Inverter

Abstract

The inverter comprises a box body and a heat conduction bottom plate arranged in the box body, and the upper end and the lower end of the heat conduction bottom plate are connected in the box body through a first bottom plate and a second bottom plate respectively; the heat conduction bottom plate is provided with power semiconductor components which are arranged side by side along the width direction, the upper ends of the plurality of power semiconductor components are connected with an alternating current wiring strip, the lower ends of the plurality of power semiconductor components are connected with a capacitor module, and the capacitor module is connected with a direct current wiring strip; and one side of the heat conduction bottom plate, which is deviated from the power semiconductor assembly, is provided with radiating fins which are arranged at equal intervals. The LED lamp has the advantages of being reasonable in structural design, high in heat dissipation efficiency, beneficial to prolonging the service life and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to inverter technical field, especially an inverter. BACKGROUND

[0002] The frequency converter is a kind of electric energy control equipment, it changes the frequency and voltage of input power supply to control the speed and torque of motor, converts fixed frequency alternating current into variable frequency alternating current, to realize the flexible control to the running state of alternating current motor.In which, inverter is the internal core part of frequency converter, and the main function is to convert DC into AC.It is converted into high-frequency pulse signal by high-frequency switching device and control circuit, and high-frequency pulse signal is converted into pure sine AC by output filter unit.Inverter circuit plays the role of bridge between DC power supply and AC load.Inverter will generate a large amount of heat under the condition of long time high-power operation, and overheating will cause inverter to work unstably, even damage, therefore, how to make inverter high-efficiency cooling becomes a problem to be solved. SUMMARY

[0003] In view of the above technical problems of prior art, the utility model wants to solve the technical problem of how to provide an inverter with reasonable structure design, high heat dissipation efficiency and long service life.

[0004] In order to solve the above technical problems, the utility model adopts the following technical scheme:

[0005] An inverter, comprising a box body and a heat-conducting bottom plate arranged in the box body, the upper and lower ends of the heat-conducting bottom plate are connected in the box body through a first bottom plate and a second bottom plate respectively, the heat-conducting bottom plate is provided with power semiconductor assemblies arranged side by side along the width direction, the upper end of each power semiconductor assembly is connected with an AC wiring bar, the lower end of each power semiconductor assembly is connected with a capacitor module, and the capacitor module is connected with a DC wiring bar; the side of the heat-conducting bottom plate away from the power semiconductor assemblies is provided with heat dissipation fins arranged at equal intervals.

[0006] The above structure is adopted, the power semiconductor assemblies with large heat generation are installed on the heat-conducting bottom plate, and heat dissipation fins are arranged on the back of the heat-conducting bottom plate, so as to increase the heat dissipation area of the heat-conducting bottom plate, to facilitate efficient heat dissipation of the power semiconductor assemblies, prolong the service life of the power semiconductor assemblies, and ensure the reliable operation of the inverter.

[0007] Further, the upper and lower ends of the box body are provided with ventilation openings, each ventilation opening is provided with a heat dissipation fan facing the heat dissipation fins, and a heat dissipation air duct penetrating vertically is formed between adjacent two heat dissipation fins.

[0008] In this way, the heat between the heat dissipation fins is taken out of the box by the airflow of the heat dissipation fan, so that the heat dissipation fins can be quickly cooled, and the power semiconductor assembly can be cooled.

[0009] Further, the capacitor module includes single capacitors arranged on the second bottom plate, and the single capacitors are arranged on the second bottom plate in a transverse and longitudinal distribution, and a heat dissipation channel is formed between adjacent two single capacitors.

[0010] In this way, the airflow of the heat dissipation fan flows through the heat dissipation channel between the single capacitors, and the single capacitors can also be cooled at the same time.

[0011] Further, the heat dissipation fan is a axial flow fan arranged on the vent at the upper end of the box.

[0012] Further, the vent at the upper end of the box is provided with a support plate, the support plate has a mounting hole arranged therethrough, at least two mounting holes are arranged on the support plate in the length direction of the support plate, and the heat dissipation fan is mounted on the mounting hole.

[0013] Further, the two sides of the support plate in the width direction are bent upwards to form reinforcing plates, and the reinforcing plates close to the heat conduction bottom plate are bent outwards to form first connecting plates, and the first connecting plates are connected to the upper end of the heat conduction bottom plate by bolts.

[0014] In this way, by bending the reinforcing plates, the overall rigidity of the support plate can be increased, the plate body vibration during operation of the heat dissipation fan can be avoided, and noise reduction is beneficial.

[0015] Further, the two sides of the support plate in the length direction are bent downwards to form second connecting plates, the second connecting plates have fixing holes arranged therethrough, and the second connecting plates are connected to the side wall of the box by bolts passing through the fixing holes.

[0016] In this way, the connection strength between the support plate and the box can be increased.

[0017] Further, the capacitor module includes a positive electrode wiring plate and a negative electrode wiring plate arranged parallel to the second bottom plate, and the second bottom plate, the positive electrode wiring plate and the negative electrode wiring plate are insulatively arranged at intervals; two pins of the single capacitor pass through the second bottom plate and are respectively connected to the positive electrode wiring plate and the negative electrode wiring plate by welding; and the positive electrode wiring plate and the negative electrode wiring plate are respectively electrically connected to the power semiconductor assembly.

[0018] Further, the upper end of the positive connection plate is provided with positive terminals corresponding to the power semiconductor assemblies, and the upper end of the negative connection plate is provided with negative terminals corresponding to the power semiconductor assemblies, and the positive terminals and the negative terminals are connected to the corresponding power semiconductor assemblies respectively.

[0019] Further, the single capacitors are arranged in at least two rows in the vertical direction, and bus connection plates are arranged in series between adjacent two rows of the single capacitors, and the bus connection plates are arranged in the second bottom plate in the side facing the positive connection plate and the negative connection plate; the side of the positive connection plate and the negative connection plate facing downward is provided with connection holes arranged uniformly along the edge, and the positive pole and the negative pole of the single capacitors are connected to the connection holes of the positive connection plate and the negative connection plate respectively; the negative connection plate is located between the positive connection plate and the second bottom plate, and the distance from the connection holes of the negative connection plate to the power semiconductor assemblies is less than the distance from the connection holes of the positive connection plate to the power semiconductor assemblies; the side of the positive connection plate and the negative connection plate facing outward is provided with a connection part arranged in a bending manner, the direct current connection strip includes a positive connection strip and a negative connection strip connected to the two connection parts respectively; one side of the box is provided with a plurality of inductance coils arranged in parallel, and the positive connection strip and the negative connection strip pass through the inductance coils.

[0020] In conclusion, the utility model has the advantages of reasonable structure design, high heat dissipation efficiency, and prolonging the service life. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the embodiment.

[0022] Figures 2 to 4 It is a schematic diagram of the internal structure of the embodiment. Figure 1

[0023] Figure 5 It is a schematic diagram of the structure of the support plate.

[0024] Figure 6 It is a schematic diagram of the structure of the capacitor module.

[0025] Figure 7 It is a schematic diagram of the exploded structure of the embodiment. Figure 6 DETAILED DESCRIPTION

[0026] The utility model will be further described in detail in combination with the embodiment.

[0027] In the specific implementation: as Figures 1 to 7 ​​As shown, an inverter comprises a box 1 and a heat-conducting bottom plate 2 arranged in the box 1, the upper and lower ends of the heat-conducting bottom plate 2 are connected in the box 1 through a first bottom plate 3 and a second bottom plate 4 respectively; the heat-conducting bottom plate 2 has a plurality of power semiconductor assemblies 5 arranged side by side along the width direction, the upper ends of the plurality of power semiconductor assemblies 5 are connected with an AC wiring bar 51, the lower ends of the plurality of power semiconductor assemblies 5 are connected with a capacitor module 6, the capacitor module 6 is connected with a DC wiring bar 61; the side of the heat-conducting bottom plate 2 away from the power semiconductor assemblies 5 has heat radiating fins arranged at equal intervals.

[0028] In the embodiment, the upper and lower ends of the box 1 are provided with ventilation openings, each of the ventilation openings has a heat radiating fan 7 arranged towards the heat radiating fins, and a heat radiating air duct penetrating along the vertical direction is formed between adjacent two heat radiating fins. Figure 1 As shown, the heat radiating fan 7 is an axial flow fan arranged on the ventilation opening at the upper end of the box 1.

[0029] The ventilation opening at the upper end of the box 1 is provided with a support plate 8, the support plate 8 has mounting holes 81 arranged therethrough, at least two of the mounting holes are arranged along the length direction of the support plate 8, and the heat radiating fan is mounted on the mounting holes 81. The two sides of the support plate 8 in the width direction are bent upwards to form reinforcing plates 82, and the reinforcing plate 82 close to the heat-conducting bottom plate 2 is bent outwards to form a first connecting plate 83, and the first connecting plate 83 is connected to the upper end of the heat-conducting bottom plate 2 through bolts. The two sides of the support plate 8 in the length direction are bent downwards to form a second connecting plate 84, the second connecting plate 84 has fixing holes arranged therethrough, and the second connecting plate 84 is connected to the side wall of the box 1 through bolts passing through the fixing holes. In this way, the reinforcing plates formed by bending can increase the overall rigidity of the support plate, avoid plate vibration during operation of the heat radiating fan, and be conducive to reducing noise.

[0030] The capacitor module 6 comprises single capacitors 62 arranged on the second bottom plate 4, the single capacitors 62 are arranged on the second bottom plate 4 along the transverse and longitudinal directions, and a heat radiating channel is formed between adjacent two single capacitors 62.

[0031] With the above structure, the power semiconductor assemblies with large heat generation are arranged on the heat-conducting bottom plate, and the heat radiating fins are arranged on the back of the heat-conducting bottom plate, so as to increase the heat radiating area of the heat-conducting bottom plate, facilitate high-efficiency heat dissipation of the power semiconductor assemblies, prolong the service life of the power semiconductor assemblies, and ensure reliable operation of the inverter.

[0032] The capacitor module 6 comprises a positive connection plate 63 and a negative connection plate 64 arranged in parallel with the second bottom plate 4, and the second bottom plate 4, the positive connection plate 63 and the negative connection plate 64 are insulatively arranged at intervals; two pins of the single capacitor 62 pass through the second bottom plate 4 and are respectively welded to the positive connection plate 63 and the negative connection plate 64; the positive connection plate 63 and the negative connection plate 64 are respectively electrically connected to the power semiconductor assembly 5.

[0033] The upper end of the positive connection plate 63 is provided with a positive terminal corresponding to the power semiconductor assembly 5, and the upper end of the negative connection plate 64 is provided with a negative terminal corresponding to the power semiconductor assembly 5, and the positive terminal and the negative terminal are respectively connected to the corresponding power semiconductor assembly 5. The single capacitor 62 is arranged in at least two rows in vertical side-by-side manner, and the adjacent two rows of single capacitors 62 have a bus connection plate 65 arranged in series, and the bus connection plate 65 is insulatively arranged on the side of the second bottom plate 4 facing the positive connection plate 63 and the negative connection plate 64; the side of the positive connection plate 63 and the negative connection plate 64 facing downward has a plurality of connection holes uniformly arranged along the edge, and the positive and negative poles of the single capacitor 62 are respectively connected to the connection holes of the positive connection plate 63 and the negative connection plate 64; the negative connection plate 64 is located between the positive connection plate 63 and the second bottom plate 4, and the distance from the connection hole of the negative connection plate 64 to the power semiconductor assembly 5 is less than the distance from the connection hole of the positive connection plate 63 to the power semiconductor assembly 5; the side of the positive connection plate 63 and the negative connection plate 64 facing outward has a wire connection part arranged in a bent manner, and the direct current wire includes a positive wire and a negative wire respectively connected to the two wire connection parts; one side of the box 1 has a plurality of inductance coils 9 arranged in parallel, and the positive wire and the negative wire pass through the inductance coils 9.

[0034] The above only describes the preferred embodiments of the present application, and is not limited to the present application, and any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An inverter, characterized by comprising: The utility model provides a power semiconductor module, including box (1) and the heat conduction bottom plate (2) of setting in the box (1), the upper and lower ends of heat conduction bottom plate (2) are connected in the box (1) through first bottom plate (3) and second bottom plate (4) respectively, heat conduction bottom plate (2) has the power semiconductor assembly (5) of setting side by side along the width direction on, the upper end of multiple power semiconductor assembly (5) is connected with alternating current wiring bar (51), the lower end of multiple power semiconductor assembly (5) is connected with capacitor module (6), and the direct current wiring bar (61) is connected on capacitor module (6), the side of heat conduction bottom plate (2) away from power semiconductor assembly (5) has the fin of equidistance arrangement.

2. The inverter of claim 1, wherein, The upper and lower ends of the box (1) are provided with ventilation openings, and each ventilation opening is provided with a cooling fan (7) facing the fins, and a vertical cooling air duct is formed between adjacent two fins.

3. The inverter of claim 2, wherein, The capacitor module (6) includes single capacitors (62) arranged on the second bottom plate (4), the single capacitors (62) are arranged on the second bottom plate (4) in a transverse and longitudinal distribution, and a heat dissipation channel is formed between adjacent two single capacitors (62).

4. The inverter of claim 3, wherein, The cooling fan (7) is an axial flow fan arranged on the upper end ventilation opening of the box (1).

5. The inverter of claim 4, wherein, A support plate (8) is arranged at the upper end ventilation opening of the box (1), the support plate (8) has mounting holes (81) arranged therethrough, at least two mounting holes are arranged along the length direction of the support plate (8), and the cooling fan is mounted on the mounting holes (81).

6. The inverter of claim 5, wherein, Both sides of the support plate (8) in the width direction are bent upwards to form reinforcing plates (82), and the reinforcing plate (82) close to the heat conduction bottom plate (2) is bent outwards to form a first connecting plate (83), and the first connecting plate (83) is connected to the upper end of the heat conduction bottom plate (2) by bolts.

7. The inverter of claim 6, wherein, Both sides of the support plate (8) in the length direction are bent downwards to form a second connecting plate (84), the second connecting plate (84) has fixing holes arranged therethrough, and the second connecting plate (84) is connected to the side wall of the box (1) by bolts passing through the fixing holes.

8. The inverter of claim 3, wherein, The capacitor module (6) includes a positive electrode wiring plate (63) and a negative electrode wiring plate (64) arranged parallel to the second bottom plate (4), and the second bottom plate (4), the positive electrode wiring plate (63), and the negative electrode wiring plate (64) are insulated from each other; two pins of the single capacitor (62) pass through the second bottom plate (4) and are respectively welded to the positive electrode wiring plate (63) and the negative electrode wiring plate (64); and the positive electrode wiring plate (63) and the negative electrode wiring plate (64) are respectively electrically connected to the power semiconductor assembly (5).

9. The inverter of claim 8, wherein, The upper end of the positive electrode connecting plate (63) is provided with a positive electrode terminal corresponding to the power semiconductor assembly (5), and the upper end of the negative electrode connecting plate (64) is provided with a negative electrode terminal corresponding to the power semiconductor assembly (5), and the positive electrode terminal and the negative electrode terminal are connected to the corresponding power semiconductor assembly (5) respectively.

10. The inverter of claim 9, wherein, The monomer capacitors (62) are arranged in at least two rows in vertical side-by-side manner, and the adjacent two rows of monomer capacitors (62) are provided with bus connecting plates (65) arranged in series, the bus connecting plates (65) are insulatively arranged on the side of the second bottom plate (4) facing the positive electrode connecting plate (63) and the negative electrode connecting plate (64); the side of the positive electrode connecting plate (63) and the negative electrode connecting plate (64) facing downward is provided with connecting holes uniformly arranged along the edge, and the positive electrode and the negative electrode of the monomer capacitors (62) are respectively connected to the connecting holes of the positive electrode connecting plate (63) and the negative electrode connecting plate (64); the negative electrode connecting plate (64) is located between the positive electrode connecting plate (63) and the second bottom plate (4), and the distance from the connecting hole of the negative electrode connecting plate (64) to the power semiconductor assembly (5) is less than the distance from the connecting hole of the positive electrode connecting plate (63) to the power semiconductor assembly (5); the side of the positive electrode connecting plate (63) and the negative electrode connecting plate (64) facing outward is provided with a bent connecting part, the direct current connecting strip includes a positive electrode connecting strip and a negative electrode connecting strip connected to the two connecting parts respectively; one side of the box (1) is provided with a plurality of inductance coils (9) arranged in parallel, and the positive electrode connecting strip and the negative electrode connecting strip pass through the inductance coils (9).

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