Grinding head capable of reducing wafer damage
By introducing a buffer pad into the grinding head, the problem of wafer damage caused by the hardness of the support plate is solved, achieving both protection and cost reduction during the wafer polishing process.
Patent Information
- Application Number
- CN202520047749.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2035-01-09
AI Technical Summary
The support plate in existing grinding heads has high hardness, which can easily cause deformation and damage to the wafer during polishing, increasing the defect rate and production costs.
A buffer pad is placed between the support plate of the grinding head and the pressure diaphragm. The buffer pad is composed of a polyurethane buffer layer and a fleece cloth, which is used to buffer the pressure acting on the wafer and reduce the deformation and damage of the wafer.
By using buffer pads, wafer deformation and damage are significantly reduced, wafer polishing yield is improved, and production costs are lowered.
Smart Images
Figure CN223670936U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer polishing device technical field especially relates to a kind of grinding head of lightening wafer damage. BACKGROUND
[0002] In the current semiconductor chip processing field, it is necessary to use a grinding head to polish the wafer. The pressure film is one of the many components of the grinding head, which connects the gas through the grinding head component to control the adsorption and unloading of the wafer by the pressure film, so that the wafer is rubbed on the grinding pad to achieve the purpose of polishing. The pressure film is mostly made of rubber, which has low hardness and thin thickness, so it needs to be loaded with a support plate to support the shape of the pressure film.
[0003] The support plate is mostly made of metal, which is not easy to get dirty and will not contaminate the pressure film, so it can meet the strict flatness processing requirements and is not easy to deform. After the support plate is loaded into the pressure film, it can ensure the surface flatness, uniform pressure distribution, no bulge, wrinkle, etc. However, the support plate has high hardness, and when the pressure film adsorbs the wafer, the internal support plate directly presses on the wafer, which can easily cause the wafer to deform and damage, increase the wafer's defective rate, and increase the production cost. SUMMARY
[0004] The utility model aims to provide a kind of grinding head of lightening wafer damage, solve the problem that wafer is easily damaged in polishing process.
[0005] To achieve the above-mentioned purpose, the utility model provides a kind of grinding head of lightening wafer damage, including support plate and pressure film, support plate is located in the inside of pressure film, pressure film is set in the installation groove of grinding head, and the lower surface of support plate and the inner surface of pressure film are provided with buffer pad, and buffer pad is coaxially fixedly connected with support plate.
[0006] Preferably, the lower surface of the support plate is provided with a groove for mounting the buffer pad, and the groove is coaxially arranged with the support plate, and the diameter of the groove is not less than the diameter of the buffer pad.
[0007] Preferably, the support plate is a polyurethane plate.
[0008] Preferably, the buffer pad includes a buffer layer, the buffer layer is fixed to the lower surface of the support plate, and the lower surface of the buffer layer is provided with a velvet, and the velvet is located between the buffer layer and the pressure film.
[0009] Preferably, the buffer layer is a polyurethane layer.
[0010] Preferably, the upper surface of the buffer layer is provided with a first adhesive layer, and the first adhesive layer is provided with a release paper, and the buffer layer is fixed to the support plate by the first adhesive layer.
[0011] Preferably, the lower surface of the buffer layer is provided with a second adhesive layer, and the flannelette is fixed on the buffer layer through the second adhesive layer.
[0012] The grinding head for reducing wafer damage has the advantages and positive effects that the buffer pad is arranged between the lower surface of the support plate and the inner surface of the pressure film, the buffer pad is used for buffering the pressure acting on the wafer, and the deformation and damage of the wafer are reduced. The buffer pad comprises a buffer layer and flannelette, the buffer layer and the support plate are both polyurethane materials, and the stability of the buffer pad and the support plate is improved. The flannelette is arranged on the lower surface of the buffer layer, the flannelette also has a certain buffering effect, and the surface of the wafer can be protected, and the surface damage of the wafer caused by the hard contact with the pressure film is reduced.
[0013] The technical scheme of the utility model is further described in detail below with reference to the drawings and embodiments. BRIEF DESCRIPTION OF DRAWINGS
[0014] Figure 1 It is a grinding head three-dimensional structure schematic view of the utility model embodiment;
[0015] Figure 2 It is a grinding head cross section three-dimensional structure schematic view of the utility model embodiment;
[0016] Figure 3 It is Figure 2 A enlarged view;
[0017] Figure 4 It is a grinding head cross section structure schematic view of the utility model embodiment;
[0018] Figure 5 It is Figure 4 B enlarged view;
[0019] Figure 6 It is a support plate structure schematic view of the utility model embodiment;
[0020] Figure 7 It is a buffer pad structure schematic view of the utility model embodiment;
[0021] Figure 8 It is a grinding head use state schematic view of the utility model embodiment;
[0022] Figure 9 It is a grinding head stress structure schematic view of the utility model embodiment.
[0023] REFERENCE SIGNS
[0024] 1, grinding head; 2, mounting groove; 3, pressure film; 4, support plate; 5, buffer pad; 6, groove; 7, wafer; 8, buffer layer; 9, flannel; 10, release paper; 11, first adhesive layer; 12, second adhesive layer; 13, grinding pad. DETAILED DESCRIPTION
[0025] In the description of the present application, it should be explained that the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, and are only for the convenience of describing the present application and simplifying the description, and are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In the description of the present application, it should be explained that, unless otherwise specified and limited, the terms "provided", "mounted", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0026] In the present application, unless otherwise defined, all technical and scientific terms used herein have the same meaning as understood by those skilled in the art to which the present application belongs. If there is any inconsistency, the meaning explained in the specification or derived from the content described in the specification shall prevail. In addition, the terms used herein are only for the purpose of describing the embodiments of the present application and are not intended to limit the present application. In order to accurately describe the technical content in the present application, and in order to accurately understand the present application, before the specific embodiments are described, the terms used in the specification are first explained as follows:
[0027] The embodiments of the present application will be described in detail below with reference to the accompanying drawings.
[0028] As shown in Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 The grinding head for reducing wafer damage includes a support plate 4 and a pressure film 3, and the pressure film 3 is arranged in a mounting groove 2 inside the grinding head 1. The pressure film 3 is made of rubber material, and the pressure film 3 is adsorbed and unloaded on the wafer 7 through the existing structure. The support plate 4 is located inside the pressure film 3, and the support plate 4 supports the pressure film 3, so that the surface of the pressure film 3 is flat, and the adsorption effect of the pressure film 3 on the wafer 7 is improved.
[0029] The support plate 4 is a polyurethane plate, which has certain elasticity and hardness, supports the pressure film 3, and has certain buffering effect on the pressure acting on the wafer 7, thereby reducing damage to the wafer 7.
[0030] A buffer pad 5 is arranged between the lower surface of the support plate 4 and the inner surface of the pressure film 3, and is used to buffer the pressure acting on the wafer 7, thereby reducing deformation and damage of the wafer 7.
[0031] As shown in Figure 6 , the lower surface of the support plate 4 is provided with a groove 6 for mounting the buffer pad 5, and the groove 6 is coaxially arranged with the support plate 4. The diameter of the groove 6 is slightly larger than the diameter of the buffer pad 5. The groove 6 has the positioning effect on the buffer pad 5, thereby improving the stability of the installation of the buffer pad 5.
[0032] As shown in Figure 7 , the buffer pad 5 comprises a buffer layer 8, which is fixed to the lower surface of the support plate 4. The buffer layer 8 is a polyurethane layer, which has certain hardness and elasticity. On the one hand, the polyurethane layer has the supporting effect on the pressure film 3, and ensures the flatness of the buffer pad 5; on the other hand, the polyurethane layer can absorb energy by deformation, thereby buffering the force acting on the wafer 7, reducing deformation of the wafer 7 and damage to the wafer 7.
[0033] The upper surface of the buffer layer 8 is provided with a first adhesive layer 11, and the first adhesive layer 11 is provided with a release paper 10. After tearing off the release paper 10, the buffer layer 8 is adhered to the groove 6 of the support plate 4 through the first adhesive layer 11. The first adhesive layer 11 is a residue-free double-sided adhesive tape. Since the buffer layer 8 and the support plate 4 are both polyurethane materials, the stability of the adhesion of the buffer layer 8 and the support plate 4 is improved.
[0034] The lower surface of the buffer layer 8 is provided with a flannel 9, which is located between the buffer layer 8 and the pressure film 3. The lower surface of the buffer layer 8 is provided with a second adhesive layer 12, and the flannel 9 is fixed to the buffer layer 8 through the second adhesive layer 12. The second adhesive layer 12 is also a residue-free double-sided adhesive tape. The flannel 9 is fixed to the support plate 4 through the second adhesive layer 12, thereby ensuring the flatness, no bulge and no wrinkle of the flannel 9. The flannel 9 has certain buffering effect, and can also protect the surface of the wafer 7, thereby reducing surface damage of the wafer 7 caused by hard contact with the pressure film 3.
[0035] The size and shape of the buffer pad 5 are determined according to the size and shape of the support plate 4.
[0036] As shown in Figure 8 , Figure 9As shown. When in use, tear off the release paper 10, fix the buffer pad 5 in the groove 6 of the support plate 4 through the first adhesive layer 11, load the support plate 4 into the pressure film 3, and the flannel 9 contacts the inner bottom surface of the pressure film 3. The polishing head 1 connects the external gas control pressure film 3 to adsorb the wafer 7, and the polishing head 1 drives the wafer 7 to move on the polishing pad 13 to polish the wafer 7. The pressure on the wafer 7 under the action of the support plate 4 is reduced by the support plate 4, the buffer pad 5 and the pressure film 3 through elastic deformation and energy absorption, so that the impact and vibration transmission to the wafer 7 are reduced, and the deformation and damage of the wafer 7 are reduced.
[0037] After a period of practical application, it is found that the polishing head with the added buffer pad can significantly reduce the deformation and damage of the wafer when connecting the pressure adsorption wafer, which can be verified from the quality of the wafer after batch polishing. The yield of wafer polishing is guaranteed, the cost of materials is greatly reduced, the operating cost of the enterprise is saved by several times, and the purpose of reducing cost and increasing benefit is achieved.
[0038] Therefore, the polishing head for reducing wafer damage can solve the problem that the wafer is easily damaged in the polishing process, and has the advantages of simple structure, low cost and convenient use.
[0039] Finally, it should be noted that: the above examples are only used to illustrate the technical scheme of the utility model and not to limit it, although the utility model has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical scheme of the utility model can still be modified or replaced, and these modifications or replacements cannot make the modified technical scheme deviate from the spirit and scope of the technical scheme of the utility model.
Claims
1. A polishing head for reducing wafer damage, comprising a support plate and a pressure diaphragm, wherein the support plate is located inside the pressure diaphragm, and the pressure diaphragm is disposed within a mounting groove of the polishing head, characterized in that: A buffer pad is provided between the lower surface of the support plate and the inner surface of the pressure membrane, and the buffer pad is coaxially and fixedly connected to the support plate.
2. The grinding head for reducing wafer damage according to claim 1, characterized in that: The lower surface of the support plate is provided with a groove for installing a buffer pad. The groove is coaxial with the support plate, and the diameter of the groove is not less than the diameter of the buffer pad.
3. The grinding head for reducing wafer damage according to claim 1, characterized in that: The support plate is a polyurethane board.
4. A grinding head for reducing wafer damage according to claim 1, characterized in that: The buffer pad includes a buffer layer, which is fixed to the lower surface of the support plate. A fleece is provided on the lower surface of the buffer layer, and the fleece is located between the buffer layer and the pressure membrane.
5. A grinding head for reducing wafer damage according to claim 4, characterized in that: The buffer layer is a polyurethane layer.
6. A grinding head for reducing wafer damage according to claim 4, characterized in that: The upper surface of the buffer layer is provided with a first adhesive layer, and release paper is provided on the first adhesive layer. The buffer layer is fixed to the support plate by the first adhesive layer.
7. A grinding head for reducing wafer damage according to claim 4, characterized in that: A second adhesive layer is provided on the lower surface of the buffer layer, and the fleece is fixed to the buffer layer through the second adhesive layer.