Wafer annealing laser processing equipment
By introducing a beam splitter and a shaping mirror into the wafer annealing furnace, combined with a dual worktable and automated control, the problems of low efficiency and difficulty in controlling laser energy in traditional wafer annealing furnaces have been solved, achieving efficient and stable laser processing results, improving product quality and reducing costs.
Patent Information
- Application Number
- CN202422932040.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-11-29
AI Technical Summary
Traditional wafer annealing furnaces are inefficient, lack user-friendliness, and are devoid of intelligent control interfaces. Furthermore, the laser annealing process does not employ spot shaping technology, resulting in uncontrollable laser energy, poor stability, easy surface burns, uncontrollable quality, low yield, and high cost.
A wafer annealing laser processing equipment was designed, which uses a beam splitter and a shaping mirror in conjunction with a dual worktable to achieve independent movement of the two optical paths. Different light spots are formed by the shaping mirror. Combined with a laser processing head, a height measuring instrument and a camera device, fully automated processing is achieved. It is also equipped with an optical shutter and a dust collection device to control laser energy and clean the processing area.
It improves processing efficiency and flexibility, enables controllable laser energy, avoids surface burns on wafers, improves product quality and yield, and reduces costs.
Smart Images
Figure CN223665413U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to laser processing technical field, concretely relates to a circular crystal annealing laser processing equipment. BACKGROUND
[0002] Traditional circular crystal annealing furnace is low in efficiency, is not humanized enough and lacks intelligent control interface and system, leading to poor annealing effect control, and general laser annealing process does not use light spot shaping process, that is, a point is formed by field lens focusing light spot through galvanometer scanning mirror, and a line is formed by points to process products, since there is no light spot shaping process, laser energy is too strong, is not easy to control, and stability is not high, energy is too high and is easy to burn the surface of circular crystal, energy is lower than the set value, reaches the processing effect, quality is not controllable, yield is low, and cost is high. CONTENT
[0003] The utility model aims at overcoming the insufficient of the prior art, and provides a circular crystal annealing laser processing equipment.
[0004] It comprises base and be located on the gantry of base, two vertical arms of gantry are set as stand, the cross arm of gantry is set as crossbeam, the boss is extended at one end on both sides of crossbeam and is located, and the crossbeam is T-shaped structure;
[0005] The middle part of the boss of the crossbeam is installed with a beam splitter, both sides of the boss are provided with a reflector, both sides of the crossbeam and corresponding the position of the reflector are installed with a shaping mirror, the reflector, the beam splitter and the shaping mirror are located on the same horizontal plane and correspond to each other.
[0006] Further, a laser is installed on the crossbeam, an expander is installed at the output end of the laser, and the output end of the expander corresponds to the beam splitter.
[0007] Further, a light gate is installed on the edge of the crossbeam through a pneumatic cylinder, and the light gate is located between the beam splitter and the reflector.
[0008] Further, laser processing heads are installed on both sides of the crossbeam, the laser processing heads are arranged corresponding to the shaping mirror, and a galvanometer is installed at the output end of the laser processing head.
[0009] Further, a height measuring instrument is installed on one side of the laser processing head shell.
[0010] Further, a camera device is installed on one side of the laser processing head shell, and the height measuring instrument and the camera device are arranged in the same direction as the laser processing head.
[0011] Further, a dust cover is fixed to the outer edge of the galvanometer of the laser processing head.
[0012] Further, the base is provided with an adjusting assembly, the adjusting assembly is provided with a positioning plate, the positioning plate is provided with a product body, and the product body is located below the laser processing head.
[0013] Further, the adjusting assembly comprises a Y-axis plate, an X-axis plate and a Z-axis plate, the Y-axis plate is fixed on the base, the X-axis plate slides on the Y-axis plate, and the Z-axis plate slides on the X-axis plate.
[0014] Further, the Z-axis plate is provided with a suction cavity, and the suction cavity is used for sucking the positioning plate.
[0015] Compared with the prior art, the advantages of the utility model are as follows: through the beam splitter and the shaping mirror on the beam, the workbench formed by the two positioning plates can realize the double workbench simultaneous work. And two workbenches can be independently moved to work, and do not interfere with each other, and the efficiency is high, two branch light paths can be replaced with different shaping mirrors according to actual demand, two different shaping light spots are obtained, the flexibility of equipment processing is higher, and meanwhile, the flow line connecting device can be reserved on the double workbenches, and full-automatic processing can be realized according to the on-site requirements. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is the first overall three-dimensional structure schematic diagram in the utility model.
[0017] Figure 2 It is the second overall three-dimensional structure schematic diagram in the utility model.
[0018] Figure 3 It is the overall front structure schematic diagram in the utility model.
[0019] Figure 4 It is the overall overhead structure schematic diagram in the utility model.
[0020] In the drawing:
[0021] 1, base;
[0022] 2, Y-axis plate;
[0023] 3, X-axis plate;
[0024] 4, stand;
[0025] 5, Z-axis plate;
[0026] 6, suction cavity;
[0027] 7, product body;
[0028] 8, reflector;
[0029] 9, beam splitter;
[0030] 10. A shaping mirror;
[0031] 11. A shutter;
[0032] 12. A laser;
[0033] 13. A beam expander;
[0034] 14. A laser processing head;
[0035] 15. An altimeter;
[0036] 16. A camera arrangement;
[0037] 17. A dust hood;
[0038] 18. A crossbeam. DETAILED DESCRIPTION
[0039] Reference will now be made in detail to the present embodiments of the present application, examples of which are illustrated in the accompanying drawings. While the present application will be described in conjunction with the embodiments, it will be understood that they are not intended to limit the present application to these embodiments. On the contrary, the present application is intended to cover alternatives, modifications, and equivalents, which can be included within the spirit and scope of the present application as defined by the appended claims. It should be noted that the steps described herein can be implemented by any of the functional blocks or functional arrangements, and any of the functional blocks or functional arrangements can be implemented as physical entities or logical entities, or a combination of both.
[0040] To make the present application better understood, the present application will be further described in detail below in conjunction with the drawings and specific embodiments.
[0041] Note: the examples to be introduced next are only a specific example, and not as a limitation on the embodiments of the present application must be as follows specific steps, values, conditions, data, order, etc. Those skilled in the art can use the concept of the present application by reading the present specification to construct more embodiments not mentioned in the present specification.
[0042] The traditional round crystal annealing furnace has low efficiency, is not humanized, and has no intelligent control interface and system, resulting in poor annealing effect control. Moreover, the general laser annealing process does not use a light spot shaping process, and a scanning mirror scans a mirror through a field lens to focus a light spot to form a point, and the point forms a line to process a product. Since there is no light spot shaping process, the laser energy is too strong, is not easy to control, has low stability, is too high to easily burn the surface of the round crystal, is lower than the set value to not reach the processing effect, is uncontrollable in quality, has low yield, and has high cost.
[0043] In order to solve the problems existing in the above laser processing, the present application provides a round crystal annealing laser processing equipment.
[0044] Please refer to Figures 1-4 , including the base 1 and set on the base 1 gantry, the two vertical arm of the gantry is set as a column 4, the cross arm of the gantry is set as a crossbeam 18, the crossbeam 18 both sides and located in one end extends a boss, and the crossbeam 18 is T-shaped structure; The middle of the boss of the crossbeam 18 is installed with a beam splitter 9, the two sides of the boss are provided with a mirror 8, the two sides of the crossbeam 18 and corresponding the position of the mirror 8 is installed with a shaping mirror 10, the mirror 8 and the beam splitter 9 and the shaping mirror 10 are located in the same horizontal plane, and correspond to each other.
[0045] As Figures 1-4 shown, the two vertical arms of the gantry are set left and right on both sides of the base 1, and are located at the edge of the base 1, so that the middle of the base 1 forms a channel, the gantry is composed of two columns 4 and a crossbeam 18, the crossbeam 18 is arranged between the top of the two columns 4, which forms a gantry, and the two sides of one end of the crossbeam 18 extend outward to form a boss, so that the crossbeam 18 forms a T-shaped structure.
[0046] Specifically, the crossbeam 18 is provided with a beam splitter 9 and two mirrors 8, the beam splitter 9 is installed in the middle of the top of the boss, and the two beam splitters 9 are installed on the top of the boss respectively, and the beam splitter 9 and the two mirrors 8 correspond to each other, and the edges of the top of the crossbeam 18 are connected to the shaping mirror 10 through the support structure, and the shaping mirror corresponds to the mirror 8, so that the beam splitter 9, the mirror 8 and the shaping mirror 10 form two separate light branches, so as to shape the laser, get the required light spot, and control the energy of the laser, so that the laser forms a controllable state, which is convenient for processing.
[0047] Please refer to Figure 1 , Figure 2 and Figure 4 , the crossbeam 18 is installed with a laser 12, the output end of the laser 12 is installed with a beam expander 13, and the output end of the beam expander 13 corresponds to the beam splitter 9.
[0048] As Figure 1 , Figure 2 and Figure 4 shown, the laser 12 is arranged along the length direction of the crossbeam 18, and the output end of the laser 12 is provided with a beam expander 13, which can change the laser emitted by the laser 12.
[0049] Please continue to refer to Figure 1 , Figure 2 and Figure 4 , the edge of the crossbeam 18 is installed with a light shutter 11 through the air cylinder, and the light shutter 11 is located between the beam splitter 9 and the mirror 8.
[0050] AsFigure 1 , Figure 2 and Figure 4 As shown, the optical shutter 11 is mainly composed of a cylinder and a light-shielding plate. The light-shielding plate is driven by the cylinder. The cylinder output end extends and drives the light-shielding plate to move between the beam splitter 9 and the reflector 8, blocking the laser beam and interrupting the sub-optical path, so that the product body 7 of this branch is not processed. When the cylinder retracts, the light-shielding plate no longer blocks the light, the sub-optical path is connected, and the product body 7 of the corresponding branch can be processed.
[0051] Please see Figure 1 , Figure 2 and Figure 4 Laser processing heads 14 are installed on both sides of the crossbeam 18. The laser processing heads 14 are set to correspond to the shaping mirror 10. A galvanometer is installed at the output end of the laser processing head 14.
[0052] like Figure 1 , Figure 2 and Figure 3 As shown, the laser processing head 14 is equipped with a galvanometer and a field lens. In a normal application structure, the galvanometer on the laser processing head 14 is driven by the motor through the system program and the galvanometer card. The motor drives the lens to swing, and the laser beam falls onto the field lens. The field lens focuses the laser beam into a tiny spot and processes the product. When the laser beam comes into contact with the product surface, the material is instantly vaporized for processing.
[0053] Please see Figure 1 and Figure 2 A height gauge 15 is mounted on one side of the housing of the laser processing head 14, and a camera device 16 is mounted on one side of the housing of the laser processing head 14. Both the height gauge 15 and the camera device 16 are set in the same direction as the laser processing head 14.
[0054] like Figure 3 and Figure 1 As shown, the height measuring instrument 15 and the camera device 16 move with the laser processing head 14. The height measuring instrument 15 mainly calculates the distance and height based on the echo time and light speed after the laser pulse is reflected on the target object, while the camera device 16 can take pictures of the positioning point of the product body 7 and transmit the data to the system, so that the staff can accurately understand the position of the product body 7 during the processing.
[0055] Please see Figure 2 , Figure 1 and Figure 2 A dust collection cover 17 is fixed at the outer edge of the galvanometer of the laser processing head 14.
[0056] like Figure 1 , Figure 2 and Figure 3 As shown, the dust hood 17 is located on the outside of the bottom of the laser processing head 14, and can suck away the dust and smoke from the product body 7 during processing.
[0057] Referring to Figure 1 and Figure 2 , the base 1 is provided with an adjusting assembly, the adjusting assembly is provided with a positioning plate, the positioning plate is provided with a product body 7, the product body 7 is located below the laser processing head 14, the adjusting assembly comprises a Y-axis plate 2, an X-axis plate 3 and a Z-axis plate 5, the Y-axis plate 2 is fixed on the base 1, the X-axis plate 3 slides on the Y-axis plate 2, the Z-axis plate 5 slides on the X-axis plate 3, the Z-axis plate 5 is provided with a suction cavity 6, and the suction cavity 6 suctions the positioning plate.
[0058] As Figure 3 and Figure 1 Figure 2 Figure 1 Figure 2 shown, the Y-axis plate 2 is installed on the marble base 1; the upper portion is fixed with the X-axis plate 3; the X-axis plate 3 can move back and forth in the Y direction of the Y-axis plate 2, the Z-axis plate 5 is installed on the X-axis plate 3 and slides, and the Z-axis plate 5 can adjust the height of the field lens processing focal point, the height of the camera device 16 is adjusted, and the Z-axis plate 5 is provided with the suction cavity 6, the tail of the suction cavity 6 is connected with a dust removal pipe and a dust removal machine, and the positioning plate of the product body 7 can be directly placed on the Z-axis plate 5 and be suctioned, so that the movement of the product during processing is prevented.
[0059] When the utility model is used, the laser 12 emits laser, the light beam passes through the beam expander 13, then passes through the beam splitter 9, is divided into two by the beam splitter 9, is shot into the reflector 8, the reflector 8 is shot into the shaping mirror 10 with the light beam, then is shaped into the laser processing head 14 by the shaping mirror 10, the galvanometer on the laser processing head 14 is driven motor by the system program, the motor drives the lens to swing, the light beam falls on the field lens, the field lens focuses the laser beam into a tiny spot, processes the product, contacts the product surface, and the material is instantaneously gasified, and the laser 12 emits light, the Y-axis plate 2 and the X-axis plate 3 drive the product body 7 to move in a plane trajectory, and the processing action is completed.
[0060] In the description of the utility model, it should be explained that the orientation or position relationship indicated by the terms "upper", "lower" and the like is the orientation or position relationship shown based on the drawings, and is only for the convenience of describing the utility model and simplifying the description, and is not indicative or suggestive of the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore can not be understood as a limitation on the utility model. Unless otherwise expressly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, can be fixedly connected, can also be detachably connected, or integrally connected, can be mechanically connected, can also be electrically connected, can be directly connected, or indirectly connected through an intermediate medium, and can be the communication between two elements. For ordinary skilled in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.
[0061] It should be noted that, in the present application, relational terms such as "first" and "second", and the like, are used solely to distinguish one from another entity or action, without necessarily requiring or implying any actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.
[0062] The foregoing is considered as illustrative only of the principles of the application. Various modifications can be made to the embodiments described above without departing from the spirit or scope of the application defined by the appended claims. Accordingly, the application is not to be restricted except in the spirit or scope of the appended claims.
Claims
1. A wafer annealing laser processing apparatus comprising a base (1) and a gantry provided on the base (1), characterized in that, Two vertical arms of the portal frame are arranged as columns (4), and a cross arm of the portal frame is arranged as a cross beam (18), which is provided with a boss at both sides and at one end, and the cross beam (18) is in T-shaped structure; The middle of the boss of the cross beam (18) is provided with a beam splitter (9), both sides of the boss are provided with a reflector (8), and both sides of the cross beam (18) and the positions corresponding to the reflector (8) are provided with a shaping mirror (10), and the reflector (8), the beam splitter (9) and the shaping mirror (10) are located on the same horizontal plane and correspond to each other.
2. A bulge annealing laser processing apparatus as claimed in claim 1, characterized in that, A laser (12) is installed on the cross beam (18), an expander (13) is installed at the output end of the laser (12), and the output end of the expander (13) corresponds to the beam splitter (9).
3. A bulk acoustic wave resonator annealing laser processing apparatus as described in claim 1, wherein, An optical shutter (11) is installed on the edge of the cross beam (18) through a gas cylinder, and the optical shutter (11) is located between the beam splitter (9) and the reflector (8).
4. A bulge annealing laser processing apparatus as described in claim 1, wherein, Laser processing heads (14) are installed on both sides of the cross beam (18), the laser processing heads (14) are arranged corresponding to the shaping mirror (10), and galvanometers are installed at the output ends of the laser processing heads (14).
5. A bulk acoustic wave resonator annealing laser processing apparatus as defined in claim 4, wherein A height measuring instrument (15) is installed on one side of the shell of the laser processing head (14).
6. A bulk acoustic wave resonator annealing laser processing apparatus as defined in claim 5, wherein, A camera device (16) is installed on one side of the shell of the laser processing head (14), and the height measuring instrument (15) and the camera device (16) are arranged in the same direction as the laser processing head (14).
7. A bulk acoustic wave resonator annealing laser processing apparatus as described in claim 4, wherein, A dust cover (17) is fixed to the outer edge of the galvanometer of the laser processing head (14).
8. A bulk acoustic wave resonator annealing laser processing apparatus as described in claim 4, wherein, An adjusting assembly is installed on the base (1), a positioning plate is arranged on the adjusting assembly, a product body (7) is arranged on the positioning plate, and the product body (7) is located below the laser processing head (14).
9. A bulk acoustic wave resonator annealing laser processing apparatus as defined in claim 8, wherein, The adjusting assembly comprises a Y-axis plate (2), an X-axis plate (3) and a Z-axis plate (5), the Y-axis plate (2) is fixed on the base (1), the X-axis plate (3) slides on the Y-axis plate (2), and the Z-axis plate (5) slides on the X-axis plate (3).
10. A bulk acoustic wave resonator annealing laser processing apparatus as defined in claim 9, wherein, An adsorption cavity (6) is formed in the Z-axis plate (5), and the adsorption cavity (6) adsorbs the positioning plate.