Circuit board module, control assembly, energy storage power supply and electrical equipment

Abstract

The utility model relates to the technical field of heat dissipation of power devices, in particular to a circuit board module, a control assembly, an energy storage power supply and electrical equipment, the circuit board module comprises a circuit board and a heat-conducting fin, the circuit board is provided with a heat-conducting through hole, and the heat-conducting through hole is configured to be filled with a tin material; heat generated by a power device arranged on the circuit board is absorbed and conducted by the tin material; the heat-conducting fin is provided with a first surface and a second surface which are opposite, the first surface is configured to be in heat-conducting contact with the radiator, and the second surface is attached to the circuit board and blocks the heat-conducting through hole so as to prevent the tin material from seeping out of the heat-conducting through hole in the pouring process. The above arrangement can improve the heat dissipation effect of the power device.

Description

Technical Field

[0001] This application relates to the field of power device heat dissipation technology, and in particular to a circuit board module, control component, energy storage power supply and electrical equipment. Background Technology

[0002] Circuit boards and power devices are essential components of electronic devices. Power devices generate a significant amount of heat during operation. To prevent damage from overheating, vias are typically placed on the circuit board, and a heat sink is installed on the side of the circuit board furthest from the power device. This allows the heat generated by the power device to dissipate through the vias to the heat sink. While this achieves heat dissipation, its efficiency still needs improvement. Utility Model Content

[0003] In view of this, this application provides a circuit board module, a control component, an energy storage power supply, and an electrical device, which can improve the heat dissipation effect of power devices.

[0004] In a first aspect, embodiments of this application provide a circuit board module, including a circuit board and a heat-conducting sheet. The circuit board has heat-conducting vias configured for solder to be poured into them, so that the solder absorbs and conducts the heat generated by power devices disposed on the circuit board. The heat-conducting sheet has a first side and a second side facing away from each other. The first side is configured to make thermal contact with a heat sink, and the second side is attached to the circuit board and blocks the heat-conducting vias to prevent solder from seeping out of the heat-conducting vias during the pouring process.

[0005] By filling the heat-conducting vias with solder, the good thermal conductivity of the solder can improve the heat dissipation effect on power devices. However, during the soldering process, the solder can easily seep out to the surface of the circuit board near the heat sink, forming solder balls and solder bumps between the circuit board and the heat sink. These solder balls / bumps make point contact with the heat sink, resulting in a gap between the heat sink and the circuit board. This reduces the connection area between the heat sink and the circuit board, thus affecting the heat dissipation effect of the heat sink on the power devices. This application addresses this by using a heat-conducting plate, the second side of which is first sealed. Thermal vias prevent solder from seeping out, improving the problem of solder balls and solder bumps that easily form between the circuit board and the heat sink. This reduces the gap between the thermal pad and the circuit board, making the connection between them tighter and improving the thermal conductivity of the thermal pad for power devices. Due to the improved thermal conductivity of the thermal pad for power devices, more heat can be conducted to the heat sink. Furthermore, the first side of the thermal pad is in contact with the heat sink, ensuring the connection area between the thermal pad and the heat sink, thereby improving the heat dissipation effect of the heat sink for power devices.

[0006] In at least one embodiment, multiple heat-conducting vias are provided, each containing solder, and the openings of the multiple heat-conducting vias toward the heat-conducting sheet are all blocked by the heat-conducting sheet.

[0007] By filling multiple thermal vias with solder, the solder in these vias simultaneously transfers heat from the power devices to the heat sink, improving the thermal conductivity of the power devices. Furthermore, the thermal pad simultaneously seals multiple thermal vias, preventing the solder in each via from seeping out onto the surface of the circuit board near the heat sink. This reduces the gap between the thermal pad and the circuit board, resulting in a tighter connection between them and improving the thermal conductivity of the thermal pad for the power devices. Consequently, more heat can be transferred to the heat sink, enhancing the heat dissipation effect of the heat sink on the power devices.

[0008] In at least one embodiment, a heat-conducting sheet and a plurality of heat-conducting through holes form a set of heat dissipation structures, and a plurality of heat dissipation structures are provided, wherein the heat-conducting sheets of the plurality of heat dissipation structures are configured to be covered by a heat sink.

[0009] The structure of the circuit board module is simplified by using a single heat sink to dissipate heat from multiple power devices.

[0010] In at least one embodiment, multiple heat dissipation structures are distributed in an array.

[0011] Multiple heat dissipation structures distributed in an array can maximize the use of the surface area of ​​the heat sink closest to the circuit board, thereby improving the heat dissipation effect of a single heat sink for multiple power devices.

[0012] In at least one embodiment, the second side of the heat-conducting sheet is provided with a flange, which is embedded in the heat-conducting through hole.

[0013] By setting a flange on the heat-conducting plate and embedding the flange into the heat-conducting through hole, a tight connection between the heat-conducting plate and the circuit board is achieved.

[0014] In at least one embodiment, the second side of the heat-conducting sheet is bonded and welded to the side surface of the circuit board closest to the heat-conducting sheet.

[0015] By setting it up as described above, the distance between the plane of the second side of the heat-conducting sheet and the plane of the heat-conducting through-hole of the circuit board facing the opening of the heat-conducting sheet can be minimized as much as possible, so that the heat-conducting sheet can achieve a better sealing effect and prevent solder from seeping out of the heat-conducting through-hole.

[0016] In at least one embodiment, the circuit board has a front side and a back side distributed along its thickness direction, the front side being for mounting power devices, the back side being in thermal contact with a heat-conducting sheet, and thermally conductive vias penetrating the front side and the back side.

[0017] During the process of pouring solder into the thermal via, the opening of the thermal via on the reverse side of the circuit board is first sealed with a thermal pad. Then, the solder is poured in through the opening of the thermal via on the front side of the circuit board. The power device is mounted on the front side of the circuit board and covers the opening of the thermal via on the front side of the circuit board, so that the solder is less likely to form solder balls and solder bumps between the reverse side of the circuit board and the second side of the thermal pad.

[0018] Secondly, one embodiment of this application provides a control component including a power device and a heat sink. The control component also includes a circuit board module as described above. The power device is disposed on the circuit board of the circuit board module and makes thermal contact with the solder in the thermally conductive through-hole of the circuit board. The heat sink is attached to the first side of the thermally conductive sheet of the circuit board module.

[0019] By applying the aforementioned circuit board module to the control components, the improved heat dissipation of the circuit board module can alleviate the problem of damage caused by excessive temperature, thereby extending the service life of the control components.

[0020] In at least one embodiment, the heat sink includes a heat sink body and a thermally conductive adhesive layer, wherein the thermally conductive adhesive layer is disposed on the heat sink body and bonded to the thermally conductive sheet.

[0021] By bonding the heat-conducting sheet and the heat sink body with a thermally conductive adhesive layer, the gap between the heat-conducting sheet and the heat sink body can be reduced. Furthermore, the thermally conductive adhesive layer itself has good thermal conductivity, which can transfer more heat to the heat sink body for heat dissipation, thereby improving the heat dissipation effect of the heat sink on power devices.

[0022] Thirdly, one embodiment of this application provides an energy storage power supply, including the circuit board module described above.

[0023] By applying the aforementioned circuit board module to an energy storage power supply, the improved heat dissipation of the circuit board module can alleviate the problem of damage caused by excessive temperature, thereby extending the service life of the energy storage power supply.

[0024] Fourthly, one embodiment of this application provides an electrical device including the circuit board module described above.

[0025] By applying the aforementioned circuit board module to electrical equipment, the improved heat dissipation of the circuit board module can alleviate the problem of damage caused by excessive temperature, thereby extending the service life of the electrical equipment. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation on the scope.

[0027] Figure 1 A three-dimensional structural schematic diagram of an energy storage power supply provided in an embodiment of this application;

[0028] Figure 2 An exploded view of an energy storage power source provided in an embodiment of this application;

[0029] Figure 3 This is a schematic diagram of the structure of a control component provided in an embodiment of this application;

[0030] Figure 4 A cross-sectional view of a first embodiment of the circuit board module of the control component provided in this application;

[0031] Figure 5 A cross-sectional view of a second embodiment of the circuit board module of the control component provided in this application.

[0032] Explanation of main component symbols

[0033] 100, Circuit board module; 10, Circuit board; 2022, Thermally conductive adhesive layer; 200, Control component; 11, Thermally conductive through hole; 30, First solder layer; 300, Energy storage power supply; 20, Thermal conductive sheet; 31, Second solder layer; 201, Power device; 21, Flange; 110, Sealing space; 202, Heat sink; 2021, Heat sink body. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0036] Circuit boards and power devices are essential components of electronic devices. Circuit boards are primarily responsible for electrical connections and signal transmission. The layout and design of power devices (such as power transistors and power MOSFETs) on the circuit board directly affect the power handling capability and efficiency of the electronic device. Power devices typically require high current and voltage handling capacity; therefore, the layout of power devices on the circuit board needs to take into account heat dissipation and electrical performance.

[0037] In related technologies, in order to prevent power devices from being damaged due to excessive temperature, vias are usually set on the circuit board, and a heat sink is set on the side of the circuit board away from the power device, so that the heat generated by the power device can reach the heat sink through the vias for heat dissipation. Although heat dissipation can be achieved in this way, the heat dissipation efficiency still needs to be improved.

[0038] In related technologies, when tinning the heat-conducting vias, the solder tends to seep out onto the surface of the circuit board near the heat sink, forming solder balls and solder bumps between the circuit board and the heat sink. This results in a gap between the heat sink and the circuit board, reducing the connection area between them and thus affecting the heat dissipation effect of the heat sink on the power devices.

[0039] An embodiment of this application provides a circuit board module, which includes a circuit board and a heat-conducting sheet. The circuit board has heat-conducting vias configured for solder to be poured into them, so that the solder absorbs and conducts the heat generated by the power devices disposed on the circuit board. The heat-conducting sheet has a first side and a second side opposite to each other. The first side is configured to make thermal contact with a heat sink, and the second side is attached to the circuit board and blocks the heat-conducting vias to prevent the solder from seeping out of the heat-conducting vias during the pouring process.

[0040] By filling the heat-conducting vias with solder, the good thermal conductivity of the solder can improve the heat dissipation effect on power devices. However, during the soldering process, the solder can easily seep out to the surface of the circuit board near the heat sink, forming solder balls and solder bumps between the circuit board and the heat sink. These solder balls / bumps make point contact with the heat sink, resulting in a gap between the heat sink and the circuit board. This reduces the connection area between the heat sink and the circuit board, thus affecting the heat dissipation effect of the heat sink on the power devices. This application addresses this by using a heat-conducting plate, the second side of which is first sealed. Thermal vias prevent solder from seeping out, improving the problem of solder balls and solder bumps that easily form between the circuit board and the heat sink. This reduces the gap between the thermal pad and the circuit board, making the connection between them tighter and improving the thermal conductivity of the thermal pad for power devices. Due to the improved thermal conductivity of the thermal pad for power devices, more heat can be conducted to the heat sink. Furthermore, the first side of the thermal pad is in contact with the heat sink, ensuring the connection area between the thermal pad and the heat sink, thereby improving the heat dissipation effect of the heat sink for power devices.

[0041] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0042] Please see Figure 1 , Figure 2 and Figure 3One embodiment of this application provides a circuit board module 100, a control component 200, an energy storage power supply 300, and an electrical device (not shown).

[0043] In some embodiments, the energy storage power supply 300 includes a circuit board module 100.

[0044] In some embodiments, the electrical device includes a circuit board module 100.

[0045] Please refer to the following: Figure 4 In some embodiments, the control component 200 includes a power device 201, a heat sink 202, and a circuit board module 100.

[0046] Please see Figure 3 and Figure 4 The circuit board module 100 includes a circuit board 10, which has a heat-conducting through hole 11 for filling with solder. A power device 201 is disposed on the circuit board 10 and makes thermal contact with the solder in the heat-conducting through hole 11. A heat sink 202 is disposed on the side of the circuit board 10 away from the power device.

[0047] By filling the heat-conducting through-hole 11 with solder, the solder absorbs and conducts the heat generated by the power device 201 on the circuit board 10. The solder has good thermal conductivity, which can improve the heat conduction effect on the power device 201, thereby conducting more heat to the heat sink 202, and thus improving the heat dissipation effect of the heat sink 202 on the power device 201.

[0048] In specific applications of the power device 201 / control component 200, the power device 201 is often used in high-power applications such as power management, motor control, and signal amplification. The control component 200 can be an inverter control module or a BMS control module.

[0049] Specifically, the BMS (Battery Management System Control Module) is a core component of the battery management system. It primarily monitors battery parameters such as voltage, current, and temperature, and provides functions including battery balancing management, safety protection, thermal management, and communication and data logging to ensure battery performance and safety. Optionally, the BMS control module can be applied to energy storage power supplies, electric vehicles, and robots.

[0050] In some embodiments, the energy storage power supply 300 has the functions of storing and discharging electricity for use as backup power for homes, production units, outdoor work, and outdoor recreation.

[0051] In some embodiments, the electrical equipment may be an air conditioner, a refrigerator, etc.

[0052] Please see Figure 4 In some embodiments, the circuit board module 100 includes a heat-conducting sheet 20 having a first side and a second side opposite to each other. The first side is configured to make thermal contact with the heat sink 202, and the second side is attached to the circuit board 10 and blocks the thermal through-hole 11 to prevent solder from seeping out of the thermal through-hole 11 during the potting process.

[0053] This application improves the problem of solder balls and solder bumps easily forming between the circuit board 10 and the heat sink 202 by setting a heat-conducting plate 20. The second side of the heat-conducting plate 20 first blocks the heat-conducting through hole 11 to prevent solder from seeping out of the heat-conducting through hole 11. This reduces the gap between the heat-conducting plate 20 and the circuit board 10, making the connection between the heat-conducting plate 20 and the circuit board 10 tighter and improving the heat conduction effect of the heat-conducting plate 20 on the power device 201. Due to the improved heat conduction effect of the heat-conducting plate 20 on the power device 201, more heat can be conducted to the heat sink 202. Furthermore, the first side of the heat-conducting plate 20 is in thermal contact with the heat sink 202, ensuring the connection area between the heat-conducting plate 20 and the heat sink 202, thereby improving the heat dissipation effect of the heat sink 202 on the power device 201.

[0054] Optionally, the first surface of the heat-conducting fin 20 makes thermal contact with the heat sink 202 in the following ways: the first surface makes direct contact with the heat sink 202; or a heat sink is provided between the first surface and the heat sink so that the first surface and the heat sink make indirect contact.

[0055] Specifically, the first and second surfaces of the heat-conducting sheet 20 are located on both sides of the thickness direction of the heat-conducting sheet 20, respectively.

[0056] Please see Figure 4 In some embodiments, the heat-conducting sheet 20 and the circuit board 10 are welded together by a first solder layer 30, wherein the first solder layer 30 is solder; the circuit board 10 and the power device 201 are welded together by a second solder layer 31, wherein the second solder layer 31 is solder.

[0057] Please see Figure 4 In some embodiments, multiple heat-conducting through holes 11 are provided, each of which contains tin material, and the openings of the multiple heat-conducting through holes 11 facing the heat-conducting sheet are all blocked by the heat-conducting sheet 20.

[0058] By filling multiple heat-conducting through-holes 11 with solder, the solder in the multiple heat-conducting through-holes 11 simultaneously transfers heat from the power device 201 to the heat sink. Compared to a single heat-conducting through-hole 11, the arrangement of multiple heat-conducting through-holes 11 improves the heat conduction effect on the power device 201. Furthermore, the heat-conducting sheet 20 simultaneously blocks multiple heat-conducting through-holes 11, preventing the solder in each heat-conducting through-hole 11 from seeping out to the surface of the circuit board 10 near the heat sink 202. This reduces the gap between the heat-conducting sheet 20 and the circuit board 10, making the connection between the heat-conducting sheet 20 and the circuit board 10 tighter, and improving the heat conduction effect of the heat-conducting sheet 20 on the power device 201. As a result, more heat can be conducted to the heat sink 202, improving the heat dissipation effect of the heat sink 202 on the power device 201.

[0059] In some embodiments, a single heat-conducting sheet 20 is provided, and solder is disposed within each of the plurality of heat-conducting through holes 11. One end of each of the plurality of heat-conducting through holes 11 is blocked by a single heat-conducting sheet 20. This application can use a single heat-conducting sheet 20 with a larger area to block the plurality of heat-conducting through holes 11. Compared with the solution of using multiple heat-conducting sheets 20 to block the plurality of heat-conducting through holes 11 separately, the solution of using a single heat-conducting sheet 20 to block the plurality of heat-conducting through holes 11 results in fewer components in the circuit board module 100 and a more concentrated structure.

[0060] In some embodiments, the power device 201 is provided with a plurality of thermally conductive through holes 11, the openings of which are all covered by the power device 201, so that the power device 201 can be cooled through the plurality of thermally conductive through holes 11. Compared with the solution with a single thermally conductive through hole 11, the solution with multiple thermally conductive through holes 11 improves the heat dissipation effect of the power device 201.

[0061] In some embodiments, a plurality of thermally conductive vias 11 are arranged in an array. Compared with a plurality of thermally conductive vias 11 distributed in a single direction, a plurality of thermally conductive vias 11 arranged in an array can make full use of the area of ​​the second surface of the heat-conducting sheet 20 when transferring heat to the heat-conducting sheet 20, so that the heat is evenly distributed on the second surface of the heat-conducting sheet 20, thereby improving the heat conduction effect on the power device 201.

[0062] In some embodiments, a heat-conducting sheet 20 and a plurality of heat-conducting through holes 11 form a set of heat dissipation structures, and a plurality of heat dissipation structures are provided, wherein the heat-conducting sheets 20 of the plurality of heat dissipation structures are configured to be covered by a heat sink 202.

[0063] Specifically, multiple thermally conductive vias 11 of a heat dissipation structure are covered by a power device 201.

[0064] Compared to a solution where one heat sink cools one power device, the structure of cooling multiple power devices 201 through one heat sink 202 simplifies the structure of the circuit board module 100.

[0065] In some embodiments, multiple heat dissipation structures are distributed in an array. Compared to multiple heat dissipation structures distributed in a single direction, multiple heat dissipation structures distributed in an array can make maximum use of the area of ​​the surface of the heat sink 202 closest to the circuit board 10, thereby improving the heat dissipation effect of one heat sink 202 on multiple power devices 201.

[0066] Please see Figure 5 In some embodiments, the second side of the heat-conducting sheet 20 is provided with a flange 21, which is embedded in the heat-conducting through hole 11 to make the connection between the heat-conducting sheet 20 and the circuit board 10 tight.

[0067] Please see Figure 5 In some embodiments, the flange 21 is an annular flange, which is interference-fitted with the heat-conducting through hole 11 so that the annular flange, the heat-conducting plate 20 and the heat-conducting through hole 11 form a sealed sealing space 110, thereby improving the sealing effect on the solder and thus better improving the problem of solder balls and solder protrusions easily generated between the circuit board 10 and the heat sink 202.

[0068] In other embodiments, the flange 21 is a solid columnar flange, at least a portion of which is located within the heat-conducting through-hole 11 to block one end of the heat-conducting through-hole 11.

[0069] In some embodiments, the circuit board 10 has a front side and a back side distributed along its thickness direction. The front side is for mounting power devices 201, and the back side is in thermal contact with the heat-conducting sheet 20. The heat-conducting through hole 11 extends through the front side and the back side.

[0070] During the process of pouring solder into the thermal via 11, the opening of the thermal via 11 on the reverse side of the circuit board 10 is first sealed with the thermal plate 20. Then, the solder is poured in from the opening of the thermal via 11 on the front side of the circuit board 10. The power device 201 is mounted on the front side of the circuit board 10 and covers the opening of the thermal via 11 on the front side of the circuit board 10, so that the solder is less likely to form solder balls and solder bumps between the reverse side of the circuit board 10 and the second side of the thermal plate 20.

[0071] In some embodiments, the second surface of the heat-conducting sheet 20 is attached and soldered to the surface of the circuit board 10 near the heat-conducting sheet 20, so that the distance between the plane where the second surface of the heat-conducting sheet 20 is located and the plane where the heat-conducting through hole 11 of the circuit board 10 is located toward the opening of the heat-conducting sheet 20 is minimized as much as possible, so that the heat-conducting sheet 20 can achieve a better sealing effect and prevent solder from seeping out of the heat-conducting through hole 11.

[0072] Specifically, the second side of the heat-conducting sheet 20 is attached to and soldered to the reverse side of the circuit board 10.

[0073] In some embodiments, the area of ​​the second surface of the heat-conducting plate 20 is larger than the area of ​​the opening of the heat-conducting through hole 11 toward the heat-conducting plate 20, so that the heat-conducting plate 20 completely covers the opening of the heat-conducting through hole toward the heat-conducting plate 20.

[0074] In some embodiments, the heat-conducting sheet 20 has a heat dissipation cavity (not shown), which is configured to be circulated with coolant so that when the solder transfers the heat of the power device 201 to the heat-conducting sheet 20, the heat is dissipated by the liquid cooling of the heat-conducting sheet 20. Combined with the arrangement of the heat sink 202, the heat dissipation effect of the power device 201 can be improved.

[0075] In some embodiments, a recess (not shown) is provided on the second surface of the heat-conducting sheet 20. If some solder seeps out from the gap between the second surface of the heat-conducting sheet 20 and the heat-conducting through-hole 11 toward the opening of the heat-conducting sheet 20, the seeping solder can flow into the recess to prevent the solder from continuing to seep out. After the solder is embedded in the recess, it can adhere to the inner surface of the recess. The contact between the recess and the seeping solder is a surface contact. Compared with the point contact between the solder ball / solder protrusion and the heat sink in related technologies, the surface contact makes the contact area between the recess and the seeping solder larger, thereby improving the heat conduction effect of the heat-conducting sheet 20 on the power device 201 to a certain extent, and thus improving the heat dissipation effect of the heat sink on the power device 201.

[0076] In some embodiments, multiple recesses are provided, and the multiple recesses are spaced apart around the heat-conducting through-hole.

[0077] Please see Figure 4 and Figure 5 In some embodiments, the heat sink 202 includes a heat sink body 2021 and a thermally conductive adhesive layer 2022, the thermally conductive adhesive layer 2022 being disposed on the heat sink body 2021 and bonded to the thermally conductive sheet 20.

[0078] By bonding the heat-conducting sheet 20 and the heat sink body 2021 with the thermally conductive adhesive layer 2022, the gap between the heat-conducting sheet 20 and the heat sink body 2021 can be reduced. Furthermore, the thermally conductive adhesive layer 2022 itself has good thermal conductivity, which can transfer more heat to the heat sink body 2021 for heat dissipation, thereby improving the heat dissipation effect of the heat sink 202 on the power device.

[0079] Optionally, the thermally conductive adhesive layer 2022 is a thermally conductive silicone putty or silicone grease sheet.

[0080] In some embodiments, the heat-conducting plate 20 and the heat sink 202 are an integral structure.

[0081] Optionally, the heat-conducting plate 20 is welded to the heat sink 202 as an integral structure; or, the heat-conducting plate 20 is a boss formed by cutting the heat sink 202, so that the heat-conducting plate 20 and the heat sink 202 are formed into an integral structure by cutting.

[0082] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of this application's disclosure.

Claims

1. A circuit board module, characterized in that, include: A circuit board having thermally conductive vias configured to allow solder to be poured into them, so that the solder absorbs and conducts heat generated by power devices disposed on the circuit board. The heat-conducting sheet has a first side and a second side facing away from each other. The first side is configured to make thermal contact with a heat sink, and the second side is attached to the circuit board and blocks the thermally conductive via to prevent the solder from seeping out of the thermally conductive via during the pouring process.

2. The circuit board module according to claim 1, characterized in that, The heat-conducting through holes are provided in multiple ways, and the solder is disposed in each of the multiple heat-conducting through holes. The openings of the multiple heat-conducting through holes facing the heat-conducting sheet are all blocked by the heat-conducting sheet.

3. The circuit board module according to claim 2, characterized in that, A heat-conducting sheet and a plurality of heat-conducting through holes form a heat dissipation structure, and a plurality of heat dissipation structures are provided, wherein the heat-conducting sheets of the plurality of heat dissipation structures are configured to be covered by a heat sink.

4. The circuit board module according to claim 3, characterized in that, Multiple heat dissipation structures are distributed in an array.

5. The circuit board module according to any one of claims 1 to 4, characterized in that, The second surface of the heat-conducting sheet is provided with a flange, which is embedded in the heat-conducting through hole; and / or, The second side of the heat-conducting sheet is attached to and welded to the side surface of the circuit board closest to the heat-conducting sheet.

6. The circuit board module according to any one of claims 1 to 4, characterized in that, The circuit board has a front side and a back side distributed along its thickness direction. The front side is for mounting the power device, and the back side is in thermal contact with the heat-conducting sheet. The heat-conducting through-holes extend through the front side and the back side.

7. A control component, comprising a power device and a heat sink, characterized in that, The control component further includes a circuit board module as described in any one of claims 1 to 6, wherein the power device is disposed on the circuit board of the circuit board module and makes thermal contact with the solder in the thermally conductive via of the circuit board, and the heat sink is attached to the first side of the thermally conductive sheet of the circuit board module.

8. The control component according to claim 7, characterized in that, The heat sink includes a heat sink body and a thermally conductive adhesive layer, wherein the thermally conductive adhesive layer is disposed on the heat sink body and bonded to the thermally conductive sheet.

9. An energy storage power source, characterized in that, The circuit board module includes any one of claims 1 to 6.

10. An electrical appliance, characterized in that, The circuit board module includes any one of claims 1 to 6.

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