Wire-drawing die polishing machining table with lifting adjustment function
By using a height-adjustable wire drawing die grinding table, the problem of debris scraping caused by the fixed contact point between the grinding needle and the wire drawing die was solved, achieving effective debris removal and improving the processing accuracy and yield of the wire drawing die.
Patent Information
- Application Number
- CN202423218822.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-25
AI Technical Summary
In the prior art, during the grinding process of the grinding needle on the wire drawing die, the metal debris may scrape the inner hole of the wire drawing die, affecting its quality.
Design a height-adjustable wire drawing die grinding table. By setting a lifting guide rod and a movable platform on the base plate, the movable platform is driven by a lifting adjustment cylinder to make periodic lifting and lowering movements along the lifting guide rod, changing the contact position between the grinding needle and the wire drawing die. Combined with rubber pads and chip removal holes, the chip removal is effectively achieved.
It effectively prevents metal shavings from scratching the inner hole of the wire drawing die, improves the processing accuracy and yield of the wire drawing die, and ensures the processing quality.
Smart Images
Figure CN223670895U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to the field of wire drawing die processing equipment technology, specifically relates to a wire drawing die polishing processing platform of lift adjustment. BACKGROUND
[0002] Wire drawing die is a kind of die for metal wire drawing production, and the wire drawing die is provided with a die core inner hole in the center, and when the wire drawing die is processed, a hole is first rough-machined in the center of the blank of the wire drawing die, and then the hole is polished and processed into a shape by using a grinding needle.
[0003] The existing wire drawing die is placed in batches on the processing table during processing, and the grinding needle is driven by the upper grinding machine head to polish the inner hole of the wire drawing die, but the contact point between the grinding needle and the wire drawing die is fixed, and the grinding process will generate debris, which may be scraped off the wire drawing die along with the grinding needle during polishing, seriously affecting the quality of the wire drawing die. UTILITY MODEL CONTENTS
[0004] The utility model aims at providing a wire drawing die polishing processing platform of lift adjustment to solve the problems in the wire drawing die processing process in the background art.
[0005] To achieve the above object, the utility model provides the following technical scheme: a wire drawing die polishing processing platform of lift adjustment, including base plate, two groups of lift guide rods are arranged side by side on the base plate, and the lift guide rods are provided with movable platform, the top surface of the movable platform is provided with multiple material supports, the bottom of the movable platform is provided with lift adjustment cylinder, and the lift adjustment cylinder drives the movable platform to slide along the lift guide rod.
[0006] Preferably, the material support includes a rotating disc and a rubber cushion, the rubber cushion is arranged above the rotating disc, and the rotating disc is connected with a driving belt and driven to rotate by the driving belt.
[0007] Preferably, the rubber cushion and the rotating disc are provided with a chip removal hole in the center.
[0008] Preferably, the lift adjustment cylinder is arranged at the bottom centerline position of the movable platform, and the lift adjustment cylinder is periodically lifted and lowered.
[0009] Preferably, a sliding sleeve is arranged at the connection position between the movable platform and the lift guide rod.
[0010] Preferably, a front baffle is arranged on the front side of the lift guide rod.
[0011] Compared with the prior art, the utility model has the advantages of:
[0012] The movable platform can be driven to lift and slightly move by the lifting platform, the contact position of the wire drawing die with the grinding needle is different during the processing, and the debris generated during the grinding process can directly fall in the lifting movement of the wire drawing die, so that the metal debris is prevented from following the grinding needle to scratch the inner wall of the inner hole of the die core of the wire drawing die, and the yield of the wire drawing die is ensured. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 It is a structural schematic view of the utility model.
[0014] In the figure: 1, base plate; 2, front baffle; 3, lifting guide rod; 4, lifting cylinder; 5, movable platform; 6, rotating disc; 7, chip removal hole; 8, rubber cushion. DETAILED DESCRIPTION
[0015] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0016] REFERENCE Figure 1 A wire drawing die grinding and processing platform with lifting adjustment comprises a base plate 1, two groups of lifting guide rods 3 are arranged side by side on the base plate 1, a movable platform 5 is sleeved on the two groups of lifting guide rods 3, a plurality of material supports are arranged on the top surface of the movable platform 5, a lifting adjustment cylinder is arranged directly below the bottom of the movable platform 5, and the lifting adjustment cylinder drives the movable platform 5 to lift and slide along the lifting guide rod 3.
[0017] In view of the problem that the contact position of the inner hole of the die core of the wire drawing die with the grinding needle is unchanged during the grinding and processing, the metal debris is difficult to remove, and the inner wall of the inner hole of the die core is scratched during the grinding process, the technical scheme is provided with the movable platform 5 with lifting adjustment, the movable platform 5 is sleeved on the lifting guide rod 3, the movable platform 5 is driven to periodically lift and move along the lifting guide rod 3 by the lifting adjustment cylinder at the bottom, so that the movable platform 5 is lifted and slightly moved up and down, and when the grinding needle processes the wire drawing die, the contact position of the grinding needle with the wire drawing die blank can be changed, the debris is conveniently removed, the metal debris is prevented from scratching the inner wall of the wire drawing die by the grinding needle, and the processing precision and the yield of the wire drawing die are ensured.
[0018] Further, the material support comprises a rotating disc 6 and a rubber cushion 8, the rubber cushion 8 is arranged above the rotating disc 6, and the rotating disc 6 is connected with a driving belt and driven to rotate by the driving belt.
[0019] Through the technical scheme, the wire drawing die blank is placed on the rubber soft pad 8, is rotated together by the rotating disc 6, and the inner wall of the inner hole of the die core of the wire drawing die is polished and processed by the grinding needle; in the scheme, the rubber soft pad 8 is of soft material, and when the wire drawing die blank is processed by grinding, the rubber soft pad 8 can absorb energy to a certain extent, thereby protecting the grinding needle and avoiding breakage of the grinding needle in the processing process.
[0020] Further, the center of the rubber soft pad 8 and the rotating disc 6 is provided with a chip removal hole 7.
[0021] When placed, the center hole of the wire drawing die blank corresponds to the rubber soft pad 8 and the chip removal hole 7 of the rotating disc 6, and a hole is also formed in the movable platform 5; when processed, the grinding needle polishes the inner hole of the die core of the wire drawing die, and the metal chips fall from the center of the chip removal hole 7 to the base plate 1; the lifting movement of the movable platform 5 can avoid the metal chips being stuck on the grinding needle.
[0022] Further, the lifting adjusting cylinder is arranged at the bottom center line position of the movable platform 5, and the lifting adjusting cylinder performs periodic lifting movement.
[0023] The lifting cylinder 4 is directly arranged at the bottom of the movable platform 5, and the telescopic connecting rod of the lifting cylinder 4 is parallel to the lifting guide rod 3; the movable platform 5 moves more smoothly, and the lifting cylinder 4 performs periodic lifting movement, which can directly drive the movable platform 5 to perform periodic lifting movement, so that the contact positions of the grinding needle and the wire drawing die are different, thereby avoiding the wire drawing die chips being stuck.
[0024] Further, a sliding sleeve is arranged at the connection position of the movable platform 5 and the lifting guide rod 3.
[0025] Further, a front baffle 2 is arranged at the front side of the lifting guide rod 3.
[0026] Working principle: Compared with the fixed processing table, the movable platform 5 of the technical scheme can be driven by the lifting cylinder 4 to slide up and down along the lifting guide rail, so that the wire drawing die blank can be adjusted by up and down lifting and micro-motion during processing, the contact positions of the wire drawing die and the grinding needle are different during processing, and the chips generated during polishing can directly fall in the lifting movement of the wire drawing die, so that the metal chips can not follow the movement of the grinding needle, thereby ensuring the yield of the wire drawing die.
[0027] In the description of the present application, the terms "first", "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.
[0028] In the description of the application, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the application. In the application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable manner in any one or more embodiments or examples. In addition, different embodiments or examples described in the application and the features of different embodiments or examples can be combined by those skilled in the art without contradiction, if possible.
[0029] Although the embodiments of the application have been shown and described, it is to be understood that various changes, modifications, substitutions and variations can be made in such embodiments without departing from the principles and spirit of the application, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A die polishing station for die sinking, characterized by: The utility model provides a material loading and unloading platform, including the substrate, two groups of lifting guide rods are provided with side by side on the substrate, two groups the movable platform is sleeved on the lifting guide rod, the top of movable platform is provided with a plurality of material support, the bottom of movable platform is provided with the lifting adjusting pneumatic cylinder, the lifting adjusting pneumatic cylinder drives movable platform to do the lifting sliding along the lifting guide rod.
2. A processing bench for the grinding of drawing dies with lifting adjustment according to claim 1, characterized in that: The material support includes a rotating disc and a rubber cushion, the rubber cushion is arranged above the rotating disc, the rotating disc is connected with a driving belt and drives the rotating disc to rotate through the driving belt.
3. A processing bench for the grinding of drawing dies with lifting adjustment according to claim 2, characterized in that: The center of the rubber cushion and the rotating disc is provided with a chip removal hole.
4. A processing bench for polishing drawing dies with lift adjustment according to claim 1, characterized in that: The lifting adjusting pneumatic cylinder is arranged at the bottom center line of the movable platform, and the lifting adjusting pneumatic cylinder performs periodic lifting movement.
5. A processing table for polishing a drawing die according to claim 1, wherein: A sliding sleeve is arranged at the connection position of the movable platform and the lifting guide rod.
6. A processing table for the grinding of drawing dies according to claim 1, characterized in that: A front baffle is arranged at the front side of the lifting guide rod.