Feeding mechanism of high-density integrated circuit lead frame

The feeding mechanism of the high-density integrated circuit lead frame automatically adjusts the size of the magazine limit frame using an electric adjustment component. Combined with the wafer transfer mechanism, it achieves efficient transfer and loading/unloading of the lead frame, solving the problems of low efficiency and manual adjustment in the existing technology, and realizing efficient and precise automated feeding.

CN223665427UActive Publication Date: 2025-12-12DONGGUAN ALLMERIT TECH CO LTD
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Patent Information

Application Number
CN202422985523.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-04
Publication Date
2025-12-12
Estimated Expiration
2034-12-04

AI Technical Summary

Technical Problem

In the existing technology, the feeding and unloading efficiency of the lead frame is low, and the size and specifications of the receiving clip need to be manually adjusted, so the efficiency needs to be improved.

Method used

The feeding mechanism adopts a high-density integrated circuit lead frame. It uses an electric adjustment component to automatically adjust the size of the magazine limit frame. Combined with the wafer transfer mechanism, it realizes efficient transfer and loading/unloading of the lead frame. The electric length adjustment component and the electric width adjustment component automatically adapt to different sizes of receiving magazines. Combined with the reciprocating motion of the transfer module and the wafer pick-and-place module, it realizes efficient feeding with one pick-and-place.

Benefits of technology

It improves the feeding efficiency of the lead frame, reduces the need for manual adjustment, and realizes automated high-precision dimensional adaptation and efficient feeding process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of lead frame conveying equipment, in particular to a feeding mechanism of a high-density integrated circuit lead frame, which comprises a transfer module and two groups of sheet taking and placing modules used for taking and placing the lead frame, the transfer module comprises a vertical frame, a rotating frame and a transfer driving part, and the rotating frame is rotatably mounted on the vertical frame; the two sheet taking and placing modules are mounted on the rotating stand and are symmetrically arranged relative to a rotating shaft of the rotating stand; the transfer driving part is used for driving the rotating frame to rotate so as to drive the two sheet taking and placing modules to be switched between the two sheet taking and placing stations in a reciprocating manner; wherein one of the sheet taking and placing stations is provided with a sheet carrying table used for carrying the lead frame transferred by the sheet taking and placing module, and the sheet carrying table is provided with a sheet pushing assembly used for transversely pushing the lead frame. When the lead frame taking and placing device is used, one piece taking and placing module takes a lead frame, the other piece taking and placing module puts down the lead frame, one piece is taken and one piece is placed, and the working efficiency is high. And the efficiency of electric adjustment of the material receiving box is higher than that of manual adjustment, and the adjustment accuracy is improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to lead frame conveying equipment technical field, concretely relates to the feeding mechanism of high density integrated circuit lead frame. BACKGROUND

[0002] Lead frame as the important carrier in semiconductor integrated chip packaging process, is the important bridge connecting internal circuit and external lead, also is a kind of key structural member that the electrical connection of chip internal circuit lead-out end and external lead is realized by bonding material (gold wire, aluminum wire, copper wire), it plays the bridge function of connection with external wire, and most of semiconductor integrated blocks need to use lead frame, is important basic material in electronic information industry.

[0003] The lead frame needs to be fed and discharged in the electroplating process, and a kind of lead frame poking transfer device and method are disclosed in Chinese patent with patent No.CN201811397007.6, device and method are used to automatically move and poke lead frame for preheating, movement of the poking lever is controlled by the transmission module, the poking lever drives the pawl to poke and transfer the arranged lead frame from the feeding platform to the preheating table, so as to realize the poking movement and preheating treatment of lead frame.

[0004] For example, the feeding mechanism for transferring lead frame is previously developed, referring to the disclosed grabbing type rotary feeding mechanism for integrated circuit lead frame in Chinese patent literature with publication No.CN219566761U, including transfer module and clamping mechanism, transfer module includes reciprocating drive seat, and drive seat bottom is installed with rotatable rotary drive part;Clamping mechanism includes a pair of opposite and opposite movement clamping gripper, clamping gripper includes gripper drive plate arranged along the length direction of gripper bottom plate, and more than one longitudinal arrangement gripper drive bar is installed on gripper drive plate, and gripper drive bar is installed with the clamping finger for lifting and supporting the bottom plate edge of lead frame;The lead frame to be clamped can be first attached to the bottom of gripper bottom plate, and can be matched with lead frame of different width size, improve the clamping stability, at the same time, it can be applied to lead frame of various sizes;Then, driven by transfer module and rotary drive part, clamping mechanism can be rotated by 180°, and then can be horizontally transferred to one place to discharge or feed.

[0005] The above prior art realizes feeding or discharging after rotating lead frame by 180° of clamping mechanism. However, the movement of clamping mechanism is realized by reciprocating movement of transfer module, after clamping a piece of lead frame, it is moved to the specified position, and then returns to continue taking material, so that the material transfer between the two positions needs to be completed by reciprocating movement of transfer module once, and the efficiency needs to be improved.

[0006] The flip-type take-up box mechanism of the lead frame device disclosed in Chinese patent document CN219216785U includes a bottom support plate and a top support plate slidably mounted on the bottom support plate. The top support plate has two clip stations, each clip station including a mounting frame and a swing frame rotatably mounted in the mounting frame. A take-up clip for take-up and stacking of lead frames is pluggable into the swing frame. When unloading is required, the top support plate slides along the bottom support plate, causing the take-up clip in one clip station to unload and stack the lead frames. After loading is completed, the top support plate slides along the bottom support plate, causing the take-up clip in the other clip station to continue taking up the lead frames. The swing frame with the take-up clips mounted rotates as a whole, so that the top openings of the take-up clips and the swing frame face outwards, which facilitates the removal and replacement of the take-up clips, making the operation simpler and allowing observation of the lead frame stacking and unloading.

[0007] For example, the transverse receiving box mechanism of the lead frame device disclosed in Chinese patent document CN219216815U includes a bottom support plate, a guide member arranged along the length of the bottom support plate, and a top support plate. The top support plate is equipped with two or more clip stations. Each clip station is detachably equipped with a receiving clip. The receiving clip is provided with a pad for supporting the receiving lead frame and an adjustment component for longitudinal adjustment of the pad. The bottom support plate is provided with a transverse drive member that drives the top support plate to reciprocate along the guide member. When the lead frame is unloading, after the receiving clip in one clip station is filled, the top support plate moves transversely so that the receiving clip in the other clip station is aligned with the lead frame unloading position to continue receiving. At this time, an empty receiving clip can be replaced with a receiving clip that has been filled. After the receiving clip in the clip station that is unloading is filled, the receiving and unloading of the lead frame continues without stopping.

[0008] However, when the width and length of the lead frame for receiving materials are different, the size and specifications of the magazine station for placing the receiving magazine need to be adjusted. The existing technology requires manual adjustment, and the efficiency needs to be improved. Summary of the Invention

[0009] In view of the above-mentioned technical problems in the existing technology, this utility model provides a feeding mechanism for a high-density integrated circuit lead frame.

[0010] To achieve the above objectives, this utility model provides the following technical solution:

[0011] A feeding mechanism for high-density integrated circuit lead frames includes a wafer handling mechanism and a take-up / placement box. The take-up / placement box includes a support plate and a clip limiting frame disposed on the support plate. The clip limiting frame is used to hold take-up clips for stacking the lead frames. The clip limiting frame includes two first limiting plates that limit the take-up clips on both sides in the length direction and two second limiting plates that limit the take-up clips on both sides in the width direction. The support plate is also provided with an electric length adjustment component for adjusting the distance between the two first limiting plates and an electric width adjustment component for adjusting the distance between the two second limiting plates.

[0012] The wafer handling mechanism includes a transfer module and two wafer picking and placing modules for picking up and placing lead frames. The transfer module includes a stand, a rotating frame, and a transfer drive. The rotating frame is rotatably mounted on the stand, and its rotation axis is arranged longitudinally. The two wafer picking and placing modules are mounted on the rotating frame and are arranged symmetrically with respect to the rotation axis of the rotating frame. A wafer carrier platform is provided below the wafer picking and placing modules to receive the lead frames transferred from the wafer picking and placing modules. The wafer carrier platform is provided with a wafer pushing assembly for laterally pushing the lead frames. The transfer drive is used to drive the rotating frame to rotate, so that the two wafer picking and placing modules alternately switch between the receiving clip and the wafer carrier platform.

[0013] Specifically, the pick-and-place module includes a lifting seat, a longitudinal drive unit mounted on the rotating frame for driving the lifting seat up and down, a clamping slide rail mounted on the lifting seat, two sets of clamping arms slidably mounted on the clamping slide rail, and a clamping drive unit for driving the two sets of clamping arms to move closer to or further away; the longitudinal drive unit is an electric cylinder fixed to the rotating frame, and its telescopic rod is connected to the lifting seat; the lifting seat is fixed with a lifting guide column, and the rotating frame is equipped with a longitudinal linear bearing, through which the lifting guide column passes.

[0014] Specifically, the frame includes an inverted "U"-shaped vertical frame and a horizontal frame. The two ends of the horizontal frame are connected to the upper ends of the two vertical frames, and two sets of pick-and-place modules are arranged on both sides below the horizontal frame.

[0015] Specifically, the pusher assembly includes a pusher rod, a pusher drive for driving the pusher rod to rise and fall and to move laterally, and a pusher slot for the pusher rod to pass through and move laterally on the plate carrier stage; the pusher drive includes a pusher base and a pusher longitudinal shift seat, the pusher longitudinal shift seat is mounted on the pusher base, the pusher base is provided with a pusher lifting cylinder for driving the pusher longitudinal shift seat to move up and down, and the pusher rod is mounted on the pusher longitudinal shift seat; the pusher drive also includes a pusher power component for driving the pusher base to move laterally.

[0016] Specifically, the push rods are arranged in two rows on the top of the push rod longitudinal transfer seat, and space is left between the two rows of push rods for placing the lead frame; the wafer carrier is provided with a receiving station, a transition station and a wafer exit station arranged in sequence. The receiving station is close to the transfer module to receive the lead frame from the wafer pick-up and drop-off module. The two rows of push rods move the lead frame from the receiving station to the transition station, and at the same time move the lead frame from the transition station to the wafer exit station; the wafer exit station is provided with a wafer support body, which is a series of grids arranged at intervals; the wafer carrier is provided with two baffles that guide and limit the two sides of the lead frame, and the distance between the two baffles can be adjusted.

[0017] Specifically, the top of the support plate is provided with a first guide rail, and two first limiting plates are provided with first sliding seats that slide in cooperation with the first guide rail; the electric length adjustment assembly includes an length adjustment motor and an length adjustment screw, the length adjustment screw is arranged in parallel with the first guide rail, the two first limiting plates are threadedly connected to the length adjustment screw respectively, and the threads of the two first limiting plates and the length adjustment screw are arranged oppositely, so that when the length adjustment motor drives the length adjustment screw to rotate, it drives the two first limiting plates to move in opposite directions; the opposing sides of the two first limiting plates are provided with mounting plates, and the mounting plates are slidably provided with slide rods perpendicular to the first guide rail, and the second limiting plates are fixed to the slide rods; each first limiting plate corresponds to two second limiting plates, one of which is fixed to the slide rod as a fixed plate, and the other is fixed to the first limiting plate as a movable plate.

[0018] Specifically, the electric width adjustment assembly includes a width adjustment motor and a width adjustment lead screw. The width adjustment lead screw is arranged perpendicularly to the length adjustment lead screw. The end of the width adjustment lead screw is connected to the output shaft of the width adjustment motor. The width adjustment lead screw is threadedly connected to a connecting seat, and a connecting rod is fixed to the connecting seat. The two ends of the connecting rod are respectively connected to two second limiting plates that serve as moving plates. The electric length adjustment assembly also includes a steering rod, which is arranged parallel to the width adjustment lead screw. The steering rod and the length adjustment lead screw are driven by a helical gear. The output shaft of the length adjustment motor is connected to the end of the steering rod. The length adjustment motor and the width adjustment motor are located on the same side of the support plate.

[0019] Specifically, there are two sets of magazine limiting frames, and the electric width adjustment components and electric length adjustment components of the two sets of magazine limiting frames are linked together; it also includes a base plate, the top of which is provided with a transverse slide rail, which is arranged in parallel with the first guide rail, and the bottom of the support plate is provided with a transverse slide block that slides with the transverse slide rail, so that the support plate can be slidably mounted on the base plate; the base plate is provided with a transverse motor and a transverse lead screw, which are arranged in parallel with the length adjustment lead screw, and the support plate is connected to the transverse lead screw via a threaded seat, and the output shaft of the transverse motor is connected to the transverse lead screw.

[0020] Specifically, the base plate is a long strip with suspension rods connected to both ends, and the lower ends of the suspension rods are fixedly connected to the base plate.

[0021] Specifically, the first limiting plate has a clearance hole, and a material-supporting cylinder is fixed on the opposite sides of the two first limiting plates. The piston rod of the material-supporting cylinder is fixed with a cartridge-supporting plate. The cartridge-supporting plate extends through the clearance hole to the opposite sides of the two first limiting plates to support the receiving cartridge.

[0022] The beneficial effects of this utility model are:

[0023] The feeding mechanism of this high-density integrated circuit lead frame utilizes an electric length adjustment component to adjust the distance between two first limiting plates and an electric width adjustment component to adjust the distance between two second limiting plates, based on the size of the take-up clip. This ensures that the two first limiting plates abut against opposite sides of the take-up clip in the length direction and the two second limiting plates abut against opposite sides of the take-up clip in the width direction. Electric adjustment is more efficient and accurate than manual adjustment. One set of pick-up and place-down modules picks up the lead frame from the take-up clip, while another set of pick-up and place-down modules places the lead frame on the wafer carrier stage, resulting in high working efficiency. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the feeding mechanism in the embodiment.

[0025] Figure 2 This is a schematic diagram of the material receiving and discharging box in the embodiment.

[0026] Figure 3 for Figure 2 A magnified view of the circled area.

[0027] Figure 4 This is a schematic diagram of the magazine limiting frame in the embodiment.

[0028] Figure 5 This is a schematic diagram of the adjustable receiving box combined with the receiving clip in the embodiment.

[0029] Figure 6 for Figure 5 A schematic diagram from another perspective.

[0030] Figure 7 This is a schematic diagram of the sheet-moving mechanism in the embodiment.

[0031] Figure 8 This is an exploded view of the plate-moving mechanism in the embodiment.

[0032] Figure 9 This is a schematic diagram of the transfer module in the embodiment.

[0033] Figure 10 This is a schematic diagram of the pusher assembly in the embodiment.

[0034] Figure 11This is a schematic diagram of the stage structure in the embodiment.

[0035] Figure 12 This is an exploded view of the stage in the embodiment.

[0036] Figure label:

[0037] Transfer module 50, upright frame 501, vertical frame body 502, horizontal frame body 503, rotating frame 504, transfer drive unit 505;

[0038] 51. Plate picking and placing module 51, lifting seat 511, longitudinal movement drive component 512, plate clamping slide rail 513, plate clamping arm 514, lifting guide column 515;

[0039] 52. Film carrier stage, 521. Film pusher groove, 522. Film receiving station, 523. Transition station, 524. Film ejection station, 525. Film support body, 526. Film baffle.

[0040] Pusher assembly 53, pusher rod 531, pusher base 532, pusher longitudinal shift seat 533, pusher lifting cylinder 534, pusher power component 535.

[0041] Support plate 621;

[0042] Magazine limiting frame 622, first limiting plate 6221, clearance hole 62211, second limiting plate 6222, mounting plate 6223, slide bar 6224, material supporting cylinder 225, magazine supporting plate 6226;

[0043] 623 receiving magazine;

[0044] First guide rail 624, first slide block 625;

[0045] Electric length adjustment assembly 626, length adjustment lead screw 6261, length adjustment motor mounting base 6262, steering rod 6263, helical gear 6264;

[0046] Electric width adjustment assembly 627, width adjustment screw 6271, width adjustment motor mounting base 6272, connecting base 6273, connecting rod 6274, synchronous belt pulley assembly 6275;

[0047] Base plate 628, transverse slide rail 6281, transverse slide block 6282, transverse motor 6283, transverse lead screw 6284;

[0048] Suspension rod 629. Detailed Implementation

[0049] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0050] The feeding mechanism in this embodiment, such as Figures 1 to 12 As shown, it includes a sheet handling mechanism and a receiving / discharging box. The receiving / discharging box includes a support plate 621 and two sets of clip limiting frames 622 disposed on the support plate 621. Each set of clip limiting frames 622 is used to place a receiving clip 623 for placing the lead frame.

[0051] The following description focuses on each set of magazine limiting frames 622: It includes two first limiting plates 6221 and four second limiting plates 6222. The top of the support plate 621 is provided with two first guide rails 624. Each of the two first limiting plates 6221 has a first sliding block 625 that slides with the first guide rails 624. Each first limiting plate 6221 corresponds to two second limiting plates 6222. One second limiting plate 6222 is movable relative to the first limiting plate 6221, while the other second limiting plate 6222 is fixed to the first limiting plate 6221. The distance between the two second limiting plates 6222 is adjusted to accommodate magazines 623 of different widths.

[0052] The support plate 621 is also provided with an electric length adjustment assembly 626 for adjusting the distance between the two first limiting plates 6221 and an electric width adjustment assembly 627 for adjusting the distance between the two second limiting plates 6222. Specifically, the electric length adjustment assembly 626 includes an adjustment motor and an adjustment screw 6261. The adjustment motor is not shown in the figure; only the adjustment motor mounting base 6262 is shown. The adjustment screw 6261 is arranged in parallel with the first guide rail 624. The four first limiting plates 6221 of the two sets of clip limiting frames 622 are threadedly connected to the adjustment screw 6261, and the threads of the two first limiting plates 6221 of the same set of clip limiting frames 622 are arranged opposite to those of the adjustment screw 6261. This is so that when the adjustment motor drives the adjustment screw 6261 to rotate, it drives the two first limiting plates 6221 of each set of clip limiting frames 622 to move in opposite directions to accommodate receiving clips 623 of different lengths.

[0053] In this embodiment, the electric length adjustment assembly 626 further includes a steering rod 6263, which is arranged perpendicularly to the length adjustment screw 6261. The steering rod 6263 and the length adjustment screw 6261 are driven by a helical gear 6264, and the output shaft of the length adjustment motor is connected to the end of the steering rod 6263.

[0054] In this embodiment, mounting plates 6223 are provided on the opposite sides of the two first limiting plates 6221. The mounting plates 6223 are slidably provided with slide rods 6224 perpendicular to the first guide rail 624. One of the second limiting plates 6222 is fixed to the slide rods 6224 as a fixed plate, and the other second limiting plate 6222 is fixed to the first limiting plate 6221 as a movable plate.

[0055] In this embodiment, the electric width-adjusting assembly 627 includes a width-adjusting motor and a width-adjusting lead screw 6271. The width-adjusting motor is not shown in the figure; only the width-adjusting motor mounting base 6272 is illustrated. The length-adjusting motor and the width-adjusting motor are located on the same side of the support plate 621. The width-adjusting lead screw 6271 is arranged perpendicularly to the length-adjusting lead screw 6261. The end of the width-adjusting lead screw 6271 is connected to the output shaft of the width-adjusting motor. The width-adjusting lead screw 6271 is threadedly connected to a connecting seat 6273. A connecting rod 6274 is fixed to the connecting seat 6273. The two ends of the connecting rod 6274 are respectively connected to two second limiting plates 6222, which serve as moving plates.

[0056] In this embodiment, the electric width adjustment components 627 of the two sets of magazine limiting frames 622 are linked together, that is, a synchronous belt pulley assembly 6275 is provided between the output shaft of the width adjustment motor and the width adjustment lead screw 6271, and the second limiting plates 6222 of the two sets of magazine limiting frames 622 are adjusted synchronously.

[0057] In this embodiment, a base plate 628 is also included. A transverse slide rail 6281 is provided on the top of the base plate 628, arranged parallel to the first guide rail 624. A transverse slide block 6282, which slidably engages with the transverse slide rail 6281, is provided on the bottom of the support plate 621, allowing the support plate 621 to be slidably mounted on the base plate 628. The base plate 628 is equipped with a transverse motor 6283 and a transverse lead screw 6284, arranged parallel to the length adjustment lead screw 6261. The support plate 621 is connected to the transverse lead screw 6284 via a threaded seat. The output shaft of the transverse motor 6283 is connected to the transverse lead screw 6284. This is used to move the support plate 621 and the magazine limiting frames 622 on it, so that one set of magazine limiting frames 622 is in the loading position, and the other set of magazine limiting frames 622 is in the standby position.

[0058] In this embodiment, the base plate 628 is a long strip with suspension rods 629 connected to both ends. The lower ends of the suspension rods 629 are fixedly connected to the base plate 628. This facilitates fixing the entire receiving box to the bottom of the equipment.

[0059] In this embodiment, the first limiting plate 6221 has a clearance hole 62211, and a material-supporting cylinder 225 is fixed on the opposite sides of the two first limiting plates 6221. The piston rod of the material-supporting cylinder 225 is fixed with a spring-supporting clamp plate 6226. The spring-supporting clamp plate 6226 extends through the clearance hole 62211 to the opposite sides of the two first limiting plates 6221, and is used to support the receiving spring clip 623 and to lift and lower the receiving spring clip 623.

[0060] During use, the lead frame in the receiving magazine 623 is lifted and grasped by the feeding mechanism. The feeding mechanism includes a transfer module 50 and two sets of pick-and-place modules 51 for picking up and placing the lead frame. The transfer module 50 includes a stand 501, a rotating frame 504, and a transfer drive 505. The rotating frame 504 is rotatably mounted on the stand 501, and its rotation axis is arranged longitudinally. The two sets of pick-and-place modules 51 are mounted on the rotating frame 504 and are symmetrically arranged with respect to the rotation axis of the rotating frame 504. The transfer drive 505 (using a motor) drives the rotating frame 504 to rotate, thereby causing the two sets of pick-and-place modules 51 to switch back and forth between two pick-and-place positions. In this example, the switching position is a 180° rotation. The support frame 501 includes a vertical frame 502 and a horizontal frame 503 in the shape of an inverted "U". The two ends of the horizontal frame 503 are connected to the upper ends of the two vertical frames 502. Two sets of pick-and-place modules 51 are arranged on both sides below the horizontal frame 503.

[0061] In this embodiment, the plate picking and placing module 51 includes a lifting seat 511, a longitudinal drive component 512 mounted on a rotating frame 504 for driving the lifting seat 511 to move up and down, a plate clamping slide rail 513 mounted on the lifting seat 511, two sets of plate clamping arms 514 slidably mounted on the plate clamping slide rail 513, and a plate clamping drive component (which may be a cylinder) for driving the two sets of plate clamping arms 514 to move closer to or further away from each other. The longitudinal drive component 512 is an electric cylinder fixed to the rotating frame 504, and its telescopic rod is connected to the lifting seat 511; the lifting seat 511 is fixed with a lifting guide column 515, and the rotating frame 504 is provided with a longitudinal linear bearing, through which the lifting guide column 515 passes.

[0062] One of the wafer handling stations is equipped with a wafer carrier 52 for receiving the lead frame transferred from the wafer handling module 51. The wafer carrier 52 is equipped with a wafer pusher assembly 53 for laterally pushing the lead frame. The wafer pusher assembly 53 includes a wafer pusher rod 531 and a wafer pusher drive for driving the wafer pusher rod 531 to move up and down and laterally. The wafer carrier 52 has a wafer pusher slot 521 for the wafer pusher rod 531 to pass through and move laterally. The wafer pusher drive includes a wafer pusher base 532 and a wafer pusher longitudinal shift seat 533. The wafer pusher longitudinal shift seat 533 is mounted on the wafer pusher base 532. The wafer pusher base 532 is equipped with a wafer pusher lifting cylinder 534 for driving the wafer pusher longitudinal shift seat 533 to move up and down. The wafer pusher rod 531 is mounted on the wafer pusher longitudinal shift seat 533. The wafer pusher drive also includes a wafer pusher power component 535 for driving the wafer pusher base 532 to move laterally.

[0063] Specifically, the push rods 531 are arranged in two rows on top of the pusher longitudinal conveyor 533, with space between the two rows of push rods 531 for placing the lead frame. The wafer carrier 52 has a wafer receiving station 522, a transition station 523, and a wafer exit station 524 arranged sequentially. The wafer receiving station 522 is close to the transfer module 50 to receive the lead frame from the wafer pick-up and drop-off module 51. The two rows of push rods 531 move the lead frame from the wafer receiving station 522 to the transition station 523, and simultaneously move the lead frame from the transition station 523 to the wafer exit station 524. That is, the two rows of push rods 531 are inserted into both sides of the lead frame at the wafer receiving station 522. One row of push rods 531 pushes the lead frame from the wafer receiving station 522 to the transition station 523, and the other row of push rods 531 pushes the lead frame from the transition station 523 to the wafer exit station 524.

[0064] In this embodiment, the wafer exit station 524 is provided with a wafer support body 525, which consists of multiple grids arranged at intervals to facilitate the clamping and removal of the lead frame.

[0065] In this embodiment, the wafer stage 52 is provided with two baffles 526 for guiding and limiting the two sides of the lead frame. The distance between the two baffles 526 is adjustable, which facilitates the guidance and limiting of lead frames of different specifications. Specifically, the baffles 526 are provided with rods, and the position of the baffles 526 is adjusted by tightening or loosening the rods with screws.

[0066] In the description of this utility model, it is obvious that the described embodiments are only a part of the embodiments of this utility model, and not all of them. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0067] Therefore, the above detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0068] In the description of this utility model, it should be noted that the terms "middle," "upper," "lower," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0069] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, or a connection within two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

Claims

1. A feeding mechanism for high-density integrated circuit lead frames, characterized in that: The device includes a sheet handling mechanism and a take-up and drop-off box. The take-up and drop-off box includes a support plate and a clip limiting frame disposed on the support plate. The clip limiting frame is used to hold the take-up clips for the lead wire frame to be stacked. The clip limiting frame includes two first limiting plates that limit the take-up clips on both sides in the length direction and two second limiting plates that limit the take-up clips on both sides in the width direction. The support plate is also provided with an electric length adjustment component for adjusting the distance between the two first limiting plates and an electric width adjustment component for adjusting the distance between the two second limiting plates. The wafer handling mechanism includes a transfer module and two wafer picking and placing modules for picking up and placing lead frames. The transfer module includes a stand, a rotating frame, and a transfer drive. The rotating frame is rotatably mounted on the stand, and its rotation axis is arranged longitudinally. The two wafer picking and placing modules are mounted on the rotating frame and are arranged symmetrically with respect to the rotation axis of the rotating frame. A wafer carrier platform is provided below the wafer picking and placing modules to receive the lead frames transferred from the wafer picking and placing modules. The wafer carrier platform is provided with a wafer pushing assembly for laterally pushing the lead frames. The transfer drive is used to drive the rotating frame to rotate, so that the two wafer picking and placing modules alternately switch between the receiving clip and the wafer carrier platform.

2. The feeding mechanism for the high-density integrated circuit lead frame according to claim 1, characterized in that: The plate picking and placing module includes a lifting base, a longitudinal drive component mounted on the rotating frame for driving the lifting base to move up and down, a plate clamping slide rail mounted on the lifting base, two sets of plate clamping arms slidably mounted on the plate clamping slide rail, and a plate clamping drive component for driving the two sets of plate clamping arms to move closer to or further away; the longitudinal drive component is an electric cylinder fixed to the rotating frame, and its telescopic rod is connected to the lifting base; the lifting base is fixed with a lifting guide column, and the rotating frame is equipped with a longitudinal linear bearing, through which the lifting guide column passes.

3. The feeding mechanism for the high-density integrated circuit lead frame according to claim 1, characterized in that: The frame consists of an inverted "U"-shaped vertical frame and a horizontal frame. The two ends of the horizontal frame are connected to the upper ends of the two vertical frames, and two sets of pick-and-place modules are arranged on both sides below the horizontal frame.

4. The feeding mechanism for the high-density integrated circuit lead frame according to claim 1, characterized in that: The pusher assembly includes a pusher rod and a pusher drive for driving the pusher rod to move up and down and laterally. The plate carrier has a pusher slot for the pusher rod to pass through and move laterally. The pusher drive includes a pusher base and a pusher longitudinal shift seat. The pusher longitudinal shift seat is mounted on the pusher base. The pusher base is provided with a pusher lifting cylinder for driving the pusher longitudinal shift seat to move up and down. The pusher rod is mounted on the pusher longitudinal shift seat. The pusher drive also includes a pusher power component for driving the pusher base to move laterally.

5. The feeding mechanism for the high-density integrated circuit lead frame according to claim 4, characterized in that: Two rows of push rods are arranged on top of the push rod longitudinal transfer seat, with space between the two rows of push rods for placing the lead frame; the wafer carrier stage has a receiving station, a transition station and a wafer ejection station arranged in sequence. The receiving station is close to the transfer module to receive the lead frame from the wafer pick-up and drop-off module. The two rows of push rods move the lead frame from the receiving station to the transition station, and at the same time move the lead frame from the transition station to the wafer ejection station; the wafer ejection station is equipped with a wafer support body, which is a series of grids arranged at intervals; the wafer carrier stage is equipped with two baffles that guide and limit the lead frame on both sides, and the distance between the two baffles can be adjusted.

6. The feeding mechanism for the high-density integrated circuit lead frame according to claim 1, characterized in that: A first guide rail is provided on the top of the support plate, and two first limiting plates are provided with first sliding seats that slide in cooperation with the first guide rail. The electric length adjustment assembly includes an length adjustment motor and an length adjustment screw. The length adjustment screw is arranged in parallel with the first guide rail. The two first limiting plates are threadedly connected to the length adjustment screw, and the threads of the two first limiting plates and the length adjustment screw are arranged oppositely, so that when the length adjustment motor drives the length adjustment screw to rotate, it drives the two first limiting plates to move in opposite directions. A mounting plate is provided on the facing sides of the two first limiting plates. The mounting plate is slidably provided with a slide rod perpendicular to the first guide rail, and the second limiting plate is fixed to the slide rod. Each first limiting plate corresponds to two second limiting plates, one of which is fixed to the slide rod as a fixed plate, and the other is fixed to the first limiting plate as a movable plate.

7. The feeding mechanism for the high-density integrated circuit lead frame according to claim 6, characterized in that: The electric width-adjusting assembly includes a width-adjusting motor and a width-adjusting lead screw. The width-adjusting lead screw is arranged perpendicularly to the length-adjusting lead screw. The end of the width-adjusting lead screw is connected to the output shaft of the width-adjusting motor. The width-adjusting lead screw is threadedly connected to a connecting seat, and a connecting rod is fixed to the connecting seat. The two ends of the connecting rod are respectively connected to two second limiting plates that serve as moving plates. The electric length-adjusting assembly also includes a steering rod, which is arranged parallel to the width-adjusting lead screw. The steering rod and the length-adjusting lead screw are driven by a helical gear. The output shaft of the length-adjusting motor is connected to the end of the steering rod. The length-adjusting motor and the width-adjusting motor are located on the same side of the support plate.

8. The feeding mechanism for the high-density integrated circuit lead frame according to claim 7, characterized in that: The magazine limiting frame consists of two sets, with the electric width adjustment component and electric length adjustment component of the two sets of magazine limiting frames linked together. It also includes a base plate, with a transverse slide rail on the top of the base plate, arranged in parallel with the first guide rail. The bottom of the support plate is provided with a transverse slide block that slides with the transverse slide rail, so that the support plate can be slidably mounted on the base plate. The base plate is provided with a transverse motor and a transverse lead screw, arranged in parallel with the length adjustment lead screw. The support plate is connected to the transverse lead screw via a threaded seat, and the output shaft of the transverse motor is connected to the transverse lead screw.

9. The feeding mechanism for the high-density integrated circuit lead frame according to claim 8, characterized in that: The base plate is a long strip with suspension rods connected to both ends. The lower ends of the suspension rods are fixedly connected to the base plate.

10. The feeding mechanism for the high-density integrated circuit lead frame according to claim 1, characterized in that: The first limiting plate has a clearance hole. A material-supporting cylinder is fixed on the opposite sides of the two first limiting plates. The piston rod of the material-supporting cylinder is fixed with a cartridge-supporting plate. The cartridge-supporting plate extends through the clearance hole to the opposite sides of the two first limiting plates to support the receiving cartridge.

Citation Information

Patent Citations

  • A device and method for moving and transferring lead frames

    CN109850549B

  • Turnover type material receiving box mechanism of lead frame equipment

    CN219216785U

  • Transverse moving type material receiving box mechanism of lead frame equipment

    CN219216815U

  • Grabbing type rotary feeding mechanism of integrated circuit lead frame

    CN219566761U