Refrigeration helmet capable of forcibly supplying air

Abstract

The utility model discloses a refrigeration helmet capable of forcibly supplying air, which is characterized in that a shell is provided with a hollow double-layer structure, and an air supply cavity is formed by a hollow part; a temperature control module is arranged at the rear part of the shell; the temperature control module comprises an air supply cabin, a ventilation cabin, a control cabin, a power supply cabin, a fresh air port, a heat dissipation air port and an air supply duct; a semiconductor chilling plate is arranged between the air supply cabin and the ventilation cabin, cold air fins are arranged on one side of the semiconductor chilling plate, and heat dissipation fins are arranged on the other side of the semiconductor chilling plate; a centrifugal fan is arranged between the air supply cabin and the fresh air port, and an axial flow fan is arranged in the ventilation cabin; and the air supply duct is communicated with the air supply cavity. A cold source is obtained according to the semiconductor refrigeration principle, air is forcibly supplied into the helmet through the centrifugal fan and the special structure of the helmet, air supply uniformity is kept, condensate water is prevented from being separated out, meanwhile, the temperature of all points in the inner space of the helmet is effectively controlled and adjusted, the refrigeration effect is good, the application range is wide, and the helmet is comfortable to wear.

Description

TECHNICAL FIELD

[0001] The utility model relates to a helmet technology especially a forced air supply's refrigeration helmet. BACKGROUND

[0002] The helmet is necessary protection tool for driving motorcycle, electric vehicle, bicycle and other life scene, and is necessary protection article for factory, construction site and other work scene, and is widely used. However, in summer or high intensity physical activity, the helmet affects the human head heat dissipation, and the head is the concentrated part of the human heat dissipation, and in this case, high temperature and stuffy feeling appear, so the reality exists the phenomenon of unwilling to wear due to the comfort of wearing helmet, thereby causing safety hazard.

[0003] For the refrigeration mode, usually consider two kinds, one is radiation heat exchange, one is convection heat exchange. The above-mentioned application of the refrigeration mode is usually radiation heat exchange, but for the small space of the helmet, the temperature difference needs to be strictly controlled considering the condensate water problem, so a more reasonable refrigeration method needs to be adopted to complete the refrigeration function in the helmet. SUMMARY

[0004] The utility model discloses a forced air supply's refrigeration helmet, which cools fresh air through a semiconductor refrigeration device, uniformly distributes cool air according to the inherent structure of the helmet, avoids the appearance of condensate water by using forced air supply, and has the characteristics of efficient refrigeration, convenient operation and on-demand adjustment.

[0005] The above technical problems of the utility model are mainly solved by the following technical scheme: a forced air supply's refrigeration helmet, including the shell, characterized by: the shell has a hollow double-layer structure, the hollow part forms an air supply cavity, and a plurality of air supply air outlets are arranged on the inner side wall of the air supply cavity; a temperature control module is arranged at the rear of the shell.

[0006] The temperature control module includes an air supply cabin, a ventilation cabin, a control cabin, a power supply cabin, a fresh air outlet, a heat dissipation air outlet and an air supply air duct. The air supply cabin and the ventilation cabin are provided with a semiconductor refrigeration sheet therebetween, the semiconductor refrigeration sheet is provided with cold air fins on the side facing the air supply cabin, and the semiconductor refrigeration sheet is provided with heat dissipation fins on the side facing the ventilation cabin.

[0007] A centrifugal fan is arranged between the air supply cabin and the fresh air outlet, and an axial flow fan is arranged in the ventilation cabin.

[0008] In the foregoing forced air supply's refrigeration helmet, preferably, a buffer pad layer and an inner liner pad are arranged in sequence on the inner side of the shell, the buffer pad layer is provided with a first hollow part matched with the air supply air outlet on the shell, and the inner liner pad is provided with a second hollow part matched with the air supply air outlet and the first hollow part.

[0009] In the aforementioned forced air cooling helmet, preferably, the control cabin is provided with a controller, and cold end sensors and hot end sensors are arranged on both sides of the semiconductor refrigeration sheet; the helmet is provided with an in-helmet sensor, and the air supply cavity is provided with an air supply sensor, and all the sensors are connected to the controller.

[0010] In the aforementioned forced air cooling helmet, preferably, the temperature control module has a cuboid structure, and the air supply cabin, the ventilation cabin, the control cabin and the power supply cabin in the temperature control module are sealed and separated from each other by webs and semiconductor refrigeration sheets.

[0011] In the aforementioned forced air cooling helmet, preferably, in the temperature control module, the fresh air inlet is arranged at the bottom, the power supply cabin and the ventilation cabin are arranged on the same side, and the centrifugal fan and the control cabin are arranged on the same side.

[0012] In the aforementioned forced air cooling helmet, preferably, a control cabin cover plate is arranged at the control cabin, and the centrifugal fan is provided with a fan shell.

[0013] In the aforementioned forced air cooling helmet, preferably, a heat insulation plate is arranged between the air supply cabin and the ventilation cabin.

[0014] In the aforementioned forced air cooling helmet, preferably, the cuboid structure of the temperature control module has an independent box body structure or a partial box body structure with a common box wall of the helmet.

[0015] In the aforementioned forced air cooling helmet, preferably, the power supply cabin is provided with a power supply, and the positive and negative poles of the power supply are switchable.

[0016] The technical scheme utilizes the semiconductor refrigeration mode to supply air to the inside of the helmet, sets an air supply cavity according to the special structure of the helmet shell, and arranges air supply inlets on the inside of the air supply cavity according to human anatomy, so that uniform air supply in the helmet is achieved, the shell with the cavity has limited influence on the weight of the helmet, but can improve the structural strength of the helmet.

[0017] In the technical scheme, the forced air supply in the helmet is completed by the centrifugal fan, outdoor air enters the air supply cabin through the fresh air inlet, exchanges heat with the cold air fins on one side of the semiconductor refrigeration sheet, and is then supplied to the air supply cavity through the air supply air duct and distributed to the inside of the helmet, so that the user of the helmet feels comfortable and clean wind. On the other side of the semiconductor refrigeration sheet, the heat of the heat dissipation fins after heat exchange is taken out of the shell by the axial flow fan, so that the operating temperature of the hot end meets the use requirements. The air inlet in the device can also be inhaled from the four sides of the heat dissipation inlet, and the air is blown out by the axial flow fan through the heat dissipation inlet after heat exchange with the heat dissipation fins. The cold and hot sides do not interfere with each other, so that the semiconductor refrigeration sheet can achieve the best heat exchange efficiency.

[0018] To ensure the cooling effect of the helmet and the effective operation of the semiconductor refrigeration system, the device is provided with multiple sensors. All the sensors are provided with temperature and humidity monitoring and data transmission functions, and various data inputs are all input into the controller. Through the arrangement of the sensors, the cooling effect in the helmet is ensured, the dew point temperature in the helmet is monitored, the condensate is prevented from being separated out, and the control system is adjusted in feedback to the air supply temperature, the refrigeration power of the semiconductor refrigeration piece and other parameters, and meanwhile, the temperature at both ends of the semiconductor refrigeration piece is monitored to prevent the semiconductor refrigeration piece from being damaged due to overcooling or overheating.

[0019] Compared with the prior art, the device has the advantages that: the cold source is obtained by using the semiconductor refrigeration principle, the centrifugal fan and the special structure of the helmet are used to forcibly supply air into the helmet and keep the air supply uniform, the condensate is prevented from being separated out, the temperature at each point in the helmet is effectively controlled and adjusted, and a good state that meets the requirements of the user is achieved; the application range is wide; the refrigeration effect is good, and the wearing is comfortable. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a schematic view of an overall sectional structure of the device.

[0021] Figure 2 is a schematic view of a shell structure of the device.

[0022] Figure 3 is Figure 1 is a schematic view of a local enlarged structure at M in the device.

[0023] Figure 4 is a refrigeration principle diagram of the device.

[0024] Figure 5 is a schematic view of an internal cabin distribution structure of a temperature control module of the device.

[0025] Figure 6 is a schematic view of a component arrangement structure of the temperature control module of the device.

[0026] In the drawings: 1 - shell, 101 - air supply cavity, 102 - air supply air port, 2 - temperature control module, 201 - box body, 202 - ventilation cabin, 203 - air supply cabin, 204 - power supply cabin, 205 - semiconductor refrigeration piece, 206 - heat dissipation air port, 207 - fresh air port, 208 - control cabin, 209 - control cabin cover plate, 210 - heat dissipation fin, 211 - cold air fin, 212 - controller, 213 - axial flow fan, 214 - power supply, 215 - power supply cabin cover, 216 - centrifugal fan, 217 - fan shell, 218 - cold end sensor, 219 - in-helmet sensor, 220 - hot end sensor, 3 - buffer layer, 301 - first hollowed-out portion, 401 - second hollowed-out portion, 4 - liner gasket. DETAILED DESCRIPTION

[0027] The technical scheme of the utility model is further specifically explained below by examples and in combination with the drawings.

[0028] A forced air supply refrigeration helmet, as shown in Figure 1 、 Figure 2 , comprises a full helmet structure shell 1, the shell 1 has a hollow double-layer structure, the hollow double-layer structure is generally arranged on the upper part of the shell, a hollow part forms an air supply cavity 101, a plurality of air supply air outlets 102 are arranged on the inner side wall of the air supply cavity 101, and the shell 1 is made of carbon fiber, glass fiber or the like.

[0029] A buffer pad layer 3 and an inner liner pad 4 are sequentially arranged on the inner side of the shell 1. In order to meet the uniform air supply requirement, in combination with the air supply air outlet 102 of the air supply cavity 101, the buffer pad layer 3 is provided with a first hollowing 301 matched with the air supply air outlet 102 on the shell 1, as shown in Figure 3 , and the inner liner pad 4 is provided with a second hollowing 401 matched with the air supply air outlet 102 and the first hollowing 301.

[0030] The buffer pad layer 3 is made of EPS or the like, can be extruded and deformed when the helmet is impacted, absorbs the impact force, and reduces the impact on the head. The EPS or the like is a lightweight material, and is convenient to process. The inner liner pad 4 is made of velvet or the like for the comfort of wearing, and the hollowing range of the inner liner pad 4 can be more flexible, and the main principle is not to block the air supply. Thus, the helmet shell 1 combines the hollowing of the buffer pad layer 3 and the hollowing of the inner liner pad 4, and forms an overall structure to ensure the uniformity of air supply.

[0031] A temperature control module 2 is arranged at the rear of the shell 1.

[0032] The temperature control module 2 has a cuboid structure, can be installed on the helmet shell 1 as an assembled module, has an independent box body 201, and is directly connected with the air supply cavity 101 of the helmet shell 1 by an air supply air duct 222, so as to send the cooled air into the helmet after processing. Of course, the temperature control module 2 can also be partially arranged in combination with the helmet shell 1, and has a common box wall including a box cover and other box body structures of the shell 1.

[0033] Inside the cuboid structure of the temperature control module 2, the air supply cabin 203, the ventilation cabin 202, the control cabin 208 and the power supply cabin 204 are sealed and separated from each other by a rib plate integrated with the box body 201, and the semiconductor refrigerating sheet 205 between the air supply cabin 203 and the ventilation cabin 202 is used as a partition member.

[0034] The inside of the temperature control module 2 is divided into four independent cabins, namely the air supply cabin 203, the ventilation cabin 202, the control cabin 208 and the power supply cabin 204, as shown in Figure 5As shown, the box body 201 is provided with a fresh air inlet 207, a heat dissipation air inlet 206 and a air supply air duct 222. The fresh air inlet 207 is arranged at the bottom of the box body 201, the heat dissipation air inlet 206 is arranged on the outer side of the box body 201, and the air supply air duct 222 is arranged at the top of the shell 1. Thus, the cabin is arranged with the power supply cabin 204 and the ventilation cabin 202 on the same side, and the centrifugal fan 216 and the control cabin 208 are arranged on the same side.

[0035] The semiconductor refrigeration sheet 205 is arranged between the air supply cabin 203 and the ventilation cabin 202, the semiconductor refrigeration sheet 205 is provided with cold air fins 211 on the side facing the air supply cabin 203, and the semiconductor refrigeration sheet 205 is provided with heat dissipation fins 210 on the side facing the ventilation cabin 202, as shown. Figure 6 The centrifugal fan 216 is arranged between the air supply cabin 203 and the fresh air inlet 207, the axial flow fan 213 is arranged in the ventilation cabin 202, and the air supply air duct 222 is communicated with the air supply cavity 101.

[0036] Further, the air supply cabin 203 and the ventilation cabin 202 are isolated by heat insulation material to prevent heat loss. The number of semiconductor refrigeration sheets 205 can be set according to actual needs, for example, one or two.

[0037] The cold air fins 211 on the side of the air supply cabin 203 are arranged vertically in the same direction as the air flow. The outdoor air is sucked into the air supply air duct 222 by the centrifugal fan 216 through the fresh air inlet 207 and fully exchanges heat with the cold air fins 211. The centrifugal fan 216 is provided with a fan housing 217, and the fan housing 217 is tightly connected with the box body 201 of the temperature control module 2 to strengthen the air flow organization of the fan.

[0038] The air that has completed heat exchange is sent into the air supply cavity 101 of the helmet to complete the preparation and delivery of the air supply. Figure 4 Further, the volume and surface shape of the control cabin 208 are set in combination with the shape of the air supply cabin 203, the controller 212 is arranged in the control cabin 208, and the controller 212 realizes the temperature control function of the refrigeration helmet in combination with the sensors arranged at multiple positions. As shown, the sensors are arranged according to actual needs, such as the cold end sensor 218 and the hot end sensor 220 arranged on both sides of the semiconductor refrigeration sheet 205, the in-helmet sensor 219 arranged in the shell 1, and the air supply sensor 221 arranged in the air supply cavity 101. All the sensors are connected with the controller 212.

[0039] The control cabin 208 is provided with a control cabin cover plate 209, and the centrifugal fan 216 is provided with a fan shell 217, so as to facilitate maintenance of the controller 209 and the centrifugal fan 216. The direction of the heat dissipation fins 210 of the semiconductor refrigeration sheet 205 is not limited, because the direction of the outdoor air entering the ventilation cabin 202 is not limited, the outdoor air can enter from the periphery of the heat dissipation air outlet 206, and after heat exchange through the heat dissipation fins 210, the outdoor air is blown out of the heat dissipation air outlet 206 through the axial flow fan 213, so as to complete heat dissipation at the hot end of the semiconductor refrigeration sheet 205.

[0040] The power supply cabin 204 is provided with a power supply 214, and the positive and negative poles of the power supply 214 can be switched. The power supply can adopt a form of a rechargeable lithium battery, or the battery can be integrally hidden, and a charging interface is reserved on the outside, so as to facilitate external power supply for continuous power supply when the helmet is used for a long time. The power supply cabin 204 is provided with a power supply cabin cover 215 on the outside, so as to facilitate battery replacement. When the battery is integrally hidden and the charging interface is reserved, the power supply cabin cover 215 can not be provided.

[0041] In use, the centrifugal fan 216 inputs fresh air to the air supply cabin 203, the fresh air is subjected to heat exchange through the cold air fins 211 and the semiconductor refrigeration sheet 205, the cold air obtained after cooling is introduced into the air supply cavity 101 through the air supply air duct 222, and then is uniformly distributed into the helmet shell 1 through the air supply air outlet 102, so that the helmet is cooled. At the hot end of the semiconductor refrigeration sheet 205, the heat absorbed by the heat dissipation fins 210 is discharged from the shell through the axial flow fan 213. At this time, because the direction of the outdoor air entering the ventilation cabin 202 is not limited, the natural wind enters from the periphery of the heat dissipation air outlet 206, is subjected to heat exchange with the heat dissipation fins 204, and is then discharged, so that the semiconductor refrigeration sheet 205 can fully play a heat exchange effect.

[0042] In the embodiment, the positive and negative poles of the power supply 214 can be switched, so that the cold end and the hot end are switched, and the refrigeration-heating function is exchanged.

[0043] The helmet in the embodiment can be a half helmet, a 3 / 4 helmet, an off-road helmet, and the like, and the technical solutions of the helmets can be inspired from the design principles of the embodiment.

[0044] The above-described embodiments are used to illustrate the present application, but are not used to limit the present application, and the described embodiments are only some of the embodiments of the present application, but are not all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the present application.

Claims

1. A forced air cooled headgear comprising a shell (1) characterised in that: The shell has a hollow double-layer structure, a blowing cavity (101) is formed by a hollow part, and a plurality of blowing air outlets (102) are arranged on the inner side wall of the blowing cavity; a temperature control module (2) is arranged at the rear of the shell; The temperature control module comprises a blowing cabin (203), a ventilation cabin (202), a control cabin (208), a power supply cabin (204), a fresh air outlet (207), a heat dissipation air outlet (206) and a blowing air duct (222); wherein a semiconductor refrigerating sheet (205) is arranged between the blowing cabin and the ventilation cabin, cold air fins (211) are arranged on the side of the semiconductor refrigerating sheet facing the blowing cabin, and heat dissipation fins (210) are arranged on the side of the semiconductor refrigerating sheet facing the ventilation cabin; A centrifugal fan (216) is arranged between the blowing cabin and the fresh air outlet, and an axial flow fan (213) is arranged in the ventilation cabin; the blowing air duct is communicated with the blowing cavity.

2. A forced air cooled head top according to claim 1, wherein, A buffer pad layer (3) and an inner liner pad (4) are sequentially arranged on the inner side of the shell (1), wherein the buffer pad layer is provided with a first hollow part (301) matched with the blowing air outlet (102) on the shell, and the inner liner pad is provided with a second hollow part (401) matched with the blowing air outlet and the first hollow part.

3. A forced air cooled head top according to claim 1, wherein, A controller (212) is arranged in the control cabin (208), cold end sensors (218) and hot end sensors (220) are respectively arranged on the two sides of the semiconductor refrigerating sheet (205), an in-helmet sensor (219) is arranged in the shell (1), and a blowing air sensor (221) is arranged in the blowing cavity (101); all the sensors are connected with the controller.

4. A forced air cooled head top according to claim 1, wherein, The temperature control module (2) has a cuboid structure, and the blowing cabin (203), the ventilation cabin (202), the control cabin (208) and the power supply cabin (204) in the temperature control module are sealed and separated from each other by a rib plate and the semiconductor refrigerating sheet (205).

5. A forced air cooled headgear according to claim 4 wherein, In the temperature control module (2), the fresh air outlet (207) is arranged at the bottom, the power supply cabin (204) and the ventilation cabin (202) are located on the same side, and the centrifugal fan (216) and the control cabin (208) are arranged on the same side.

6. A forced air cooled head top according to claim 5, wherein, A control cabin cover plate (209) is arranged at the control cabin (208) part, and the centrifugal fan (216) is provided with a fan shell (217).

7. A forced air cooled head top according to claim 1 wherein, A heat insulation plate is arranged between the blowing cabin (203) and the ventilation cabin (202).

8. A forced air cooled head top according to claim 4, wherein, The cuboid structure of the temperature control module (2) is a separate box body (201) structure, or a partial box body structure with a common box wall of the shell (1).

9. A forced air cooled head top according to claim 1, wherein, The power supply cabin (204) is provided with a power supply (214), and the positive and negative poles of the power supply are switchable.

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