BMC, BIC, BMS, battery pack and electric equipment

Abstract

According to the BMC, the BIC, the BMS, the battery pack and the electric equipment, optical communication modules can be arranged in the BMC and the BIC, so that data can be transmitted between the BMC and the BIC and between the BICs through optical communication, when data are transmitted between the BMC and the BIC and between the BICs through optical communication, more structures such as isolation modules and plugging modules do not need to be arranged in the corresponding BMC and the BIC to connect wire harnesses, and the cost is reduced. Therefore, the overall structural complexity and cost of the BMC, the BIC, the BMS and the electric equipment where the BMC, the BIC and the BMS are located are reduced.

Description

Technical Field

[0001] This application relates to the field of battery technology, and in particular to a battery management controller (BMC), a battery information collector (BIC), a battery management system (BMS), a battery pack, and electrical equipment. Background Technology

[0002] Battery packs are an important component of various electrical devices such as electric vehicles and electronic devices. A battery pack is equipped with a BMS and multiple battery cells. The BMS specifically includes a BMC and multiple BICs. The BICs are used to collect information such as the voltage and temperature of the battery cells and send it to the BMC, so that the BMC can perform corresponding operations on the battery cells based on the information collected by the BICs.

[0003] In existing technologies, to improve communication efficiency between the BMC and BIC, some battery packs employ daisy-chain communication, where multiple BICs are cascaded sequentially, and the BMC communicates with both the first and last BICs. Furthermore, wiring harnesses are only used between adjacent BICs, ensuring that information collected by each BIC from the battery cells must pass through the BICs connected to it before being sent to the BMC.

[0004] Using existing technology, when the number of BICs in the BMS of a battery pack is large, a large number of wiring harnesses need to be set between the BMC and multiple BICs, thus increasing the structural complexity and cost of the BMS and the battery pack it contains. Utility Model Content

[0005] This application provides a BMC, BIC, BMS, battery pack, and electrical equipment to reduce the structural complexity and cost of the BMS and the battery pack it is located in.

[0006] The first aspect of this application provides a BMC applied in a battery management system (BMS) using daisy-chain cascaded communication, comprising: a control module, a bridging module, and at least one first optical communication module; the control module is connected to the first optical communication module through the bridging module for transmitting data with a BIC supporting optical communication in the daisy-chain cascaded communication.

[0007] A second aspect of this application provides a BIC (Brain IC) applied in a battery management system (BMS) using daisy-chain cascaded communication, comprising: a sampling module and at least one second optical communication module; the sampling module is connected to the second optical communication module and is used to transmit data with a first target device supporting optical communication in the daisy-chain cascaded communication, the first target device including a BMC (Battery Management System) or an adjacently arranged BIC.

[0008] A third aspect of this application provides a BMS including a BMC as provided in the first aspect of this application, and a plurality of BICs as described in the second aspect of this application, wherein the BMC and the plurality of BICs are daisy-chained and cascaded for communication.

[0009] A fourth aspect of this application provides a battery pack including a plurality of battery cells and a BMS as provided in a third aspect of this application, the BMS being used to control the plurality of battery cells.

[0010] The fifth aspect of this application provides an electrical device, including a battery pack as described in the fourth aspect of this application.

[0011] In summary, the BMC, BIC, BMS, battery pack, and electrical equipment provided in this application include optical communication modules in the BMC and BIC, enabling data transmission between BMC and BIC, and between BIC and BIC. When data is transmitted between BMC and BIC, and between BIC and BIC, there is no need to install additional isolation modules and plug-in modules within the BMC and BIC to connect wiring harnesses, thereby reducing the overall structural complexity and cost of the BMC, BIC, BMS, and the electrical equipment they are located in. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of a BMS structure;

[0014] Figure 2 This is a schematic diagram of the structure of a BMC and a BIC;

[0015] Figure 3 A schematic diagram of a BMC embodiment provided in this application;

[0016] Figure 4 A schematic diagram of another embodiment of the BMC provided in this application;

[0017] Figure 5 A schematic diagram of a BIC embodiment provided in this application;

[0018] Figure 6 A schematic diagram of another embodiment of the BIC provided in this application;

[0019] Figure 7 This application provides a schematic diagram of the structure of an optical communication module;

[0020] Figure 8 A schematic diagram of the structure in this application showing the connection between BICs via a wire harness;

[0021] Figure 9 This is a schematic diagram of the structure of an embodiment of the battery pack provided in this application. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0024] Figure 1 This is a schematic diagram of a BMS structure, such as... Figure 1 As shown, this application is used in battery packs 1 of electrical equipment such as new energy vehicles and energy storage systems. Specifically, battery pack 1 includes a BMS 10 and multiple battery cells 11. Figure 1 The BMS10 shown specifically includes a BMC101 and multiple BIC102s. The BIC102 is used to collect information such as the voltage and temperature of the battery cell and send it to the BMC101. The BMC101 can be used to perform corresponding analysis, control and management operations on the battery cell based on the information of the battery cell.

[0025] In the specific implementation, BMC101 and multiple BIC102 communicate in a daisy-chain manner. For example, Figure 1 Taking n BIC102s as an example, denoted as BIC102-1, BIC102-2, BIC102-3, BIC102-4, BIC102-5...BIC102-n, the n BIC102s are cascaded for communication. BMC101 can communicate with the first BIC102-1 and the last BIC-n. This cascading communication method is called daisy-chain cascading communication. For example, when BMC101 sends data to BIC102-3, BMC101 first sends the data to BIC102-1, which then sends it to BIC102-2, which in turn sends it to BIC102-3, and so on. In daisy-chain cascading communication, each device can transmit data with other devices through cascading communication.

[0026] In order to achieve such Figure 1 The daisy-chain cascaded communication shown requires that every two adjacent devices in BMC101 and multiple BIC102 are connected by a wiring harness, allowing the transmission of communication data in the form of electrical signals between adjacent devices. For example, BMC101 is connected to BIC102-1 by a wiring harness, BMC101 is connected to BIC102-n by a wiring harness, and BIC102-1, BIC102-2, BIC102-3, BIC102-4, BIC102-5...BIC102-n are connected sequentially by wiring harnesses.

[0027] Figure 2 A schematic diagram of the structure of a BMC and a BIC, as shown below. Figure 2 China and Israel Figure 1 Taking BMC101 and BIC102-1 as examples, to achieve wiring harness connections between adjacent devices in daisy-chain cascading communication, BMC101 is equipped with a first isolation module 1013 and a first plug-in module 1014, while BIC102-1 is equipped with a second isolation module 1022-1 and a second plug-in module 1023-1. When the first plug-in module 1014 and the second plug-in module 1023-1 are connected via wiring harnesses, the control module 1011 of BMC101 can transmit data with the sampling module 1021 in BIC102-1.

[0028] For example, when the control module 1011 of BMC101 sends data to the sampling module 1021 in BIC102-1, the data format is converted by the bridging module 1012, and then the electrical signal is voltage-converted by the first isolation module 1013 before being sent to the wiring harness through the first plug-in module 1014. After the second plug-in module 1023-1 receives the electrical signal from the wiring harness, the second isolation module 1022-1 performs voltage conversion, and finally sends the data in electrical signal form to the sampling module 1021.

[0029] Combination Figure 1 and Figure 2 For example, BMC101 and multiple BIC102 in BMS10 can achieve daisy-chain cascading communication. However, when there are many BIC102 in BMS10, wiring harnesses need to be set between BMC101 and multiple BIC102. Furthermore, isolation modules and plug-in modules need to be set in BMC101 and each BIC102 to transmit data. This increases the structural complexity of BMC101, BIC102, BMS10 and its battery pack 1, thereby increasing the cost required to implement the above devices and seriously affecting the user experience of the electrical equipment in which battery pack 1 is located.

[0030] Based on this, this application provides a BMC, BIC, BMS, battery pack, and electrical equipment to reduce the structural complexity of BMC101, BIC102, BMS10, and their respective battery packs 1 when BMC101 and multiple BIC102 in BMS10 implement daisy-chain cascading communication, thereby reducing costs and improving the user experience of the electrical equipment in which the battery pack 1 is located. The technical solution of this application will be described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0031] Figure 3 A schematic diagram of a BMC embodiment provided in this application is shown below. Figure 3 The BMC101 shown can be applied to Figure 1 In the scenario shown, specifically, such as Figure 3 The BMC101 shown includes a control module 1011, a bridging module 1012, and at least one first optical communication module 1015. Figure 3 In the example shown, BMC101 includes two first optical communication modules 1015, which are referred to as first optical communication module 1015-1 and first optical communication module 1015-2 respectively.

[0032] Control module 1011 is connected to first optical communication module 1015-1 via bridging module 1012, and control module 1011 is also connected to first optical communication module 1015-2 via bridging module 1012. Combined with... Figure 1 The structure of BMS10 shown allows the control module 1011 to transmit data via optical communication with BIC102-1 through bridging module 1012, first optical communication module 1015-1, and BIC102-1. In this case, BIC102-1 also supports optical communication. The control module 1011 can also transmit data via optical communication with BIC102-n through bridging module 1012, first optical communication module 1015-2, and BIC102-n. In this case, BIC102-n also supports optical communication.

[0033] In one embodiment, the control module 1011 may be a microcontroller unit (MCU) or other controller in the BMS10, and the bridging module 1012 may be a communication bridging chip, which can be used to convert the electrical signals supported by the control module 1011 to the electrical signals supported by the first optical communication module.

[0034] Figure 4 This is a structural schematic diagram of another embodiment of the BMC provided in this application. Figure 4 In the example shown, BMC101 includes a first optical communication module 1015 as an example. BMC101 also includes a first isolation module 1013 and a first plug-in module 1014. The control module 1011 can be connected to the first plug-in module 1014 through the bridging module 1012 and the first isolation module 1013.

[0035] Combination Figure 1 The structure of BMS10 shown is such that, assuming the control module 1011 can transmit data with BIC102-1 via optical communication through the bridging module 1012 and the first optical communication module 1015-1, the control module 1011 can be connected to BIC102-n via a wiring harness through the bridging module 1012, the first isolation module 1013, and the first plug-in module 1014, and transmit data through the wiring harness.

[0036] In summary, the BMC101 provided in this application embodiment can transmit data with at least one BIC102 via optical communication through at least one first optical communication module 1015, so that the BMC101 does not need to be equipped with structures such as the first isolation module 1013 and the first plug-in module 1014, reducing the data loss problem caused by the failure of plug-in between modules. In addition, there is no need to set up a wiring harness to connect the BMC101 and the BIC102, thereby reducing the structural complexity and cost of the BMC101 and the BMS10 it is located in.

[0037] Figure 5 A schematic diagram of a BIC embodiment provided in this application is shown below. Figure 5 The BIC102 shown can be applied to Figure 1 In the scenario shown, specifically, such as Figure 5 The BIC102 shown includes a sampling module 1021 and at least one second optical communication module 1024. Figure 5 In the example shown, BIC102 includes two second optical communication modules 1024, which are referred to as second optical communication module 1024-1 and second optical communication module 1024-2 respectively.

[0038] The sampling module 1021 is connected to the second optical communication module 1024-1 and the second optical communication module 1024-2, respectively. Figure 1 The structure of BMS10 shown allows the sampling module 1021 to transmit data with its adjacent first target device via optical communication through the second optical communication module 1024-1. The sampling module 1021 can also transmit data with its adjacent second target device via optical communication through the second optical communication module 1024-2. The adjacent first target device includes a BMC or BIC, and in this case, the first target device also supports optical communication. For example, using... Figure 1 Taking BIC102-1 as an example, the sampling module 1021 of BIC102-1 can transmit data with BMC101 through optical communication via the second optical communication module 1024-1, and can also transmit data with the adjacent BIC102-2 through the second optical communication module 1024-2.

[0039] Figure 6 This is a schematic diagram of another embodiment of the BIC provided in this application. Figure 6 In the example shown, BIC102 includes a second optical communication module 1024 as an example. BIC102 also includes a second plug-in module 1023 and a second isolation module 1022. Sampling module 1021 can be connected to second plug-in module 1023 through second isolation module 1022. Sampling module 1021 can be connected to second target device through second isolation module 1022 and second plug-in module 1023 via wire harness and transmit data through wire harness. Second target device includes BMC or adjacent BIC.

[0040] Combination Figure 1 The structure of BIC10 shown is as follows: Figure 1Taking BIC102-1 as an example, the sampling module 1021 of BIC102-1 can transmit data with BMC101 through optical communication via the second optical communication module 1024-1, that is, the first target device is BMC101; the sampling module 1021 can also be connected to BIC102-2 through the second isolation module 1022 and the second plug-in module 1023 via a wire harness, and transmit data through the wire harness, that is, the second target device is BIC102-2.

[0041] In summary, the BIC102 provided in this application embodiment can transmit data with the first target device via optical communication through at least one second optical communication module 1024, so that the BIC102 does not need to be equipped with more second isolation modules 1022 and second plug-in modules 1023, etc., reducing the data loss problem caused by plug-in failure between modules. In addition, there is no need to set up a wiring harness to connect the BIC102 and the first target device, thereby reducing the structural complexity and cost of the BIC102 and its BMS10.

[0042] More specifically, Figure 7 A schematic diagram of the structure of an optical communication module provided in this application is shown below. Figure 7 The optical communication module shown can be applied to Figures 3-6 In any of the devices.

[0043] In one embodiment, the optical signal received or transmitted by the optical communication module provided in this application is specifically infrared light. This application does not limit the specific communication principle or implementation method of optical communication.

[0044] For example, such as Figure 3 or Figure 4 The first optical communication module 1015 in the BMC101 shown specifically includes an electrical signal to optical signal conversion unit 10151 and an optical signal to electrical signal conversion unit 10152. The electrical signal to optical signal conversion unit 10151 converts the first electrical signal provided by the control module 1011 after conversion by the bridging module 1012 into a first optical signal, and sends the first optical signal to the BIC102 supporting optical communication. The optical signal to electrical signal conversion unit 10152 receives the second optical signal sent by the BIC102 supporting optical communication, converts the second optical signal into a second electrical signal, and sends it to the control module 1011 through the bridging module 1012.

[0045] For example, such as Figure 5 or Figure 6The second optical communication module 1024 in the illustrated BIC102 specifically includes an electrical signal / optical signal conversion unit 10151 and an optical signal / electrical signal conversion unit 10152. The electrical signal / optical signal conversion unit 10151 converts the third electrical signal provided by the sampling module 1021 into a third optical signal and transmits the third optical signal to the first target device supporting optical communication. The optical signal / electrical signal conversion unit 10152 receives a fourth optical signal transmitted by the first target device supporting optical communication, converts the fourth optical signal into a fourth electrical signal, and then transmits the fourth electrical signal to the sampling module 1021.

[0046] Specifically, such as Figure 7 As shown, the electrical signal / optical signal conversion unit 10151 specifically includes: a first voltage divider resistor R1, a second voltage divider resistor, a switching transistor K, an LED D1, and a current-limiting resistor R3. The second terminal of the first voltage divider resistor R1 is connected to the first terminal of the second voltage divider resistor R2 and the control terminal of the switching transistor K. The first terminal of the switching transistor K is connected to the power supply via the LED D1 and the current-limiting resistor R3. The second terminal of the switching transistor K and the second terminal of the second voltage divider resistor R2 are grounded.

[0047] When the electrical signal / optical signal conversion unit 10151 is applied Figure 3 or Figure 4 In the BMC101 shown, the first end of the first voltage divider resistor R1 is connected to the bridge module 1012. The control module 1011 provides the first electrical signal provided by the bridge module 1012 through the voltage division of the first voltage divider resistor R1 and the second voltage divider resistor R2, and provides the conduction voltage to the control terminal of the switch transistor K. After the switch transistor K is turned on, the power supply provides the current flowing through the light emitter D1 through the current limiting resistor R3, so that the light emitter D1 emits light and thus forms the first light signal.

[0048] When the electrical signal / optical signal conversion unit 10151 is applied Figure 5 or Figure 6 In the BIC102 shown, the first end of the first voltage divider resistor R1 is connected to the sampling module 1021. In one embodiment, the first end of the first voltage divider resistor R is specifically connected to the TX pin of the sampling module 1021. The third electrical signal provided by the sampling module 1021 is divided by the first voltage divider resistor R1 and the second voltage divider resistor R2, providing a conduction voltage to the control terminal of the switching transistor K. After the switching transistor K is turned on, the power supply provides current flowing through the light emitter D1 through the current limiting resistor R3, causing the light emitter D1 to emit light, thereby forming the third optical signal.

[0049] The optical signal to electrical signal conversion unit 1052 specifically includes: a photosensitive sensor D2, an operational amplifier OP, and a feedback resistor R4. The first terminal of the photosensitive sensor D2 is grounded, the second terminal of the photosensitive sensor D2 is connected to the first input terminal - of the operational amplifier OP and the first terminal of the feedback resistor R4, the second input terminal + of the operational amplifier OP is grounded, and the output terminal of the operational amplifier OP is connected to the second terminal of the feedback resistor R4.

[0050] When the optical signal / electrical signal conversion unit 1052 is applied Figure 3 or Figure 4 In the BMC101 shown, the output terminal of the operational amplifier OP is connected to the bridge module 1012. When the photosensitive sensor D2 receives the second light signal, it provides a first intermediate electrical signal to the first input terminal of the operational amplifier OP, so that the output terminal of the operational amplifier OP outputs the second electrical signal to the bridge module 1012.

[0051] When the electrical signal / optical signal conversion unit 10151 is applied Figure 5 or Figure 6 In the BIC102 shown, the output of the operational amplifier OP is connected to the sampling module 1021. In one embodiment, the output of the operational amplifier OP is specifically connected to the RX pin of the sampling module 1021. When the photosensor D2 receives the fourth optical signal, it provides a second intermediate electrical signal to the first input of the operational amplifier OP, causing the output of the operational amplifier OP to output the fourth electrical signal to the sampling module 1021.

[0052] It should be noted that, Figure 7 This document only illustrates one possible circuit implementation of the optical communication module. In specific applications, components in the optical communication module can be added or removed as needed, such as reducing the current-limiting resistor, which is also within the scope of protection of this application. The optical communication module provided in this application has a relatively simple structure and a relatively direct implementation logic, which is more conducive to reducing the size and cost of the optical communication module, and thus facilitates the use and promotion of this application.

[0053] Figure 8 A schematic diagram of the structure connecting BICs via wire harnesses provided in this application is shown below. Figure 8 As shown, taking BIC102-A and BIC102-B as examples, the second plug-in module 1023-2 of BIC102-A and the second plug-in module 1023-1 of BIC102-B are connected by a wiring harness 103. The second isolation module 1022-2 of BIC102-A is specifically connected to the IM pin and IP pin of the sampling module 1021 of BIC102-A, and the second isolation module 1022-1 of BIC102-B is specifically connected to the IM pin and IP pin of the sampling module 1021 of BIC102-B.

[0054] Because differential signals are transmitted through harness 103, data transmission via harness has strong anti-interference capabilities, making it suitable for long-distance cascaded communication. Therefore, in one embodiment, when BMC101 and multiple BIC102 in BMS10 use daisy-chain cascaded communication, if the distance between two adjacent third target devices is less than a preset value, the two third target devices transmit data via optical communication. In this case, an optical communication module needs to be set between the two adjacent third target devices to support optical communication. However, if the distance between two adjacent fourth target devices is greater than or equal to the preset value, the two fourth target devices are connected via harness and transmit data via the harness.

[0055] In one embodiment, the preset value ranges from 50mm to 200mm, and can be determined based on the communication capability of the optical communication module. Preferably, the preset value can be 50mm.

[0056] For example, in Figure 1 In the BMS10 shown, when the distance between BMC101 and the adjacent BIC102-1 and BIC102-n is less than a preset value, then BMC101 can be... Figure 3 The structure shown allows BMC101 to transmit data with its adjacent BIC102-1 and BIC102-n via optical communication. When the distance between BMC101 and its adjacent BIC102-1 is less than a preset value, and the distance between BMC101 and its adjacent BIC102-n is greater than a preset value, then BMC101 can... Figure 4 The structure shown enables BMC101 to transmit data with the adjacent BIC102-1 via optical communication, and to transmit data with the adjacent BIC102-n via a wire harness.

[0057] For example, in Figure 1 In the BMS10 shown, when the distance between BIC102-1 and the adjacent BMC101 and BIC102-2 is less than a preset value, then BIC102-1 can be... Figure 5 The structure shown allows BIC102-1 to transmit data with its adjacent BMC101 and BIC102-2 via optical communication. When the distance between BIC102-1 and its adjacent BMC101 is less than a preset value, and the distance between BIC102-1 and its adjacent BIC102-2 is greater than a preset value, then BIC102-1 can be used for optical communication. Figure 6 The structure shown enables BIC102-1 to transmit data with the adjacent BMC101 via optical communication, and to transmit data with the adjacent BIC102-2 via a wire harness.

[0058] In summary, in the BMS10 provided in this embodiment, the BMC101 and multiple BIC102 do not require additional isolation modules and plug-in modules to connect the wiring harness, reducing data loss caused by plug-in failures between modules. Furthermore, when adjacent devices in the BMC101 and multiple BIC102 transmit data via optical communication, no wiring harness is required for connection. This reduces the overall structural complexity and cost of the BMS10 and the associated electrical equipment 10, thereby improving the user experience of the electrical equipment 10.

[0059] Meanwhile, the BMS10 provided in this embodiment can more flexibly determine the data transmission method between adjacent devices according to the interval range. While reducing the overall structural complexity and cost of BMS10, it also ensures the communication quality of BMC101 and multiple BIC102 in daisy-chain cascading communication, further ensuring the stability of BMS10 and its associated electrical equipment 10.

[0060] Figure 9 This is a schematic diagram of the structure of an embodiment of the battery pack provided in this application, as shown below. Figure 9 The battery pack 1 shown includes a BMS 10 and multiple battery cells 11. Specifically, the battery pack 1 can be a battery pack using blade batteries. The multiple battery cells in the battery pack 1 are arranged horizontally in sequence as shown in the figure. The two sides in the vertical direction of the figure represent the electrode directions of the battery cells 11. n BICs 102 are located on both sides of the electrode directions of the multiple battery cells 11, specifically on the upper and lower sides in the vertical direction of the figure. For example, [the following is an example of a battery pack 10]. Figure 9 The lower side in the vertical direction is designated as the first side. A portion of BIC102 are located on the first side in the electrode direction of cell 11, including BIC102-1, BIC102-2, and BIC102-3. Figure 9 The upper side in the vertical direction is referred to as the second side. Then, another part of BIC102 is located on the second side in the pole direction of cell 11, including BIC102-4, BIC102-5 and BIC102-n.

[0061] Specifically, BIC102 located on the same side of the battery cell 11 in the battery pack 1 transmit data via optical communication, while BIC102 located on different sides of multiple battery cells are connected via wire harnesses and transmit data via wire harnesses. Furthermore, BMC101 is connected via wire harnesses to the first BIC102-1 and the last BIC102-n located adjacent to each other among the multiple BIC102 and transmits data via wire harnesses.

[0062] Since BIC102 is soldered to the terminals and busbars of cell 11 using nickel sheets, and the cells 11 are of uniform thickness and neatly arranged, the BIC102s on the same side are installed at the same level and close to each other. Therefore, optical communication modules are installed between adjacent BIC102s on the same side of cell 11 to support optical communication, enabling data transmission between adjacent BIC102s. For example, BIC102-1 and BIC102-2, BIC102-2 and BIC102-3, BIC102-4 and BIC102-5, and BIC102-5 and BIC102-n transmit data via optical communication.

[0063] Since the BIC102 located on different sides of the battery cell 11 are far apart, there may be significant interference if optical communication is used to transmit data. Therefore, the BIC102 on different sides are connected by a wire harness and data is transmitted through the wire harness. For example, BIC102-4 and BIC102-3 are connected by a wire harness and data is transmitted through the wire harness.

[0064] Since BMC101 is installed in the distribution box, it is usually placed in front of multiple cells 11 in the battery pack 1. The distance between BMC101 and its adjacent first BIC102-1 and last BIC102-n is relatively far. Therefore, BMC101 is connected to the first BIC102-1 and the last BIC102-n through a wire harness and data is transmitted through the wire harness.

[0065] In summary, in the battery pack 1 provided in this embodiment, according to the specific arrangement of BMC101 and multiple BIC102, BIC102 located on the same side of the battery cell 11 transmit data through optical communication, while BIC102 located on different sides of multiple battery cells are connected through wire harnesses and transmit data through wire harnesses. Therefore, the structural complexity and cost of battery pack 1 are reduced to a certain extent, while ensuring the communication quality of BMC101 and multiple BIC102, and improving the overall stability of battery pack 1.

[0066] This application also provides an electrical appliance, including, for example... Figure 9 The battery pack 1 shown can be a new energy vehicle or an energy storage system, etc.

[0067] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A battery management controller (BMC) applied in a battery management system (BMS) (10) using daisy-chain cascaded communication, characterized in that, include: The control module (1011), the bridging module (1012), and at least one first optical communication module (1015). The control module (1011) is connected to the first optical communication module (1015) through the bridging module (1012) for transmitting data with the battery information collector BIC (102) that supports optical communication in the daisy chain cascaded communication.

2. The BMC according to claim 1, characterized in that, The BMC (101) also includes: First isolation module (1013) and first plug-in module (1014); The control module (1011) is connected to the first plug-in module (1014) through the bridging module (1012) and the first isolation module (1013) for transmitting data with the BIC (102) connected by a wire harness in the daisy-chain cascade communication.

3. The BMC according to claim 1 or 2, characterized in that, The first optical communication module (1015) includes: An electrical signal to optical signal conversion unit is used to convert the first electrical signal provided by the control module (1011) through the bridging module (1012) into a first optical signal and send the first optical signal; An optical signal to electrical signal conversion unit is used to receive a second optical signal and convert the second optical signal into a second electrical signal, which is then sent to the control module (1011) through the bridging module (1012).

4. The BMC according to claim 3, characterized in that, The electrical signal to optical signal conversion unit includes: First voltage divider resistor, second voltage divider resistor, switching transistor, LED and current limiting resistor; Wherein, the first end of the first voltage divider resistor is connected to the bridge module (1012), the second end of the first voltage divider resistor is connected to the first end of the second voltage divider resistor and the control terminal of the switching transistor, the first end of the switching transistor is connected to the power supply through the light emitter and the current limiting resistor in sequence, and the second end of the switching transistor and the second end of the second voltage divider resistor are grounded.

5. The BMC according to claim 3, characterized in that, The optical signal to electrical signal conversion unit includes: Photosensitive sensor, operational amplifier, and feedback resistor; One end of the photosensor is grounded, and the other end is connected to the first input terminal of the operational amplifier and the first terminal of the feedback resistor. The second input terminal of the operational amplifier is grounded, and the output terminal of the operational amplifier is connected to the second terminal of the feedback resistor.

6. A battery information acquisition unit (BIC) is used in a battery management system (BMS) (10) using daisy-chain cascaded communication, characterized in that, include: The sampling module (1021) and at least one second optical communication module (1024). The sampling module (1021) is connected to the second optical communication module (1024) and is used to transmit data with the first target device that supports optical communication in the daisy-chain cascaded communication. The first target device includes a BMC (101) or an adjacent BIC (102).

7. The BIC according to claim 6, characterized in that, Also includes: Second isolation module (1022) and second plug-in module (1023); The sampling module (1021) is connected to the second plug-in module (1023) through the second isolation module (1022) for transmitting data with the second target device connected by a wire harness in the daisy-chain cascaded communication. The second target device includes a BMC (101) or an adjacent BIC (102).

8. The BIC according to claim 6 or 7, characterized in that, The second optical communication module (1024) includes: An electrical signal to optical signal conversion unit is used to convert the third electrical signal provided by the sampling module (1021) into a third optical signal and send the third optical signal; An optical signal to electrical signal conversion unit is used to receive a fourth optical signal and convert the fourth optical signal into a fourth electrical signal and send it to the sampling module (1021).

9. The BIC according to claim 8, characterized in that, The electrical signal to optical signal conversion unit includes: First voltage divider resistor, second voltage divider resistor, switching transistor, LED and current limiting resistor; Wherein, the first end of the first voltage divider resistor is connected to the sampling module (1021), the second end of the first voltage divider resistor is connected to the first end of the second voltage divider resistor and the control terminal of the switching transistor, the first end of the switching transistor is connected to the power supply through the light emitter and the current limiting resistor in sequence, and the second end of the switching transistor and the second end of the second voltage divider resistor are grounded.

10. The BIC according to claim 8, characterized in that, The optical signal to electrical signal conversion unit includes: Photosensitive sensor, operational amplifier, feedback resistor; The first terminal of the photosensor is grounded, the second terminal is connected to the first input terminal of the operational amplifier and the first terminal of the feedback resistor, the second input terminal of the operational amplifier is grounded, and the output terminal of the operational amplifier is connected to the second terminal of the feedback resistor.

11. A BMS, characterized in that, include: The BMC (101) as described in any one of claims 1-5, and the plurality of BICs (102) as described in any one of claims 6-10, wherein the BMC (101) and the plurality of BICs (102) use daisy-chain cascading communication.

12. The BMS according to claim 11, characterized in that, In the daisy-chain cascaded communication between the BMC (101) and the plurality of BICs (102), when the distance between two adjacent third target devices is less than a preset value, the two third target devices transmit data through the optical communication module.

13. The BMS according to claim 11, characterized in that, In the daisy-chain cascaded communication between the BMC (101) and the plurality of BICs (102), when the distance between two adjacent fourth target devices is greater than or equal to the preset value, the two fourth target devices are connected by a wire harness and transmit data.

14. The BMS according to claim 12 or 13, characterized in that, The preset value ranges from 50mm to 200mm.

15. A battery pack, characterized in that, include: Multiple battery cells (11); The BMS (10) as described in any one of claims 11-14, wherein the BMS (10) is used to control the plurality of battery cells (11).

16. The battery pack according to claim 15, characterized in that, The plurality of battery cells are arranged in sequence. Among the plurality of BICs (102) of the BMS (10), a portion of the BICs (102) are disposed on the first side of one terminal of the plurality of battery cells (11), and another portion of the BICs (102) are disposed on the second side of another terminal of the plurality of battery cells (11).

17. The battery pack according to claim 16, characterized in that, Data is transmitted via optical communication between BICs (102) located on the same side of the plurality of battery cells (11).

18. The battery pack according to claim 16, characterized in that, Data is transmitted between BICs (102) located on different sides of the plurality of cells (11) via wire harnesses.

19. The battery pack according to claim 16, characterized in that, The BMC (101) in the BMS (10) is connected to the adjacent BIC (102) in the plurality of BICs (102) via a wire harness and transmits data.

20. An electrical appliance, characterized in that, include: The battery pack (1) as described in any one of claims 15-19.

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