Wafer adjusting table

Abstract

The utility model discloses a wafer adjusting table, which is characterized in that a wafer rotary table is rotatably mounted on a bottom plate, a rotary table driving device for driving the wafer rotary table to rotate is arranged on the bottom plate, the wafer rotary table comprises an upper disc positioned at the bottom and a shell surrounding the upper disc, a lifting leveling device is mounted on the upper disc, and a workbench is mounted on the lifting leveling device. A wafer placing table is installed on the working table, a lifting and leveling device drives the wafer placing table to lift and level, an ejector pin which penetrates through the wafer placing table and is used for supporting wafer lifting is installed on the upper disc in a lifting mode, the ejector pin is driven by an ejector pin lifting power device, and a plurality of bottom measuring sensors which penetrate through the wafer placing table in a lifting mode are further arranged on the upper disc. The wafer placing table is provided with a negative pressure channel for performing negative pressure suction on the wafer, and the negative pressure channel is connected with a negative pressure system; the adjusting table can perform horizontal adjustment and height measurement on the supported wafer, and can ensure that the wafer is accurately placed after being taken for multiple times, so that the use effect is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer detection equipment field especially relates to a wafer adjusting platform. BACKGROUND

[0002] Wafer refers to the silicon wafer used for making silicon semiconductor integrated circuit, its shape is circular, and wafer needs to be placed on wafer turntable, and etching needs to be completed multiple times when photoetching, and bottom sensor needs to be measured on wafer turntable to determine whether wafer is placed accurately and the subsequent processing height is determined, so as to ensure the accurate and stable processing, the bottom sensor is installed in the wafer turntable, and the bottom of the wafer turntable is used as the reference, currently, the bottom sensor includes a sensing head and a cylinder for driving the sensing head to lift, the cylinder is connected with an airflow interface, then the cylinder is directly fixed with the bottom of the wafer turntable, and the installation and fixation are relatively cumbersome, and when the cylinder or the sensing head needs to be replaced, the air pipe on the airflow interface needs to be pulled out in sequence, and the disassembly is also very cumbersome, and the bottom of the cylinder cannot be effectively ensured to be flush, which affects the accuracy of the bottom measurement, and the wafer turntable is provided with a wafer supporting table, and the corresponding wafer is adsorbed and placed on the wafer supporting table, and the wafer supporting table needs to ensure the horizontal of the end face to ensure that the wafer can be in a horizontal state during etching, therefore, the wafer supporting table needs to be horizontally adjusted on the wafer turntable, the patent number 202223067713.9 discloses a turntable adjusting mechanism and detection device, the turntable adjusting mechanism drives the screw rod to rotate through the driving part, so as to drive the moving block to move linearly, the moving block is connected with the rotating plate through the connecting assembly, the moving block moves linearly, and the rotating plate can rotate circularly, so the connecting assembly is also provided with guide rails, bearings and other components, therefore, the structure of the connecting assembly is complex when driving rotation, and the cooperation of the screw nut also needs high cooperation precision, which also increases the complexity of the structure and improves the use cost, and the wafer turntable cannot be horizontally adjusted, which affects the etching accuracy of the wafer. UTILITY MODEL CONTENTS

[0003] The utility model solves the technical problem that a wafer adjusting platform can horizontally adjust and measure the height of the supported wafer, and ensure the accurate placement of the wafer after multiple taking, and improve the use effect.

[0004] The utility model discloses a wafer adjusting platform, including bottom plate, the bottom plate is rotationally installed with wafer rotary table, be equipped with the rotary table drive arrangement of drive wafer rotary table rotation on the bottom plate, the wafer rotary table includes the upper disc at bottom and the shell around upper disc, install the lifting leveling device on the upper disc, install the workstation on the lifting leveling device, install the wafer placing table on the workstation, the lifting leveling device drives the wafer placing table elevating and leveling, install the thimble for supporting wafer elevating through the wafer placing table on the upper disc elevating, the thimble is driven through thimble elevating power device, still be equipped with the multiple bottom measuring sensor elevating through the wafer placing table on the upper disc, the bottom measuring sensor is driven by sensor elevating power device, be equipped with the negative pressure passage of carrying out negative pressure suction to wafer on the wafer placing table, the negative pressure passage is connected with negative pressure system.

[0005] As a preferred scheme, the rotary table drive arrangement includes the rotary connecting rod fixedly installed on the upper disc and synchronously rotating with the wafer rotary table, the top pushing block that pushes the rotary connecting rod is horizontally and linearly slidably installed on the bottom plate, the end of the top pushing block is close to the side surface of the rotary connecting rod, the top pushing block is driven by the linear pushing power device, the reset structure that makes the wafer rotary table return to turn is arranged on the bottom plate and connected with the rotary connecting rod, and the limiting structure that limits the rotary connecting rod to rotate with the wafer rotary table is arranged on the bottom plate.

[0006] As a preferred scheme, the upper disc is provided with a containing groove corresponding to the bottom measuring sensor, the containing groove is provided with a mounting base, the sensor driving cylinder is vertically inserted and mounted on the mounting base, the upper surface of the mounting base is a reference surface, the bottom of the sensor driving cylinder is in contact with the reference surface, the air flow channel that is communicated with the sensor driving cylinder is arranged on the mounting base, the air flow channel is communicated with the cylinder driving gas source, the bottom measuring sensor is vertically installed on the sensor driving cylinder, the sensor wire harness that is connected with the bottom measuring sensor is further arranged on the sensor driving cylinder, and the auxiliary fixing device that is vertically installed with the auxiliary sensor driving cylinder is arranged on the upper disc.

[0007] As a preferred scheme, the lifting leveling device comprises four lifting mounts fixedly installed on the upper disc, the four lifting mounts are uniformly circumferentially arranged with the wafer placing table as the center, each lifting mount is vertically slidably installed with a sliding seat, the sliding seats are driven by a workbench lifting power device, two of the sliding seats are on the X diameter and defined as X sliding seats, the other two sliding seats are on the Y diameter and defined as Y sliding seats, each X sliding seat is fixedly installed with an X adjusting block, each Y sliding seat is fixedly installed with a Y adjusting block, the workbench is fixed on the X adjusting block and the Y adjusting block, the X adjusting block is divided into an X upper block and an X lower block, a Y connecting block facing the Y direction is arranged between the X upper block and the X lower block, an X connecting block facing the X direction is arranged between the X lower block and the X sliding seat, and gaps are arranged between the X upper block and the X lower block and between the X lower block and the X sliding seat; the Y adjusting block is divided into a Y upper block and a Y lower block, an X connecting block facing the X direction is arranged between the Y upper block and the Y lower block, a Y connecting block facing the Y direction is arranged between the Y lower block and the Y sliding seat, and gaps are arranged between the Y upper block and the Y lower block and between the Y lower block and the Y sliding seat.

[0008] As a preferred scheme, the workbench bottom is provided with a groove matched with the X adjusting block and the Y adjusting block, and the workbench is fixedly installed with the X adjusting block and the Y adjusting block through screws.

[0009] As a preferred scheme, the upper disc and the workbench are further provided with connecting extension springs connected with each other.

[0010] As a preferred scheme, the upper disc is provided with a vertical sliding seat, the vertical sliding seat is fixedly installed with a support seat supporting a support pin, the support seat is provided below with a horizontally extending strip-shaped through hole, the support pin lifting power device comprises a support pin driving motor fixedly installed on the upper disc, an eccentric rotating rod is connected to an output end of the support pin driving motor, and the eccentric rotating rod is constrained in the strip-shaped through hole.

[0011] As a preferred scheme, the end of the pushing block is provided with a circular arc protrusion abutting against the side surface of the rotating connecting rod, the bottom plate is provided with a sliding guide rail, and the pushing block is slidably installed on the bottom plate through the sliding guide rail; the reset structure comprises a reset fixed rod vertically fixed on the bottom plate, a reset extension spring is arranged between the reset fixed rod and the end of the rotating connecting rod; the limiting structure comprises limiting stop rods located on both sides of the rotating connecting rod, and the limiting stop rods are fixedly installed on the bottom plate; the bottom plate is further provided with a sensing device detecting the moving position of the pushing plate, and the sensing device is limited in cooperation with the limiting stop rods.

[0012] As a preferred scheme, the mounting base is provided with an insertion opening, the bottom of the sensor driving cylinder is provided with a pipe protrusion inserted into the insertion opening, the upper end surface of the mounting base is provided with a sealing groove at the edge of the insertion opening, and the sealing groove is provided with a sealing ring.

[0013] As a preferred scheme, the auxiliary fixing device comprises an auxiliary rod vertically fixedly installed on the upper disc, and a fixing clamp block is arranged between the auxiliary rod and the sensor driving cylinder to clamp each other; the auxiliary fixing device further comprises an auxiliary positioning member, the auxiliary positioning member is provided with an inner positioning sleeve portion sleeved on the auxiliary rod and an outer positioning sleeve portion sleeved on the sensor driving cylinder, and the fixing clamp block is located above the auxiliary positioning member; the auxiliary rod is provided with a limiting step, and the inner positioning sleeve portion abuts against the limiting step.

[0014] After the technical scheme is adopted, the wafer adjusting table has the following effects: the wafer adjusting table comprises a bottom plate, a wafer turntable is rotatably installed on the bottom plate, a turntable driving device for driving the wafer turntable to rotate is arranged on the bottom plate, the wafer turntable comprises an upper disc at the bottom and an outer shell surrounding the upper disc, a lifting and leveling device is installed on the upper disc, a workbench is installed on the lifting and leveling device, a wafer placing table is installed on the workbench, the wafer placing table is driven by the lifting and leveling device to lift and level, a top pin penetrating through the wafer placing table and supporting the wafer to lift is installed on the upper disc in a lifting mode, the top pin is driven by a top pin lifting power device, a plurality of bottom measuring sensors penetrating through the wafer placing table and lifting are further arranged on the upper disc and driven by a sensor lifting power device, a negative pressure channel for negatively sucking the wafer is arranged on the wafer placing table, and the negative pressure channel is connected with a negative pressure system; the top pin lifting power device drives the top pin to ascend to effectively support the wafer conveyed, then the top pin is lowered to make the wafer fall on the wafer placing table, the negative pressure channel on the wafer placing table sucks air through the negative pressure system, so that the wafer is effectively adsorbed, then the sensor lifting power device drives the bottom measuring sensors to ascend to touch the bottom of the wafer, the distance length is calculated to determine whether the wafer is horizontal, the wafer surface is controlled to be in a horizontal state through the lifting and leveling device, finally the turntable driving device is driven to rotate, so that the wafer can be in the same position when repeatedly etching, and the etching is accurate; the adjusting table can horizontally adjust and measure the height of the supported wafer, and can ensure that the wafer is accurately placed after being taken for many times, and the use effect is improved.

[0015] The rotary connecting rod is fixedly installed on the upper disc and rotates synchronously with the wafer rotary table, the pushing block is horizontally and linearly slidably installed on the bottom plate and pushes the rotary connecting rod, the end of the pushing block is close to the side of the rotary connecting rod, the pushing block is driven by the linear pushing power device, the reset structure is arranged on the bottom plate and is connected with the rotary connecting rod to pull and make the wafer rotary table rotate back, and the limiting structure is arranged on the bottom plate and limits the rotary connecting rod to rotate within a range; the pushing block is pushed by the linear pushing power device, then the pushing block pushes the rotary connecting rod to make the wafer rotary table rotate, when the wafer rotary table rotates back, the reset structure drives the wafer rotary table to rotate back, and the pushing block pushes against the rotary connecting rod to retract; the wafer rotary table is effectively and stably driven to rotate accurately, the structure is simple, and the practicality is improved.

[0016] The accommodating groove is arranged on the upper disc and corresponds to the bottom measuring sensor, the mounting base is installed in the accommodating groove, the sensor driving cylinder is vertically inserted and installed on the mounting base, the upper surface of the mounting base is a reference surface, the bottom of the sensor driving cylinder is in contact with the reference surface, the air flow channel that is in communication with the sensor driving cylinder is arranged on the mounting base, the air flow channel is in communication with the cylinder driving air source, the bottom measuring sensor is installed on the sensor driving cylinder, the sensor wire harness that is connected with the bottom measuring sensor is further arranged on the sensor driving cylinder, and the auxiliary fixing device that vertically installs the auxiliary sensor driving cylinder is arranged on the upper disc; the sensor driving cylinder is inserted into the mounting base, can be effectively communicated with the air flow channel, is convenient to install, the mounting base is installed in the accommodating groove, can be stably installed, and the installation is vertical and stable based on the reference; then the sensor driving cylinder can be stably lifted and lowered through the auxiliary fixing device, the bottom measuring sensor can be effectively detected through the sensor wire harness, and the use effect is improved.

[0017] Further, the lifting leveling device comprises four lifting mounts fixedly installed on the upper disc, the four lifting mounts are evenly circumferentially arranged with the wafer placing table as the center, each lifting mount is vertically slidably installed with a sliding seat, the sliding seats are driven by a workbench lifting power device, two of the sliding seats are on the X diameter and defined as X sliding seats, the other two sliding seats are on the Y diameter and defined as Y sliding seats, each X sliding seat is fixedly installed with an X adjusting block, each Y sliding seat is fixedly installed with a Y adjusting block, the workbench is fixed on the X adjusting blocks and the Y adjusting blocks, the X adjusting blocks are divided into an X upper block and an X lower block, the X upper block and the X lower block are provided with a Y connecting block facing the Y direction, the X lower block and the X sliding seat are provided with an X connecting block facing the X direction, and gaps are arranged between the X upper block and the X lower block and between the X lower block and the X sliding seat; the Y adjusting blocks are divided into a Y upper block and a Y lower block, the Y upper block and the Y lower block are provided with an X connecting block facing the X direction, the Y lower block and the Y sliding seat are provided with a Y connecting block facing the Y direction, and gaps are arranged between the Y upper block and the Y lower block and between the Y lower block and the Y sliding seat; the workbench is supported by the X adjusting blocks and the Y adjusting blocks on the X sliding seats and the Y sliding seats, when the four sliding seats are synchronously lifted, the workbench is lifted as a whole, when horizontal adjustment is needed, the sliding seats on the same diameter are lifted for adjustment, when the two X sliding seats are lifted, the Y connecting blocks on the X sliding seats are twisted, the Y connecting blocks on the Y sliding seats are also twisted, the gaps on the two sides of the Y connecting blocks are compressed and expanded respectively, the wafer placing table can be effectively horizontally adjusted, since the wafer placing table is close to the X sliding seats when the X sliding seats are lifted, the adjustment range is large, therefore, the Y connecting blocks are arranged between the X upper block and the X lower block, while the Y sliding seats are in the middle of the horizontal adjustment, the range is small, therefore, the Y connecting blocks are arranged between the Y lower block and the Y sliding seat, and vice versa when the Y sliding seats are lifted, the structure is simple and the adjustment is convenient.

[0018] Further, the workbench bottom is provided with a groove matched with the X adjusting blocks and the Y adjusting blocks, and the workbench is fixedly installed with the X adjusting blocks and the Y adjusting blocks through screws; the groove can facilitate the installation of the workbench and make the installation accurate and firm.

[0019] Further, the upper disc and the workbench are further provided with connecting extension springs connected with each other; when the workbench is lifted, the connecting extension springs can effectively pull the workbench, so that the workbench can be quickly reset after being lifted.

[0020] Further, the upper disc is provided with a vertical sliding seat, a support seat for supporting the ejector pin is fixedly installed on the vertical sliding seat, a horizontal strip-shaped through hole is arranged below the support seat, the ejector pin lifting power device comprises an ejector pin driving motor fixedly installed on the upper disc, an eccentric rotating rod is connected to the output end of the ejector pin driving motor, and the eccentric rotating rod is constrained in the strip-shaped through hole; the ejector pin driving motor is rotated to drive the eccentric rotating rod to rotate, the eccentric rotating rod is continuously rotated in the strip-shaped through hole, so that the support seat is lifted or lowered, and the support seat slides along the vertical sliding seat, accurate lifting is achieved, and the wafer can be accurately supported and placed on the wafer placing table.

[0021] Further, the end of the ejector block is provided with a circular arc protrusion, the circular arc protrusion is close to the side surface of the rotating connecting rod, the bottom plate is provided with a sliding guide rail, and the ejector block is slidably installed on the bottom plate through the sliding guide rail; the reset structure comprises a reset fixing rod vertically fixed on the bottom plate, a reset tension spring is arranged between the reset fixing rod and the end of the rotating connecting rod; the limiting structure comprises limiting stop rods arranged on the two sides of the rotating connecting rod, and the limiting stop rods are fixedly installed on the bottom plate; the bottom plate is further provided with a sensing device for detecting the moving position of the ejector plate, and the sensing device is limited in cooperation with the limiting stop rods; the ejector block is not fixedly connected to the rotating connecting rod, so that the ejector block deviates when the rotating connecting rod is pushed to rotate, the circular arc protrusion can be conveniently moved relative to the rotating connecting rod when the rotating connecting rod is pushed, the movement is stable, the pushing is accurate, and when the rotating connecting rod is pushed, the rotating connecting rod is away from the wafer turntable by a certain distance, so that the rotating distance of the rotating connecting rod is much larger than the rotating distance of the wafer turntable when the rotating connecting rod rotates by the same angle, the influence of the swing error of the rotating connecting rod is reduced, and the use effect is improved; the reset tension spring can always pull the rotating connecting rod, so that the rotating connecting rod is pulled back, the rotating connecting rod cooperates with the ejector block, the rotation of the wafer turntable is completed, the structure is simple, and the use is convenient; the limiting stop rods prevent the wafer turntable from rotating too much, and the rotation accuracy is improved; the sensing device cooperates with the limiting stop rods to further improve the rotation accuracy of the wafer turntable.

[0022] Further, the mounting base is provided with an insertion opening, the bottom of the sensor driving air cylinder is provided with a pipeline protrusion inserted into the insertion opening, the upper end surface of the mounting base located at the edge of the insertion opening is provided with a sealing groove, a sealing ring is arranged on the sealing groove, and the bottom of the sensor driving air cylinder and the mounting base are sealingly matched by extruding the sealing ring; the pipeline protrusion is inserted or pulled out to complete the connection or disconnection of the airflow channel, and the sealing ring can effectively improve the sealing effect, so that the sensor driving air cylinder is more stable.

[0023] And the auxiliary fixing device comprises an auxiliary rod fixedly installed vertically on the upper disc, and a fixed clamping block is arranged between the auxiliary rod and the sensor driving cylinder and clamps them; the auxiliary fixing device further comprises an auxiliary positioning member, the auxiliary positioning member is provided with an inner positioning sleeve portion sleeved on the auxiliary rod and an outer positioning sleeve portion sleeved on the sensor driving cylinder, and the fixed clamping block is located above the auxiliary positioning member; a limiting step is arranged on the auxiliary rod, and the inner positioning sleeve portion abuts against the limiting step; the sensor driving cylinder can be effectively fixed vertically by the auxiliary rod through the fixed clamping block, so that the installation is firm and the lifting is stable; the auxiliary positioning member can limit the auxiliary rod and the sensor driving cylinder, and the limiting step can prevent the auxiliary positioning member from being stuck, so that the auxiliary positioning member is constrained at a certain height to constrain the auxiliary rod and the sensor driving cylinder, and the fixing effect is improved and the installation is stable. BRIEF DESCRIPTION OF DRAWINGS

[0024] The utility model is further explained below in combination with the drawings and examples.

[0025] Figure 1 It is the perspective view of the utility model embodiment;

[0026] Figure 2 It is the structure schematic view of the bottom plate of the utility model embodiment;

[0027] Figure 3 It is the structure schematic view of the utility model embodiment lifting leveling device;

[0028] Figure 4 It is the structure schematic view of the utility model embodiment top pin lifting power device;

[0029] Figure 5 It is the structure schematic view of the utility model embodiment rotary table driving device;

[0030] Figure 6 It is the structure schematic view of the utility model embodiment bottom measuring sensor;

[0031] Figure 7 It is the structure schematic view of the utility model embodiment installation base and sensor driving cylinder;

[0032] Figure 8 It is the structure schematic view of the utility model embodiment upper disc;

[0033] Figure 9 It is the structure schematic view of the utility model embodiment bottom measuring sensor installation;

[0034] In the drawing: 1, bottom plate; 2, wafer turntable; 3, upper disc; 4, shell; 5, workbench; 6, wafer placing table; 7, thimble; 8, bottom measuring sensor; 9, negative pressure channel; 10, annular arc-shaped protrusion; 11, negative pressure suction port; 12, rotary connecting rod; 13, push block; 14, containing groove; 15, mounting base; 16, sensor driving cylinder; 17, air flow channel; 18, sensor wire harness; 19, lifting mounting frame; 20, X sliding seat; 21, insertion port; 22, Y sliding seat; 23, X adjusting block; 231, X upper layer block; 232, X lower layer block; 24, Y adjusting block; 241, Y upper layer block; 242, Y lower layer block; 25, X connecting block; 26, Y connecting block; 27, screw; 28, connecting extension spring; 29, vertical sliding seat; 30, support seat; 31, strip-shaped through hole; 32, eccentric rotating rod; 33, thimble driving motor; 34, circular arc protrusion; 35, sliding guide rail; 36, voice coil motor; 37, motor fixing plate; 38, mounting plate; 39, reset fixing rod; 40, reset extension spring; 41, limiting stop rod; 42, grating ruler; 43, cover shell; 44, pipe protrusion; 45, sealing slot; 46, auxiliary rod; 47, fixed clamping block; 48, limiting step; 49, auxiliary positioning member; 491, inner positioning sleeve part; 492, outer positioning sleeve part; 50, connecting rod part; 51, mounting pad; 52, semicircular groove DETAILED DESCRIPTION

[0035] The utility model will be described in further detail below through specific embodiments.

[0036] As Figures 1 to 9 shown, a wafer adjusting table, comprising a bottom plate 1, a wafer turntable 2 is rotatably installed on the bottom plate 1, a turntable driving device for driving the wafer turntable 2 to rotate is arranged on the bottom plate 1, the wafer turntable 2 comprises an upper disc 3 at the bottom and a shell 4 surrounding the upper disc 3, a lifting leveling device is installed on the upper disc 3, a workbench 5 is installed on the lifting leveling device, a wafer placing table 6 is installed on the workbench 5, the lifting leveling device drives the wafer placing table 6 to lift and level, a thimble 7 for supporting the wafer lifting is installed on the upper disc 3 and lifts and drives through a thimble 7 lifting power device, a plurality of bottom measuring sensors 8 are further arranged on the upper disc 3 and lift through the wafer placing table 6, a negative pressure channel 9 for negative pressure suction of the wafer is arranged on the wafer placing table 6, and the negative pressure channel 9 is connected with a negative pressure system.

[0037] In this embodiment, the wafer placing table 6 is fixedly connected with the workbench 5, and the workbench 5 is gap-fitted with the shell 4, so that the horizontal adjustment of the workbench 5 is facilitated, and the wafer placing table 6 is provided with a plurality of annular arc-shaped protrusions 10, the annular arc-shaped protrusions 10 are provided with negative pressure suction ports 11 communicated with the negative pressure channels 9, then the negative pressure suction ports 11 are suctioned by the negative pressure system, and the wafer pressed on the annular arc-shaped protrusions 10 forms negative pressure in the annular arc-shaped protrusions 10, so that the wafer can be effectively adsorbed.

[0038] As shown in Figure 5 , the rotary connecting rod 12 is fixedly installed on the upper disc 3 and rotates synchronously with the wafer rotary table 2, the push block 13 horizontally and linearly slidingly installed on the bottom plate 1 pushes the rotary connecting rod 12, the end of the push block 13 abuts against the side surface of the rotary connecting rod 12, the push block 13 is driven by the linear pushing power device, the bottom plate 1 is provided with a reset structure connected with the rotary connecting rod 12 to pull and make the wafer rotary table 2 rotate back, and the bottom plate 1 is provided with a limiting structure limiting the rotary range of the rotary connecting rod 12 following the wafer rotary table 2; the push block 13 is pushed by the linear pushing power device, then the push block 13 pushes the rotary connecting rod 12 to make the wafer rotary table 2 rotate, when the wafer rotary table 2 rotates back, the reset structure drives the rotation back, and the push block 13 pushes against the rotary connecting rod 12 to retract; the wafer rotary table 2 is effectively and stably driven to rotate accurately, the structure is simple, and the practicability is improved.

[0039] As shown in Figure 8 and Figure 9 , the upper disc 3 is provided with a containing groove 14 corresponding to the bottom measuring sensor 8, the containing groove 14 is provided with an installation base 15, the installation base 15 is vertically inserted and installed with a sensor driving cylinder 16, the upper surface of the installation base 15 is a reference surface, the bottom of the sensor driving cylinder 16 is in contact with the reference surface, the installation base 15 is provided with an airflow channel 17 communicated with the sensor driving cylinder 16, the airflow channel 17 is communicated with a cylinder driving gas source, the bottom measuring sensor 8 is installed on the sensor driving cylinder 16, the sensor driving cylinder 16 is further provided with a sensor wire harness 18 connected with the bottom measuring sensor 8, and the upper disc 3 is provided with an auxiliary fixing device vertically installed with the auxiliary sensor driving cylinder 16; the sensor driving cylinder 16 inserted into the installation base 15 can be effectively communicated with the airflow channel 17, the installation is convenient, the installation base 15 is installed in the containing groove 14, the installation is stable, the installation is effectively vertical based on the reference, the measurement is accurate, then the sensor driving cylinder 16 can be stably lifted by the auxiliary fixing device, the bottom measuring sensor 8 can be effectively detected by the sensor wire harness 18, and the use effect is improved.

[0040] As shown in Figure 2As shown, the lifting leveling device comprises four lifting mounts 19 fixedly installed on the upper disc 3, the four lifting mounts 19 are evenly circumferentially placed with the wafer placing table 6 as the center, each lifting mount 19 is vertically slidably installed with a sliding seat, the sliding seat is driven by a workbench lifting power device, the workbench lifting power device comprises a workbench lifting cylinder, two sliding seats are on the X diameter and defined as X sliding seats 20, the other two sliding seats are on the Y diameter and defined as Y sliding seats 22, each X sliding seat 20 is fixedly installed with an X adjusting block 23, each Y sliding seat 22 is fixedly installed with a Y adjusting block 24, the workbench 5 is fixed on the X adjusting block 23 and the Y adjusting block 24, the X adjusting block 23 is divided into an X upper block 231 and an X lower block 232, a Y connecting block 26 facing the Y direction is arranged between the X upper block 231 and the X lower block 232, an X connecting block 25 facing the X direction is arranged between the X lower block 232 and the X sliding seat 20, gaps are arranged between the X upper block 231 and the X lower block 232, the X lower block 232 and the X sliding seat 20; the Y adjusting block 24 is divided into a Y upper block 241 and a Y lower block 242, an X connecting block 25 facing the X direction is arranged between the Y upper block 241 and the Y lower block 242, a Y connecting block 26 facing the Y direction is arranged between the Y lower block 242 and the Y sliding seat 22, gaps are arranged between the Y upper block 241 and the Y lower block 242, the Y lower block 242 and the Y sliding seat 22; the lifting mounts 19 are evenly distributed at four circumferential positions on the upper disc 3, which ensures that the four lifting mounts 19 are symmetrically arranged in pairs, then the workbench 5 lifting cylinder on the lifting mount 19 can drive the sliding seat to lift, when the four sliding seats are synchronously lifted, the workbench 5 can be lifted as a whole, when horizontal adjustment is needed, the sliding seats on the same diameter are lifted for adjustment, when the two X sliding seats 20 are lifted, the Y connecting block 26 on the X sliding seat 20 is twisted, the Y connecting block 26 on the Y sliding seat 22 is also twisted, the gaps on both sides of the Y connecting block 26 are compressed and expanded respectively, which can effectively adjust the wafer placing table 6 horizontally, since the X sliding seat 20 is lifted, the wafer placing table 6 is close to the X sliding seat 20, so the adjustment range is large, therefore the Y connecting block 26 is arranged between the X upper block 231 and the X lower block 232, while the Y sliding seat 22 is in the middle of horizontal adjustment, so the range is small, the Y connecting block 26 is arranged between the Y lower block 232 and the Y sliding seat 22, conversely when the Y sliding seat 22 is lifted, the same principle applies, the structure is simple and the adjustment is convenient.

[0041] Further, the bottom of the workbench 5 is provided with a groove matched with the X adjusting block 23 and the Y adjusting block 24, and the workbench 5 is fixedly installed with the X adjusting block 23 and the Y adjusting block 24 through the screw 27. The workbench 5 can be quickly and accurately buckled on the X adjusting block 23 and the Y adjusting block 24 through the groove, and then fixed by the screw 27. When the level is adjusted, the workbench 5 can move synchronously with the X adjusting block 23 and the Y adjusting block 24, so that the installation is accurate and firm.

[0042] The upper disc 3 and the workbench 5 are further provided with the connecting tension spring 28 connected with each other, which can ensure that the workbench 5 can be effectively pressed on the X adjusting block 23 and the Y adjusting block 24, and when the workbench 5 is lifted, the connecting tension spring 28 can effectively pull to make the workbench 5 return to the initial position quickly and accurately.

[0043] As shown in Figure 4 The upper disc 3 is provided with the vertical sliding seat 29, the support seat 30 supporting the top pin 7 is fixedly installed on the vertical sliding seat 29, the horizontal strip-shaped through hole 31 is arranged below the support seat 30, the top pin lifting driving device includes the top pin driving motor 33 fixedly installed on the upper disc 3, the eccentric rotating rod 32 is connected to the output end of the top pin driving motor 33, and the eccentric rotating rod 32 is constrained in the strip-shaped through hole 31. The installation plate 38 supporting the top pin driving motor 33 is arranged in the middle of the upper disc 3, the installation plate 38 makes the top pin driving motor 33 horizontally placed, then drives the eccentric rotating rod 32 to rotate, makes the eccentric rotating rod 32 drive the support seat 30 provided with the strip-shaped through hole 31 to lift, and the support seat 30 slides along the vertical sliding seat 29, which is accurate in lifting, and ensures that the wafer can be accurately supported and dropped on the wafer placing table 6.

[0044] As shown in Figure 5As shown, the end of the pushing block 13 is provided with a circular arc protrusion 34 which is close to the side surface of the rotating connecting rod 12, and the bottom plate 1 is provided with a sliding guide rail 35, and the pushing block 13 is slidably installed on the bottom plate 1 through the sliding guide rail 35; the pushing block 13 is not fixedly connected with the rotating connecting rod 12, so that the pushing block 13 will be deviated when pushing the rotating connecting rod 12 to rotate, and the circular arc protrusion 34 can be conveniently moved relative to the rotating connecting rod 12 when pushing the rotating connecting rod 12, so as to stably and accurately push the rotating connecting rod 12, and when the circular arc protrusion 34 pushes the rotating connecting rod 12, since there is a certain distance between the rotating connecting rod 12 and the wafer turntable 2, when rotating by the same angle, the swinging distance of the rotating connecting rod 12 can be far greater than the rotating distance of the wafer turntable 2, so that the influence of the swinging error of the rotating connecting rod 12 can be reduced, and the use effect is improved; the linear pushing power device comprises a voice coil motor 36 which is fixedly installed on a motor fixing plate 37 and drives the pushing block 13 to horizontally and linearly move, and the voice coil motor 36 has the characteristics of simple structure, small size, high speed, high acceleration, fast response and the like, so that the structure is more compact, and the sliding guide rail 35 is a cross ball guide rail, one part of the cross ball guide rail is fixed with the pushing block 13, and the other part is fixed with the bottom plate 1, so that the pushing block can linearly slide, and the linear moving direction is effectively determined.

[0045] The reset structure comprises a reset fixing rod 39 which is vertically fixed on the bottom plate 1, and a reset tension spring 40 which is arranged between the reset fixing rod 39 and the end of the rotating connecting rod 12; the reset tension spring 40 can always pull the rotating connecting rod 12, so that the rotating connecting rod 12 can be pulled back to cooperate with the pushing block 13 to complete the rotation of the wafer turntable 2, and the structure is simple and convenient to use, and the reset tension spring 40 is connected with the end of the rotating connecting rod 12 to maximize the reset tension spring force and improve the reset effect.

[0046] The limiting structure comprises limiting stop rods 41 which are arranged on both sides of the rotating connecting rod 12 and are fixedly installed on the bottom plate 1; the bottom plate 1 is further provided with a sensing device for detecting the moving position of the pushing block, and the sensing device cooperates with the limiting stop rods 41 to limit; the limiting stop rods 41 are arranged on both sides of the rotating connecting rod 12 to effectively block the swinging range of the rotating connecting rod 12, prevent the wafer turntable 2 from rotating excessively, and improve the rotation accuracy; the sensing device is a grating ruler 42 which is fixed on the pushing block 13 and is used for detecting the moving distance of the pushing block 13; since the pushing block 13 pushes the rotating connecting rod 12, the rotating connecting rod 12 can only swing back and forth between the limiting stop rods 41, and the extension distance of the pushing block 13 corresponds to the rotation angle of the wafer turntable 2, so that the rotation angle can be accurately obtained by detecting the moving distance of the pushing block 13 through the grating ruler 42, the rotation accuracy is ensured, and the use effect is improved.

[0047] The bottom plate 1 is fixedly installed with a cover 43 covering the pushing block 13; and the motor fixing plate 37 cooperates to effectively protect the pushing block 13 to push safely and stably.

[0048] As shown in Figure 7 The installation base 15 is provided with an insertion opening 21, the bottom of the sensor driving cylinder 16 is provided with a pipeline protrusion 44 matched with the insertion opening 21, the upper end surface of the installation base 15 located at the edge of the insertion opening 21 is provided with a sealing recess 45, and the sealing recess 45 is provided with a sealing ring matched with the lower end surface of the pipeline protrusion 44; the pipeline protrusion 44 is inserted or pulled out to complete the connection or disconnection with the airflow channel 17, and the sealing ring can effectively improve the sealing effect, so that the sensor driving cylinder 16 is more stable.

[0049] As shown in Figure 6 The auxiliary fixing device includes an auxiliary rod 46 vertically fixedly installed on the upper disc 3, and the auxiliary rod 46 and the sensor driving cylinder 16 are provided with a fixed clamping block 47 clamped with each other; the upper disc 3 is provided with three accommodating grooves 14, so that the three accommodating grooves 14 correspondingly have three installation bases 15 respectively, and the sensor driving cylinder 16 is inserted and installed on each installation base 15, then the auxiliary rod 46 is arranged in parallel with the sensor driving cylinder 16, and the fixed clamping block 47 can effectively fix the sensor driving cylinder 16 based on the auxiliary rod 46, and the fixed clamping block 47 is simple in structure and convenient to use; the fixed clamping block 47 is a fixed half clamping block arranged in mirror image, and the fixed half clamping block is provided with a half circular groove 52 abutting with the auxiliary rod 46 and the sensor driving cylinder 16, so that the half circular grooves 52 on the two fixed half clamping blocks form a whole circular groove to fix the auxiliary rod 46 and the sensor driving cylinder 16.

[0050] The auxiliary fixing device further comprises an auxiliary positioning member 49, the auxiliary positioning member 49 is provided with an inner positioning sleeve part 491 sleeved on the auxiliary rod 46 and an outer positioning sleeve part 492 sleeved on the sensor driving cylinder, and the fixing clamp block 47 is located above the auxiliary positioning member 49; the auxiliary rod 46 is provided with a limiting step 48, the inner positioning sleeve part 491 abuts against the limiting step 48; firstly, the auxiliary positioning member 49 is sleeved on the sensor driving cylinder 16, then the inner positioning sleeve part 491 of the auxiliary positioning member 49 is sleeved on the auxiliary rod 46, and then the sensor driving cylinder 16 is inserted into the mounting base 15, so that the sensor driving cylinder 16 and the mounting base 15 are matched, the fixing clamp block 47 is further fixed on the auxiliary positioning member 49 to further ensure the stability of the fixing, and the sensor driving cylinder 16 is effectively pressed on the mounting base 15; the limiting step 48 clamps the inner positioning sleeve part 491, so that the auxiliary positioning member 49 cannot fall down, thereby limiting the auxiliary rod 46 and the sensor driving cylinder 16 at a certain height, and the sensor driving cylinder 16 can be more accurately installed, and the constraint is stable and reliable.

[0051] As shown in Figure 8 and Figure 9 shown, the accommodating groove 14 is a straight line hole, the mounting base 15 is provided below with a mounting cushion block 51 matched and clamped with the straight line hole, the mounting cushion block 51 is installed in the straight line hole, and the mounting base 15 and the mounting cushion block 51 are detachably fixed, and the outlet of the airflow channel 17 is arranged on the side surface of the mounting base 15; the mounting cushion block 51 is first fixedly installed in the straight line hole, and then the mounting base 15 is installed on the mounting cushion block 51, so as to ensure that the mounting base 15 leaks out of the airflow channel 17, facilitate connection, and also facilitate replacement, and improve convenience.

[0052] In the embodiment, the number of the bottom measuring sensors 8 is three and is circumferentially distributed, the number of the corresponding sensor driving cylinders 16 is also three, and the auxiliary positioning member 49 further comprises a connecting rod part 50 sequentially connecting the outer positioning sleeve parts 492; in this way, the auxiliary positioning member 49 forms a whole and restrains the three bottom measuring sensors 8, so that the auxiliary positioning member 49 can not only ensure that the corresponding sensor driving cylinders 16 are effectively and parallelly arranged with the corresponding auxiliary rods 46, but also can limit the three sensor driving cylinders 16 with each other, further improve the installation precision, and simultaneously insert the three sensor driving cylinders 16 into the corresponding mounting bases 15, so as to improve the use effect.

[0053] The working principle of the embodiment is as follows: firstly, the wafer is placed on the ejector pin 7, the eccentric rotating rod 32 is driven to rotate by the ejector pin driving motor 33, the supporting seat 30 is lowered along the vertical sliding seat 29, the wafer falls on the wafer placing table 6, the negative pressure system performs air extraction through the negative pressure air extraction hole to complete the adsorption of the wafer, then the bottom measuring sensor 8 is driven to rise by the sensor driving cylinder 16, whether the distance from each bottom measuring sensor 8 to the wafer placing table 6 is the same is detected, the sliding seat is driven to rise and fall by the workbench 5 lifting cylinder, when the four sliding seats rise and fall synchronously, the workbench 5 can be lifted as a whole, when horizontal adjustment is needed, the sliding seats on the same diameter are lifted to adjust, when the two X sliding seats 20 are lifted, the Y connecting block 26 on the X sliding seat 20 is twisted, the Y connecting block 26 on the Y sliding seat 22 is also twisted, the gap on both sides of the Y connecting block 26 is compressed and expanded respectively, so that the wafer placing table 6 can be effectively adjusted horizontally, when the two Y sliding seats 22 are lifted, the X connecting block 25 on the Y sliding seat 22 is twisted, the X connecting block 23 on the X sliding seat 20 is also twisted, corresponding horizontal adjustment is completed, then the push block 13 is driven to move linearly by the voice coil motor 36, the circular arc protrusion 34 lifts the rotating connecting rod 12, the upper disc 3 is driven to rotate, then the push block 13 is driven to retract by the voice coil motor 36, the rotating connecting rod 12 is retracted by the reset tension spring 40, the rotating connecting rod 12 is tightly attached to the circular arc protrusion 34, the rotating angle of the wafer turntable 2 is adjusted to make the wafer correspond to a suitable etching position.

[0054] The above-described embodiments are only descriptions of preferred embodiments of the present application and are not intended to limit the scope of the present application, and various modifications and improvements of the technical solutions of the present application made without departing from the design spirit of the present application shall fall within the protection scope of the present application defined by the claims.

Claims

1. A wafer adjustment stage, comprising a base plate, wherein a wafer turntable is rotatably mounted on the base plate, characterized in that: The base plate is equipped with a turntable drive device for driving the wafer turntable to rotate. The wafer turntable includes an upper disk located at the bottom and a shell surrounding the upper disk. A lifting and leveling device is installed on the upper disk, and a worktable is installed on the lifting and leveling device. A wafer placement stage is installed on the worktable. The lifting and leveling device drives the wafer placement stage to lift and level. A pin is lifted and installed on the upper disk to support the lifting and lowering of the wafer. The pin is driven by a pin lifting power device. The upper disk is also equipped with multiple bottom-measuring sensors that lift and lower through the wafer placement stage. The bottom-measuring sensors are driven by a sensor lifting power device. The wafer placement stage is equipped with a negative pressure channel for negative pressure suction of the wafer. The negative pressure channel is connected to a negative pressure system.

2. A wafer adjustment stage as described in claim 1, characterized in that: The turntable drive device includes a rotating connecting rod fixedly mounted on the upper disk and rotating synchronously with the wafer turntable. A push block that pushes the rotating connecting rod is horizontally and linearly slidably mounted on the base plate. The end of the push block is close to the side of the rotating connecting rod. The push block is driven by a linear push power device. The base plate is provided with a reset structure that is connected to the rotating connecting rod and pulls to make the wafer turntable rotate. The base plate is provided with a limiting structure that limits the range of rotation of the rotating connecting rod following the wafer turntable.

3. A wafer adjustment stage as described in claim 2, characterized in that: The upper disc has a receiving groove corresponding to the bottom-measuring sensor. A mounting base is installed in the receiving groove. A sensor driving cylinder is vertically inserted into the mounting base. The upper surface of the mounting base is a reference surface. The bottom of the sensor driving cylinder is in contact with the reference surface. The mounting base has an airflow channel communicating with the sensor driving cylinder. The airflow channel is connected to the cylinder driving air source. The bottom-measuring sensor is lifted and lowered on the sensor driving cylinder. The sensor driving cylinder is also equipped with a sensor wiring harness connected to the bottom-measuring sensor. The upper disc has an auxiliary fixing device for vertically mounting the sensor driving cylinder.

4. A wafer adjustment stage as described in claim 3, characterized in that: The lifting and leveling device includes four lifting mounting frames fixedly mounted on the upper disc. The four lifting mounting frames are evenly arranged circumferentially around the wafer placement stage. Each lifting mounting frame has a vertically slidable sliding seat, driven by a worktable lifting power device. Two sliding seats are located on the X diameter and are defined as X sliding seats, while the other two are located on the Y diameter and are defined as Y sliding seats. An X adjustment block is fixedly mounted on each X sliding seat, and a Y adjustment block is fixedly mounted on each Y sliding seat. The worktable is fixed to the X and Y adjustment blocks. The X-adjustment block is divided into an upper X-block and a lower X-block. A Y-oriented connecting block is provided between the upper X-block and the lower X-block. An X-oriented connecting block is provided between the lower X-block and the X-sliding seat. Gaps are provided between the upper X-block and the lower X-block, and between the lower X-block and the X-sliding seat. The Y-adjustment block is divided into an upper Y-block and a lower Y-block. An X-oriented connecting block is provided between the upper Y-block and the lower Y-block. A Y-oriented connecting block is provided between the lower Y-block and the Y-sliding seat. Gaps are provided between the upper Y-block and the lower Y-block, and between the lower Y-block and the Y-sliding seat.

5. A wafer adjustment stage as described in claim 4, characterized in that: The bottom of the workbench is provided with a groove for mounting the X-adjustment block and the Y-adjustment block. The workbench is fixedly mounted to the X-adjustment block and the Y-adjustment block by screws.

6. A wafer adjustment stage as described in claim 5, characterized in that: A connecting tension spring is also provided between the upper disc and the worktable.

7. A wafer adjustment stage as described in claim 6, characterized in that: The upper disc is provided with a vertical slide block, and a support seat for supporting the ejector pin is fixedly installed on the vertical slide block. A horizontally extending strip-shaped through hole is provided below the support seat. The ejector pin lifting power device includes an ejector pin drive motor fixedly installed on the upper disc. The output end of the ejector pin drive motor is connected to an eccentric rotating rod, and the eccentric rotating rod is constrained within the strip-shaped through hole.

8. A wafer adjustment stage as described in claim 7, characterized in that: The push block has an arc-shaped protrusion at its end, which is in close contact with the side of the rotating connecting rod. The base plate has a sliding guide rail, and the push block is slidably mounted on the base plate via the sliding guide rail. The reset structure includes a reset fixing rod vertically fixed on the base plate, and a reset tension spring is provided between the ends of the reset fixing rod and the rotating connecting rod. The limiting structure includes limiting stops located on both sides of the rotating connecting rod, and the limiting stops are fixedly mounted on the base plate. The base plate is also provided with a sensing device for detecting the movement position of the push plate, and the sensing device cooperates with the limiting stops to limit the movement.

9. A wafer adjustment stage as described in claim 8, characterized in that: The mounting base is provided with an insertion port, and the bottom of the sensor driving cylinder is provided with a pipe protrusion that inserts into the insertion port. The upper end face of the mounting base is provided with a sealing groove at the edge of the insertion port, and a sealing ring is provided in the sealing groove. The bottom of the sensor driving cylinder and the mounting base achieve a sealing fit by pressing the sealing ring.

10. A wafer adjustment stage as described in claim 9, characterized in that: The auxiliary fixing device includes an auxiliary rod vertically fixed on the upper disc, and a fixing block that clamps the auxiliary rod and the sensor driving cylinder together; the auxiliary fixing device also includes an auxiliary positioning component, which has an inner positioning sleeve fitted on the auxiliary rod and an outer positioning sleeve fitted on the sensor driving cylinder, and the fixing block is located above the auxiliary positioning component; the auxiliary rod has a limiting step, and the inner positioning sleeve abuts against the limiting step.

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