TO263 lead frame
By setting reinforcing blocks and limiting grooves on the base island side of the lead frame, the problem of weak connection between the base island and the molding compound is solved, achieving higher connection strength and chip stability.
CN223665456UActive Publication Date: 2025-12-12NINGBO GANGBO ELECTRONICS CO LTD
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Patent Information
- Application Number
- CN202423272075.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Technical Problem
The connection between the base island and the molding compound in existing lead frames is not strong and stable, which makes the chip easy to fall off.
Method used
A reinforcing block is set on the side of the base island to form a reinforcing groove to increase the contact area and connection strength with the molding material, and the stability and structural strength of the connection are improved by limiting groove and bending groove.
Benefits of technology
The connection strength between the lead frame and the molding compound was enhanced, reducing the probability of chip detachment and improving the stability of chip use.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN223665456U_ABST
Abstract
The TO263 lead frame provided by the utility model comprises base islands, a connecting unit and a pin unit, the two base islands are connected through the connecting unit, and one end, far away from a connecting sheet, of each base island is connected with the pin unit; the side end of the base island is provided with a reinforcing block, the reinforcing block protrudes outwards parallel to the first direction, a reinforcing groove is formed between the reinforcing block and the end face of the side end of the base island, and the reinforcing groove is used for improving the connection strength of the base island and the chip. According to the TO263 lead frame provided by the invention, the reinforcing block is arranged at the side end of the base island, and the reinforcing block protrudes outwards along the first direction, so that the reinforcing groove is formed between the reinforcing block and the end surface of the side end of the base island, and the reinforcing groove can accommodate more plastic packaging materials, thereby increasing the contact area between the lead frame and the plastic packaging materials, and improving the reliability of the lead frame. And resistance in multiple directions can be provided, the connection strength between the plastic package material and the lead frame is improved, the probability that the lead frame falls off from the chip is reduced, and the use stability of the chip is improved.
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