Camera module

Abstract

A camera module is provided. The camera module includes: a lens module including at least one lens; an image sensor module including an image sensor disposed below the lens module and a circuit board on which the image sensor is mounted; and an optical filter module including an optical filter and a sub-housing configured to support the optical filter, and disposed between the lens module and the image sensor module, in which a groove portion is disposed on an inner surface of the sub-housing, and the groove portion is spaced apart from a surface of the sub-housing facing the circuit board.

Description

TECHNICAL FIELD

[0001] The following description relates to a camera module. BACKGROUND

[0002] With the development of information communication technology and semiconductor technology, the distribution and implementation of electronic devices is rapidly increasing. Recently, cameras are implemented in portable electronic devices such as, but not limited to, smart phones, tablet personal computers (PCs), and laptop computers.

[0003] Recently, as the implementation of high-pixel sensors and the increase in the number of sensor pads in a camera module, the connection pad arrangement on a circuit board is increasingly implemented in a complex structure of three or more rows, and as the trend toward miniaturization of portable electronic devices equipped with a camera module, an ultra-thin form factor of the camera module is also desired. As a result, the implementation space of the circuit board is limited, and the demand for a camera module that can minimize the height of a sensor package while minimizing the expansion of the left and right widths is increasing.

[0004] The camera module includes a circuit board on which an image sensor is mounted, and an optical unit including at least one lens that transmits an image to the image sensor. In addition, it can also include a filter between the image sensor and the optical unit to block light of a specific band width from the light passing through the lens from entering the image sensor.

[0005] The image sensor is connected to the circuit board by wire bonding, and the filter is disposed in a sub-housing having a hollow portion to be fixed to the circuit board by an adhesive. In this example, as the adhesive hardens, an overflow phenomenon occurs in which the adhesive overflows to the inside of the sub-housing.

[0006] The height of the sub-housing is limited according to the requirements of an ultra-thin camera module, so the adhesive that overflows to the inside of the sub-housing adheres to the bonding wire, and the upper surface of the bonding wire and the sub-housing can be bonded. As a result, the connection performance between the image sensor and the circuit board can be degraded or the connection can become unstable. In particular, if a slight impact is applied after the camera module is completed, a defect in which the wire connection between the image sensor and the circuit board is disconnected can occur. SUMMARY

[0007] The purpose of the summary portion of the present content is to briefly introduce the selection of the concepts, and these concepts will be further described in the detailed description portion below. The summary portion of the present content is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used to determine the scope of the claimed subject matter.

[0008] In general aspects, a camera module includes a lens module including at least one lens, an image sensor module including an image sensor disposed below the lens module and a circuit board on which the image sensor is mounted, and a filter module including a filter and a sub-housing configured to support the filter, and disposed between the lens module and the image sensor module, wherein a recessed portion is provided on an inner surface of the sub-housing and is spaced apart from a surface of the sub-housing facing the circuit board.

[0009] The image sensor can be connected to the circuit board by a wire bond, and the recessed portion can be disposed around at least a portion of an area in which the wire bond is provided.

[0010] The camera module can further include a bonding layer disposed between the sub-housing and the circuit board, wherein a portion of an adhesive material constituting the bonding layer is accommodated in the recessed portion.

[0011] The recessed portion can include a first recessed portion spaced apart from the surface of the sub-housing facing the circuit board by a first distance, and a second recessed portion spaced apart from the surface of the sub-housing facing the circuit board by a second distance.

[0012] A protrusion can also be provided on the inner surface of the sub-housing, and the protrusion can be spaced apart from the surface of the sub-housing facing the circuit board farther than the recessed portion.

[0013] The sub-housing can include a hollow upper surface portion and a base portion extending downward from an edge of the upper surface portion and coupled to the circuit board, and the recessed portion can be provided on an inner side surface of the base portion.

[0014] In general aspects, a camera module includes an image sensor, a circuit board on which the image sensor is mounted, a filter disposed on the image sensor, and a sub-housing configured to support the filter, wherein a protrusion is provided on an inner surface of the sub-housing and is spaced apart from a surface of the sub-housing facing the circuit board.

[0015] The image sensor can be connected to the circuit board by a wire bond, and the protrusion can be disposed around at least a portion of an area in which the wire bond is provided.

[0016] The camera module can further include a bonding layer disposed between the sub-housing and the circuit board, wherein a portion of an adhesive material constituting the bonding layer can be accommodated at a lower portion of the protrusion.

[0017] The protrusion can include a first protrusion spaced apart from the surface of the sub-housing facing the circuit board by a first distance, and a second protrusion spaced apart from the surface of the sub-housing facing the circuit board by a second distance.

[0018] A recessed portion can also be provided on the inner surface of the sub-housing, and can be spaced further from the surface of the sub-housing facing the circuit board than the protrusion.

[0019] The sub-housing can include a hollow upper surface portion and a base portion extending downward from an edge of the upper surface portion and coupled to the circuit board, and the protrusion can be provided on an inner side surface of the base portion.

[0020] Other features and aspects will be apparent from the accompanying drawings and from the detailed description which follows. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 An exploded perspective view of an exemplary camera module according to one or more embodiments is shown.

[0022] Figure 2 A perspective view of Figure 1 a portion of the exemplary camera module shown in FIG. 1 is shown.

[0023] Figure 3 A partial cross-sectional view taken along line V-V' of Figure 2 FIG. 2 is shown.

[0024] Figure 4 A sub-housing of an exemplary camera module according to one or more embodiments is shown.

[0025] Figure 5 A cross-sectional view of Figure 3 the adhesion state of the sub-housing shown in FIG. 3 is shown.

[0026] Figure 6 A cross-sectional view of a portion of an exemplary camera module according to one or more embodiments is shown.

[0027] Figure 7 A cross-sectional view of a portion of an exemplary camera module according to one or more embodiments is shown.

[0028] Figure 8 A cross-sectional view of Figure 7 the adhesion state of the sub-housing shown in FIG. 7 is shown.

[0029] Figure 9 A cross-sectional view of a portion of an exemplary camera module according to one or more embodiments is shown.

[0030] Figure 10 A cross-sectional view of a portion of an exemplary camera module according to one or more embodiments is shown.

[0031] Figure 11 A cross-sectional view of a portion of an exemplary camera module according to one or more embodiments is shown.

[0032] Throughout the drawings and specific embodiments, identical reference numerals designate identical elements, unless otherwise described. The drawings can not be to scale and the relative dimensions, proportions and descriptions of the elements in the drawings can be exaggerated for purpose of clarity, illustration and convenience. DETAILED DESCRIPTION

[0033] The following detailed description is presented to aid the reader in gaining a comprehensive understanding of the methods, apparatuses, and / or systems described herein. However, various changes, modifications, and equivalents can be used, and the disclosure herein has been presented to enable any person skilled in the art to make or use the methods, apparatuses, and / or systems described herein, as well as the various changes, modifications, and equivalents that will become apparent to the skilled artisan upon

[0034] Although expressions such as "first", "second", and "third" or A, B, (a), (b) and the like can be used in this document to describe various components, parts, regions, layers or portions, the components, parts, regions, layers or portions are not limited by the expressions. Each of the expressions is not used to define importance, sequence or order of, for example, the corresponding components, parts, regions, layers or portions, but is used only to distinguish the corresponding components, parts, regions, layers or portions from the other components, parts, regions, layers or portions. Accordingly, the first components, first parts, first regions, first layers or first portions mentioned in the examples can be referred to as the second components, second parts, second regions, second layers or second portions, without departing from the teachings of the examples described herein.

[0035] Throughout this specification, where a component, element, or layer is described as being "on", "connected to", "coupled to", or "joined to" another component, element, or layer, it can be directly on, directly connected to, directly coupled to, or directly joined to the other component, element, or layer (e.g., in contact with the other component, element, or layer), or there can be one or more other components, elements, or layers intervening. Where a component, element, or layer is described as being "directly on", "directly connected to", "directly coupled to", or "directly joined to" another component, element, or layer, then there are no intervening components, elements, or layers present. Likewise, the expressions, for example, "between" and "directly between" as well as "adjacent" and "directly adjacent" can also be interpreted in the same way as just described.

[0036] The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. By the term "comprising" or "containing" or "including" or "having" or "characterized by" is meant "including, but not limited to", and is intended to cover the terms "consisting essentially of" or "consisting of" or "consisting of and their grammatical variants. As used herein, the singular form "a", "an" and "the" include plural references unless the context clearly dictates otherwise. As used herein, the expression "and / or" includes any one as well as any combination of any two or more of the associated listed items. The phrases "at least one of A, B, and C", and the like, are intended to mean one or more of A, B, and C, for example, any combination of one or more of A, B, and C (e.g., A alone, B alone, C alone, two of A, B, and C, for example, A and B together, A and C together, B and C together, or A, B, and C together, etc.). As used herein, the term "exemplary" means "an example of" and is not intended to indicate that a described implementation is preferred or superior to other implementations.

[0037] As used herein, the expression "and / or" includes any one as well as any combination of any two or more of the associated listed items. The phrases "at least one of A, B, and C", and the like, are intended to mean one or more of A, B, and C, for example, any combination of one or more of A, B, and C (e.g., A alone, B alone, C alone, two of A, B, and C, for example, A and B together, A and C together, B and C together, or A, B, and C together, etc.). As used herein, the term "exemplary" means "an example of" and is not intended to indicate that a described implementation is preferred or superior to other implementations.

[0038] The features described herein can be embodied in different forms, and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely for the purpose of illustration so that one of ordinary skill in the art will understand many possible ways to implement the methods, devices, and / or systems described herein after the disclosure herein is understood. In this document, the use of the expression "may" (e.g., with respect to examples or embodiments that can include or implement something) means that at least one example or embodiment exists in which the feature is included or implemented, and that not all examples or embodiments need to include or implement the feature. The expression "example" or "embodiment" used herein has the same meaning (e.g., the phrase "in one example" has the same meaning as "in one embodiment," and "in one or more examples" has the same meaning as "in one or more embodiments").

[0039] One or more examples can provide a camera module that prevents overflow of an adhesive at a junction between a sub-housing provided with a filter and a circuit board.

[0040] Figure 1 An exploded perspective view of an exemplary camera module according to one or more embodiments is shown, and Figure 2 An exploded perspective view of an exemplary camera module according to one or more embodiments is shown, and Figure 1 A perspective view of a portion of the exemplary camera module shown in FIG. 1.

[0041] Referring to Figure 1 and Figure 2 A camera module 10 according to one or more embodiments includes an image sensor module 100, a lens module 200, a filter module 300, and a cover 400.

[0042] The image sensor module 100 includes a circuit board 110 and an image sensor 120. The circuit board 110 can include a circuit board electrically connected to a main board (not shown) and can have a wiring pattern capable of electrical connection, such as a rigid circuit board, a flexible circuit board, or a rigid-flexible circuit board, as an example. The circuit board 110 can have one surface on which the image sensor 120 is mounted, and can include a connection pad 112 to enable connection of the image sensor 120.

[0043] The image sensor 120 can be a charge-coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS), as a device that converts light incident through a lens of the lens module 200 into an electrical signal. However, one or more examples are not limited thereto.

[0044] The image sensor 120 can be disposed below the lens module 200 along the direction of the optical axis of the lens, and can be connected to the connection pads 112 of the circuit board 110 through the bonding wires 113. The connection between the image sensor 120 and the circuit board 110 is not limited thereto, and various modifications to the connection of the electronic components mounted on the circuit board 110 are obviously possible. The electrical signals converted by the image sensor 120 are output as an image through a display device of an electronic device.

[0045] The lens module 200 includes a lens 210, a lens barrel 220 accommodating the lens 210, a lens driving device 230 moving the lens barrel 220, and a housing 240 accommodating the lens barrel 220. The lens 210 can include one or more lenses having the same or different optical properties such as refractive index, and is mounted on the lens barrel 220 along an optical axis. In an example, the optical axis can be disposed as a central axis of the lens 210 accommodated in the lens barrel 220, and the optical axis direction refers to a direction parallel to the central axis. The lens 210 can be disposed as needed according to the implementation of the lens barrel 220.

[0046] The lens barrel 220 can have a hollow cylindrical shape so that one or more lenses 210 for imaging an object can be accommodated therein, the image sensor 120 can be disposed below the lens barrel 220 along the optical axis to convert light incident through the lens barrel 220 into an electrical signal, and the converted electrical signal can be transmitted to the circuit board 110 and to an electronic device such as a mobile phone, as an example. Based on the driving force of the lens driving device 230, the lens barrel 220 can move in the direction of the optical axis or in the direction perpendicular to the optical axis while being accommodated in the housing 240.

[0047] The lens driving device 230 is a device that moves the lens barrel 220, and includes an auto focus (AF) driver (not shown) and an optical image stabilization (OIS) driver (not shown). In an example, the AF driver can include an AF driving magnet and an AF driving coil, and the electromagnetic influence therebetween moves the lens barrel 220 along the optical axis to implement a focus adjustment operation or a zoom operation. In addition, the OIS driver can include an OIS driving magnet and an OIS driving coil, and can implement an operation of correcting hand-shake or shake by moving the lens barrel 220 in a direction perpendicular to the optical axis based on the electromagnetic influence therebetween.

[0048] The housing 240 can accommodate the lens barrel 220 and the lens driving device 230 in an internal space, and in an example, the housing 240 can have a box shape with the upper and lower parts open. The circuit board 110 can be disposed below the housing 240.

[0049] The optical filter module 300 can be disposed between the image sensor module 100 and the lens module 200, and can include an optical filter 310 and a sub-housing 320 supporting the optical filter 310. The optical filter 310 can be disposed on the image sensor 120, aligned with the lens 210 and the image sensor 120 in the direction of the optical axis, and can be arranged in parallel to the direction perpendicular to the optical axis. The optical filter 310 can block light of a specific band width from the light passing through the lens 210 from entering the image sensor 120. In an example, the optical filter 310 can include an infrared (IR) cut filter.

[0050] The optical filter 310 can be disposed inside the sub-housing 320. The optical filter 310 can be fixed to the sub-housing 320 in various ways. In an example, the optical filter 310 can be adhesively fixed to the sub-housing 320 with an ultraviolet-cured adhesive material or a heat-cured adhesive material, where the adhesive material can be formed of an epoxy material. In addition, as an example, any possible adhesive means such as a tape can also be used.

[0051] The cover 400 can be connected to the housing 240 to cover the housing 240. The cover 400 can have a frame shape with an open lower portion and four corner portions. The cover 400 protects internal components of the camera module 10. As an example, the cover 400 can be made of a metal plate or a material having a low corrosion rate such as stainless steel. In addition, the cover 400 can operate to block electromagnetic waves. For example, the cover 400 can shield electromagnetic waves to prevent electromagnetic waves generated inside the camera module 10 from affecting other electronic components inside the electronic device, or to prevent noise current flowing from the outside of the camera module 10 from affecting the inside of the camera module 10. The cover 400 can be grounded to the circuit board 110 to shield electromagnetic waves inside and outside the camera module 10.

[0052] Hereinafter, a camera module 10 according to one or more embodiments will be described in detail with reference to the accompanying drawings. Figures 3 to 5 The sub-housing 320 of the camera module 10 according to one or more embodiments will be described in more detail. Figure 3 A partial cross-sectional view taken along a line V-V' of Figure 2 A partial cross-sectional view taken along a line V-V' of Figure 4 A sub-housing of an exemplary camera module according to an embodiment is illustrated, and Figure 5 A cross-sectional view illustrating an adhered state of the sub-housing illustrated in Figure 3

[0053] The sub-housing 320 includes an upper surface portion 322 having a hollow portion 321, a seating portion 323 on which the optical filter 310 is disposed, and a base portion 324 which can be coupled to the circuit board 110. A groove portion 325 is disposed on an inner surface of the sub-housing 320.

[0054] ​In an example, the upper surface portion 322 can have an approximately quadrangular shape, and a hollow portion 321 extending through the sub-housing 320 in the optical axis direction can be formed at the center. The image sensor 120 can be disposed below the hollow portion 321, and light passing through the lens barrel 220 can be transmitted to the image sensor 120 through the hollow portion 321 of the upper surface portion 322.

[0055] The seating portion 323 can be formed to have a step with respect to the upper surface portion 322 at the edge of the hollow portion 321. That is, the seating portion 323 can be recessed downward in the optical axis direction in the upper surface portion 322 by a predetermined depth adjacent to the edge of the hollow portion 321. The depth of the seating portion 323 in the optical axis direction can be equal to or greater than the thickness of the optical filter 310. Accordingly, when the optical filter 310 is disposed on the seating portion 323, the optical filter 310 can be disposed on the same plane as the upper surface portion 322 in the optical axis direction, or can be disposed below the upper surface portion 322 in the optical axis direction.

[0056] As a portion in which the sub-housing 320 is coupled to the circuit board 110, the base portion 324 can be formed to extend downward from the edge of the upper surface portion 322 in the optical axis direction. In this example, in order to stably couple the sub-housing 320 and the circuit board 110, the height of the base portion 324 in the optical axis direction can be formed to be equal to or greater than the depth of the seating portion 323.

[0057] In addition, the bonding layer 330 can be disposed between the sub-housing 320 and the circuit board 110. As a layer in which the sub-housing 320 is coupled to the circuit board 110, the bonding layer 330 can be formed on a surface of the base portion 324 facing the circuit board 110. The bonding layer 330 can include various adhesive materials such as, but not limited to, ultraviolet-cured adhesive or heat-cured adhesive, and can include any possible adhesive means such as a tape.

[0058] The recessed portion 325 can be disposed on the inner surface of the sub-housing 320. In an example, the recessed portion 325 can be disposed on the lower surface (i.e., the surface facing the image sensor 120) of the upper surface portion 322, or can be disposed on the inner side surface of the base portion 324.

[0059] The recessed portion 325 can be formed to be spaced apart from a surface of the sub-housing 320 facing the circuit board 110. For example, the recessed portion 325 can be provided at a predetermined distance above in the optical axis direction at a lower portion of the base portion 324, can be recessed on a lower surface of the upper surface portion 322 in the optical axis direction, or can be formed by being recessed in an inner side surface of the base portion 324 in a direction perpendicular to the optical axis (x-axis direction). That is, the recessed portion 325 can be formed on a lower surface of the upper surface portion 322 in a recessed shape smaller than a thickness of the upper surface portion 322, or can be formed on an inner side surface of the base portion 324 to be smaller than a thickness of the base portion 324 in the direction perpendicular to the optical axis (x-axis direction).

[0060] The recessed portion 325 can be provided on at least one surface of an inner surface of the sub-housing 320, and can be provided to correspond to an area in which the bonding wire 113 is provided. The recessed portion 325 can be provided around at least a portion of the area in which the bonding wire 113 is provided.

[0061] In an example, when the sub-housing 320 has a structure of a substantially quadrangular frame shape with an upper surface portion, the recessed portion 325 can be provided on a lower surface of the upper surface portion or on four inner side surfaces. When the recessed portion 325 is provided on the lower surface of the upper surface portion, the recessed portion 325 can be provided along all corners of the quadrangular shape of the lower surface, can be provided along two corners of the four corners corresponding to the bonding wire 113 facing each other, or can be provided along two entire corners corresponding to the bonding wire 113 facing each other and a portion of adjacent corners. When the recessed portion 325 is provided on the four inner side surfaces, the recessed portion 325 can be provided on all four inner side surfaces, can be provided on two inner side surfaces of the four inner side surfaces corresponding to the bonding wire 113 facing each other, or can be provided on two entire inner side surfaces of the four inner side surfaces corresponding to the bonding wire 113 facing each other and a portion of adjacent inner side surfaces.

[0062] Referring to Figure 4 , the recessed portion 325 can be provided on an entire longitudinal direction (y-axis direction) of two inner side surfaces of the sub-housing 320 corresponding to the bonding wire 113 facing each other, and can be provided on a portion of a longitudinal direction (x-axis direction) of another two inner side surfaces adjacent to each of the two inner side surfaces facing each other.

[0063] The groove portion 325 can be continuously or discontinuously provided on at least one surface of the inner surface of the sub-housing 320. When discontinuously provided, the groove portion 325 can include a plurality of slits provided at a predetermined interval at the at least one surface of the inner surface of the sub-housing 320. With respect to the slits, adjacent slits can be arranged in a straight line in the longitudinal direction (y-axis direction) of the inner surface of the sub-housing 320, or can be arranged at different distances from the lower end of the sub-housing 320. In the latter case, the slits can be arranged such that adjacent slits and the end portion on the inner surface of the sub-housing 320 in the longitudinal direction (y-axis direction) partially overlap in the optical axis direction. In this way, the groove portion 325 can be modified in various ways in terms of arrangement or shape.

[0064] Referring to Figure 5 , the groove portion 325 can accommodate some of the adhesive material B constituting the bonding layer 330. If the filter module 300 is fixed to the circuit board 110 by the bonding layer 330, the adhesive material B can overflow into the inner surface of the sub-housing 320 when the bonding layer 330 hardens, and the adhesive material B flowing upward along the inner surface of the sub-housing 320 in the optical axis direction can be accommodated in the groove portion 325.

[0065] The adhesive material B overflowing from the bonding layer 330 can be accommodated in the groove portion 325, so that the adhesive material B can be prevented from contaminating the bonding wire 113, or the adhesive material B can be prevented from flowing to the inner surface of the sub-housing 320 facing the upper surface of the bonding wire 113. This can prevent the bonding wire 113 and the sub-housing 320 from adhering to each other, thereby preventing the connection performance between the image sensor 120 and the circuit board 110 from deteriorating or the connection from becoming unstable. Accordingly, even if a slight impact is applied after the completion of the camera module 10, the risk of the bonding wire 113 between the image sensor 120 and the circuit board 110 being disconnected can be reduced.

[0066] In this way, according to the present embodiment, by preventing the adhesive material B from overflowing from the bonding layer 330 while maintaining the height of the sub-housing 320 in the optical axis direction, the effect of minimizing the connection defect of the bonding wire 113 is achieved.

[0067] Figure 6 A cross-sectional view of a portion of an exemplary camera module according to one or more embodiments is shown.

[0068] Referring to Figure 6 , the exemplary camera module according to one or more embodiments has substantially the same configuration as that described with reference to Figures 1 to 5 However, in the present embodiment, two groove portions 325 can be provided on the inner surface of the sub-housing 320. Hereinafter, a description will be made of the configuration of the exemplary camera module according to the present embodiment with reference to FIG. 17. Figures 1 to 5The embodiments shown have different configurations; the same reference numerals will be used for the same configuration, and configurations not described separately may be similar to... Figures 1 to 5 The implementation shown is used to set it up.

[0069] In this embodiment, the groove portion 325 may include a first groove portion 325a and a second groove portion 325b. The first groove portion 325a is spaced apart from the surface of the sub-housing 320 facing the circuit board 110 by a first distance a1. The second groove portion 325b is spaced apart from the surface of the sub-housing 320 facing the circuit board 110 above the first groove portion 325a in the optical axis direction by a second distance a2.

[0070] The second recessed portion 325b can accommodate adhesive material overflowing from the first recessed portion 325a. That is, when the bonding layer 330 hardens, adhesive material flowing towards the inner surface of the base portion 324 can be primarily contained in the first recessed portion 325a, and adhesive material overflowing from the first recessed portion 325a can be secondary contained in the second recessed portion 325b. The depth of the first recessed portion 325a and the depth of the second recessed portion 325b can be the same or different. According to this embodiment, the recessed portion 325 can be formed by two recessed portions to more precisely prevent adhesive material flowing into the inner surface of the sub-housing 320 from overflowing.

[0071] Figure 7 A cross-sectional view of a portion of an exemplary camera module according to one or more embodiments is shown, and Figure 8 It shows Figure 7 The cross-sectional view of the subshell in its adhesive state is shown.

[0072] Reference Figure 7 and Figure 8 The camera module according to this embodiment has the same features as the reference module. Figures 1 to 5 The configuration of the described embodiments is substantially the same. However, in this embodiment, the protrusion 327 may be provided on the inner surface of the sub-housing 320. Hereinafter, the configuration will be described as similar to... Figures 1 to 5 The embodiments shown have different configurations; the same reference numerals will be used for the same configuration, and configurations not described separately may be similar to... Figures 1 to 5 The implementation shown is used to set it up.

[0073] In this embodiment, the sub-housing 320 includes an upper surface portion 322 having a hollow portion 321, a mounting portion 323 on which a filter 310 is disposed, and a base portion 324 connected to the circuit board 110. A protrusion 327 is provided on the inner surface of the sub-housing 320.

[0074] The protrusions 327 can be provided on the inner surface of the sub-housing 320. In an example, the protrusions 327 can be provided on the lower surface of the upper surface portion 322 (i.e., the surface facing the image sensor 120), or can be provided on the inner side surface of the base portion 324.

[0075] The protrusions 327 can be formed to be spaced apart from the surface of the sub-housing 320 facing the circuit board 110. In an example, the protrusions 327 can be provided at a predetermined distance above in the optical axis direction at the lower portion of the base portion 324, can protrude in the optical axis direction on the lower surface of the upper surface portion 322, or can be formed by protruding from the inner side surface of the base portion 324 in a direction (x-axis direction) perpendicular to the optical axis. That is, the protrusions 327 can be formed in a convex shape on the lower surface of the upper surface portion 322 or on the inner side surface of the base portion 324.

[0076] The protrusions 327 can be provided on at least one surface of the inner surface of the sub-housing 320, and can be provided to correspond to the area where the bonding wire 113 is provided. The protrusions 327 can be provided around at least a portion of the area where the bonding wire 113 is provided.

[0077] In an example, when the sub-housing 320 has a structure of a substantially quadrangular frame shape with an upper surface portion, the protrusions 327 can be provided on the lower surface of the upper surface portion or on the four inner side surfaces. When the protrusions 327 are provided on the lower surface of the upper surface portion, the protrusions 327 can be provided along all four corners of the quadrangular shape of the lower surface, can be provided along two of the corners facing each other corresponding to the bonding wire 113 among the four corners, or can be provided along the entire two of the corners facing each other corresponding to the bonding wire 113 and a portion of the adjacent corners. When the protrusions 327 are provided on the four inner side surfaces, the protrusions 327 can be provided on all four inner side surfaces, can be provided on two of the inner side surfaces facing each other corresponding to the bonding wire 113 among the four inner side surfaces, or can be provided on the entire two of the inner side surfaces facing each other corresponding to the bonding wire 113 and a portion of the adjacent inner side surfaces among the four inner side surfaces.

[0078] The protrusions 327 can be continuously or discontinuously provided on at least one surface of the sub-housing 320. When provided discontinuously, the protrusions 327 can include a plurality of protrusions provided at predetermined intervals on at least one surface of the inner surface of the sub-housing 320. With respect to the protrusions, adjacent protrusions can be arranged in a straight line in the longitudinal direction (y-axis direction) of the inner surface of the sub-housing 320, or can be arranged at different distances from the lower end of the sub-housing 320. In the latter example, the protrusions can be arranged such that adjacent protrusions and the end portion in the longitudinal direction (y-axis direction) on the inner surface of the sub-housing 320 partially overlap in the optical axis direction. In this way, the protrusions 327 can be modified in various ways in terms of arrangement or shape.

[0079] Referring to Figure 8 , the protrusions 327 can accommodate some of the adhesive material B constituting the bonding layer 330. If the filter module 300 is fixed to the circuit board 110 by the bonding layer 330, when the bonding layer 330 hardens, the adhesive material B can overflow into the inner surface of the sub-housing 320, and the adhesive material B flowing upward along the inner surface of the sub-housing 320 in the optical axis direction can be accommodated in the lower portion of the protrusions 327. Accordingly, it is possible to prevent the adhesive material B from contaminating the bonding wire 113 or to prevent the bonding wire 113 from adhering to the sub-housing 320.

[0080] Figure 9 A cross-sectional view of a portion of an exemplary camera module according to one or more embodiments is shown.

[0081] Referring to Figure 9 , the exemplary camera module according to one or more embodiments has substantially the same configuration as that of the embodiment described with reference to Figures 1 to 5 . However, in the present embodiment, two protrusions 327 can be provided on the inner surface of the sub-housing 320. Hereinafter, a configuration different from that of the embodiment shown in Figures 1 to 5 will be described, the same reference numerals will be used for the same configuration, and the configuration not separately described can be provided similarly to the embodiment shown in Figures 1 to 5 .

[0082] In the present embodiment, the protrusions 327 can include a first protrusion 327a spaced apart from the surface of the sub-housing 320 facing the circuit board 110 by a first distance b1 and a second protrusion 327b spaced apart from the surface of the sub-housing 320 facing the circuit board 110 above the first protrusion 327a in the optical axis direction by a second distance b2.

[0083] The second protrusion 327b can accommodate the adhesive material overflowing from the first protrusion 327a. That is, when the bonding layer 330 hardens, the adhesive material flowing toward the inner surface of the base portion 324 can be primarily accommodated in the first protrusion 327a, and the adhesive material overflowing from the first protrusion 327a can be secondarily accommodated in the second protrusion 327b. The height of the first protrusion 327a and the height of the second protrusion 327b can be the same or different. According to the present embodiment, the protrusion 327 can be formed of two protrusions in order to more definitely prevent overflow of the adhesive material flowing into the inner surface of the sub-housing 320.

[0084] Figure 10 A cross-sectional view showing a portion of an exemplary camera module according to one or more embodiments is illustrated.

[0085] Referring to Figure 10 , the exemplary camera module according to the present embodiment has substantially the same configuration as that of the embodiment described with reference to Figures 1 to 5 Hereinafter, a configuration different from that of the embodiment shown in Figures 1 to 5 will be described, the same reference numerals will be used for the same configuration, and the configuration not described separately can be provided similarly to the embodiment shown in Figures 1 to 5

[0086] Referring to Figure 10 , the sub-housing 320 includes an upper surface portion 322 having a hollow portion 321, a seating portion 323 on which the optical filter 310 is disposed, and a base portion 324 coupled to the circuit board 110. A recessed portion 325 and a protrusion 327 are provided on the inner surface of the sub-housing 320.

[0087] In the present embodiment, the recessed portion 325 can be spaced apart from the surface of the sub-housing 320 facing the circuit board 110 by a first distance c1, and the protrusion 327 can be spaced apart from the surface of the sub-housing 320 facing the circuit board 110 more distantly than the recessed portion 325. That is, the protrusion 327 can be formed to be spaced apart from the surface of the sub-housing 320 facing the circuit board 110 by a second distance c2.

[0088] The protrusion 327 can accommodate the adhesive material overflowing from the recessed portion 325. That is, when the bonding layer 330 hardens, the adhesive material flowing toward the inner surface of the sub-housing 320 is primarily accommodated in the recessed portion 325, and the adhesive material overflowing from the recessed portion 325 can be secondarily accommodated at the lower portion of the protrusion 327. In an example, the depth of the recessed portion 325 and the height of the protrusion 327 can be the same or different. According to the present embodiment, by forming a double configuration to accommodate the adhesive material overflowing from the bonding layer 330 having the recessed portion 325 and the protrusion 327, overflow of the adhesive material flowing into the inner surface of the sub-housing 320 can be more reliably prevented.​

[0089] Figure 11 A cross-sectional view showing a portion of a camera module according to another embodiment is shown.

[0090] The exemplary camera module according to the present embodiment has substantially the same configuration as the configuration of the camera module described with reference to Figures 1 to 5 In the following, a configuration different from the embodiment shown in FIG. 1 will be described, the same reference numerals will be used for the same configuration, and the configuration not described separately can be provided similarly to the embodiment shown in FIG. 1. Figures 1 to 5 Figures 1 to 5

[0091] Referring to FIG. 3, the sub-housing 320 includes an upper surface portion 322 having a hollow portion 321, a seating portion 323 on which the optical filter 310 is disposed, and a base portion 324 coupled to the circuit board 110. A protrusion 327 and a recessed portion 325 can be provided on an inner surface of the sub-housing 320. Figure 11 In the present embodiment, the protrusion 327 can be spaced apart from a surface of the sub-housing 320 facing the circuit board 110 by a first distance d1, and the recessed portion 325 can be spaced apart from the surface of the sub-housing 320 facing the circuit board 110 more distantly than the protrusion 327. That is, the recessed portion 325 can be formed to be spaced apart from the surface of the sub-housing 320 facing the circuit board 110 by a second distance d2.

[0092] The recessed portion 325 can accommodate the adhesive material overflowing from the protrusion 327. That is, when the bonding layer 330 hardens, the adhesive material flowing toward the inner surface of the base portion 324 can be primarily accommodated at a lower portion of the protrusion 327, and the adhesive material overflowing from the protrusion 327 can be secondarily accommodated in the recessed portion 325. The height of the protrusion 327 and the depth of the recessed portion 325 can be the same or different. According to the present embodiment, by forming a double configuration to accommodate the adhesive material overflowing from the bonding layer 330 having the recessed portion 325 and the protrusion 327, overflow of the adhesive material flowing into the inner surface of the sub-housing 320 can be more reliably prevented.

[0093]

[0094] ​​​While the present disclosure includes specific examples, it will be apparent to one skilled in the art, after an understanding of the disclosure herein, that various changes in form and details can be made without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects in each example should be considered as being applicable to similar features or aspects in other examples. Proper results can be achieved if the described techniques are performed in a different order, and / or if components in the described systems, architectures, devices, or circuits are combined in a different manner, or replaced or supplemented by other components or their equivalents.

[0095] Thus, although the present disclosure has been described in detail with respect to specific examples, it will be apparent to those skilled in the art that various alterations, modifications, and improvements can be made to the examples without departing from the spirit and scope of the claims and their equivalents. It will also be apparent that features or aspects of one example can be incorporated into another example without changing the basic principles or characteristics thereof. Therefore, the above discussed embodiments should be understood to be illustrative only and not restrictive, as the scope of the disclosure is best shown by the appended claims and their equivalents.

Claims

1. A camera module characterized by, The camera module includes: a lens module including at least one lens; an image sensor module including an image sensor disposed below the lens module and a circuit board on which the image sensor is mounted; and a filter module including a filter and a sub-housing configured to support the filter, and disposed between the lens module and the image sensor module, wherein a recessed portion is provided on an inner surface of the sub-housing, and the recessed portion is spaced apart from a surface of the sub-housing facing the circuit board. 2.The camera module of claim 1, wherein: the image sensor is connected to the circuit board by a wire bonding, and the recessed portion is provided around at least a portion of an area in which the wire bonding is provided.

3. The camera module of claim 1, wherein, The camera module further includes: a bonding layer provided between the sub-housing and the circuit board, wherein a portion of an adhesive material constituting the bonding layer is accommodated in the recessed portion.

4. The camera module of claim 1, wherein, The recessed portion includes: a first recessed portion spaced apart from the surface of the sub-housing facing the circuit board by a first distance, and a second recessed portion spaced apart from the surface of the sub-housing facing the circuit board by a second distance. 5.The camera module of claim 1, wherein: a protrusion is further provided on the inner surface of the sub-housing, and the protrusion is spaced apart from the surface of the sub-housing facing the circuit board farther than the recessed portion. 6.The camera module of claim 1, wherein: the sub-housing includes a hollow upper surface portion and a base portion extending downward from an edge of the upper surface portion and coupled to the circuit board, and the recessed portion is provided on an inner side surface of the base portion.

7. A camera module characterized by, The camera module includes: an image sensor; a circuit board on which the image sensor is mounted; a filter provided on the image sensor; and a sub-housing configured to support the filter, wherein a protrusion is provided on an inner surface of the sub-housing, and the protrusion is spaced apart from a surface of the sub-housing facing the circuit board. 8.The camera module of claim 7, wherein: the image sensor is connected to the circuit board by a wire bonding, and the protrusion is provided around at least a portion of an area in which the wire bonding is provided.

9. The camera module of claim 7, wherein, The camera module further includes: a bonding layer provided between the sub-housing and the circuit board, wherein a portion of an adhesive material constituting the bonding layer is accommodated at a lower portion of the protrusion.

10. The camera module of claim 7, wherein, The protrusion includes: a first protrusion spaced apart from the surface of the sub-housing facing the circuit board by a first distance, and a second protrusion spaced apart from the surface of the sub-housing facing the circuit board by a second distance. 11.The camera module of claim 7, wherein: a recessed portion is further provided on the inner surface of the sub-housing, and the recessed portion is spaced apart from the surface of the sub-housing facing the circuit board farther than the protrusion. 12.The camera module according to claim 7, characterized in that: the sub-housing includes a hollow upper surface portion and a pedestal portion extending downward from an edge of the upper surface portion and coupled to the circuit board, and the protrusion is disposed on an inner side surface of the pedestal portion.

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