SD card storage chip packaging structure

Abstract

The utility model discloses an SD card storage chip packaging structure, which relates to the technical field of chip packaging and comprises a substrate, a storage chip packaging body is arranged at the top end of the substrate, and the substrate and the storage chip packaging body are of an integrated structure. A storage chip body is arranged on one side in the storage chip sealing body, a heat conduction mechanism is arranged at the bottom end of the storage chip body, and an insulation assembly is arranged at the top end of the storage chip body; and an SD interface golden finger is arranged at one end of the top end of the storage chip sealing body. According to the utility model, the structure is reasonable and reliable, the integrated structure between the substrate and the storage chip packaging body improves the stability and reliability of the whole packaging structure, the heat conduction mechanism arranged at the bottom end of the storage chip body can effectively conduct and dissipate heat generated by the chip, the chip is prevented from being damaged due to overheating, and the service life of the chip is prolonged. The stable performance of the chip under long-time work can be maintained, and the service life of the SD card is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and more specifically, to an SD card storage chip packaging structure. Background Technology

[0002] SD card memory chips, as a new generation of memory devices based on semiconductor flash memory, are also known as secure digital cards. Chips play a crucial role in electronics by miniaturizing circuits and are typically manufactured on semiconductor wafers. Once the chip is made, it is encapsulated in a protective shell along with a substrate with conductive structures. This shell not only houses and secures the chip but also plays a vital role in sealing, protecting, and enhancing the chip's electrothermal performance.

[0003] For example, Chinese patent CN217214695U discloses a chip packaging structure with a heat sink on top of the chip and a thermally conductive interface material layer between the top of the heat sink and the back of the chip. This allows for timely heat transfer from the thermally conductive interface material layer to the heat sink, where heat exchange occurs with the external environment, achieving rapid heat dissipation. However, in this chip packaging structure, heat dissipation requires passing through the material layer and the heat sink, finally dissipating heat into the environment through the top and bottom edges of the heat sink. The molding compound filling the gaps between the heat sink, the thermally conductive interface material layer, and the chip hinders effective heat transfer, preventing efficient heat dissipation through the top and bottom edges of the heat sink, resulting in low heat dissipation efficiency.

[0004] No effective solutions have yet been proposed to address the problems in the relevant technologies. Utility Model Content

[0005] In view of the problems in the related technologies, this utility model proposes an SD card storage chip packaging structure to overcome the above-mentioned technical problems existing in the existing related technologies.

[0006] Therefore, the specific technical solution adopted by this utility model is as follows:

[0007] An SD card memory chip packaging structure includes a substrate, a memory chip enclosure disposed on the top of the substrate, and the substrate and the memory chip enclosure are an integral structure; a memory chip body is disposed on one side of the memory chip enclosure, a heat conduction mechanism is disposed at the bottom of the memory chip body, and an insulating component is disposed at the top of the memory chip body; an SD interface gold finger is disposed at one end of the top of the memory chip enclosure.

[0008] Furthermore, in order to install the heat-conducting mechanism and better dissipate the heat on the heat-conducting mechanism, several through holes provide a direct heat dissipation channel for the heat on the heat-conducting mechanism, which helps the heat to be quickly transferred to the outside of the substrate and reduce the operating temperature of the chip. One end of the substrate has a mounting cavity that cooperates with the heat-conducting mechanism. Several through holes are opened at the bottom of the mounting cavity. Channels are opened inside the substrate on both sides of the mounting cavity. The cross-section of the channel is L-shaped, and one end of the channel is connected to the inside of the mounting cavity.

[0009] Furthermore, in order to quickly absorb and conduct the heat generated by the memory chip and to transfer the heat away from the memory chip in a timely manner, several heat sinks are evenly arranged, which greatly increases the heat dissipation area and allows the heat to be dissipated into the surrounding environment more quickly, thereby reducing the operating temperature of the chip. The heat conduction mechanism includes a heat conduction plate set at the bottom of the memory chip body, and several heat sinks that penetrate the top of the mounting cavity are set at the bottom of the heat conduction plate. The heat sinks are evenly arranged, and several perforations are opened on the sidewalls of the heat sinks.

[0010] Furthermore, in order to protect the memory chip, the SD card memory chip can be provided with comprehensive and reliable insulation protection through the advantages of enhanced electrical isolation, improved voltage resistance, enhanced protection, and the provision of flexibility and design space. This ensures the stable operation and long-term reliability of the chip. The insulation component is arranged from top to bottom as a base insulation layer, a first isolation layer, a second isolation layer, and a protective insulation layer.

[0011] The beneficial effects of this utility model are as follows:

[0012] 1. The present invention has a reasonable and reliable structure. The integrated structure between the substrate and the memory chip enclosure improves the stability and reliability of the entire packaging structure. The heat conduction mechanism set at the bottom of the memory chip body can effectively conduct and dissipate the heat generated by the chip, prevent the chip from being damaged due to overheating, help maintain the stability of the chip under long-term operation, and extend the service life of the SD card.

[0013] 2. By setting up a substrate, the heat conduction mechanism can be installed and the heat on the heat conduction mechanism can be better dissipated. Several through holes provide a direct heat dissipation channel for the heat on the heat conduction mechanism, which helps the heat to be quickly transferred to the outside of the substrate and reduces the operating temperature of the chip.

[0014] 3. By setting up a heat conduction mechanism, the heat generated by the memory chip can be quickly absorbed and conducted, allowing the heat to be transferred away from the memory chip in a timely manner. Several heat sinks are evenly arranged, which greatly increases the heat dissipation area, allowing the heat to be dissipated into the surrounding environment more quickly and reducing the operating temperature of the chip.

[0015] 4. By setting up insulating components, the memory chip is protected. It provides comprehensive and reliable insulation protection for SD card memory chips through advantages such as enhanced electrical isolation, improved withstand voltage performance, enhanced protection, and provision of flexibility and design space, ensuring the stable operation and long-term reliability of the chip. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of an SD card storage chip packaging structure according to an embodiment of the present utility model;

[0018] Figure 2 This is a schematic diagram of the heat dissipation mechanism in an SD card storage chip packaging structure according to an embodiment of the present utility model;

[0019] Figure 3 This is a schematic diagram of the insulating component in an SD card storage chip packaging structure according to an embodiment of the present utility model.

[0020] In the picture:

[0021] 1. Substrate; 101. Mounting cavity; 102. Through hole; 103. Channel; 2. Memory chip enclosure; 3. Memory chip body; 4. Thermal conduction mechanism; 401. Heat conduction plate; 402. Heat sink; 403. Through hole; 5. Insulating components; 501. Basic insulating layer; 502. First isolation layer; 503. Second isolation layer; 504. Protective insulating layer; 6. SD interface gold fingers. Detailed Implementation

[0022] To further illustrate the various embodiments, the present invention provides accompanying drawings, which are part of the disclosure of the present invention. These drawings are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should be able to understand other possible implementation methods and the advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are usually used to represent similar components.

[0023] According to an embodiment of the present invention, an SD card storage chip packaging structure is provided.

[0024] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments, such as... Figure 1-3As shown, the SD card storage chip packaging structure according to an embodiment of the present utility model includes a substrate 1, a storage chip enclosure 2 is disposed at the top of the substrate 1, and the substrate 1 and the storage chip enclosure 2 are an integral structure; a storage chip body 3 is disposed on one side inside the storage chip enclosure 2, a heat conduction mechanism 4 is disposed at the bottom of the storage chip body 3, and an insulating component 5 is disposed at the top of the storage chip body 3; an SD interface gold finger 6 is disposed at one end of the top of the storage chip enclosure 2.

[0025] It should be noted that substrate 1 can be made of resin substrate, ceramic substrate or copper frame. SD interface gold fingers 6 are inserted and contacted with external host devices to achieve communication connection. The memory chip body 3 is used for data storage and retrieval, and provides storage space through the memory chip body 3. The memory chip body 3 has two memory chips. The two memory chips are of the same model and are connected in parallel, that is, the same pins of the two memory chips are connected together. The two memory chips are packaged in the memory chip enclosure 2 using a stacked process.

[0026] With the help of the above-mentioned technical solution of this utility model, the structure of this utility model is reasonable and reliable. The integrated structure between the substrate 1 and the memory chip enclosure 2 improves the stability and reliability of the entire packaging structure. The heat conduction mechanism 4 set at the bottom of the memory chip body 3 can effectively conduct and dissipate the heat generated by the chip, prevent the chip from being damaged due to overheating, help maintain the stability of the chip under long-term operation, and extend the service life of the SD card.

[0027] In one embodiment, for the substrate 1, a mounting cavity 101 that cooperates with the heat conduction mechanism 4 is formed at one end of the substrate 1. Several through holes 102 are formed at the bottom end of the mounting cavity 101. Channels 103 are formed inside the substrate 1 on both sides of the mounting cavity 101. The cross-section of the channel 103 is L-shaped, and one end of the channel 103 is connected to the inside of the mounting cavity 101, thereby realizing the installation of the heat conduction mechanism 4 and better dissipating the heat on the heat conduction mechanism 4. The several through holes 102 provide a direct heat dissipation channel for the heat on the heat conduction mechanism 4, which helps the heat to be quickly transferred to the outside of the substrate 1 and reduces the operating temperature of the chip.

[0028] In one embodiment, the heat conduction mechanism 4 includes a heat conduction plate 401 disposed at the bottom of the memory chip body 3. The bottom of the heat conduction plate 401 is provided with a plurality of heat dissipation plates 402 penetrating the top of the mounting cavity 101. The plurality of heat dissipation plates 402 are evenly arranged, and the sidewalls of the heat dissipation plates 402 are provided with a plurality of perforations 403, so as to quickly absorb and conduct the heat generated by the memory chip, and enable the heat to be transferred away from the memory chip in a timely manner. The even arrangement of the plurality of heat dissipation plates 402 greatly increases the heat dissipation area, so that the heat can be dissipated to the surrounding environment more quickly, and the operating temperature of the chip is reduced.

[0029] In one embodiment, the insulating component 5 is provided with a base insulating layer 501, a first isolation layer 502, a second isolation layer 503 and a protective insulating layer 504 in sequence from top to bottom, thereby protecting the memory chip. It provides comprehensive and reliable insulation protection for the SD card memory chip by enhancing electrical isolation, improving withstand voltage performance, enhancing protection, and providing flexibility and design space, thus ensuring the stable operation and long-term reliability of the chip.

[0030] Specifically, the base insulating layer 501 is the insulating layer closest to the chip surface, used to isolate circuit components and provide basic protection. It is typically made of materials such as silicon dioxide or silicon nitride.

[0031] The first isolation layer 502 is located above the basic insulating layer 501. It provides additional electrical isolation, enhances the chip's withstand voltage performance, and has some special physical or chemical properties to cope with specific operating environments, such as alumina and hafnium oxide.

[0032] The second isolation layer 503 is used to further enhance electrical isolation and withstand voltage performance. It may also have additional functions such as moisture protection and corrosion protection to protect the chip from damage by the external environment. It is usually made of composite materials with special properties to improve the overall performance of the insulating components.

[0033] The protective insulating layer 504 serves as the last line of defense for the insulating components, preventing the chip from being damaged by mechanical forces, chemical corrosion, or electrical interference. Materials with high strength, wear resistance, and corrosion resistance, such as certain polymers or ceramics, are typically chosen to ensure the safety and reliability of the chip during long-term use.

[0034] To facilitate understanding of the above-mentioned technical solutions of this utility model, the working principle or operation method of this utility model in actual process will be described in detail below.

[0035] In practical applications, the substrate 1 and the memory chip enclosure 2 adopt an integrated structural design, which ensures the stability and reliability of the entire packaging structure. The memory chip body 3 generates heat during operation. This heat is conducted and dissipated through the heat conduction mechanism 4 at the bottom. The heat conduction plate 401 quickly absorbs the heat generated by the chip and transfers the heat to the outside of the substrate 1 through the heat conduction plate 401 and the heat sink 402. The mounting cavity 101 and the through hole 102 provide mounting space and heat dissipation channel for the heat conduction mechanism 4. The L-shaped channel 103 enables air circulation inside the mounting cavity 101, ensuring the stability of heat dissipation. The insulating component 5 provides comprehensive electrical isolation and protection for the chip, preventing direct contact between the chip and the external environment and reducing the risk of electrical interference and short circuit.

[0036] In summary, with the help of the above-mentioned technical solution of this utility model, the structure of this utility model is reasonable and reliable. The integrated structure between the substrate 1 and the memory chip enclosure 2 improves the stability and reliability of the entire packaging structure. The heat conduction mechanism 4 provided at the bottom of the memory chip body 3 can effectively conduct and dissipate the heat generated by the chip, preventing the chip from being damaged due to overheating, helping to maintain the stability of the chip under long-term operation, and extending the service life of the SD card. By setting the substrate 1, the heat conduction mechanism 4 can be installed and the heat on the heat conduction mechanism 4 can be better dissipated. Several through holes 102 provide a direct heat dissipation channel for the heat on the heat conduction mechanism 4, which helps the heat to be quickly transferred to the outside of the substrate 1 and reduce the operating temperature of the chip. By setting the heat conduction mechanism 4, the heat generated by the memory chip can be quickly absorbed and conducted, and the heat can be transferred away from the memory chip in a timely manner. Several heat sinks 402 are evenly arranged, which greatly increases the heat dissipation area, allowing the heat to be dissipated to the surrounding environment more quickly and reducing the operating temperature of the chip. By setting up insulation component 5, the memory chip is protected. It provides comprehensive and reliable insulation protection for the SD card memory chip through advantages such as enhanced electrical isolation, improved withstand voltage performance, enhanced protection, and the provision of flexibility and design space, ensuring the stable operation and long-term reliability of the chip.

[0037] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0038] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An SD card memory chip package structure, characterized by, The application relates to a storage chip package structure, which comprises a substrate (1), the top end of the substrate (1) is provided with a storage chip package body (2), and the substrate (1) and the storage chip package body (2) are in an integrated structure; One side of the storage chip package body (2) is provided with a storage chip body (3), the bottom end of the storage chip body (3) is provided with a heat conduction mechanism (4), and the top end of the storage chip body (3) is provided with an insulation assembly (5); One end of the top end of the storage chip package body (2) is provided with an SD interface gold finger (6).

2. The SD card memory chip package structure of claim 1, wherein, The inside of the substrate (1) is provided with an installation cavity (101) matched with the heat conduction mechanism (4), the bottom end of the installation cavity (101) is provided with a plurality of through holes (102), and the inside of the substrate (1) and the two sides of the installation cavity (101) are provided with channels (103).

3. The SD card memory chip package structure of claim 2, wherein, The cross section of the channel (103) is in L-shaped structure, and one end of the channel (103) is communicated with the inside of the installation cavity (101).

4. The SD card memory chip package structure of claim 2, wherein, The heat conduction mechanism (4) comprises a heat conduction plate (401) arranged at the bottom end of the storage chip body (3), and the bottom end of the heat conduction plate (401) is provided with a plurality of heat dissipation plates (402) penetrating through the top end of the installation cavity (101).

5. The SD card memory chip package structure of claim 4, wherein, The plurality of heat dissipation plates (402) are arranged uniformly, and the side wall of the heat dissipation plate (402) is provided with a plurality of perforations (403).

6. The SD card memory chip package structure of claim 1, wherein, The insulation assembly (5) is sequentially provided with a basic insulation layer (501), a first isolation layer (502), a second isolation layer (503) and a protective insulation layer (504) from top to bottom.

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