Z-shaped arm for silicon wafer cutting machine

Abstract

The utility model discloses a Z-shaped arm for a silicon wafer cutting machine, which is applied to the technical field of silicon wafer cutting machines, and is characterized by comprising a lead screw sliding table arranged along the horizontal direction and a silicon wafer cutting table which is fixedly connected to a sliding table of the lead screw sliding table based on the Z-shaped arm and is used for placing and cutting a silicon wafer, the silicon wafer cutting table is arranged far away from the sliding table, and a dust adsorption assembly is arranged on the silicon wafer cutting table; the device has the technical effects of simple structure and capability of preventing dust from influencing the cutting precision of the silicon wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer cutting processing machine, especially to a Z -shaped arm for silicon wafer cutting processing machine. BACKGROUND

[0002] The transistor needs to use the silicon wafer cutting equipment to cut the silicon wafer in the process of processing, and then the silicon wafer meets the processing demand.

[0003] At present, the utility model with announcement No. CN216370707U discloses a kind of silicon wafer cutting equipment for transistor processing, including base, platform plate is arranged on the base upper side, No. servo guide rail mechanism is arranged on the platform plate upper side, No. servo guide rail mechanism upper side is provided with No. 2 servo guide rail mechanism, sliding table is arranged on the No. 2 servo guide rail mechanism upper side, honeycomb adsorption plate is arranged on the sliding table upper side, and honeycomb hole is arranged on the honeycomb adsorption plate upper side.

[0004] The existing utility model realizes the sliding of sliding table by No. servo guide rail mechanism and No. 2 servo guide rail mechanism, but a large amount of fine dust is inevitably generated in the process of silicon wafer cutting, and the fine dust will enter the servo guide rail mechanism if sliding table is directly arranged on servo guide rail mechanism, which will cause the sliding precision of sliding table to decrease and affect the cutting precision of silicon wafer after long-term accumulation, so it is necessary to improve. UTILITY MODEL CONTENTS

[0005] The utility model aims to provide a kind of Z -shaped arm for silicon wafer cutting processing machine, which has the advantages of simple structure and avoids the influence of dust on the cutting precision of silicon wafer.

[0006] The above technical purpose of the utility model is realized by the following technical scheme: a kind of Z -shaped arm for silicon wafer cutting processing machine, including the sliding table of screw rod that is arranged along the horizontal direction and is fixedly connected on the sliding table based on Z -shaped arm, silicon wafer cutting table for placing and cutting silicon wafer, the silicon wafer cutting table is away from the sliding table and is arranged, and dust adsorption assembly is arranged on the silicon wafer cutting table.

[0007] The utility model is further provided as follows: the Z -shaped arm includes the fixed part that is fixedly connected on the sliding table of screw rod and the mounting part that is arranged away from the screw rod and is used to install the silicon wafer cutting table, the fixed part and the mounting part are fixedly connected based on connecting part, and the connecting part is arranged downwardly.

[0008] The utility model is further provided as follows: the surface of the mounting part is lower than the surface of the sliding table.

[0009] The utility model further sets up: the dust adsorption subassembly includes the dust absorption hole of opening in the silicon wafer cutting table and the dust collector fixedly connected in the bottom surface of the silicon wafer cutting table, the dust collector is connected with first dust absorption pipe outside, the bottom surface of the silicon wafer cutting table is fixedly connected with the baffle around the dust collector, and the dust containing cavity for containing dust is formed between the baffle and the dust collector, a plurality of dust absorption holes for the dust in air to pass through are formed in the baffle, and the second dust absorption pipe for intercommunicating the dust containing cavity is connected with the connecting portion outside.

[0010] The utility model further sets up: the dust absorption pipe includes a plurality of vertical dust absorption holes along the vertical direction and the horizontal dust absorption hole along the horizontal direction in the silicon wafer cutting table, and the horizontal dust absorption hole is connected with the vertical dust absorption hole, the silicon wafer cutting table is provided with the collection hole, the dust suction port of the dust collector is arranged in the collection hole, and the horizontal dust absorption hole is connected to the collection hole.

[0011] The utility model further sets up: the horizontal dust absorption hole penetrates the lateral wall of the silicon wafer cutting table.

[0012] The utility model further sets up: at least one lightening hole is formed in the fixed part, the mounting part and the connecting part.

[0013] In conclusion, the utility model has the following beneficial effects:

[0014] 1. the silicon wafer cutting table is set up in the position far from the sliding table through Z arm, thereby avoiding that the dust generated in the cutting process of the silicon wafer on the silicon wafer cutting table falls directly into the lead screw sliding table and thereby influences the sliding precision of the lead screw sliding table;

[0015] 2. the dust adsorption subassembly sets up the dust absorption hole on the silicon wafer cutting table and sets up the dust collector on the bottom surface of the silicon wafer cutting table, and the dust generated in the cutting process of the silicon wafer is absorbed by the dust collector through the dust absorption hole, and simultaneously for the dust scattered in the air, sets up the baffle around the dust collector and sets up the dust absorption hole on the baffle, and simultaneously sets up the horizontal dust absorption hole and penetrates the lateral wall of the silicon wafer cutting table, and the dust suspended in the air is absorbed through the dust absorption hole and the horizontal dust absorption hole and is finally absorbed through the first dust absorption pipe and the second dust absorption pipe, reduces the content of the dust in the air, improves the dust adsorption effect, avoids the dust into the lead screw sliding table, and simultaneously sets up the mounting part surface and lower than the sliding table surface, can further reduce the amount of dust into the lead screw sliding table, guarantees the sliding precision of the lead screw sliding table. ACCURACY

[0016] Figure 1 It is the structure schematic diagram of the whole of this embodiment;

[0017] Figure 2is a structural schematic view of the Z-shaped arm of the embodiment;

[0018] Figure 3 is a structural sectional view of the dust adsorption assembly of the embodiment;

[0019] Figure 4 is a structural sectional view of the silicon wafer cutting table of the embodiment.

[0020] Reference signs: 1, screw slide; 11, sliding table; 2, Z-shaped arm; 21, fixed part; 22, mounting part; 23, connecting part; 24, lightening hole; 3, silicon wafer cutting table; 4, dust adsorption assembly; 41, dust suction hole; 42, dust collector; 43, first dust suction pipe; 44, shielding plate; 45, dust containing cavity; 46, dust suction hole; 47, second dust suction pipe; 48, vertical dust suction hole; 49, horizontal dust suction hole; 410, collecting hole. DETAILED DESCRIPTION

[0021] The utility model will be further explained in detail below in combination with the drawings.

[0022] Embodiment:

[0023] Reference Figures 1 to 4 A Z-shaped arm for a silicon wafer cutting processing machine, comprising a screw slide 1 arranged along a horizontal direction and a sliding table 11 fixedly connected to the screw slide 1 based on the Z-shaped arm 2, a silicon wafer cutting table 3 for placing and cutting silicon wafers, the silicon wafer cutting table 3 being arranged away from the sliding table 11, so as to avoid a large amount of dust generated during the cutting of the silicon wafers on the silicon wafer cutting table 3 from directly falling into the screw slide 1 and affecting the sliding precision of the screw slide 1, and a dust adsorption assembly 4 arranged on the silicon wafer cutting table 3, so as to adsorb the dust generated during the cutting of the silicon wafers and scattered in the air on the silicon wafer cutting table 3, thereby reducing the possibility of the dust entering the screw slide 1.

[0024] Reference Figure 1 And Figure 2 Specifically, the Z-shaped arm 2 comprises a fixed part 21 fixedly connected to the sliding table 11 of the screw slide 1 and a mounting part 22 arranged away from the screw slide 1 and used for mounting the silicon wafer cutting table 3, the fixed part 21 and the mounting part 22 are fixedly connected based on a connecting part 23, the connecting part 23 is arranged in a downward bending manner, the surface of the mounting part 22 is lower than the surface of the sliding table 11, and arranging the surface of the mounting part 22 to be lower than the surface of the sliding table 11 can also reduce the amount of dust entering the screw slide 1, and at least one lightening hole 24 is arranged on the fixed part 21, the mounting part 22 and the connecting part 23, so as to ensure the structural strength of the Z-shaped arm 2 as a whole while avoiding the excessive load torque caused by the lateral movement of the silicon wafer cutting table 3 from affecting the sliding precision of the screw slide 1.

[0025] Reference Figure 3 AndFigure 4 Specifically, the dust adsorption assembly 4 comprises a dust suction hole 41 opened on the silicon wafer cutting table 3 and a dust collector 42 fixedly connected to the bottom surface of the silicon wafer cutting table 3, the dust collector 42 is externally connected with a first dust suction pipe 43, a shielding plate 44 is fixedly connected to the bottom surface of the silicon wafer cutting table 3 around the dust collector 42, and a dust containing cavity 45 for containing dust is formed between the shielding plate 44 and the dust collector 42, a plurality of dust suction holes 46 for allowing dust in the air to pass through are opened on the shielding plate 44, a second dust suction pipe 47 for connecting the dust containing cavity 45 is externally connected to the connecting portion 23, the dust suction hole 41 comprises a plurality of vertical dust suction holes 48 opened on the silicon wafer cutting table 3 along the vertical direction and horizontal dust suction holes 49 opened in the silicon wafer cutting table 3 along the horizontal direction and used for connecting the vertical dust suction holes 48, a collecting hole 410 is opened on the silicon wafer cutting table 3, the dust suction port of the dust collector 42 is arranged in the collecting hole 410, the horizontal dust suction holes 49 are collected into the collecting hole 410, and the horizontal dust suction holes 49 penetrate through the side wall of the silicon wafer cutting table 3, the dust generated in the silicon wafer cutting process is absorbed by the dust collector 42 through the dust suction hole 41, and simultaneously, for the dust scattered in the air, the shielding plate 44 is arranged around the dust collector 42, the dust suction holes 46 are arranged on the shielding plate 44, the horizontal dust suction holes 49 are arranged to penetrate through the side wall of the silicon wafer cutting table 3, the dust suspended in the air is absorbed through the dust suction holes 46 and the horizontal dust suction holes 49 and is finally absorbed through the first dust suction pipe 43 and the second dust suction pipe 47, the content of the dust in the air is reduced, the dust adsorption effect is improved, and the dust is prevented from entering the lead screw sliding table 1.

[0026] Brief description of the use process: the dust generated in the silicon wafer cutting process is absorbed by the dust collector 42 through the dust suction hole 41, and simultaneously, for the dust scattered in the air, the shielding plate 44 is arranged around the dust collector 42, the dust suction holes 46 are arranged on the shielding plate 44, and the horizontal dust suction holes 49 are arranged to penetrate through the side wall of the silicon wafer cutting table 3, the dust suspended in the air is absorbed through the dust suction holes 46 and the horizontal dust suction holes 49 and is finally absorbed through the first dust suction pipe 43 and the second dust suction pipe 47.

[0027] The specific embodiment is only an explanation of the utility model, and is not a limitation of the utility model, and a person skilled in the art can make a modification with creative contribution according to the needs after reading the specification, but as long as it is within the scope of the claims of the utility model, it is protected by the patent law.

Claims

1. A Z-arm for a silicon wafer dicing machine, characterized by, The utility model provides a silicon wafer cutting table, including the screw slide (1) who sets up along the horizontal direction and the sliding table (11) who is fixedly connected based on Z arm (2) on the screw slide (1), be used for placing and cutting silicon wafer's silicon wafer cutting table (3) is set up away from the sliding table (11), the dust adsorption subassembly (4) is set up on the silicon wafer cutting table (3).

2. A Z-arm for a silicon wafer dicing machine as defined in claim 1, wherein The Z arm (2) includes the fixed part (21) that is fixedly connected on the sliding table (11) of the screw slide (1) and the mounting portion (22) for installing the silicon wafer cutting table (3) is set up away from the screw slide (1), the fixed part (21) is fixedly connected based on the connecting portion (23) between the mounting portion (22), and the connecting portion (23) is set up downwardly.

3. A Z-arm for a silicon wafer dicing machine as defined in claim 2, wherein The mounting portion (22) surface is lower than the sliding table (11) surface.

4. The Z-arm for a silicon wafer dicing machine of claim 2, wherein, The dust adsorption subassembly (4) includes the dust suction hole (41) that is opened on the silicon wafer cutting table (3) and the dust collector (42) that is fixedly connected on the bottom surface of the silicon wafer cutting table (3), the dust collector (42) is circumscribed with the first dust suction pipe (43), the bottom surface of the silicon wafer cutting table (3) is fixedly connected with the baffle (44) around the dust collector (42), and the baffle (44) and the dust collector (42) form the dust containing cavity (45) for containing dust between them, a plurality of dust absorption holes (46) for the dust in the air to pass through are formed in the baffle (44), and the connecting portion (23) is circumscribed with the second dust suction pipe (47) for communicating the dust containing cavity (45).

5. A Z-arm for a silicon wafer sawing machine as defined in claim 4, wherein, The dust suction hole (41) includes a plurality of vertical dust suction holes (48) that are opened on the silicon wafer cutting table (3) along the vertical direction and horizontal dust suction holes (49) that are opened in the silicon wafer cutting table (3) along the horizontal direction for communicating the vertical dust suction holes (48), the silicon wafer cutting table (3) is provided with a collection hole (410), and the dust suction port of the dust collector (42) is arranged in the collection hole (410); the horizontal dust suction holes (49) converge into the collection hole (410).

6. A Z-arm for a silicon wafer sawing machine as defined in claim 5, wherein, The horizontal dust suction hole (49) penetrates the side wall of the silicon wafer cutting table (3).

7. The Z-arm for a silicon wafer dicing machine of claim 2, wherein, At least one lightening hole (24) is formed in the fixed part (21), the mounting portion (22) and the connecting portion (23).

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