with temperature sensor to build simple control feedback circuit, and the temperature control precision is low, and the time response is low, which is generally used in application scenarios with low temperature control requirements.

[0004] External heat preservation bin is used for temperature regulation of spectrometer, specifically using heat preservation material and refrigeration chip to make semiconductor refrigerator to control the temperature of spectrometer. This method has two shortcomings:

[0005] Large volume, because the spectrometer is placed in it, so the box volume is large, and the portability is poor, which is not convenient for multi-scene deployment.

[0006] Large power consumption and poor temperature control ability, because there is always heat exchange between the inside and outside space of the controlled cavity, so for large volume cavity, TEC needs to be selected with large power. Since TEC is a low-efficiency heat pump, this will cause the system power consumption to increase significantly, and the temperature control time is poor. INVENTION CONTENTS

[0007] To solve the above problems, the utility model provides a kind of temperature control device of small spectrometer, and the specific technical scheme is:

[0008] A kind of temperature control device of small spectrometer, comprising: heat preservation component, is equipped with opening slot and heat preservation cavity for placing small spectrometer with the opening slot is communicated;Thermal insulation piece, is located in the opening slot, and is connected with the small spectrometer, and the thermal insulation piece is equipped with heat insulation hole;TEC temperature control component, is located in the heat insulation hole, and is connected with the small spectrometer, for controlling the temperature of the small spectrometer;Heat dissipation component, is equipped on the TEC temperature control component;Temperature sensor, is equipped on the small spectrometer;And controller, is equipped on the TEC temperature control component, and is electrically connected with the TEC temperature control component, the heat dissipation component and temperature sensor respectively.

[0009] Preferably, the heat preservation assembly comprises a heat preservation box body provided with an open slot and a heat preservation cavity communicated with the open slot; and a heat preservation box cover arranged on the heat preservation cavity and the open slot and used for closing the open slot and the heat preservation cavity.

[0010] Preferably, the heat preservation assembly is made of polyether ether ketone.

[0011] Preferably, the heat dissipation assembly comprises a heat dissipation device arranged on the TEC temperature control assembly; and a heat dissipation fan arranged on one side of the heat dissipation device and connected with the controller.

[0012] Further, the heat dissipation assembly further comprises a spring screw movably arranged on the heat dissipation device and connected with the heat insulation member.

[0013] Further, the heat dissipation device comprises a heat dissipation bottom plate, heat dissipation fins arranged on the top of the heat dissipation bottom plate, and a heat dissipation pressing block arranged on the bottom of the heat dissipation bottom plate.

[0014] Preferably, the heat preservation assembly further comprises a retainer arranged in the heat insulation hole and sleeved on the TEC temperature control assembly.

[0015] Compared with the prior art, the temperature control device for the small-sized spectrometer has the following beneficial effects:

[0016] The temperature control device for the small-sized spectrometer provided by the application can precisely control the temperature of the spectrometer by using the TEC temperature control assembly, so that the spectrometer can work under constant temperature conditions in the case of wide temperature changes of the external environment, the spectral measurement error caused by the change of working temperature is avoided, the accuracy of target spectral measurement is improved, the device is applicable to multiple scenes and has good environmental adaptability, the heat preservation assembly has heat preservation and thermal insulation functions, and can effectively reduce the problem of large TEC power consumption caused by the fluctuation of the external environment, and the device has small size and high portability. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a structural schematic view of the application;

[0018] Figure 2 is a perspective view of the application after the heat preservation cover plate is hidden;

[0019] Figure 3 is a structural schematic view of the heat preservation box body;

[0020] Figure 4 is a structural schematic view of the heat insulation member;

[0021] Figure 5 is a structural schematic view of the retainer;

[0022] Figure 6is a structural schematic view of the heat dissipation assembly;

[0023] Figure 7 is an exploded view of the heat dissipation assembly;

[0024] Figure 8 is a sectional view of the heat dissipation assembly;

[0025] Figure 9 is a structural schematic view of the small spectrometer;

[0026] Figure 10 is a structural schematic view of the small spectrometer. DETAILED DESCRIPTION

[0027] The utility model will be further described in connection with the drawings.

[0028] The heating and refrigeration characteristics of the semiconductor refrigeration sheet are utilized to manufacture a temperature control module, and the temperature control module is used for temperature control of equipment; meanwhile, a heat preservation structure is designed, which can reduce internal temperature fluctuation and ensure that the spectrometer works under constant temperature conditions.

[0029] As Figures 1 to 9 shown, a temperature control device of a small spectrometer, comprising a heat preservation assembly, a heat insulation piece 4, a TEC temperature control assembly 6, a heat dissipation assembly 3, a temperature sensor and a controller, the heat preservation assembly is provided with an open slot 14 and a heat preservation cavity 11, the heat preservation cavity 11 is located in the inside of the heat preservation assembly, the open slot 14 is located at the top of the heat preservation assembly, the heat preservation cavity 11 is communicated with the open slot 14, the small spectrometer 5 is installed in the heat preservation cavity 11, and the shape of the heat preservation cavity 11 is matched with the small spectrometer 5. The heat insulation piece 4 is provided with a heat insulation hole 41, the heat insulation piece 4 is installed at the top of the small spectrometer 5 and located in the open slot 14, and the heat insulation piece 4 is provided with the heat insulation hole 41; the TEC temperature control assembly 6 is inserted in the heat insulation hole 41 and connected with the small spectrometer 5, and the TEC temperature control assembly 6 is used for controlling the temperature of the small spectrometer 5; the heat dissipation assembly 3 is installed on the TEC temperature control assembly 6 and located outside the heat preservation assembly; the temperature sensor is installed on the small spectrometer 5; the controller is installed on the TEC temperature control assembly 6 and electrically connected with the TEC temperature control assembly 6, the heat dissipation assembly 3 and the temperature sensor respectively.

[0030] The TEC temperature control assembly 6 is combined with the heat preservation design of the spectrometer cavity, the controller built-in the TEC module can realize detection-feedback-temperature control; the external heat preservation structure blocks the heat exchange between the inside of the spectrometer and the environment, can reduce the power consumption of the temperature control system, and the heat preservation structure has a small volume, which ensures the multi-scene applicability, portability and environmental adaptability of the instrument.

[0031] The TEC temperature control assembly 6 is composed of a thermoelectric cooler and an electric control assembly. The thermoelectric cooler is a temperature control core assembly, which adopts a TEC semiconductor refrigeration sheet. The TEC works according to the principle of Peltier effect. When an electric current flows through the thermoelectric cooler, heat is transferred from one side of the thermoelectric cooler to the other side, which is manifested as cooling at one end and heating at the other end. If the direction of the electric current is reversed, the two ends of cooling and heating will also be reversed, i.e. the originally heated end becomes the cooling end, and the originally cooled end becomes the heated end. Direct current is applied to achieve temperature control, without mechanical movement, rapid refrigeration, high temperature control precision; the electric control assembly is composed of a temperature sensor and a controller to achieve precise temperature control, and adjusts the current size in real time according to the temperature of the controlled object.

[0032] The temperature sensor can adopt a negative temperature coefficient thermistor (NTC), a resistance temperature detector (RTD), a thermocouple (such as AD594 / 595), a semiconductor temperature sensor (such as LM335), etc.

[0033] The controller needs to achieve bidirectional temperature control, i.e. cooling or heating the controlled object, which can be achieved by using an H-bridge circuit design combined with a PID algorithm, but is not limited thereto.

[0034] When the TEC assembly completes internal heat exchange, the heat needs to be released in time to ensure the timeliness of temperature exchange, which can be cooled by air cooling mode.

[0035] The heat preservation cavity 11 of the heat preservation assembly is attached to the shape of the spectrometer and forms a good wrapping, has heat preservation and heat insulation performance, can effectively ensure the temperature inside the cavity, and blocks the heat exchange between the inside of the spectrometer and the environment, thereby reducing the power consumption of the temperature control system.

[0036] Precise temperature control, reduced temperature control power consumption, and small structure design can be achieved.

[0037] By using the TEC temperature control assembly 6 combined with the heat preservation structure design of the spectrometer cavity, the working environment temperature of the spectrometer is always constant at room temperature (25℃±0.1℃) in a wide temperature (-40℃~+60℃) change of external environment, so as to reduce the influence of external temperature change on the optical and mechanical structure of the spectrometer, and ensure the accuracy of precise spectral measurement and the environmental adaptability of the spectrometer.

[0038] The heat preservation assembly includes a heat preservation box body 1 and a heat preservation box cover 2. The heat preservation box body 1 is provided with an open slot 14 and a heat preservation cavity 11 communicating with the open slot 14. The heat preservation box cover 2 is installed on the heat preservation cavity 11 and the open slot 14, and is used to close the open slot 14 and the heat preservation cavity 11. In order to facilitate the installation of the heat preservation box cover 2 and improve the sealing performance, the heat preservation box body 1 is further provided with a cover plate fixing slot communicating with the open slot 14 and the heat preservation cavity 11, and the heat preservation box cover 2 is inserted into the cover plate fixing slot. The heat preservation box body 1 is further provided with a wiring hole.

[0039] The insulation component is made of polyetheretherketone (PEEK). PEEK’s excellent thermal insulation properties can effectively prevent heat exchange between the hot and cold surfaces of the thermal insulation device (TEC). At the same time, the structural rigidity of PEEK achieves the purpose of positioning the TEC.

[0040] The heat dissipation assembly 3 includes a heat sink 31 and a cooling fan 32. The heat sink 31 is mounted on the TEC temperature control assembly 6. The cooling fan 32 is located on one side of the heat sink 31, opposite to the heat sink 31, and is connected to the controller.

[0041] To prevent overpressure on the TEC temperature control component 6 and to provide appropriate pressure, the heat dissipation component 3 also includes a spring screw 33, which is movably mounted on the heat sink 31 and connected to the heat insulation component 4. The spring screw 33 is an existing, mature product and will not be described in detail here.

[0042] The heat sink 31 includes a heat sink base plate 311, heat sink fins 313, and heat sink clamping block 312. The heat sink fins 313 and heat sink clamping block 312 are respectively located on the top and bottom of the heat sink base plate 311 and are an integral structure, which can be made of aluminum profile. The heat sink clamping block 312 is used to press against the TEC temperature control component 6 to achieve heat conduction, while the heat sink base plate 311 facilitates installation, and the heat sink fins 313 ensure heat dissipation effect.

[0043] For ease of installation, a retainer 7 is also included, which is located inside the heat insulation hole 41 and is fitted onto the TEC temperature control assembly 6.

[0044] The heat insulation hole 41 is a stepped hole, which facilitates the installation and positioning of the cage 7.

[0045] The heat insulation component 4 is also provided with a wiring groove 43. There are two wiring grooves 43, which are connected to the heat insulation hole 41. The wiring grooves 43 are used to place the wires 61 of the TEC temperature control component 6.

[0046] The heat insulation component 4 is fixed to the top of the miniature spectrometer 5 with screws. The fan is fixed to the heat insulation component 4 with screws.

[0047] The insulation structure of the insulation cavity 11 is designed in conjunction with the small spectrometer 5. The heating and cooling characteristics of the semiconductor cooling chip are used to make a temperature control module, which controls the temperature of the equipment. At the same time, the insulation structure is designed to reduce internal temperature fluctuations and ensure that the spectrometer operates under constant temperature conditions.

[0048] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without inventive effort, and these embodiments will all fall within the protection scope of the claims of this utility model.

Claims

1. A temperature control device for a small spectrometer, characterized in that, include: The heat insulation component is provided with an opening slot (14) and a heat insulation cavity (11) communicating with the opening slot (14) for placing a small spectrometer (5). A heat insulation component (4) is provided in the opening groove (14) and connected to the small spectrometer (5). The heat insulation component (4) is provided with heat insulation holes (41). The TEC temperature control component (6) is located inside the heat insulation hole (41) and connected to the miniature spectrometer (5) for controlling the temperature of the miniature spectrometer (5); A heat dissipation component (3) is disposed on the TEC temperature control component (6); A temperature sensor is mounted on the miniature spectrometer (5); and The controller is located on the TEC temperature control component (6) and is electrically connected to the TEC temperature control component (6), the heat dissipation component (3) and the temperature sensor respectively.

2. The temperature control device for a small spectrometer according to claim 1, characterized in that, The thermal insulation component includes: The insulated box body (1) is provided with an opening slot (14) and an insulated cavity (11) communicating with the opening slot (14); and The insulated box cover (2) is provided on the insulated cavity (11) and the opening groove (14) for sealing the opening groove (14) and the insulated cavity (11).

3. The temperature control device for a small spectrometer according to claim 1 or 2, characterized in that, The insulation component is made of polyetheretherketone.

4. The temperature control device for a small spectrometer according to claim 1, characterized in that, The heat dissipation component (3) includes: Radiator (31), said radiator (31) being disposed on said TEC temperature control assembly (6); and Cooling fan (32) is located on one side of the radiator (31) and connected to the controller.

5. The temperature control device for a small spectrometer according to claim 4, characterized in that, The heat dissipation assembly (3) also includes a spring screw (33), which is movably mounted on the radiator (31) and connected to the heat insulation component (4).

6. The temperature control device for a small spectrometer according to claim 4, characterized in that, The radiator (31) includes: Heat dissipation base plate (311); Heat dissipation fins (313), the heat dissipation fins (313) being disposed on the top of the heat dissipation base plate (311); and Heat dissipation block (312) is located at the bottom of the heat dissipation base plate (311).

7. The temperature control device for a small spectrometer according to claim 1, characterized in that, Also includes: The retainer (7) is disposed inside the heat insulation hole (41) and sleeved on the TEC temperature control assembly (6).

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