High-precision automatic chip mounter for integrated circuit packaging

Abstract

The utility model discloses an automatic chip mounter with high precision for integrated circuit packaging, and relates to the technical field of chip mounters, the automatic chip mounter comprises a full-automatic chip mounter main body, the full-automatic chip mounter main body comprises a bottom box, the upper end of the bottom box is fixedly connected with an end shell, a dust removal mechanism is arranged below the middle part of the end shell, and the dust removal mechanism is fixedly connected with the bottom box. The dust removal mechanism comprises a feeding frame, one side of the upper end of the feeding frame is fixedly connected with a pressing plate, and a dust suction square pipe is arranged above the pressing plate. Through the arrangement of the dust suction square pipe and the air injection frame, when an integrated circuit is placed on the feeding frame, dust on a workpiece can be sucked through the dust suction square pipe, and dust on the workpiece can be removed through the air injection frame; air flow below the workpiece is guided, dust is made to be away from the workpiece, the chip mounting machining precision is guaranteed, dust sucked by the dust suction square pipe is filtered and stored through the dust storage drawer, and therefore the dust content in a factory is further reduced, and the chip mounting machining precision is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of chip mounter technology, and in particular to an automated chip mounter for integrated circuit packaging with high precision. Background Technology

[0002] Pick and place machine: also known as "placement machine" or "surface mount system", it is set after the dispensing machine or screen printer in the production line. It is a device that accurately places surface mount components on PCB pads by moving the placement head. The fully automatic pick and place machine is a device used to achieve high-speed, high-precision, fully automatic placement of components. It is the most critical and complex equipment in the entire SMT production.

[0003] In the prior art, such as Chinese patent CN221995736U, an automated placement machine for integrated circuit packaging with high precision is disclosed, including an automated placement machine body, a housing fixedly connected to the top right side of the automated placement machine body, a dual-axis motor fixedly connected to the inner cavity of the housing, a threaded rod fixedly connected to the output shaft of the dual-axis motor, a threaded sleeve sleeved on the surface of the threaded rod, and a limit block fixedly connected to the surface of the threaded sleeve.

[0004] However, in the existing technology, the packaging of integrated circuits requires a dust-free operation to ensure that the pins are connected correctly. The integrated circuit substrate and other components are transported by a conveyor mechanism and then placed at the loading point of an automated placement machine for placement. During this process, dust can easily adhere to the components, which will affect the placement process. Utility Model Content

[0005] The purpose of this invention is to address the problem in the existing technology that integrated circuit packaging requires dust-free operation to ensure correct pin connections. However, the integrated circuit substrate and other components are transported by a conveyor mechanism and then placed at the loading point of an automated pick-and-place machine for placement. During this process, dust easily adheres to the components, affecting the placement process. Therefore, this invention proposes a high-precision automated pick-and-place machine for integrated circuit packaging.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a high-precision automated placement machine for integrated circuit packaging, comprising a fully automatic placement machine body, the fully automatic placement machine body including a base box, an end shell fixedly connected to the upper end of the base box, a dust removal mechanism disposed below the middle of the end shell, the dust removal mechanism including a feeding rack, a pressing plate fixedly connected to one side of the upper end of the feeding rack, a dust suction square tube disposed above the pressing plate, a second connecting pipe fixedly connected to the upper end of the dust suction square tube, and an air jet frame fixedly connected inside the feeding rack below the dust suction square tube, the lower end of the air jet frame being fixedly connected to... A first connecting pipe is connected to the bottom box, and a dust collection box and an air pump are fixedly connected inside the bottom box. A dust collection tray is slidably connected inside the dust collection box. A first connecting port is fixedly connected to the upper end of the dust collection box, and a second connecting port is fixedly connected to the lower middle part of one side of the dust collection box. The second connecting port is located below the dust collection tray. The first connecting port is used to connect to the second connecting pipe with a pipe. The second connecting port is used to connect to the input end of the air pump with a pipe. The output end of the air pump is used to connect to the first connecting pipe with a pipe. The drive assembly of the conveyor belt in the feeding rack is placed inside the end shell, and a filter screen is installed at the lower end of the dust collection tray.

[0007] Preferably, a connecting hole is provided on one side of the base box, and a display screen and a control structure are fixedly connected to one side of the end shell.

[0008] Preferably, the end shell is equipped with a fully automatic patching structure, and a flip cover is rotatably connected to the middle of the end shell.

[0009] Preferably, the interior of the pressing plate is provided with a slot, and both ends of the dust suction square tube are provided with an assembly frame. The lower end of the assembly frame is fixedly connected with a locking block, and the locking block engages with the slot.

[0010] Preferably, the assembly frame has a limiting groove inside, the limiting groove is slidably connected to the dust collection square tube, and a threaded rod is fixedly connected inside the limiting groove.

[0011] Preferably, the lower end of the vacuum tube has bottom grooves on both sides, and the upper end of the bottom groove has a through hole through which the threaded rod passes.

[0012] Preferably, a nut is threaded to the outer side of the threaded rod, and a spring is fixedly connected between the upper end of the bottom groove and the lower end of the limiting slide groove.

[0013] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0014] 1. In this utility model, by setting up a dust suction tube and an air jet frame, when the integrated circuit is placed on the feeding rack, the dust on the workpiece can be adsorbed by the dust suction tube, and the air jet frame can guide the airflow below the workpiece to keep the dust away from the workpiece, thus ensuring the accuracy of the surface mount processing. The dust suction tube is filtered and stored by the dust collection drawer, thereby further reducing the dust content in the factory and ensuring the accuracy of the surface mount processing.

[0015] 2. In this utility model, by setting up a spring and a nut, the distance between the lower end of the dust-collecting square tube and the surface of the workpiece can be adjusted by rotating the nut according to the different thicknesses of the workpiece being processed. This allows for better adsorption of dust from the workpiece surface, ensuring processing accuracy. At the same time, the dual restriction of the limiting slide groove and the threaded rod further ensures the limiting effect of the dust-collecting square tube. By setting up the slot and the assembly frame, the position of the dust-collecting square tube can be adjusted according to needs, making it convenient to use. Attached Figure Description

[0016] Figure 1 A three-dimensional structural diagram of an automated chip mounter for integrated circuit packaging with high precision is provided for this utility model;

[0017] Figure 2 This utility model presents a schematic diagram of the internal structure of an automated chip mounter for high-precision integrated circuit packaging.

[0018] Figure 3 This utility model provides a three-dimensional structural diagram of a dust removal mechanism in an automated chip mounter for high-precision integrated circuit packaging.

[0019] Figure 4 This utility model provides a schematic diagram of the connection structure between the dust-collecting square tube and the assembly rack in an automated chip mounter for high-precision integrated circuit packaging.

[0020] Figure 5 This utility model provides a schematic diagram of the connection structure between the bottom box and the air pump in an automated placement machine for high-precision integrated circuit packaging;

[0021] Figure 6 This invention provides an exploded view of the internal structure of the dust collection box in an automated placement machine for high-precision integrated circuit packaging.

[0022] Legend:

[0023] 1. Main body of the fully automatic chip mounter; 11. Base box; 12. End shell; 13. Display screen; 14. Control structure; 15. Flip cover; 16. Connecting hole; 17. Fully automatic chip mounter structure;

[0024] 2. Dust removal mechanism; 21. Feeding rack; 22. Pressing plate; 23. Slot; 24. Assembly rack; 25. Dust suction square tube; 26. Air jet rack; 27. No. 1 connecting pipe; 28. No. 2 connecting pipe; 29. ​​Locking block; 210. Threaded rod; 211. Limiting slide groove; 212. Bottom groove; 213. Spring; 214. Nut; 215. Through hole; 216. Dust collection box; 217. Air pump; 218. No. 1 connecting port; 219. Dust collection drawer; 220. No. 2 connecting port. Detailed Implementation

[0025] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0026] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0027] Example 1: As Figure 1 - Figure 6 As shown, this utility model provides a high-precision automated pick-and-place machine for integrated circuit packaging, including a fully automatic pick-and-place machine body 1. The fully automatic pick-and-place machine body 1 includes a base box 11, an end shell 12 fixedly connected to the upper end of the base box 11, a dust removal mechanism 2 arranged in the lower middle part of the end shell 12, the dust removal mechanism 2 including a feeding rack 21, a pressing plate 22 fixedly connected to one side of the upper end of the feeding rack 21, a dust suction square tube 25 arranged above the pressing plate 22, a second connecting pipe 28 fixedly connected to the upper end of the dust suction square tube 25, an air jet frame 26 fixedly connected inside the feeding rack 21 below the dust suction square tube 25, a first connecting pipe 27 fixedly connected to the lower end of the air jet frame 26, and the interior of the base box 11 is fixedly... A dust collection box 216 is connected to an air pump 217. A dust collection tray 219 is slidably connected inside the dust collection box 216. A first connection port 218 is fixedly connected to the upper end of the dust collection box 216. A second connection port 220 is fixedly connected to the lower middle part of one side of the dust collection box 216. The second connection port 220 is located below the dust collection tray 219. The first connection port 218 is used to connect to the second connection pipe 28 through a pipe. The second connection port 220 is used to connect to the input end of the air pump 217 through a pipe. The output end of the air pump 217 is used to connect to the first connection pipe 27 through a pipe. The drive assembly of the conveyor belt inside the feeding rack 21 is placed inside the end shell 12. A filter screen is installed inside the lower end of the dust collection tray 219.

[0028] The specific settings and functions of this embodiment are described below. With the arrangement of the suction tube 25 and the air jet frame 26, when the integrated circuit is placed on the feed rack 21, the suction tube 25 can adsorb the dust on the workpiece, and the air jet frame 26 can guide the airflow below the workpiece to keep the dust away from the workpiece, thus ensuring the accuracy of the surface mount processing. The dust collection tray 219 filters and stores the dust sucked in by the suction tube 25, thereby further reducing the dust content in the factory and ensuring the accuracy of the surface mount processing.

[0029] Example 2: Figure 1 - Figure 5 As shown, a connecting hole 16 is provided on one side of the base box 11, and a display screen 13 and a control structure 14 are fixedly connected to one side of the end shell 12. A fully automatic patching structure 17 is installed inside the end shell 12, and a flip cover 15 is rotatably connected to the middle of the end shell 12. A slot 23 is provided through the inside of the pressing plate 22. Assembly racks 24 are provided at both ends of the dust suction square tube 25. A locking block 29 is fixedly connected to the lower end of the assembly rack 24. The locking block 29 engages with the slot 23. The inside of the assembly rack 24 is provided with... A limiting slide groove 211 is provided, which is slidably connected to the dust collection square tube 25. A threaded rod 210 is fixedly connected inside the limiting slide groove 211. Bottom grooves 212 are provided on both sides of the lower end of the dust collection square tube 25. A through hole 215 is provided at the upper end of the bottom groove 212. The threaded rod 210 passes through the through hole 215. A nut 214 is threadedly connected to the outer side of the threaded rod 210. A spring 213 is fixedly connected between the upper end of the bottom groove 212 and the lower end of the limiting slide groove 211.

[0030] The overall effect of this embodiment is that, through the setting of spring 213 and nut 214, the distance between the lower end of the dust-collecting square tube 25 and the workpiece surface can be adjusted by rotating nut 214 according to the different thicknesses of the workpiece being processed, thereby better adsorbing dust on the workpiece surface and ensuring processing accuracy. At the same time, the dual restriction of the limiting slide groove 211 and the threaded rod 210 can further ensure the restriction effect of the dust-collecting square tube 25. Through the setting of slot 23 and assembly frame 24, the position of the dust-collecting square tube 25 can be adjusted according to needs, making it convenient to use.

[0031] The usage and working principle of this device are as follows: When in use, place the integrated circuit component that needs to be surface mount on the feeding rack 21. According to the thickness of the component, turn the nut 214 to adjust the distance between the lower end of the suction tube 25 and the upper surface of the component. Move the component by the conveyor belt, turn on the air pump 217, the suction tube 25 draws in air, the air jet rack 26 blows out air, the suction tube 25 sucks in dust, and the dust enters the dust collection box 216 through the pipe. The dust is filtered and stored by the dust collection tray 219. Then the feeding rack 21 moves the integrated circuit component into the end shell 12, and the fully automatic surface mount structure 17 performs the packaging process on the integrated circuit component.

[0032] The above are merely preferred embodiments of this utility model and are not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from the technical solution of this utility model shall still fall within the protection scope of this utility model.

Claims

1. A high-precision automated placement machine for integrated circuit packaging, comprising a fully automatic placement machine body (1), characterized in that: The main body (1) of the fully automatic chip mounter includes a base box (11). An end shell (12) is fixedly connected to the upper end of the base box (11). A dust removal mechanism (2) is provided in the lower middle part of the end shell (12). The dust removal mechanism (2) includes a feeding rack (21). A pressing plate (22) is fixedly connected to one side of the upper end of the feeding rack (21). A dust suction square tube (25) is provided above the pressing plate (22). A second connecting pipe (28) is fixedly connected to the upper end of the dust suction square tube (25). An air jet frame (26) is fixedly connected inside the feeding rack (21) below the dust suction square tube (25). A first connecting pipe (27) is fixedly connected to the lower end of the air jet frame (26). The base box (11) A dust collection box (216) and an air pump (217) are fixedly connected inside. A dust collection tray (219) is slidably connected inside the dust collection box (216). A first connection port (218) is fixedly connected to the upper end of the dust collection box (216). A second connection port (220) is fixedly connected to the lower middle part of one side of the dust collection box (216). The second connection port (220) is located below the dust collection tray (219). The first connection port (218) is used to connect to the second connection pipe (28) using a pipe. The second connection port (220) is used to connect to the input end of the air pump (217) using a pipe. The output end of the air pump (217) is used to connect to the first connection pipe (27) using a pipe.

2. The high-precision automated placement machine for integrated circuit packaging according to claim 1, characterized in that: A connecting hole (16) is provided on one side of the bottom box (11), and a display screen (13) and a control structure (14) are fixedly connected to one side of the end shell (12).

3. The high-precision automated placement machine for integrated circuit packaging according to claim 1, characterized in that: The end shell (12) is equipped with a fully automatic patching structure (17), and a flip cover (15) is rotatably connected to the middle of the end shell (12).

4. The high-precision automated placement machine for integrated circuit packaging according to claim 1, characterized in that: The interior of the pressing plate (22) is provided with a slot (23), and both ends of the dust suction square tube (25) are provided with an assembly frame (24). The lower end of the assembly frame (24) is fixedly connected with a locking block (29), and the locking block (29) engages with the slot (23).

5. The high-precision automated placement machine for integrated circuit packaging according to claim 4, characterized in that: The assembly frame (24) has a limiting groove (211) inside, which is slidably connected to the dust collection square tube (25). A threaded rod (210) is fixedly connected inside the limiting groove (211).

6. The high-precision automated placement machine for integrated circuit packaging according to claim 5, characterized in that: The bottom of the vacuum tube (25) is provided with bottom grooves (212) on both sides, and the upper end of the bottom groove (212) is provided with a through hole (215), through which the threaded rod (210) passes.

7. The high-precision automated placement machine for integrated circuit packaging according to claim 6, characterized in that: The outer thread of the threaded rod (210) is threaded with a nut (214), and a spring (213) is fixedly connected between the upper end of the bottom groove (212) and the lower end of the limiting slide groove (211).

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